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市場調查報告書
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2124320

光敏半導體元件：市場佔有率分析、產業趨勢與統計、成長預測（2026-2031）

Photosensitive Semiconductor Device - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2026 - 2031)
出版日期: | 出版商: Mordor Intelligence | 英文 121 Pages | 商品交期: 2-3個工作天內

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簡介目錄

根據 Mordor Intelligence 預測，光敏半導體元件市場規模預計將在 2026 年達到 42.1 億美元，到 2031 年將成長至 52.2 億美元，預測期內複合年成長率為 4.35%。

光敏半導體裝置市場-IMG1

本報告依元件類型（光電電池、光電二極體、光電電晶體等）、材料（矽、鍺等）、工作模式（光伏、光電導、Avalanche）、應用領域（光纖通訊、汽車等）、終端用戶（汽車OEM廠商、家用電子電器等）和地區進行細分。市場預測以美元計價。

全球光敏半導體元件市場趨勢及洞察

汽車ADAS和雷射雷達的應用日益廣泛

2025年前三個季度，雷射雷達（LiDAR）出貨量達到83萬台，主要得益於售價低於4萬美元的中國產SUV廣泛採用固態掃描儀。歐洲法規要求2027年車型必須配備自動緊急煞車系統，加速了前置攝影機叢集中崩光二極體的需求。受通用汽車（GM）和福特汽車產品部署的推動，北美主要供應商在2025年下半年的訂單量增加了40%。飛行時間（ToF）陣列要求回應時間小於10奈秒，這為已獲得AEC-Q101認證的現有公司設定了准入門檻。自2024年以來，單價已下降約60%，儘管目標市場規模不斷擴大，但檢測器供應商的利潤率卻受到擠壓。

智慧型手機多相機系統的出貨量正在激增。

隨著中階安卓手機廣泛採用超廣角和長焦鏡頭，預計2025年配備三個或以上後置相機的智慧型手機出貨量將超過7.2億部，高於2024年的5.8億部。SONY的堆疊式感測器整合了相位檢測像素和高動態範圍（HDR）處理技術，而三星的「ISOCELL GNJ」技術則將模組高度降低了8%。中國品牌目前正在採用背照式感測器，可在晶片上進行類比數位轉換，從而降低20%的功耗，並解決5G數據機帶來的電池續航限制。 ISO 12233和IEEE P2020標準的協調統一，使得可用於智慧型手機和車載監控的雙用途設計成為可能，從而加速了產品的再利用。

價格壓力不斷增加

由於中國新創公司以低於傳統廠商的價格銷售產品，主流CMOS感測器的平均售價從2024年第四季到2025年第三季下降了12%。汽車系統整合商目前預計每年價格將下降5%至7%，這將對分立光電二極體的利潤率造成壓力。計算攝影技術的普及使得旗艦級影像品質能夠應用於低解析度感測器，從而減緩了對硬體升級的需求。整合到系統晶片（SoC）中，將附加價值轉移到了代工廠合作夥伴，降低了傳統感測器供應商在物料清單（BOM）中的佔有率。

細分市場分析

預計到2025年，CMOS影像感測器將佔總銷量的41.28%，持續保持光敏半導體裝置市場的銷售領先地位。其主導地位源自於堆疊式架構，該架構將像素晶圓與邏輯晶圓分離，從而實現更大的滿阱容量、更快的讀取速度以及無需外部訊號處理器的片上AI模組。預計到2025年，SONY、三星和SK海力士的堆疊式感測器總合貨量將超過1億個，從而實現每秒60幀的8K影片和用於計算攝影的480幀連拍。背照式（BSI）佈局目前約佔智慧型手機產量的70%，較2023年的55%顯著成長。這是由於中端Android設備需要小於0.7微米的像素尺寸，以在低光照條件下保持靈敏度。受穿戴式裝置和無人機中攝影機持續普及的推動，與堆疊感測器相關的光敏半導體裝置的市場規模預計將從 2026 年的 17.4 億美元成長到 2031 年的 21.5 億美元。

分立式光電二極體（PIN、PN、Avalanche和肖特基型）在光纖通訊、醫療成像和工業自動化領域佔據穩固的細分市場。在這些領域，頻譜客製化和AEC-Q101認證的重要性超過了整合影像感測器的優勢。單光子崩潰式二極體和量子影像感測器陣列的成長速度最快，年複合成長率達4.89%，這主要得益於汽車和雷射雷達製造商對皮秒級時間精度的需求。整合了光電二極體、跨阻電阻和比較器的光電積體電路（Photo IC）因其能夠將基板面積減半並將功耗降低三分之一，在健康監測貼片和擴增實境（AR）頭顯中的應用日益廣泛。相較之下，光電電晶體、光敏電阻和傳統光電池在光敏半導體裝置市場佔有率中佔比不到2%，它們在慢速光耦合器和環境光學模組中的應用也逐漸減少。汽車回流焊接製程的可靠性仍然是一個尚未解決的難題。正向電壓漂移迫使供應商規定更嚴格的結電容容差和暗電流限制，這增加了測試成本，但保持了實際使用中的性能。

預計到2025年，矽將佔市場價值的62.16%。這主要得益於CMOS製程數十年的最佳化，使其缺陷密度低，單像素成本極低。這項優勢在智慧型手機、汽車環景顯示攝影機和機器視覺系統中尤其顯著，因為這些應用可以攤提晶圓模具和電路庫的成本。然而，隨著像素間距接近0.5微米，可見光頻寬量子效率上限接近95%，降低邊際成本的效果正在減弱。因此，供應商正試圖透過先進的摻雜分佈、背面深溝槽隔離和晶圓鍵合技術，將矽的性能發揮到極致，以保持競爭力。與矽相關的感光半導體裝置市場規模預計將以低於4%的複合年成長率溫和成長，但隨著替代技術的成熟，其整體市場佔有率預計將會下降。

從長遠來看，鈣鈦礦和有機半導體構成了最現實的威脅。日本和韓國的研究團隊報告稱，到2025年，他們在800-1200奈米頻寬實現了超過80%的外部量子效率，這一性能超越了砷化銦鎵（InGaAs），而其材料成本卻只有後者的十分之一。Panasonic用於儀錶板整合式有機光電二極體的試點生產線表明，該技術有望很快實現商業化。同時，濱松光子學和安森美半導體公司發布了鈣鈦礦Avalanche結構的藍圖評估報告，這些結構無需高反向偏壓即可實現內部增益。 IEC 60747和AEC-Q101都未對溶液法製備的薄膜層的可靠性做出規定，這造成了認證方面的空白。一級汽車零件供應商已獨立開發了1000小時的濕度和紫外線測試，這將使產品推出週期延長12個月。雖然鍺和銦鎵砷在通訊和光譜學領域仍然佔據著穩固的地位，但一旦鈣鈦礦檢測器在 85 度C和 85% 相對濕度條件下表現出 10,000 小時的穩定性，這些高價產品的價格競爭力將逐漸下降。

區域分析

預計到2025年，亞太地區將佔全球銷售額的44.17%，並以每年5.81%的速度成長至2031年。 2025年，中國電動車製造商安裝的LiDAR單元數量將超過世界其他地區總和。同時，韓國晶圓代工廠已出貨超過4億個智慧型手機影像感測器。在醫療和科學研究系統用崩光二極體市場，日本廠商佔據主導地位；儘管印度和東南亞國協的模組組裝正在擴張，但製造環節仍集中在中國、日本、韓國和台灣地區。

預計到2025年，北美將佔全球雷射雷達市場佔有率的約25%，這主要得益於汽車ADAS、資料中心光鏈路和國防項目等需求的成長。然而，與全球其他地區一樣，由於依賴日本製造的外延晶圓，該地區也容易受到前置作業時間波動的影響。儘管像Teledyne和安森美半導體這樣的公司在該地區設有晶圓廠，但它們的產能擴張速度落後於亞洲。美國國家公路交通安全管理局（NHTSA）在自動緊急煞車方面的監管進展正在推動雷射雷達的應用，但其製造業補貼力度不如歐洲的「晶片法」。

到2025年，歐洲和中東地區的銷售額約佔22%。德國和法國的工廠採用環景顯示攝影機以滿足通用安全法規（GSR）的要求，這使得該地區的影像感測器出貨量增加了35%。由於缺乏本地舉措光電二極體供應商，汽車製造商被迫從日本和美國採購，這促使歐洲推出政策，旨在為合資企業提供資金。南美洲和非洲的銷售額合計不到9%，其應用主要集中在採礦自動化和通訊回程傳輸。對進口的依賴和外匯波動正在阻礙成長。

其他好處：

  • Excel格式的市場預測（ME）表
  • 3個月的分析師支持

目錄

第1章：引言

  • 研究假設和市場定義
  • 調查範圍

第2章：調查方法

第3章執行摘要

第4章 市場狀況

  • 市場概覽
  • 產業價值/價值鏈分析
  • 監理情勢
  • 技術展望
  • 宏觀經濟因素對市場的影響
  • 波特五力分析
  • 市場促進因素
    • 汽車ADAS和雷射雷達部署的擴展
    • 智慧型手機多相機系統的出貨量正在激增。
    • 對更高影像品質和光學感測技術的需求
    • 使用壽命長，功耗低
    • 軟性電子產品用有機檢測器的出現
    • 透過感測器端人工智慧處理降低頻寬和系統成本。
  • 市場限制因素
    • 物價上漲壓力不斷增大
    • 透過替代感測技術展開競爭
    • 汽車回流焊接製程中光電二極體可靠性面臨的挑戰。
    • 超高純度矽晶圓供不應求

第5章 市場規模與成長預測

  • 透過裝置
    • 光電管
    • 光電二極體
      • PIN光電二極體
      • PN光電二極體
      • 崩光二極體
      • 肖特基光電二極體
    • 光電電晶體
    • 照片登記
    • 光積體電路
    • CMOS影像感測器
      • BSI感測器
      • 堆疊式感測器
    • SPAD/QIS
  • 材料
    • 矽
    • 鎗
    • 砷化銦鎵
    • 砷化鎵
    • 有機半導體
    • 鈣鈦礦及其他新興材料
  • 透過操作模式
    • 太陽能發電系統
    • 光電導模式
    • 雪崩模式
  • 透過使用
    • 光纖通訊和資料通訊
    • 汽車和運輸業
      • LiDAR
      • ADAS攝影機
    • 家用電子產品
      • 智慧型手機和平板電腦
      • 穿戴式裝置和增強/虛擬實境
    • 醫療保健和醫學影像
    • 工業自動化與機器人技術
    • 安全監控
    • 科學研究和測量儀器
  • 最終用戶
    • 汽車原廠設備製造商
    • 家用電子電器OEM製造商
    • 航太和國防相關企業
    • 醫療設備製造商
    • 工業和製造公司
  • 按地區
    • 北美洲
      • 美國
      • 加拿大
      • 墨西哥
    • 南美洲
      • 巴西
      • 阿根廷
    • 歐洲
      • 德國
      • 法國
      • 英國
      • 義大利
      • 西班牙
      • 俄羅斯
      • 其他歐洲國家
    • 亞太地區
      • 中國
      • 日本
      • 印度
      • 韓國
      • ASEAN
      • 大洋洲
    • 中東
      • GCC
      • 土耳其
      • 其他中東國家
    • 非洲
      • 南非
      • 北非
      • 其他非洲國家

第6章 競爭情勢

  • 市場集中度
  • 策略趨勢
  • 市佔率分析
  • 公司簡介
    • Sony Semiconductor Solutions
    • Samsung System LSI
    • Hamamatsu Photonics KK
    • ON Semiconductor Corporation
    • STMicroelectronics NV
    • Teledyne Technologies Inc.
    • Canon Inc.
    • Panasonic Corporation
    • SK hynix Inc.
    • OmniVision Technologies, Inc.
    • Excelitas Technologies Corp.
    • First Sensor AG
    • Vishay Intertechnology Inc.
    • ROHM Co., Ltd.
    • Everlight Electronics Co. Ltd.
    • Kyosemi Corporation
    • OSI Optoelectronics, Inc.
    • Laser Components GmbH
    • Broadcom Inc.
    • Thorlabs Inc.

第7章 市場機會與未來展望

簡介目錄
Product Code: 70354

According to Mordor Intelligence, the photosensitive semiconductor device market size reached USD 4.21 billion in 2026 and is projected to grow to USD 5.22 billion by 2031, reflecting a 4.35% CAGR over the forecast period.

Photosensitive Semiconductor Device - Market - IMG1

This report is Segmented by Device (Photocell, Photodiode, Phototransistor, and More), Material (Silicon, Germanium, and More), Operating Mode (Photovoltaic, Photoconductive, and Avalanche), Application (Optical Communication, Automotive, and More), End User (Automotive OEMs, Consumer Electronics, and More), and Geography. The Market Forecasts are Provided in Terms of Value (USD).

Global Photosensitive Semiconductor Device Market Trends and Insights

Rising Automotive ADAS and LiDAR Adoption

LiDAR unit shipments reached 830,000 during the first three quarters of 2025 as Chinese sport-utility vehicles priced below USD 40,000 adopted solid-state scanners. European regulations requiring automatic emergency braking by model-year 2027 are accelerating avalanche-photodiode demand in forward-facing camera clusters. North American tier-one suppliers increased purchase orders by 40% in late 2025, driven by rollouts from General Motors and Ford. Time-of-flight arrays need sub-10-nanosecond response, creating a moat for incumbents that already hold AEC-Q101 qualifications. Unit prices have fallen roughly 60% since 2024, expanding addressable volume but squeezing margins for photodetector vendors.

Exploding Multi-Camera Smartphone Shipments

Handsets with three or more rear cameras surpassed 720 million units in 2025, up from 580 million in 2024, as mid-tier Android models adopted ultra-wide and telephoto modules. Sony's stacked sensors integrate phase-detection pixels and high-dynamic-range processing, while Samsung's ISOCELL GNJ shrinks module height by 8%. Chinese brands now specify back-side-illuminated arrays with on-chip analog-to-digital conversion that cuts power draw by 20%, meeting battery-life constraints imposed by 5G modems. Alignment of ISO 12233 and IEEE P2020 standards is allowing dual-use designs for smartphones and in-cabin monitoring, speeding product reuse.

Increasing Price Pressure

Average selling prices for mainstream CMOS sensors fell 12% between Q4 2024 and Q3 2025 as Chinese startups undercut incumbents. Automotive integrators now expect annual 5-7% unit cost reductions, eroding margins for discrete photodiodes. Computational photography extends flagship-level image quality to lower-resolution sensors, dampening hardware upgrades. System-on-chip integration shifts value toward foundry partners, leaving traditional sensor vendors with a shrinking share of the bill-of-material.

Other drivers and restraints analyzed in the detailed report include:

  1. On-Sensor AI Processing Reducing Bandwidth and System Cost
  2. Demand for Improved Imaging and Optical Sensing
  3. Limited Supply of Ultra-High-Purity Silicon Wafers

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

CMOS image sensors contributed 41.28% of 2025 revenue and remain the volume backbone of the photosensitive semiconductor device market. Their dominance rests on stacked architectures that decouple pixel and logic wafers, allowing larger full-well capacity, faster readout, and on-sensor artificial-intelligence blocks that remove external signal processors. Sony, Samsung, and SK hynix collectively shipped more than 100 million stacked units in 2025, enabling 8 K video at 60 frames per second and sustained 480-frame bursts for computational photography. Back-side-illuminated layouts now cover roughly 70% of smartphone output, a jump from 55% in 2023, as mid-tier Android handsets demanded sub-0.7 micrometer pixels to preserve low-light sensitivity. The photosensitive semiconductor device market size tied to stacked sensors is forecast to rise from USD 1.74 billion in 2026 to USD 2.15 billion by 2031, supported by continued camera proliferation in wearables and drones.

Discrete photodiodes PIN, PN, avalanche, and Schottky variants occupy a resilient niche in optical communication, medical imaging, and industrial automation, where spectral customization and AEC-Q101 validation outweigh the integration advantages of image sensors. Single-photon avalanche diode and quantum image sensor arrays exhibit the fastest trajectory, advancing at a 4.89% CAGR as automakers and lidar makers require picosecond timing precision. Photo-ICs that merge photodiodes with transimpedance amplifiers and comparators are expanding in health-monitoring patches and augmented-reality headsets because they cut board area by half and power draw by one-third. In contrast, phototransistors, photoresistors, and legacy photocells account for under 2% of photosensitive semiconductor device market share and are slowly retreating to low-speed optocouplers and ambient-light modules. Reliability in automotive reflow remains an open challenge; forward-voltage drift forced suppliers to specify tighter junction-capacitance windows and dark-current ceilings, raising test cost but preserving field performance.

Silicon held 62.16% of 2025 value because decades of complementary metal-oxide-semiconductor process tuning keep defect densities low and cost per pixel unmatched. Its grip is strongest in smartphones, automotive surround-view cameras, and machine-vision systems, where wafer tooling and circuit libraries are highly amortized. Even so, marginal cost gains are tapering as pixel pitch nears 0.5 micrometers and quantum-efficiency ceilings approach 95% in the visible band. Suppliers are therefore stretching silicon through advanced doping profiles, backside deep-trench isolation, and wafer bonding to retain competitiveness. The photosensitive semiconductor device market size linked to silicon is expected to inch upward at a sub-4% CAGR, yet its overall share slips as alternatives mature.

Perovskite and organic semiconductors represent the most credible long-term threat. Research groups in Japan and South Korea reported external quantum efficiency above 80% in the 800-1,200 nanometer band during 2025, performance that undercuts indium gallium arsenide at one-tenth of material cost. Panasonic's pilot line for dashboard-integrated organic photodiodes illustrates early commercialization, while Hamamatsu and ON Semiconductor have disclosed roadmap evaluations for perovskite avalanche structures that promise internal gain without high reverse bias. Qualification gaps persist because neither IEC 60747 nor AEC-Q101 defines reliability rules for solution-processed layers; tier-one automotive suppliers are crafting bespoke 1,000-hour humidity and UV tests, adding up to 12 months to launch cycles. Germanium and indium gallium arsenide remain entrenched in telecom and spectroscopy, but their premium pricing will face incremental erosion once perovskite detectors prove 10,000-hour stability under 85 °C and 85% relative humidity.

Complete Report Scope:

  • By Device
    • Photocell
    • Photodiode
      • PIN Photodiode
      • PN Photodiode
      • Avalanche Photodiode
      • Schottky Photodiode
    • Phototransistor
    • Photoresistor
    • Photo IC
    • CMOS Image Sensor
      • BSI Sensor
      • Stacked Sensor
    • SPAD / QIS
  • By Material
    • Silicon
    • Germanium
    • Indium Gallium Arsenide
    • Gallium Arsenide
    • Organic Semiconductor
    • Perovskite and Other Emerging Materials
  • By Operating Mode
    • Photovoltaic Mode
    • Photoconductive Mode
    • Avalanche Mode
  • By Application
    • Optical Communication and Datacom
    • Automotive and Transportation
      • LiDAR
      • ADAS Cameras
    • Consumer Electronics
      • Smartphones and Tablets
      • Wearables and AR/VR
    • Healthcare and Medical Imaging
    • Industrial Automation and Robotics
    • Security and Surveillance
    • Scientific Research and Instrumentation
  • By End User
    • Automotive OEMs
    • Consumer Electronics OEMs
    • Aerospace and Defence Contractors
    • Healthcare Device Manufacturers
    • Industrial and Manufacturing Firms
  • By Geography
    • North America
      • United States
      • Canada
      • Mexico
    • South America
      • Brazil
      • Argentina
    • Europe
      • Germany
      • France
      • United Kingdom
      • Italy
      • Spain
      • Russia
      • Rest of Europe
    • Asia Pacific
      • China
      • Japan
      • India
      • South Korea
      • ASEAN
      • Oceania
    • Middle East
      • GCC
      • Turkey
      • Rest of Middle East
    • AFRICA
      • South Africa
      • North Africa
      • Rest of Africa

Geography Analysis

Asia Pacific contributed 44.17% of 2025 revenue and is projected to expand at 5.81% through 2031. Chinese electric-vehicle makers installed more LiDAR units than the rest of the world combined in 2025, while South Korean foundries shipped over 400 million smartphone image sensors. Japanese specialists dominate avalanche photodiodes for medical and scientific systems, and India plus ASEAN states are scaling module assembly although fabrication stays concentrated in China, Japan, South Korea, and Taiwan.

North America generated about 25% of value in 2025, driven by automotive ADAS, data-center optical links, and defense programs. However, the region relies on Japanese epitaxial wafers, exposing it to the same lead-time shocks faced by global peers. Teledyne and ON Semiconductor operate local wafer fabs, yet capacity expansion lags Asia's scale. Regulatory momentum from the National Highway Traffic Safety Administration for automatic emergency braking is encouraging LiDAR integration, but manufacturing subsidies trail the European Chips Act.

Europe and the Middle East delivered roughly 22% of revenue in 2025. German and French plants adopted surround-view cameras to meet General Safety Regulation mandates, lifting regional image-sensor shipments by 35%. Absence of local LiDAR photodiode suppliers compels automakers to source from Japan and the United States, prompting European policy initiatives to fund joint ventures. South America and Africa combined for under 9% of revenue, with adoption focused on mining automation and telecom backhaul; reliance on imports and exchange-rate volatility constrains growth.

  1. Sony Semiconductor Solutions
  2. Samsung System LSI
  3. Hamamatsu Photonics K.K.
  4. ON Semiconductor Corporation
  5. STMicroelectronics N.V.
  6. Teledyne Technologies Inc.
  7. Canon Inc.
  8. Panasonic Corporation
  9. SK hynix Inc.
  10. OmniVision Technologies, Inc.
  11. Excelitas Technologies Corp.
  12. First Sensor AG
  13. Vishay Intertechnology Inc.
  14. ROHM Co., Ltd.
  15. Everlight Electronics Co. Ltd.
  16. Kyosemi Corporation
  17. OSI Optoelectronics, Inc.
  18. Laser Components GmbH
  19. Broadcom Inc.
  20. Thorlabs Inc.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

  • 4.1 Market Overview
  • 4.2 Industry Value / Supply-Chain Analysis
  • 4.3 Regulatory Landscape
  • 4.4 Technological Outlook
  • 4.5 Impact of Macroeconomic Factors on the Market
  • 4.6 Porter's Five Forces Analysis
    • 4.6.1 Bargaining Power of Suppliers
    • 4.6.2 Bargaining Power of Consumers
    • 4.6.3 Threat of New Entrants
    • 4.6.4 Threat of Substitutes
    • 4.6.5 Intensity of Competitive Rivalry
  • 4.7 Market Drivers
    • 4.7.1 Rising Automotive ADAS and LiDAR Adoption
    • 4.7.2 Exploding Multi-Camera Smartphone Shipments
    • 4.7.3 Demand for Improved Imaging and Optical Sensing
    • 4.7.4 Long Life and Low Power Consumption
    • 4.7.5 Emergence of Organic Photodetectors for Flexible Electronics
    • 4.7.6 On-Sensor AI Processing Reducing Bandwidth and System Cost
  • 4.8 Market Restraints
    • 4.8.1 Increasing Price Pressure
    • 4.8.2 Competition from Alternative Sensing Technologies
    • 4.8.3 Photodiode Reliability Issues During Automotive Reflow Cycles
    • 4.8.4 Limited Supply of Ultra-High-Purity Silicon Wafers

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

  • 5.1 By Device
    • 5.1.1 Photocell
    • 5.1.2 Photodiode
      • 5.1.2.1 PIN Photodiode
      • 5.1.2.2 PN Photodiode
      • 5.1.2.3 Avalanche Photodiode
      • 5.1.2.4 Schottky Photodiode
    • 5.1.3 Phototransistor
    • 5.1.4 Photoresistor
    • 5.1.5 Photo IC
    • 5.1.6 CMOS Image Sensor
      • 5.1.6.1 BSI Sensor
      • 5.1.6.2 Stacked Sensor
    • 5.1.7 SPAD / QIS
  • 5.2 By Material
    • 5.2.1 Silicon
    • 5.2.2 Germanium
    • 5.2.3 Indium Gallium Arsenide
    • 5.2.4 Gallium Arsenide
    • 5.2.5 Organic Semiconductor
    • 5.2.6 Perovskite and Other Emerging Materials
  • 5.3 By Operating Mode
    • 5.3.1 Photovoltaic Mode
    • 5.3.2 Photoconductive Mode
    • 5.3.3 Avalanche Mode
  • 5.4 By Application
    • 5.4.1 Optical Communication and Datacom
    • 5.4.2 Automotive and Transportation
      • 5.4.2.1 LiDAR
      • 5.4.2.2 ADAS Cameras
    • 5.4.3 Consumer Electronics
      • 5.4.3.1 Smartphones and Tablets
      • 5.4.3.2 Wearables and AR/VR
    • 5.4.4 Healthcare and Medical Imaging
    • 5.4.5 Industrial Automation and Robotics
    • 5.4.6 Security and Surveillance
    • 5.4.7 Scientific Research and Instrumentation
  • 5.5 By End User
    • 5.5.1 Automotive OEMs
    • 5.5.2 Consumer Electronics OEMs
    • 5.5.3 Aerospace and Defence Contractors
    • 5.5.4 Healthcare Device Manufacturers
    • 5.5.5 Industrial and Manufacturing Firms
  • 5.6 By Geography
    • 5.6.1 North America
      • 5.6.1.1 United States
      • 5.6.1.2 Canada
      • 5.6.1.3 Mexico
    • 5.6.2 South America
      • 5.6.2.1 Brazil
      • 5.6.2.2 Argentina
    • 5.6.3 Europe
      • 5.6.3.1 Germany
      • 5.6.3.2 France
      • 5.6.3.3 United Kingdom
      • 5.6.3.4 Italy
      • 5.6.3.5 Spain
      • 5.6.3.6 Russia
      • 5.6.3.7 Rest of Europe
    • 5.6.4 Asia Pacific
      • 5.6.4.1 China
      • 5.6.4.2 Japan
      • 5.6.4.3 India
      • 5.6.4.4 South Korea
      • 5.6.4.5 ASEAN
      • 5.6.4.6 Oceania
    • 5.6.5 Middle East
      • 5.6.5.1 GCC
      • 5.6.5.2 Turkey
      • 5.6.5.3 Rest of Middle East
    • 5.6.6 AFRICA
      • 5.6.6.1 South Africa
      • 5.6.6.2 North Africa
      • 5.6.6.3 Rest of Africa

6 COMPETITIVE LANDSCAPE

  • 6.1 Market Concentration
  • 6.2 Strategic Moves
  • 6.3 Market Share Analysis
  • 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share for Key Companies, Products and Services, and Recent Developments)
    • 6.4.1 Sony Semiconductor Solutions
    • 6.4.2 Samsung System LSI
    • 6.4.3 Hamamatsu Photonics K.K.
    • 6.4.4 ON Semiconductor Corporation
    • 6.4.5 STMicroelectronics N.V.
    • 6.4.6 Teledyne Technologies Inc.
    • 6.4.7 Canon Inc.
    • 6.4.8 Panasonic Corporation
    • 6.4.9 SK hynix Inc.
    • 6.4.10 OmniVision Technologies, Inc.
    • 6.4.11 Excelitas Technologies Corp.
    • 6.4.12 First Sensor AG
    • 6.4.13 Vishay Intertechnology Inc.
    • 6.4.14 ROHM Co., Ltd.
    • 6.4.15 Everlight Electronics Co. Ltd.
    • 6.4.16 Kyosemi Corporation
    • 6.4.17 OSI Optoelectronics, Inc.
    • 6.4.18 Laser Components GmbH
    • 6.4.19 Broadcom Inc.
    • 6.4.20 Thorlabs Inc.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

  • 7.1 White-Space and Unmet-Need Assessment