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市場調查報告書
商品編碼
1760962

全球模製互連設備（MID）市場

Molded Interconnect Device (MID)
出版日期: | 出版商: Global Industry Analysts, Inc. | 英文 223 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

到 2030 年，全球模塑互連設備 (MID) 市場規模將達到 57 億美元

全球模塑互連設備 (MID) 市場規模預計在 2024 年為 26 億美元，預計到 2030 年將達到 57 億美元，在 2024-2030 年分析期內的複合年成長率為 13.9%。天線和連接模組是本報告分析的細分市場之一，預計其複合年成長率為 13.9%，到分析期結束時規模將達到 19 億美元。連接器和開關細分市場在分析期間的複合年成長率預計為 12.8%。

美國市場規模將達 6.681 億美元；中國市場預期複合年成長率為 17.9%

美國模塑互連設備 (MID) 市場規模預計在 2024 年達到 6.681 億美元。預計到 2030 年，作為世界第二大經濟體的中國市場規模將達到 14 億美元，在 2024-2030 年的分析期內，複合年成長率為 17.9%。其他值得關注的區域市場包括日本和加拿大，預計在分析期間的複合年成長率分別為 9.5% 和 11.4%。在歐洲，預計德國的複合年成長率為 10.6%。

全球模塑互連設備 (MID) 市場 - 主要趨勢和促進因素摘要

什麼是模塑互連設備 (MID)？為什麼它們具有革命性？

模塑互連裝置 (MID) 是一種多功能組件，將機械和電氣功能整合在一個模塑熱塑性部件中。該技術允許將電路直接嵌入塑膠基板，將塑膠外殼和電子線路整合成一個緊湊輕巧的部件。 MID 擴大應用於各種高科技應用，包括智慧型手機、汽車感測器和醫療保健設備，因為它們可以促進小型化，同時提高可靠性和性能。整合多種功能不僅可以縮小產品的尺寸和重量，還可以簡化組裝流程，減少所需零件數量，並最終降低整體製造成本。

技術進步如何影響 MID 產業？

技術進步在擴展MID的功能和應用方面發揮關鍵作用。 3D成型製程和雷射直接成型（LDS）技術的創新尤其具有變革性。例如，LDS技術能夠在3D表面上以更高的精度創建複雜的電路路徑，從而極大地擴展了設計靈活性以及可受益於MID技術的產品類型。此外，材料科學的進步，例如高導電性聚合物複合材料的開發和電鍍技術的改進，正在提升MID的電氣性能和耐用性。這些技術改進使各行各業能夠生產出更複雜、更可靠的設備。

哪些市場趨勢正在影響模製互連設備的採用？

MID 的普及在很大程度上受到電子市場持續小型化和整合趨勢的影響。隨著設備體積越來越小，消費者對設備功能的期望也越來越高，製造商紛紛轉向 MID 技術來滿足這些需求。這一趨勢在消費性電子領域尤為明顯，該領域對更輕薄、功能更豐富的設備的需求持續成長。在汽車產業，每輛汽車的電子元件數量不斷增加，尤其是先進的安全和資訊娛樂系統，這推動了對能夠在狹小空間內整合複雜電路的 MID 的需求。此外，在醫療領域，MID 正被用於為醫療穿戴式裝置和植入提供緊湊的整合解決方案，而這些裝置的空間和可靠性至關重要。

推動模塑互連設備市場成長的因素有哪些？

模塑互連設備市場的成長受到多種因素的驅動，這些因素反映了技術創新、產業需求和消費行為的動態交互作用。 3D 列印和雷射成型技術的進步拓寬了 MID 的應用範圍，使其成為小型電子設備設計和製造中必不可少的一部分。對更永續製造流程的追求也推動著 MID 減少與傳統電路基板和電子組件相關的廢棄物和環境影響。此外，消費者對功能強大、體積小巧且節能的電子產品的需求不斷成長，這推動著 MID 市場的持續成長。汽車、家電和醫療保健等行業尤其重要，因為它們越來越依賴 MID 提供的整合能力和設計靈活性，這推動它們進行創新並增強產品供應。總之，這些因素支持著模塑互連設備市場在現代技術領域的快速成長和擴張。

部分

類型（天線和連接模組、連接器和開關、感測器、照明、其他類型）、最終用途（消費性電子、通訊、醫療、汽車、工業、其他最終用途）

受訪公司範例（46家值得關注的公司）

  • 2E Mechatronic GmbH & Co. KG
  • HARTING AG & Co. KG
  • JOHNAN Corporation
  • LPKF Laser & Electronics AG
  • MID Solutions GmbH
  • Molex LLC
  • Multiple Dimensions AG
  • TE Connectivity Ltd.

人工智慧整合

全球產業分析師正在利用可操作的專家內容和人工智慧工具改變市場和競爭情報。

Global 特定產業SLM 的典型規範，而是建立了一個從全球專家收集的內容庫，其中包括視訊錄影、部落格、搜尋引擎研究以及大量的公司、產品/服務和市場數據。

關稅影響係數

全球產業分析師根據公司總部所在國家、製造地、進出口狀況（成品和原始OEM）預測其競爭態勢的變化。這種複雜且多面向的市場動態預計將以多種方式影響競爭對手，包括銷貨成本成本 (COGS) 上升、盈利下降、供應鏈重組以及其他微觀和宏觀市場動態。

目錄

第1章調查方法

第2章執行摘要

  • 市場概覽
  • 主要企業
  • 市場趨勢和促進因素
  • 全球市場展望

第3章市場分析

  • 美國
  • 加拿大
  • 日本
  • 中國
  • 歐洲
  • 法國
  • 德國
  • 義大利
  • 英國
  • 西班牙
  • 俄羅斯
  • 其他歐洲國家
  • 亞太地區
  • 澳洲
  • 印度
  • 韓國
  • 其他亞太地區
  • 拉丁美洲
  • 阿根廷
  • 巴西
  • 墨西哥
  • 其他拉丁美洲
  • 中東
  • 伊朗
  • 以色列
  • 沙烏地阿拉伯
  • 阿拉伯聯合大公國
  • 其他中東地區
  • 非洲

第4章 競賽

簡介目錄
Product Code: MCP13437

Global Molded Interconnect Device (MID) Market to Reach US$5.7 Billion by 2030

The global market for Molded Interconnect Device (MID) estimated at US$2.6 Billion in the year 2024, is expected to reach US$5.7 Billion by 2030, growing at a CAGR of 13.9% over the analysis period 2024-2030. Antennae & Connectivity Modules, one of the segments analyzed in the report, is expected to record a 13.9% CAGR and reach US$1.9 Billion by the end of the analysis period. Growth in the Connectors & Switches segment is estimated at 12.8% CAGR over the analysis period.

The U.S. Market is Estimated at US$668.1 Million While China is Forecast to Grow at 17.9% CAGR

The Molded Interconnect Device (MID) market in the U.S. is estimated at US$668.1 Million in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$1.4 Billion by the year 2030 trailing a CAGR of 17.9% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 9.5% and 11.4% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 10.6% CAGR.

Global Molded Interconnect Device (MID) Market - Key Trends & Drivers Summarized

What Is a Molded Interconnect Device (MID) and Why Is It Revolutionary?

A Molded Interconnect Device (MID) is a highly versatile component that integrates both mechanical and electrical functions within a single molded thermoplastic unit. This technology allows for the incorporation of circuitry directly onto plastic substrates, combining the plastic housing and electronic interconnects into one compact and lightweight part. MIDs are increasingly used in various high-tech applications such as smartphones, automotive sensors, and healthcare devices due to their ability to facilitate miniaturization while enhancing reliability and performance. The integration of multiple functions not only reduces the size and weight of the product but also simplifies assembly processes, reduces the number of components required, and ultimately, cuts overall manufacturing costs.

How Are Technological Advancements Shaping the MID Industry?

Technological advancements play a crucial role in expanding the capabilities and applications of MIDs. Innovations in 3D molding processes and laser direct structuring (LDS) have particularly been transformative. LDS technology, for example, allows for greater precision in creating intricate circuit paths on three-dimensional surfaces, vastly increasing the design flexibility and the types of products that can benefit from MID technology. Additionally, advancements in materials science, including the development of highly conductive polymer composites and improved plating techniques, enhance the electrical performance and durability of MIDs. These technological improvements enable the production of more complex and reliable devices across a broader range of industries.

What Market Trends Are Influencing the Adoption of Molded Interconnect Devices?

The adoption of MIDs is heavily influenced by the ongoing trends in miniaturization and integration within the electronics market. As devices become smaller and consumer expectations for device functionality increase, manufacturers are turning to MID technology to meet these demands. This trend is evident in the consumer electronics sector, where there is a continuous push for thinner, more feature-packed devices. In the automotive industry, the increasing electronic content per vehicle, particularly for advanced safety and infotainment systems, drives the need for MIDs that can incorporate complex circuitry into tight spaces. Additionally, the medical sector utilizes MIDs for compact, integrated solutions in medical wearables and implants, where space and reliability are critical.

What Drives the Growth in the Molded Interconnect Devices Market?

The growth in the molded interconnect devices market is driven by several factors, reflecting the dynamic interplay of technological innovation, industry demands, and consumer behavior. Advances in 3D printing and laser structuring technologies have broadened the scope of MID applications, making them indispensable in the design and manufacture of compact electronic devices. The push for more sustainable manufacturing processes also favors MIDs, as they reduce the waste and environmental impact associated with traditional circuit boards and electronic assemblies. Furthermore, the increasing consumer demand for sophisticated, yet smaller and energy-efficient electronic products stimulates continuous growth in the MID market. Industries such as automotive, consumer electronics, and healthcare are particularly pivotal, as they increasingly rely on the integration capabilities and design flexibility offered by MIDs to innovate and enhance product offerings. These factors collectively underscore the burgeoning reliance on and expansion of the molded interconnect devices market in the modern technological landscape.

SCOPE OF STUDY:

The report analyzes the Molded Interconnect Device (MID) market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Type (Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting, Other Types); End-Use (Consumer Electronics, Telecommunications, Medical, Automotive, Industrial, Other End-Uses)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 46 Featured) -

  • 2E Mechatronic GmbH & Co. KG
  • HARTING AG & Co. KG
  • JOHNAN Corporation
  • LPKF Laser & Electronics AG
  • MID Solutions GmbH
  • Molex LLC
  • Multiple Dimensions AG
  • TE Connectivity Ltd.

AI INTEGRATIONS

We're transforming market and competitive intelligence with validated expert content and AI tools.

Instead of following the general norm of querying LLMs and Industry-specific SLMs, we built repositories of content curated from domain experts worldwide including video transcripts, blogs, search engines research, and massive amounts of enterprise, product/service, and market data.

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by increasing the Cost of Goods Sold (COGS), reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • Tariff Impact on Global Supply Chain Patterns
    • Global Economic Update
    • Molded Interconnect Device (MID) - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Advancements in 3D Molding Technologies Propel the Growth of Molded Interconnect Devices (MIDs)
    • Increasing Demand for Miniaturization in Consumer Electronics Spurs Adoption of MIDs
    • Expansion of Automotive Applications Drives Innovations in MID Technology
    • Integration of MIDs in Medical Devices Enhances Functionality and Compactness
    • Rise of IoT and Connected Devices Boosts Market Opportunities for MIDs
    • Technological Convergence in Multi-Functional Devices Amplifies Use of Molded Interconnect Devices
    • Growing Environmental Regulations Promote Development of Eco-Friendly MID Materials
    • Adoption of MID Technology in Smart Wearables Generates Market Growth
    • Advancements in Laser Direct Structuring (LDS) Techniques Expand MID Capabilities
    • Increasing Role of MIDs in Aerospace and Defense for Lightweight Solutions
    • Consumer Demand for Sleek, Integrated Interfaces Strengthens Market for MIDs
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Molded Interconnect Device (MID) Market Analysis of Annual Sales in US$ Thousand for Years 2015 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 3: World 6-Year Perspective for Molded Interconnect Device (MID) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets for Years 2025 & 2030
    • TABLE 4: World Recent Past, Current & Future Analysis for Antennae & Connectivity Modules by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 5: World 6-Year Perspective for Antennae & Connectivity Modules by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 6: World Recent Past, Current & Future Analysis for Connectors & Switches by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 7: World 6-Year Perspective for Connectors & Switches by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for Sensors by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 9: World 6-Year Perspective for Sensors by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 10: World Recent Past, Current & Future Analysis for Lighting by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 11: World 6-Year Perspective for Lighting by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 12: World Recent Past, Current & Future Analysis for Other Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 13: World 6-Year Perspective for Other Types by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 15: World 6-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 16: World Recent Past, Current & Future Analysis for Telecommunications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 17: World 6-Year Perspective for Telecommunications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 18: World Recent Past, Current & Future Analysis for Medical by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 19: World 6-Year Perspective for Medical by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 20: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 21: World 6-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 22: World Recent Past, Current & Future Analysis for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 23: World 6-Year Perspective for Industrial by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 24: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 25: World 6-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 26: USA Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 27: USA 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 28: USA Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 29: USA 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • CANADA
    • TABLE 30: Canada Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 31: Canada 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 32: Canada Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 33: Canada 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • JAPAN
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 34: Japan Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 35: Japan 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 36: Japan Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 37: Japan 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • CHINA
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 38: China Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 39: China 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 40: China Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 41: China 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • EUROPE
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 42: Europe Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 43: Europe 6-Year Perspective for Molded Interconnect Device (MID) by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2025 & 2030
    • TABLE 44: Europe Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 45: Europe 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 46: Europe Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 47: Europe 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • FRANCE
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
    • TABLE 48: France Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 49: France 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 50: France Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 51: France 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • GERMANY
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
    • TABLE 52: Germany Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 53: Germany 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 54: Germany Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 55: Germany 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • ITALY
    • TABLE 56: Italy Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 57: Italy 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 58: Italy Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 59: Italy 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • UNITED KINGDOM
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
    • TABLE 60: UK Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 61: UK 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 62: UK Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 63: UK 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • SPAIN
    • TABLE 64: Spain Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 65: Spain 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 66: Spain Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 67: Spain 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • RUSSIA
    • TABLE 68: Russia Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 69: Russia 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 70: Russia Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 71: Russia 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • REST OF EUROPE
    • TABLE 72: Rest of Europe Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 73: Rest of Europe 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 74: Rest of Europe Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 75: Rest of Europe 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • ASIA-PACIFIC
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 76: Asia-Pacific Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 77: Asia-Pacific 6-Year Perspective for Molded Interconnect Device (MID) by Geographic Region - Percentage Breakdown of Value Sales for Australia, India, South Korea and Rest of Asia-Pacific Markets for Years 2025 & 2030
    • TABLE 78: Asia-Pacific Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 79: Asia-Pacific 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 80: Asia-Pacific Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 81: Asia-Pacific 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • AUSTRALIA
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Australia for 2025 (E)
    • TABLE 82: Australia Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 83: Australia 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 84: Australia Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 85: Australia 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • INDIA
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in India for 2025 (E)
    • TABLE 86: India Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 87: India 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 88: India Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 89: India 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • SOUTH KOREA
    • TABLE 90: South Korea Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 91: South Korea 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 92: South Korea Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 93: South Korea 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • REST OF ASIA-PACIFIC
    • TABLE 94: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 95: Rest of Asia-Pacific 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 96: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 97: Rest of Asia-Pacific 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • LATIN AMERICA
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Latin America for 2025 (E)
    • TABLE 98: Latin America Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 99: Latin America 6-Year Perspective for Molded Interconnect Device (MID) by Geographic Region - Percentage Breakdown of Value Sales for Argentina, Brazil, Mexico and Rest of Latin America Markets for Years 2025 & 2030
    • TABLE 100: Latin America Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 101: Latin America 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 102: Latin America Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 103: Latin America 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • ARGENTINA
    • TABLE 104: Argentina Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 105: Argentina 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 106: Argentina Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 107: Argentina 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • BRAZIL
    • TABLE 108: Brazil Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 109: Brazil 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 110: Brazil Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 111: Brazil 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • MEXICO
    • TABLE 112: Mexico Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 113: Mexico 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 114: Mexico Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 115: Mexico 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • REST OF LATIN AMERICA
    • TABLE 116: Rest of Latin America Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 117: Rest of Latin America 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 118: Rest of Latin America Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 119: Rest of Latin America 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • MIDDLE EAST
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Middle East for 2025 (E)
    • TABLE 120: Middle East Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 121: Middle East 6-Year Perspective for Molded Interconnect Device (MID) by Geographic Region - Percentage Breakdown of Value Sales for Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets for Years 2025 & 2030
    • TABLE 122: Middle East Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 123: Middle East 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 124: Middle East Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 125: Middle East 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • IRAN
    • TABLE 126: Iran Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 127: Iran 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 128: Iran Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 129: Iran 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • ISRAEL
    • TABLE 130: Israel Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 131: Israel 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 132: Israel Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 133: Israel 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • SAUDI ARABIA
    • TABLE 134: Saudi Arabia Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 135: Saudi Arabia 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 136: Saudi Arabia Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 137: Saudi Arabia 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • UNITED ARAB EMIRATES
    • TABLE 138: UAE Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 139: UAE 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 140: UAE Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 141: UAE 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • REST OF MIDDLE EAST
    • TABLE 142: Rest of Middle East Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 143: Rest of Middle East 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 144: Rest of Middle East Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 145: Rest of Middle East 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • AFRICA
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Africa for 2025 (E)
    • TABLE 146: Africa Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 147: Africa 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 148: Africa Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 149: Africa 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030

IV. COMPETITION