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市場調查報告書
商品編碼
2125642

歐洲半導體裝置：市場佔有率分析、產業趨勢與統計數據、成長預測（2026-2031）

Europe Semiconductor Device - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2026 - 2031)
出版日期: | 出版商: Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3個工作天內

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簡介目錄

歐洲半導體裝置市場預計到 2025 年將達到 663.5 億美元，到 2026 年將達到 687.2 億美元，到 2031 年將達到 907.1 億美元，2026 年至 2031 年的複合年成長率為 5.71%。

歐洲半導體裝置市場-IMG1

本報告按元件類型（離散半導體、光電子元件、感測器和微機電系統、積體電路）、經營模式（整合元件製造商、設計/無晶圓廠供應商）、終端用戶產業（汽車、通訊、消費性電子、工業、計算、資料中心、政府）、技術節點（5奈米、7奈米及其他）和地區進行細分。市場預測以美元計價。

歐洲半導體裝置市場的趨勢與洞察

歐洲超大規模資料中心對人工智慧最佳化邏輯積體電路的需求

超大規模營運商正在歐洲範圍內將人工智慧 (AI) 伺服器容量擴大三倍，叢集在德國和荷蘭，因為這兩個國家的可再生能源積分和高密度光纖互連可以降低總體擁有成本 (TCO)。英偉達於 2025 年 6 月提出的「主權人工智慧」提案已說服政策制定者優先考慮本地推理加速器，從而減少對異地雲的依賴。英飛凌預計，隨著其碳化矽 (SiC)不斷電系統模組擴展到超大規模部署，其與人工智慧相關的電源管理業務在 2026 會計年度將達到 15 億歐元（17 億美元）。即使晶圓生產轉移到海外，歐洲晶圓廠仍透過專注於電源和混合訊號外圍電路而非尖端邏輯電路來獲得更高的附加價值。這一趨勢也為與資料中心架構師合作設計溫度控管和電壓調節堆疊的區域模擬專家擴大了設計訂單機會。

德國和法國對電動車用電力電子產品的需求正在推動對碳化矽元件的需求。

隨著德國和法國主要汽車製造商採用800伏特電池電動車（BEV）架構，對汽車半導體的需求激增。這種架構需要碳化矽（SiC）驅動逆變器來實現更快的充電速度和更輕的電纜重量。英飛凌和Stellantis已簽署合作備忘錄，計劃於2025年共同開發SiC功率模組，並在歐盟「晶片法」的獎勵支持下，加速英飛凌德累斯頓擴建工廠CoolSiC的量產。總部位於法國的Soytec公司正在供應「Power-SOI」基板，儘管2025會計年度庫存有所調整，但這些基板仍將是低損耗電源管理的基礎。目前，為了確保稀缺的SiC產能，多年晶圓供應合約通常涉及採購原始晶圓、外延和裝置，並將它們封裝在同一個封裝中，這增加了對供應商的依賴，並提高了整個歐洲半導體裝置市場的轉換成本。

歐盟27國的類比和混合訊號設計工程師供應日益緊張。

歐洲半導體協會 (SEMI Europe) 於 2024 年 10 月發布的《晶片技能》報告警告稱，到 2030 年，半導體相關職位將需要填補 100 萬個空缺，其中模擬和混合訊號專家最為緊缺。歐洲晶片技能學院的目標是培養 10 萬名學員，但課程更新速度跟不上低溫 CMOS 和寬能隙功率建模技術的快速發展。一家德國汽車零件供應商指出，招募資深模擬工程師的前置作業時間長達 18 個月，迫使他們依賴外地合約設計公司。人才短缺推高了收購溢價；例如，意法半導體 (STMicroelectronics) 以 9.5 億美元收購恩智浦 (NXP) 的 MEMS 部門，部分原因是為了獲得 200 名感測器設計工程師。如果人才培養無法加速，晶圓廠產能擴張的瓶頸可能並非在於設備部署，而是 IP檢驗週期。

細分市場分析

2025年，積體電路（IC）佔據了歐洲半導體裝置市場61.72%的佔有率，這主要得益於汽車車身控制、工業PLC和資料中心電壓調節等領域的強勁設計應用。意法半導體（STMicroelectronics）於2025年11月推出的STM32V8微控制器系列採用18奈米工藝，目標應用領域為高級駕駛輔助系統（ADAS）和電動車（EV）的區域控制器。光電子元件領域維持了15%左右的市場佔有率，這主要得益於歐司朗（ams-OSRAM）宣布其2D直接飛行時間（ToF）感測技術在2025年獲得50億歐元（56.5億美元）的設計應用。在分立功率元件領域，隨著800伏特電池式電動車平台的擴展，矽IGBT向碳化矽（SiC）MOSFET的轉變仍在持續。

感測器和微機電系統 (MEMS) 預計將以 6.11% 的複合年成長率成長，是所有裝置類別中成長最快的。 Melexis 公司報告稱，在磁性位置感測器和電流感測器需求不斷成長的推動下，其 2025 年第三季的銷售額達到 2.222 億歐元（2.511 億美元）。弗勞恩霍夫積體電路與材料研究所 (Fraunhofer IMS)累計了從研究機構到製造工廠的技術轉移的有效性，其數位矽光電倍增器的出貨量在 2025 年 12 月超過了 100 萬台。隨著集中式車輛架構的日益普及，分散式感測正成為重要的資料來源，這也解釋了為什麼歐洲半導體裝置市場中感測器領域的市場規模成長速度超過了邏輯和記憶子部門。

2025年，整合元件製造商（IDM）佔總銷售額的67.33%。英飛凌在歐盟「晶片法」津貼的支持下擴大其德勒斯登工廠，凸顯了IDM模式下自主生產的固有優勢。安森美半導體位於捷克的工廠正在滿足歐洲汽車製造商對影像感測器和碳化矽二極體的需求，預計2025年第三季將為公司帶來17.6億美元的企業銷售額。

然而，隨著X-FAB和全球晶圓代工廠開放代工入口網站，以及專用積體電路（ASIC）流片流程日益普及，設計和無晶圓廠供應商預計將以5.89%的複合年成長率成長。儘管消費終端市場疲軟，X-FAB在2025年第三季的銷售額仍達到1.664億美元，顯示汽車和工業原型產品的需求持續強勁。在歐洲半導體裝置產業，一種混合策略正在形成。瑞薩電子在2024年收購設計自動化公司Altium，標誌著微控制器供應商正朝著垂直整合的方向發展，而無晶圓廠新創公司則在緊張的供應週期中積極洽談未來產能契約，以保障利潤率。

其他好處：

  • Excel格式的市場預測（ME）表
  • 3個月的分析師支持

目錄

第1章：引言

  • 研究假設和市場定義
  • 調查範圍

第2章：調查方法

第3章執行摘要

第4章 市場狀況

  • 市場概覽
  • 市場促進因素
    • 歐洲超大規模資料中心對人工智慧最佳化邏輯積體電路的需求
    • 在德國和法國，電動車的電力電子技術正在推動對碳化矽元件的需求。
    • 5G SA 的快速部署導致每部智慧型手機的射頻前端模組數量增加。
    • 歐盟晶片法資助的 300 毫米晶圓廠擴建計畫降低了在地採購風險。
    • 在芬蘭和荷蘭，量子運算試點生產線正在推動對低溫 CMOS 控制器的需求。
    • 醫療影像領域的新創公司擴大採用矽光電倍增器，這推動了小眾感測器的產量成長。
  • 市場限制因素
    • 歐盟27國缺乏模擬和混合訊號設計工程師。
    • 新建SiC和GaN基板生產線面臨的資本密集障礙
    • REACH 法規逐步淘汰 PFAS 會增加介電材料重新認證的成本。
    • 200 毫米以下晶圓代工生態系的碎片化限制了物聯網原型製作的擴充性。
  • 產業價值鏈分析
  • 監理情勢
  • 波特五力分析

第5章 市場規模與成長預測

  • 依設備類型
    • 法令半導體
      • 二極體
      • 電晶體
      • 功率電晶體
      • 整流器和閘流體
      • 其他離散半導體
    • 光電子學
      • 發光二極體（LED）
      • 雷射二極體
      • 影像感測器
      • 歐普託卡普拉
      • 其他光電子裝置
    • 感測器和微機電系統
      • 壓力
      • 磁場
      • 執行器
      • 加速度和偏航率
      • 其他感測器和MEMS
    • 積體電路
      • 依積體電路類型
        • 模擬
        • 微
          • 微處理器（MPU）
          • 微控制器（MCU）
          • 數位訊號處理器
        • 邏輯
        • 記憶
  • 按經營模式
    • 整合裝置製造商 (IDM)
    • 設計/無晶圓廠供應商
  • 按最終用戶行業分類
    • 車
    • 通訊（有線和無線）
    • 一般消費者
    • 產業
    • 計算/數據存儲
    • 資料中心
    • 人工智慧
    • 政府
  • 依技術節點
    • 3奈米或更小
    • 5 nm
    • 7 nm
    • 16 nm
    • 28奈米或更小
  • 國家
    • 德國
    • 英國
    • 法國
    • 義大利
    • 荷蘭
    • 西班牙
    • 其他歐洲國家

第6章 競爭情勢

  • 市場集中度
  • 策略趨勢
  • 市佔率分析
  • 公司簡介
    • STMicroelectronics NV
    • Infineon Technologies AG
    • NXP Semiconductors NV
    • ON Semiconductor Corporation
    • Texas Instruments Incorporated
    • Analog Devices, Inc.
    • Intel Corporation
    • Advanced Micro Devices, Inc.
    • Microchip Technology Incorporated
    • Renesas Electronics Corporation
    • Micron Technology, Inc.
    • SK hynix Inc.
    • Samsung Electronics Co., Ltd.
    • Wolfspeed, Inc.
    • Melexis NV
    • Elmos Semiconductor SE
    • ams-OSRAM AG
    • GlobalFoundries Inc.
    • Taiwan Semiconductor Manufacturing Company Limited
    • X-FAB Silicon Foundries SE
    • ROHM Co., Ltd.
    • Soitec SA
    • Semikron Danfoss GmbH & Co. KG
    • ASM International NV
    • IQE plc

第7章 市場機會與未來展望

簡介目錄
Product Code: 5000076

According to Mordor Intelligence, the Europe semiconductor device market size is projected to be USD 66.35 billion in 2025, USD 68.72 billion in 2026, and USD 90.71 billion by 2031, growing at a CAGR of 5.71% from 2026 to 2031.

Europe Semiconductor Device - Market - IMG1

This report is Segmented by Device Type (Discrete Semiconductors, Optoelectronics, Sensors and MEMS, and Integrated Circuits), Business Model (IDM, and Design/Fabless Vendor), End-User Industry (Automotive, Communication, Consumer, Industrial, Computing, Data Center, and Government), Technology Node (5 Nm, 7 Nm, and More), and Geography. The Market Forecasts are Provided in Terms of Value (USD).

Europe Semiconductor Device Market Trends and Insights

AI-Optimized Logic IC Demand From European Hyperscale Datacenters

Hyperscale operators are tripling artificial-intelligence server capacity across Europe, consolidating clusters in Germany and the Netherlands where renewable-energy credits and dense fiber interconnects reduce total cost of ownership. Nvidia's June 2025 "sovereign AI" pitch persuaded policymakers to prioritize on-premise inference accelerators, reducing dependence on extra-regional clouds. Infineon expects AI-related power-management revenue to reach EUR 1.5 billion (USD 1.7 billion) in fiscal 2026 as silicon-carbide uninterrupted-power-supply modules scale to hyperscale deployments. By targeting the power and mixed-signal periphery rather than leading-edge logic, European fabs secure higher value capture even when wafer volumes migrate offshore. This dynamic also enlarges design-win opportunities for regional analog specialists that co-engineer thermal and voltage-regulation stacks with datacenter architects.

Electric-Vehicle Power Electronics Pulling SiC Devices in Germany and France

Automotive semiconductor content rose sharply after major German and French brands adopted 800-volt battery-electric architectures that mandate silicon-carbide traction inverters for fast-charging and reduced cable mass. Infineon and Stellantis signed a memorandum of understanding in 2025 to co-develop SiC power modules, accelerating CoolSiC ramp-up at Infineon's Dresden expansion backed by EU Chips Act incentives. France-based Soitec supplies Power-SOI substrates that remain foundational for low-loss power management despite fiscal-2025 inventory corrections. Multi-year wafer-supply agreements now bundle raw-wafer, epitaxy, and device procurement in a bid to secure scarce SiC capacity, tightening supplier lock-in and raising switching costs across the Europe semiconductor device market.

Tight EU27 Talent Pipeline for Analog and Mixed-Signal Design Engineers

SEMI Europe's October 2024 "Skills for Chips" report warned that 1 million semiconductor jobs must be filled by 2030, with analog and mixed-signal specialists in shortest supply. Although the European Chips Skills Academy targets 100,000 trainees, the curriculum refresh lags rapid shifts toward cryogenic CMOS and wide-bandgap power modeling. German automotive suppliers cite 18-month hiring lead times for senior analog engineers, compelling reliance on contract design houses outside the region. The scarcity inflates acquisition premiums, exemplified by STMicroelectronics paying USD 950 million for NXP's MEMS unit partly to secure 200 sensor-design engineers. Absent accelerated workforce development, fab ramps may be bottlenecked by IP validation cycles rather than equipment installations.

Other drivers and restraints analyzed in the detailed report include:

  1. Rapid 5G SA Roll-outs Elevating RF Front-End Module Content per Smartphone
  2. EU Chips Act-Funded 300 mm Fab Expansions, Lowering Local Sourcing Risk
  3. Capital-Intensity Barrier For New SiC And GaN Substrate Lines

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Integrated circuits held 61.72% of Europe semiconductor device market share in 2025, supported by entrenched design wins in automotive body control, industrial PLCs, and datacenter voltage regulation. STMicroelectronics' STM32V8 microcontroller family, launched in November 2025 on an 18 nm process, targets advanced driver-assistance and electric-vehicle zone controllers. Optoelectronics maintained a mid-teens slice, buoyed by ams-OSRAM's EUR 5 billion (USD 5.65 billion) in 2025 design-win announcements for 2D direct time-of-flight sensing. Discrete power devices continued migrating from silicon IGBTs to silicon-carbide MOSFETs as 800-volt battery-electric platforms scale.

Sensors and microelectromechanical systems are projected to grow at a 6.11% CAGR, the fastest among device classes. Melexis posted EUR 222.2 million (USD 251.1 million) in Q3-2025 revenue, driven by rising demand for magnetic-position and current sensors. Fraunhofer IMS crossed the 1-million-unit mark for its digital silicon-photomultiplier in December 2025, validating research-institute-to-fab transfer pathways. As centralized vehicle architectures proliferate, distributed sensing becomes the primary data source, explaining why the Europe semiconductor device market size attached to sensor content is expanding faster than logic or memory subsectors.

Integrated device manufacturers controlled 67.33% of 2025 revenues. Infineon's Dresden expansion, backed by EU Chips Act grants, underscores the sovereign-manufacturing advantage inherent in the IDM model. ON Semiconductor's Czech site serves image-sensor and SiC-diode demand for European automakers, contributing to USD 1.76 billion Q3-2025 corporate revenue.

Design and fabless vendors will nonetheless expand at a 5.89% CAGR as X-FAB and GlobalFoundries open foundry portals democratize application-specific integrated circuit tape-outs. X-FAB's Q3-2025 revenue reached USD 166.4 million despite soft consumer end markets, a testament to sustained automotive and industrial prototype demand. The European semiconductor device industry is witnessing hybrid strategies: Renesas' 2024 acquisition of design-automation firm Altium illustrates vertical integration moves by microcontroller suppliers, while fabless start-ups negotiate forward-capacity contracts to protect margins in tight allocation cycles.

Complete Report Scope:

  • By Device Type
    • Discrete Semiconductors
      • Diodes
      • Transistors
      • Power Transistors
      • Rectifier and Thyristor
      • Other Discrete Semiconductors
    • Optoelectronics
      • Light-Emitting Diodes (LEDs)
      • Laser Diodes
      • Image Sensors
      • Optocouplers
      • Other Optoelectronics
    • Sensors and MEMS
      • Pressure
      • Magnetic Field
      • Actuators
      • Acceleration and Yaw Rate
      • Other Sensors and MEMS
    • Integrated Circuits
      • By IC Type
        • Analog
        • Micro
          • Microprocessors (MPU)
          • Microcontrollers (MCU)
          • Digital Signal Processors
        • Logic
        • Memory
  • By Business Model
    • Integrated Device Manufacturer (IDM)
    • Design / Fabless Vendor
  • By End-user Industry
    • Automotive
    • Communication (Wired and Wireless)
    • Consumer
    • Industrial
    • Computing / Data Storage
    • Data Center
    • Artificial Intelligence
    • Government
  • By Technology Node
    • Less than or Equal to 3nm
    • 5 nm
    • 7 nm
    • 16 nm
    • Less than or Equal to 28nm
  • By Country
    • Germany
    • United Kingdom
    • France
    • Italy
    • Netherlands
    • Spain
    • Rest of Europe

List of Companies Covered in this Report:

  1. STMicroelectronics N.V.
  2. Infineon Technologies AG
  3. NXP Semiconductors N.V.
  4. ON Semiconductor Corporation
  5. Texas Instruments Incorporated
  6. Analog Devices, Inc.
  7. Intel Corporation
  8. Advanced Micro Devices, Inc.
  9. Microchip Technology Incorporated
  10. Renesas Electronics Corporation
  11. Micron Technology, Inc.
  12. SK hynix Inc.
  13. Samsung Electronics Co., Ltd.
  14. Wolfspeed, Inc.
  15. Melexis N.V.
  16. Elmos Semiconductor SE
  17. ams-OSRAM AG
  18. GlobalFoundries Inc.
  19. Taiwan Semiconductor Manufacturing Company Limited
  20. X-FAB Silicon Foundries SE
  21. ROHM Co., Ltd.
  22. Soitec S.A.
  23. Semikron Danfoss GmbH & Co. KG
  24. ASM International N.V.
  25. IQE plc

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 AI-Optimised Logic IC Demand from European Hyperscale Data Centres
    • 4.2.2 Electric-Vehicle Power Electronics Pulling SiC Devices in Germany and France
    • 4.2.3 Rapid 5G SA Roll-outs Elevating RF Front-End Module Content per Smartphone
    • 4.2.4 EU Chips Act- Funded 300 mm Fab Expansions Lowering Local Sourcing Risk
    • 4.2.5 Quantum-Computing Pilot Lines Spurring Cryogenic CMOS Controller Demand in Finland and Netherlands
    • 4.2.6 Silicon Photomultiplier Adoption in Medical Imaging Start-ups Accelerating Niche Sensor Volumes
  • 4.3 Market Restraints
    • 4.3.1 Tight EU27 Talent Pipeline for Analog and Mixed-Signal Design Engineers
    • 4.3.2 Capital-Intensity Barrier for New SiC and GaN Substrate Lines
    • 4.3.3 PFAS Phase-Out under REACH Raising Dielectric Material Re-qualification Costs
    • 4.3.4 Fragmented Sub-200 mm Foundry Ecosystem Limiting IoT Prototyping Scalability
  • 4.4 Industry Value Chain Analysis
  • 4.5 Regulatory Landscape
  • 4.6 Porter's Five Forces Analysis
    • 4.6.1 Bargaining Power of Suppliers
    • 4.6.2 Bargaining Power of Buyers
    • 4.6.3 Threat of New Entrants
    • 4.6.4 Threat of Substitutes
    • 4.6.5 Intensity of Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

  • 5.1 By Device Type
    • 5.1.1 Discrete Semiconductors
      • 5.1.1.1 Diodes
      • 5.1.1.2 Transistors
      • 5.1.1.3 Power Transistors
      • 5.1.1.4 Rectifier and Thyristor
      • 5.1.1.5 Other Discrete Semiconductors
    • 5.1.2 Optoelectronics
      • 5.1.2.1 Light-Emitting Diodes (LEDs)
      • 5.1.2.2 Laser Diodes
      • 5.1.2.3 Image Sensors
      • 5.1.2.4 Optocouplers
      • 5.1.2.5 Other Optoelectronics
    • 5.1.3 Sensors and MEMS
      • 5.1.3.1 Pressure
      • 5.1.3.2 Magnetic Field
      • 5.1.3.3 Actuators
      • 5.1.3.4 Acceleration and Yaw Rate
      • 5.1.3.5 Other Sensors and MEMS
    • 5.1.4 Integrated Circuits
      • 5.1.4.1 By IC Type
        • 5.1.4.1.1 Analog
        • 5.1.4.1.2 Micro
          • 5.1.4.1.2.1 Microprocessors (MPU)
          • 5.1.4.1.2.2 Microcontrollers (MCU)
          • 5.1.4.1.2.3 Digital Signal Processors
        • 5.1.4.1.3 Logic
        • 5.1.4.1.4 Memory
  • 5.2 By Business Model
    • 5.2.1 Integrated Device Manufacturer (IDM)
    • 5.2.2 Design / Fabless Vendor
  • 5.3 By End-user Industry
    • 5.3.1 Automotive
    • 5.3.2 Communication (Wired and Wireless)
    • 5.3.3 Consumer
    • 5.3.4 Industrial
    • 5.3.5 Computing / Data Storage
    • 5.3.6 Data Center
    • 5.3.7 Artificial Intelligence
    • 5.3.8 Government
  • 5.4 By Technology Node
    • 5.4.1 Less than or Equal to 3nm
    • 5.4.2 5 nm
    • 5.4.3 7 nm
    • 5.4.4 16 nm
    • 5.4.5 Less than or Equal to 28nm
  • 5.5 By Country
    • 5.5.1 Germany
    • 5.5.2 United Kingdom
    • 5.5.3 France
    • 5.5.4 Italy
    • 5.5.5 Netherlands
    • 5.5.6 Spain
    • 5.5.7 Rest of Europe

6 COMPETITIVE LANDSCAPE

  • 6.1 Market Concentration
  • 6.2 Strategic Moves
  • 6.3 Market Share Analysis
  • 6.4 Company Profiles {(includes Global level Overview, Market level overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share for key companies, Products and Services, and Recent Developments)}
    • 6.4.1 STMicroelectronics N.V.
    • 6.4.2 Infineon Technologies AG
    • 6.4.3 NXP Semiconductors N.V.
    • 6.4.4 ON Semiconductor Corporation
    • 6.4.5 Texas Instruments Incorporated
    • 6.4.6 Analog Devices, Inc.
    • 6.4.7 Intel Corporation
    • 6.4.8 Advanced Micro Devices, Inc.
    • 6.4.9 Microchip Technology Incorporated
    • 6.4.10 Renesas Electronics Corporation
    • 6.4.11 Micron Technology, Inc.
    • 6.4.12 SK hynix Inc.
    • 6.4.13 Samsung Electronics Co., Ltd.
    • 6.4.14 Wolfspeed, Inc.
    • 6.4.15 Melexis N.V.
    • 6.4.16 Elmos Semiconductor SE
    • 6.4.17 ams-OSRAM AG
    • 6.4.18 GlobalFoundries Inc.
    • 6.4.19 Taiwan Semiconductor Manufacturing Company Limited
    • 6.4.20 X-FAB Silicon Foundries SE
    • 6.4.21 ROHM Co., Ltd.
    • 6.4.22 Soitec S.A.
    • 6.4.23 Semikron Danfoss GmbH & Co. KG
    • 6.4.24 ASM International N.V.
    • 6.4.25 IQE plc

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

  • 7.1 White-Space and Unmet-Need Assessment