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市場調查報告書
商品編碼
2099239

歐洲人血腦障壁市場：市場佔有率分析、產業趨勢與統計、成長預測（2026-2031）

Europe HBM - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2026 - 2031)
出版日期: | 出版商: Mordor Intelligence | 英文 151 Pages | 商品交期: 2-3個工作天內

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簡介目錄

根據 Mordor Intelligence 預測，歐洲 HBM 市場規模預計在 2025 年達到 4.3 億美元，2026 年達到 5.5 億美元，到 2031 年達到 16.8 億美元，2026 年至 2031 年的複合年成長率為 25.02%。

歐洲 HBM 市場-IMG1

本報告依 HBM 類型（HBM2E、HBM3、HBM3E、HBM4、HBM4E）、技術領域（1X、1Y、1Z、Sub-1Z）、終端用戶行業（雲、AI 開發人員、企業、政府、電信等）、應用（AI 模型訓練、AI 模型推理、網路和處理堆等33 類型）。市場預測以美元 (USD) 為單位。

歐洲人血腦障壁市場趨勢與洞察

歐洲資料中心人工智慧主導的加速器密度

GPU密集型基礎設施的快速擴張仍然是歐洲HBM市場短期內最強勁的利多因素。這是因為每新增一個AI叢集，都會增加系統級高頻寬記憶體的需求。 2026年6月，NVIDIA表示，歐洲23個國家正在開發35台新的AI超級電腦，自2025年以來，歐洲已部署或宣布的AI超級電腦算力超過800 exaflops。這一成長對歐洲HBM市場意義重大，因為超過90%的AI工廠部署都與使用HBM作為記憶體基礎的Blackwell和Hopper系統有關。從模型訓練到即時推理的轉變也在推動需求成長。這是因為生產工作負載需要在多個並發會話中保持穩定的記憶體吞吐量，而不是間歇性的突發流量。隨著這一趨勢擴展到更多國家級和企業級部署，歐洲HBM市場正從超大規模資料中心業者有限的採購週期轉向更廣泛、更持續的採購模式。

EuroHPC主權計算構建

EuroHPC網路正在為歐洲HBM市場的需求設定一個政策支援的下限，這與典型的商業雲端支出週期截然不同。 EuroHPC正從孤立的旗艦系統轉向更廣泛的AI工廠網路，將高頻寬運算的需求分散到多個成員國。 2026年4月簽署的IT4LIA AI工廠合約清楚地展現了這項需求的規模，該專案基於NVIDIA GB200 NVL4架構，擁有超過8000個GPU，峰值推理性能超過160 exaflops。 SiPearl的「Rhea1」於2026年5月完成通電，其設計整合了四個HBM堆疊，為歐洲提供了一條直接的HBM賦能自主計算途徑。這些項目與一項多年組織藍圖相聯繫，為歐洲HBM市場提供了穩定的需求來源，即使商業支出預測變得越來越困難。

歐洲HBM本地供應基地短缺

歐洲HBM市場最大的結構性限制因素是該地區持續缺乏商業規模的在地化HBM生產。這一缺口意味著供應仍然依賴區域外的製造商，而不斷成長的歐洲需求並不會自動轉化為本地價值創造。因此，歐洲HBM市場持續受到外部分配優先順序、供應商認證週期以及歐洲買家無法直接控制的封裝瓶頸的影響。儘管歐盟的《晶片法案》加強了半導體產業的整體努力，但目前的計畫更著重於邏輯和功率半導體，而非HBM產能本身。在這一缺口縮小之前，儘管本地人工智慧基礎設施需求強勁，歐洲HBM市場仍將繼續受到其他地區上游工程決策的影響。

細分市場分析

到2025年，HBM3E將佔據歐洲HBM市場51.95%的佔有率，這反映了其作為該地區最廣泛部署的AI加速器平台標準記憶體配置的地位。 HBM3E基於Hopper和早期Blackwell系統構建，仍然是當前採購的核心，因為這些平台繼續支撐著眾多雲端、研究和政府部署項目。歐洲HBM市場也體現了平台連續性的重要性，因為即使下一代產品開始被廣泛採用，現有的基於HBM3E的系統仍將繼續運作。 2026年5月，三星宣布已提前向NVIDIA交付了HBM4E樣品，其規格為每引腳最高16 Gbps、48 GB容量和每堆疊最高3.6 TB/s。 NVIDIA於2026年6月確認Vera Rubin平台的量產，顯示市場已在為向HBM4的過渡做好準備。

預計到2031年，HBM4E及其後續衍生產品將以25.94%的最高複合年成長率成長，顯示市場需求正迅速轉向更高性能水準。歐洲HBM市場的這一趨勢不僅體現在速度的提升；對新型晶片和封裝的預期也將改變整合要求。三星早期提供HBM4E樣品以及NVIDIA的藍圖都表明，認證時間將在供應商的市場定位中發揮關鍵作用。雖然HBM2E和HBM3等老一代產品以及傳統部署方案仍在學術機構、公共機構和早期人工智慧叢集中發揮作用，但它們已不再是塑造歐洲HBM市場走向的決定性因素。因此，該細分市場呈現出分階段的普及趨勢，目前的出貨量主要集中在HBM3E，而未來的成長則取決於對HBM4E的準備工作。

到2025年，1Z以下的先進製程節點將佔據歐洲HBM市場59.13%的佔有率，而這一細分市場也將引領新型HBM部署。這種集中度表明，歐洲的採購活動與實現現代人工智慧系統頻寬密度和能源效率目標所需的最先進記憶體製程密切相關。因此，歐洲HBM市場在各製程世代之間的分佈並不均衡。這是因為市場需求趨勢強烈傾向為最新加速器平台打造的記憶體。根據三星和SK海力士等供應商的藍圖，從HBM3E到HBM4的過渡與向更先進製程等級的持續過渡密切相關。因此，隨著新一代人工智慧系統進入量產階段，先進製程節點在歐洲HBM市場的佔有率預計將持續成長。

1Z節點在HBM3部署中仍然佔據重要地位，繼續提供給尚未升級到HBM3E或HBM4配置的機構和營運商。而較老的節點，例如1Y和1X，則擴大與傳統的HBM專案和較舊的高效能運算（HPC）設施綁定，而非與新的主流引進週期掛鉤。這在歐洲HBM市場的工藝層面造成了一種「贏家通吃」的局面，因為每一次成功的節點升級都會擴大與上一代產品之間的商業性差距。 HBM互通性的標準化工作有助於降低系統整合商被完全鎖定的風險，但並不能改變商業性需求集中在最先進的製造節點。因此，這一部分錶明，工藝領先地位正成為進入歐洲HBM市場最清晰的結構性篩選條件之一。

其他好處：

  • Excel格式的市場預測（ME）表
  • 3個月的分析師支持

目錄

第1章：引言

  • 研究假設和市場定義
  • 調查範圍

第2章：調查方法

第3章執行摘要

第4章 市場狀況

  • 市場概覽
  • 市場促進因素
    • 歐洲資料中心人工智慧驅動加速器的密度
    • EuroHPC的自主計算建設
    • 汽車高級駕駛輔助系統和車載人工智慧的記憶體密集度
    • 在記憶體受限的科學計算工作負載中採用 HBM
    • 歐洲系統整合商正在推動對先進封裝技術的需求。
    • 採用封裝內記憶體的專用推理平台
  • 市場限制因素
    • 歐洲HBM本地供應基地短缺
    • 先進包裝生產能力集中在歐洲以外的地區。
    • 大規模部署中溫度控管和電源供應的複雜性。
    • 汽車和工業平台認證週期長
  • 產業供應鏈分析
  • 監理情勢
  • 技術展望
  • 波特五力分析

第5章 市場規模與成長預測

  • HBM 型
    • HBM2E 及更早世代
    • HBM3
    • HBM3E
    • HBM4
    • HBM4E
  • 按技術領域
    • 1X 或更高版本以及傳統節點
    • 1Y節點
    • 1Z 節點
    • 小於 1Z 的高階節點
  • 按包裝類型
    • 採用 2.5D 中介層的封裝
    • 3D堆疊
    • 扇出高級封裝
  • 按最終用途行業分類
    • 雲端服務供應商和超大規模資料中心業者雲端服務商
    • 網際網路平台和人工智慧模型開發公司
    • 政府、國防、研究和學術機構
    • 企業資料中心
    • 通訊業者和網路設備供應商
    • 其他商業領域
  • 透過使用
    • 訓練人工智慧模型
    • AI模型推理
    • 高效能運算和科學運算
    • 專業圖形、渲染和視覺化
    • 網路與通訊處理
    • 其他高頻寬運算工作負載
  • 按地區
    • 德國
    • 英國
    • 法國
    • 義大利
    • 西班牙
    • 北歐的
    • 其他歐洲國家

第6章 競爭情勢

  • 市場集中度
  • 策略趨勢
  • 市佔率分析
  • 公司簡介
    • Samsung Electronics Co., Ltd.
    • SK hynix Inc.
    • Micron Technology, Inc.
  • Other Ecosystem Players
    • NVIDIA Corporation
    • Advanced Micro Devices, Inc.
    • Intel Corporation
    • Broadcom Inc.
    • Hewlett Packard Enterprise Company
    • Lenovo Group Limited
    • ASML Holding NV
    • STMicroelectronics NV
    • Infineon Technologies AG
    • Robert Bosch GmbH
    • SiPearl SAS
    • Eviden
    • Atos SE
    • imec vzw
    • Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung eV
    • Cadence Design Systems, Inc.
    • Synopsys, Inc.
    • Marvell Technology, Inc.
    • Applied Materials, Inc.
    • Renault Group
    • BMW AG
    • Mercedes-Benz Group AG
    • Volkswagen AG

第7章 市場機會與未來展望

簡介目錄
Product Code: 100044

According to Mordor Intelligence, the Europe HBM market size is projected to be USD 0.43 billion in 2025, USD 0.55 billion in 2026, and reach USD 1.68 billion by 2031, growing at a CAGR of 25.02% from 2026 to 2031.

Europe HBM - Market - IMG1

This report is Segmented by HBM Type (HBM2E, HBM3, HBM3E, HBM4, and HBM4E), Technology Node (1X, 1Y, 1Z, and Sub-1Z), End Use Industry (Cloud, AI Developers, Enterprise, Government, Telecom, and More), Application (AI Model Training, AI Model Inference, Network and Telecom Processing, and More), Packaging (2. 5D Interposer, 3D Stacking, and Fan-Out), and Geography. The Market Forecasts are Provided in Terms of Value (USD).

Europe HBM Market Trends and Insights

AI-Driven Accelerator Density in European Data Centers

The rapid buildout of GPU-heavy infrastructure remains the strongest near-term support for the Europe HBM market because each new AI cluster adds high-bandwidth memory requirements at system scale. NVIDIA said in June 2026 that 35 new AI supercomputers were in development across 23 European countries, with more than 800 AI exaflops deployed or announced in Europe since 2025. That buildout matters for the Europe HBM market because more than 90% of those AI factory deployments were tied to Blackwell and Hopper systems that use HBM as their memory base. The shift from model training to live inference is also widening demand, as production workloads require consistent memory throughput across multiple simultaneous sessions rather than periodic bursts. As that pattern spreads into more national and enterprise deployments, the Europe HBM market is moving from a narrow hyperscaler buying cycle toward a broader and more repeatable procurement base.

EuroHPC Sovereign Compute Buildout

The EuroHPC network is creating a policy-backed demand floor for the Europe HBM market that sits outside the usual commercial cloud spending cycle. EuroHPC moved from isolated flagship systems toward a wider network of AI factories, and that shift is spreading high-bandwidth compute demand across multiple member states. The IT4LIA AI Factory contract signed in April 2026 showed the scale of this demand because the system was built on NVIDIA GB200 NVL4 architecture with more than 8,000 GPUs and over 160 exaflops of peak inference performance. SiPearl's Rhea1 completed power-on in May 2026, and its design with 4 integrated HBM stacks added a direct European pathway for HBM-enabled sovereign compute. Because these programs are tied to multiyear institutional roadmaps, they give the Europe HBM market a steadier source of demand even when commercial spending becomes less predictable

Limited Indigenous HBM Supply Base in Europe

The biggest structural limit on the Europe HBM market is that the region still lacks local HBM fabrication at a commercial scale. That gap means European demand growth does not automatically translate into local value capture, because supply still depends on producers outside the region. The Europe HBM market, therefore, remains exposed to external allocation priorities, supplier qualification cycles, and packaging bottlenecks that European buyers do not directly control. The EU Chips Act has strengthened the broader semiconductor agenda, but the projects highlighted in the current pipeline are focused more on logic and power semiconductors than on HBM capacity itself. Until that gap narrows, the Europe HBM market will remain sensitive to upstream decisions in other regions, even as local AI infrastructure demand remains strong.

Other drivers and restraints analyzed in the detailed report include:

  1. Specialized Inference Platforms Using On-Package Memory
  2. Automotive ADAS and In-Vehicle AI Memory Intensity
  3. Advanced Packaging Capacity Concentration Outside Europe

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

HBM3E held 51.95% of the Europe HBM market by revenue in 2025, reflecting its role as the standard memory configuration on the AI accelerator platforms most widely deployed across the region. The installed base built around Hopper and early Blackwell systems keeps HBM3E central to current procurement because these platforms continue to anchor many cloud, research, and sovereign deployments. The Europe HBM market also shows that platform continuity matters, because existing HBM3E-based systems will remain active even as the next generation starts to scale. Samsung said in May 2026 that it shipped HBM4E samples to NVIDIA ahead of schedule, with specifications of up to 16 Gbps per pin, 48 GB capacity, and up to 3.6 TB/s per stack. NVIDIA's confirmation of the Vera Rubin platform's production start in June 2026 reinforces that the market is already preparing for the HBM4 transition.

HBM4E and later variants are projected to record the fastest CAGR of 25.94% through 2031, indicating how quickly the demand mix is shifting toward the next performance tier. This part of the Europe HBM market is not only about a speed upgrade; the move also changes integration requirements due to new base-die and packaging expectations. Samsung's early HBM4E sampling and the NVIDIA roadmap both suggest that qualification timing will play a major role in supplier positioning. Older generations such as HBM2E and HBM3, as well as legacy deployments, still have a place in academic, institutional, and earlier AI clusters, but they are no longer setting the direction of the Europe HBM market. The segment, therefore, reflects a layered adoption curve where current volume remains concentrated in HBM3E, while future growth is already defined by HBM4E readiness.

Advanced nodes below 1Z held 59.13% of the Europe HBM market in 2025, and this tier also represented the leading edge of new HBM deployment. That concentration shows that European procurement is closely aligned with the most advanced memory processes required to meet bandwidth density and power efficiency targets in modern AI systems. The Europe HBM market is therefore not spreading evenly across process generations, because the demand profile strongly favors memory built for the newest accelerator platforms. Supplier roadmaps from Samsung and SK Hynix indicate that the transition from HBM3E toward HBM4 is tied to continued migration into more advanced process classes. As a result, the share of advanced nodes within the Europe HBM market is likely to keep rising as new AI system generations move into production.

The 1Z tier remains relevant for HBM3 deployments that continue to serve institutions and operators that are not yet refreshing to HBM3E or HBM4-based configurations. Earlier nodes, such as 1Y and 1X, are increasingly tied to legacy HBM programs and older HPC installations rather than new mainstream deployment cycles. This creates a process-layer winner-takes-most pattern in the Europe HBM market, because each successful node migration increases the commercial gap with prior generations. Standards work around HBM interoperability helps reduce the risk of complete lock-in for system integrators, yet it does not change the fact that commercial demand is clustering around the most advanced manufacturing nodes. The segment therefore shows that process leadership is becoming one of the clearest structural filters for participation in the Europe HBM market.

Complete Report Scope:

  • By HBM Type
    • HBM2E and Earlier Generations
    • HBM3
    • HBM3E
    • HBM4
    • HBM4E
  • By Technology Node
    • 1X And Above Legacy Nodes
    • 1Y Node
    • 1Z Node
    • Advanced Nodes Below 1Z
  • By Packaging Type
    • 2.5D Interposer-Based Packaging
    • 3D Stacking
    • Fan-Out Advanced Packaging
  • By End Use Industry
    • Cloud Service Providers and Hyperscalers
    • Internet Platforms and AI Model Developers
    • Government, Defense, Research, and Academic Institutions
    • Enterprise Data Centers
    • Telecommunications Operators and Network Equipment Providers
    • Other Enterprise Verticals
  • By Application
    • AI Model Training
    • AI Model Inference
    • HPC and Scientific Computing
    • Professional Graphics, Rendering, and Visualization
    • Network and Telecom Processing
    • Other High-Bandwidth Compute Workloads
  • By Geography
    • Germany
    • United Kingdom
    • France
    • Italy
    • Spain
    • Nordics
    • Rest of Europe

List of Companies Covered in this Report:

  1. Samsung Electronics Co., Ltd.
  2. SK hynix Inc.
  3. Micron Technology, Inc.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 AI-Driven Accelerator Density in European Data Centers
    • 4.2.2 EuroHPC Sovereign Compute Buildout
    • 4.2.3 Automotive ADAS and In-Vehicle AI Memory Intensity
    • 4.2.4 HBM Adoption in Memory-Bound Scientific Workloads
    • 4.2.5 Advanced Packaging Pull-Through from European System Integrators
    • 4.2.6 Specialized Inference Platforms Using On-Package Memory
  • 4.3 Market Restraints
    • 4.3.1 Limited Indigenous HBM Supply Base in Europe
    • 4.3.2 Advanced Packaging Capacity Concentration Outside Europe
    • 4.3.3 High Thermal and Power-Delivery Complexity at Scale
    • 4.3.4 Long Qualification Cycles for Automotive and Industrial Platforms
  • 4.4 Industry Supply Chain Analysis
  • 4.5 Regulatory Landscape
  • 4.6 Technological Outlook
  • 4.7 Porter's Five Forces Analysis
    • 4.7.1 Bargaining Power of Suppliers
    • 4.7.2 Bargaining Power of Buyers
    • 4.7.3 Threat of New Entrants
    • 4.7.4 Threat of Substitutes
    • 4.7.5 Intensity of Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

  • 5.1 By HBM Type
    • 5.1.1 HBM2E and Earlier Generations
    • 5.1.2 HBM3
    • 5.1.3 HBM3E
    • 5.1.4 HBM4
    • 5.1.5 HBM4E
  • 5.2 By Technology Node
    • 5.2.1 1X And Above Legacy Nodes
    • 5.2.2 1Y Node
    • 5.2.3 1Z Node
    • 5.2.4 Advanced Nodes Below 1Z
  • 5.3 By Packaging Type
    • 5.3.1 2.5D Interposer-Based Packaging
    • 5.3.2 3D Stacking
    • 5.3.3 Fan-Out Advanced Packaging
  • 5.4 By End Use Industry
    • 5.4.1 Cloud Service Providers and Hyperscalers
    • 5.4.2 Internet Platforms and AI Model Developers
    • 5.4.3 Government, Defense, Research, and Academic Institutions
    • 5.4.4 Enterprise Data Centers
    • 5.4.5 Telecommunications Operators and Network Equipment Providers
    • 5.4.6 Other Enterprise Verticals
  • 5.5 By Application
    • 5.5.1 AI Model Training
    • 5.5.2 AI Model Inference
    • 5.5.3 HPC and Scientific Computing
    • 5.5.4 Professional Graphics, Rendering, and Visualization
    • 5.5.5 Network and Telecom Processing
    • 5.5.6 Other High-Bandwidth Compute Workloads
  • 5.6 By Geography
    • 5.6.1 Germany
    • 5.6.2 United Kingdom
    • 5.6.3 France
    • 5.6.4 Italy
    • 5.6.5 Spain
    • 5.6.6 Nordics
    • 5.6.7 Rest of Europe

6 COMPETITIVE LANDSCAPE

  • 6.1 Market Concentration
  • 6.2 Strategic Moves
  • 6.3 Market Share Analysis
  • 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Products and Services, Recent Developments)
    • 6.4.1 Samsung Electronics Co., Ltd.
    • 6.4.2 SK hynix Inc.
    • 6.4.3 Micron Technology, Inc.
  • 6.5 Other Ecosystem Players
    • 6.5.1 NVIDIA Corporation
    • 6.5.2 Advanced Micro Devices, Inc.
    • 6.5.3 Intel Corporation
    • 6.5.4 Broadcom Inc.
    • 6.5.5 Hewlett Packard Enterprise Company
    • 6.5.6 Lenovo Group Limited
    • 6.5.7 ASML Holding N.V.
    • 6.5.8 STMicroelectronics N.V.
    • 6.5.9 Infineon Technologies AG
    • 6.5.10 Robert Bosch GmbH
    • 6.5.11 SiPearl SAS
    • 6.5.12 Eviden
    • 6.5.13 Atos SE
    • 6.5.14 imec vzw
    • 6.5.15 Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
    • 6.5.16 Cadence Design Systems, Inc.
    • 6.5.17 Synopsys, Inc.
    • 6.5.18 Marvell Technology, Inc.
    • 6.5.19 Applied Materials, Inc.
    • 6.5.20 Renault Group
    • 6.5.21 BMW AG
    • 6.5.22 Mercedes-Benz Group AG
    • 6.5.23 Volkswagen AG

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

  • 7.1 White-Space and Unmet-Need Assessment