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市場調查報告書

商品編碼

1856905

模塑互連市場預測至2032年：按產品、材料、技術、組件、應用、最終用戶和地區分類的全球分析

Molded Interconnect Device Market Forecasts to 2032 - Global Analysis By Product (Two-Dimensional (2D) MID, Three-Dimensional (3D) MID, and Other Products), Material, Technology, Component, Application, End User and By Geography

出版日期: 2025年10月01日 | 出版商:

Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

簡介目錄圖表

根據 Stratistics MRC 的數據，預計到 2025 年，全球模塑互連市場規模將達到 20.6 億美元，到 2032 年將達到 45.7 億美元，預測期內複合年成長率為 12.0%。

模塑互連裝置 (MID) 是一種先進的電子解決方案，它將結構和電子功能整合於3D塑膠基體中。導電路徑可以直接成型於模塑塑膠元件內，從而減少對傳統電路基板的依賴。 MID 廣泛應用於汽車、醫療、消費性電子和電訊等領域，具有尺寸較小、重量更輕、耐用性更強等優勢。 MID 支援複雜緊湊的設計，同時提升裝置的整體效能。

對物聯網設備和5G技術的需求不斷成長

智慧型設備和下一代連接技術的普及加速了對小型多功能組件（例如模塑電路組件）的需求。模塑積體電路 (MID) 可將電子電路直接整合到 3D 塑膠結構中，使其成為空間受限的物聯網應用的理想選擇。隨著 5G 網路的全球部署，通訊和消費性電子產業在天線、感測器和開關等領域對 MID 的應用正在加速成長。電子設備小型化和輕量化的趨勢進一步推動了市場發展。雷射直接成型 (LDS) 和多色注塑成型等技術進步正在提高設計精度和電氣性能。這些創新使 MID 成為穿戴式裝置、智慧家庭系統和邊緣運算設備的關鍵建構模組。

高昂的初始製造和模具成本

安裝LDS系統和精密成型設備需要大量資金投入，這對中小型製造商尤其具有挑戰性。將機械和電子功能整合到單塊基板需要先進的工程技術和嚴格的品管。廣泛的應用客製化進一步增加了原型製作和檢驗成本。雖然自動化和模組化模具的出現有助於降低這些成本，但擴充性仍然是一個問題。這些經濟限制因素可能會減緩市場擴張，尤其是在對成本敏感的地區。

在醫療保健和醫療設備推廣應用

助聽器、診斷感測器和穿戴式監測器等設備受益於微型醫療器材（MID）帶來的小型化和耐用性。無線通訊和物聯網在病患監護系統中的整合正在拓展微型醫療器材的應用範圍。生物相容性材料和精密成型技術的進步使得更安全、更符合人體工學的醫療設計成為可能。監管機構對數位醫療和遠距離診斷的支持進一步推動了市場需求。隨著個人化醫療和智慧治療的發展，微型醫療器材在下一代醫療解決方案中發揮關鍵作用。

替代互連技術

替代技術具有成本優勢，並且與傳統製造流程相容。增材電子和印刷導電油墨的創新也在某些應用領域挑戰了MID（模組化積體電路）的主導地位。一些製造商傾向於採用更易於升級和維護的模組化設計，從而減少對整合結構的依賴。奈米材料和導電聚合物的快速發展正在豐富互連領域的格局。如果缺乏持續創新，MID將面臨被更具適應性或成本效益的技術所取代的風險。

新冠疫情的影響：

新冠疫情擾亂了全球供應鏈，導致製造資訊技術（MID）生產放緩，並影響了各行業的零件供應。停工和勞動力短缺尤其影響了精密工具和半導體整合產業的生產計劃。然而，這場危機也加速了數位轉型，增加了對物聯網醫療保健和遠距離診斷的需求。醫療穿戴式裝置和非接觸式裝置等領域的MID應用顯著成長。後疫情時代的策略重點在於靈活生產、數位化庫存系統和在地採購，以降低未來可能出現的干擾。

預計在預測期內，液晶聚合物（LCP）細分市場將成為最大的細分市場。

由於其優異的熱穩定性、低吸濕性和卓越的介電性能，液晶聚合物 (LCP) 預計將在預測期內佔據最大的市場佔有率。 LCP 適用於天線、射頻模組和 5G 組件等高頻應用。它與 LDS 技術的兼容性使其即使在複雜形狀中也能實現精確的電路配置。隨著對小型化、高速電子產品的需求不斷成長，LCP 在嚴苛環境下也能提供無與倫比的效能。近期發展趨勢包括基於 LCP 的感測器外殼以及用於汽車和通訊行業的超薄連接器。

預計在預測期內，醫療設備領域將實現最高的複合年成長率。

預計在預測期內，醫療設備領域將保持最高的成長率，這主要得益於市場對小型化、多功能和生物相容性組件的需求。微型診斷設備（MID）有助於將感測器、天線和電路整合到符合人體工學的醫療工具和穿戴式裝置中。遠端患者監護和智慧診斷的興起正在拓展MID在醫療保健領域的應用。新興趨勢包括一次性診斷試劑套件和具有無線遙測功能的植入式設備。監管機構正透過加快核准和推行數位化醫療計畫來支持技術創新。

最大佔有率區域：

亞太地區預計將在預測期內佔據最大的市場佔有率，這主要得益於其強勁的電子製造業和不斷擴展的通訊基礎設施。中國、日本和韓國等國正大力投資5G部署和消費性電子產品生產。政府為促進半導體和元件本地化生產而採取的舉措，正在推動對微型積體電路（MID）的需求。該地區在汽車電子和工業自動化領域的領先地位，進一步鞏固了其市場地位。全球原始設備製造商（OEM）與區域供應商之間的策略聯盟，正在加速技術轉移和創新。

複合年成長率最高的地區：

預計在預測期內，北美地區將呈現最高的複合年成長率，這主要得益於其技術領先地位和強勁的研發投入。美國正在航太、國防和先進醫療設備領域開發行動資訊技術（MID）應用。智慧製造和人工智慧驅動的設計工具的普及，正在提升MID的客製化程度和效能。對數位健康和互聯基礎設施的監管支持，正在拓展市場機會。關鍵發展方向包括支援MID的穿戴式裝置、汽車感測器和工業IoT模組。

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公司簡介
- 對其他市場參與者（最多 3 家公司）進行全面分析
- 對主要企業進行SWOT分析（最多3家公司）
區域細分
- 根據客戶興趣對主要國家進行市場估算、預測和複合年成長率分析（註：基於可行性檢查）
競爭基準化分析
- 基於產品系列、地域覆蓋和策略聯盟對主要企業基準化分析

北美洲
- 美國
- 加拿大
- 墨西哥
歐洲
- 德國
- 英國
- 義大利
- 法國
- 西班牙
- 其他歐洲
亞太地區
- 日本
- 中國
- 印度
- 澳洲
- 紐西蘭
- 韓國
- 亞太其他地區
南美洲
- 阿根廷
- 巴西
- 智利
- 其他南美洲國家
中東和非洲
- 沙烏地阿拉伯
- 阿拉伯聯合大公國
- 卡達
- 南非
- 其他中東和非洲地區

第12章重大進展

協議、夥伴關係、合作和合資企業
收購與併購
新產品上市
業務拓展
其他關鍵策略

第13章：企業概況

TE Connectivity
Element Solutions
Molex LLC
Cicor Group
Amphenol Corporation
Sumitomo Electric Industries, Ltd.
LPKF Laser & Electronics AG
RTP Company
Taoglas Limited
Multiple Dimensions AG
KYOCERA AVX Components Corporation
Teprosa GmbH
HARTING Technology Group
2E mechatronic GmbH & Co. KG
MID Solutions GmbH

簡介目錄圖表

Product Code: SMRC31777

According to Stratistics MRC, the Global Molded Interconnect Device Market is accounted for $2.06 billion in 2025 and is expected to reach $4.57 billion by 2032 growing at a CAGR of 12.0% during the forecast period. A Molded Interconnect Device (MID) is a sophisticated electronic solution that combines structural and electronic functions within a three-dimensional plastic base. It allows conductive pathways to be formed directly on molded plastic components, reducing reliance on conventional circuit boards. MIDs find applications across automotive, medical, consumer electronics, and telecom sectors, offering benefits like miniaturization, weight savings, and greater durability. They support intricate, compact designs while enhancing overall device performance.

Market Dynamics:

Driver:

Rising demand for iot devices and 5g technology

The proliferation of smart devices and next-generation connectivity is accelerating the need for compact, multifunctional components like molded interconnect devices. MIDs enable the integration of electronic circuits directly onto 3D plastic structures, making them ideal for space-constrained IoT applications. As 5G networks expand globally, telecom and consumer electronics sectors are increasingly deploying MIDs in antennas, sensors, and switches. The trend toward miniaturization and lightweight electronics is further boosting market momentum. Technological advancements such as laser direct structuring (LDS) and multi-shot molding are enhancing design precision and electrical performance. These innovations are positioning MIDs as essential building blocks in wearables, smart home systems, and edge computing devices.

Restraint:

High initial manufacturing and tooling costs

Setting up LDS systems and precision molding equipment requires significant capital investment, particularly challenging for small and mid-sized manufacturers. The integration of mechanical and electronic functions into a single substrate demands advanced engineering and rigorous quality control. Customization across diverse applications further increases prototyping and validation expenses. Although automation and modular tooling are emerging to reduce these costs, scalability remains a concern. These financial constraints can slow market expansion, especially in cost-sensitive regions.

Opportunity:

Increased adoption in healthcare and medical devices

Devices such as hearing aids, diagnostic sensors, and wearable monitors benefit from MID-enabled miniaturization and durability. The integration of wireless communication and IoT in patient monitoring systems is expanding MID applications. Advances in biocompatible materials and precision molding are enabling safer and more ergonomic medical designs. Regulatory support for digital health and remote diagnostics is further propelling market demand. As personalized medicine and smart therapeutics evolve, MIDs are playing a pivotal role in next-generation healthcare solutions.

Threat:

Alternative interconnect technologies

The alternatives offer cost benefits and compatibility with conventional manufacturing workflows. Innovations in additive electronics and printed conductive inks are also challenging MID dominance in select applications. Some manufacturers prefer modular designs that allow easier upgrades and maintenance, reducing reliance on integrated structures. Rapid advancements in nanomaterials and conductive polymers are diversifying the interconnect landscape. Without continuous innovation, MIDs risk being displaced by more adaptable or cost-effective technologies.

Covid-19 Impact:

The COVID-19 pandemic disrupted global supply chains, delaying MID production and affecting component availability across industries. Lockdowns and workforce shortages impacted manufacturing timelines, particularly for precision tooling and semiconductor integration. However, the crisis accelerated digital transformation, increasing demand for IoT-enabled healthcare and remote diagnostics. MID applications in medical wearables and contactless devices saw a notable rise. Post-pandemic strategies now emphasize flexible production, digital inventory systems, and localized sourcing to mitigate future disruptions.

The liquid crystal polymer (LCP) segment is expected to be the largest during the forecast period

The liquid crystal polymer (LCP) segment is expected to account for the largest market share during the forecast period, due to its exceptional thermal stability, low moisture absorption, and superior dielectric properties. LCPs are well-suited for high-frequency applications such as antennas, RF modules, and 5G components. Their compatibility with LDS technology allows precise circuit structuring on complex geometries. As demand grows for miniaturized and high-speed electronics, LCPs offer unmatched performance in demanding environments. Recent developments include LCP-based sensor housings and ultra-thin connectors for automotive and telecom sectors.

The medical devices segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the medical devices segment is predicted to witness the highest growth rate, driven by the need for compact, multifunctional, and biocompatible components. MIDs facilitate the integration of sensors, antennas, and circuitry into ergonomic medical tools and wearables. The rise of remote patient monitoring and smart diagnostics is expanding MID applications in healthcare. Emerging trends include disposable diagnostic kits and implantable devices with wireless telemetry. Regulatory bodies are supporting innovation through fast-track approvals and digital health initiatives.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share, supported by robust electronics manufacturing and expanding telecom infrastructure. Countries like China, Japan, and South Korea are investing heavily in 5G deployment and consumer electronics production. Government initiatives promoting local semiconductor and component fabrication are boosting MID demand. The region's leadership in automotive electronics and industrial automation further strengthens its market position. Strategic collaborations between global OEMs and regional suppliers are accelerating technology transfer and innovation.

Region with highest CAGR:

Over the forecast period, the North America region is anticipated to exhibit the highest CAGR, driven by technological leadership and strong R&D investments. The U.S. is pioneering MID applications in aerospace, defense, and advanced medical devices. Adoption of smart manufacturing and AI-driven design tools is enhancing MID customization and performance. Regulatory support for digital health and connected infrastructure is expanding market opportunities. Key developments include MID-enabled wearables, automotive sensors, and industrial IoT modules.

Key players in the market

Some of the key players in Molded Interconnect Device Market include TE Connectivity, Element Solutions, Molex LLC, Cicor Group, Amphenol Corporation, Sumitomo Electric Industries, Ltd., LPKF Laser & Electronics AG, RTP Company, Taoglas Limited, Multiple Dimensions AG, KYOCERA AVX Components Corporation, Teprosa GmbH, HARTING Technology Group, 2E mechatronic GmbH & Co. KG, and MID Solutions GmbH.

Key Developments:

In October 2025, Molex announced that it has signed an agreement to acquire Smiths Interconnect. Smiths Interconnect, a subsidiary of United Kingdom-based Smiths Group plc, is a leading provider of high-reliability connectivity products and solutions serving the aerospace and defense, medical, semiconductor test and industrial markets.

In March 2024, Element Solutions Inc announced an agreement to sell its flexographic printing plate business, MacDermid Graphics Solutions, to XSYS, a global specialist provider in the flexographic printing industry, for an enterprise value of approximately $325 million. The MacDermid Graphics Solutions business transferring to XSYS constitutes substantially all of Element Solutions' Graphics Solutions reporting vertical.

Products Covered:

Two-Dimensional (2D) MID
Three-Dimensional (3D) MID
Other Products

Materials Covered:

Thermoplastics
Other Thermoplasticsd

Technologies Covered:

Laser Direct Structuring (LDS)
Film Insert Molding (FIM)
Two-Shot Molding
Other Technologies

Components Covered:

Antennas
Connectors
Sensors
Switches
Lighting Components

Applications Covered:

Automotive
Consumer Electronics
Medical Devices
Telecommunications
Industrial
Other Applications

End Users Covered:

Original Equipment Manufacturers (OEMs)
Electronics Manufacturing Services

Regions Covered:

North America
- US
- Canada
- Mexico
Europe
- Germany
- UK
- Italy
- France
- Spain
- Rest of Europe
Asia Pacific
- Japan
- China
- India
- Australia
- New Zealand
- South Korea
- Rest of Asia Pacific
South America
- Argentina
- Brazil
- Chile
- Rest of South America
Middle East & Africa
- Saudi Arabia
- UAE
- Qatar
- South Africa
- Rest of Middle East & Africa

What our report offers:

Market share assessments for the regional and country-level segments
Strategic recommendations for the new entrants
Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
Strategic recommendations in key business segments based on the market estimations
Competitive landscaping mapping the key common trends
Company profiling with detailed strategies, financials, and recent developments
Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

Company Profiling
- Comprehensive profiling of additional market players (up to 3)
- SWOT Analysis of key players (up to 3)
Regional Segmentation
- Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
Competitive Benchmarking
- Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

1 Executive Summary

2 Preface

2.1 Abstract
2.2 Stake Holders
2.3 Research Scope
2.4 Research Methodology
- 2.4.1 Data Mining
- 2.4.2 Data Analysis
- 2.4.3 Data Validation
- 2.4.4 Research Approach
2.5 Research Sources
- 2.5.1 Primary Research Sources
- 2.5.2 Secondary Research Sources
- 2.5.3 Assumptions

3 Market Trend Analysis

3.1 Introduction
3.2 Drivers
3.3 Restraints
3.4 Opportunities
3.5 Threats
3.6 Product Analysis
3.7 Technology Analysis
3.8 Application Analysis
3.9 End User Analysis
3.10 Emerging Markets
3.11 Impact of Covid-19

4 Porters Five Force Analysis

4.1 Bargaining power of suppliers
4.2 Bargaining power of buyers
4.3 Threat of substitutes
4.4 Threat of new entrants
4.5 Competitive rivalry

5 Global Molded Interconnect Device Market, By Product

5.1 Introduction
5.2 Two-Dimensional (2D) MID
5.3 Three-Dimensional (3D) MID
5.4 Other Products

6 Global Molded Interconnect Device Market, By Material

6.1 Introduction
6.2 Thermoplastics
- 6.2.1 Polycarbonate (PC)
- 6.2.2 Liquid Crystal Polymer (LCP)
- 6.2.3 Polybutylene Terephthalate (PBT)
- 6.2.4 Polyphthalamide (PPA)
6.3 Other Thermoplastics

7 Global Molded Interconnect Device Market, By Technology

7.1 Introduction
7.2 Laser Direct Structuring (LDS)
7.3 Film Insert Molding (FIM)
7.4 Two-Shot Molding
7.5 Other Technologies

8 Global Molded Interconnect Device Market, By Component

8.1 Introduction
8.2 Antennas
8.3 Connectors
8.4 Sensors
8.5 Switches
8.6 Lighting Components

9 Global Molded Interconnect Device Market, By Application

9.1 Introduction
9.2 Automotive
- 9.2.1 Steering Wheel Controls
- 9.2.2 Sensors & Switches
- 9.2.3 Lighting Systems
9.3 Consumer Electronics
- 9.3.1 Smartphones & Wearables
- 9.3.2 Home Appliances
9.4 Medical Devices
- 9.4.1 Diagnostic Equipment
- 9.4.2 Surgical Instruments
9.5 Telecommunications
- 9.5.1 Antenna Modules
- 9.5.2 Routers & Modems
9.6 Industrial
- 9.6.1 Automation Equipment
- 9.6.2 Control Systems
9.7 Other Applications

10 Global Molded Interconnect Device Market, By End User

10.1 Introduction
10.2 Original Equipment Manufacturers (OEMs)
10.3 Electronics Manufacturing Services

11 Global Molded Interconnect Device Market, By Geography

11.1 Introduction
11.2 North America
- 11.2.1 US
- 11.2.2 Canada
- 11.2.3 Mexico
11.3 Europe
- 11.3.1 Germany
- 11.3.2 UK
- 11.3.3 Italy
- 11.3.4 France
- 11.3.5 Spain
- 11.3.6 Rest of Europe
11.4 Asia Pacific
- 11.4.1 Japan
- 11.4.2 China
- 11.4.3 India
- 11.4.4 Australia
- 11.4.5 New Zealand
- 11.4.6 South Korea
- 11.4.7 Rest of Asia Pacific
11.5 South America
- 11.5.1 Argentina
- 11.5.2 Brazil
- 11.5.3 Chile
- 11.5.4 Rest of South America
11.6 Middle East & Africa
- 11.6.1 Saudi Arabia
- 11.6.2 UAE
- 11.6.3 Qatar
- 11.6.4 South Africa
- 11.6.5 Rest of Middle East & Africa

12 Key Developments

12.1 Agreements, Partnerships, Collaborations and Joint Ventures
12.2 Acquisitions & Mergers
12.3 New Product Launch
12.4 Expansions
12.5 Other Key Strategies

13 Company Profiling

13.1 TE Connectivity
13.2 Element Solutions
13.3 Molex LLC
13.4 Cicor Group
13.5 Amphenol Corporation
13.6 Sumitomo Electric Industries, Ltd.
13.7 LPKF Laser & Electronics AG
13.8 RTP Company
13.9 Taoglas Limited
13.10 Multiple Dimensions AG
13.11 KYOCERA AVX Components Corporation
13.12 Teprosa GmbH
13.13 HARTING Technology Group
13.14 2E mechatronic GmbH & Co. KG
13.15 MID Solutions GmbH

簡介目錄圖表

List of Tables

Table 1 Global Molded Interconnect Device Market Outlook, By Region (2024-2032) ($MN)
Table 2 Global Molded Interconnect Device Market Outlook, By Product (2024-2032) ($MN)
Table 3 Global Molded Interconnect Device Market Outlook, By Two-Dimensional (2D) MID (2024-2032) ($MN)
Table 4 Global Molded Interconnect Device Market Outlook, By Three-Dimensional (3D) MID (2024-2032) ($MN)
Table 5 Global Molded Interconnect Device Market Outlook, By Other Products (2024-2032) ($MN)
Table 6 Global Molded Interconnect Device Market Outlook, By Material (2024-2032) ($MN)
Table 7 Global Molded Interconnect Device Market Outlook, By Thermoplastics (2024-2032) ($MN)
Table 8 Global Molded Interconnect Device Market Outlook, By Polycarbonate (PC) (2024-2032) ($MN)
Table 9 Global Molded Interconnect Device Market Outlook, By Liquid Crystal Polymer (LCP) (2024-2032) ($MN)
Table 10 Global Molded Interconnect Device Market Outlook, By Polybutylene Terephthalate (PBT) (2024-2032) ($MN)
Table 11 Global Molded Interconnect Device Market Outlook, By Polyphthalamide (PPA) (2024-2032) ($MN)
Table 12 Global Molded Interconnect Device Market Outlook, By Other Thermoplastics (2024-2032) ($MN)
Table 13 Global Molded Interconnect Device Market Outlook, By Technology (2024-2032) ($MN)
Table 14 Global Molded Interconnect Device Market Outlook, By Laser Direct Structuring (LDS) (2024-2032) ($MN)
Table 15 Global Molded Interconnect Device Market Outlook, By Film Insert Molding (FIM) (2024-2032) ($MN)
Table 16 Global Molded Interconnect Device Market Outlook, By Two-Shot Molding (2024-2032) ($MN)
Table 17 Global Molded Interconnect Device Market Outlook, By Other Technologies (2024-2032) ($MN)
Table 18 Global Molded Interconnect Device Market Outlook, By Component (2024-2032) ($MN)
Table 19 Global Molded Interconnect Device Market Outlook, By Antennas (2024-2032) ($MN)
Table 20 Global Molded Interconnect Device Market Outlook, By Connectors (2024-2032) ($MN)
Table 21 Global Molded Interconnect Device Market Outlook, By Sensors (2024-2032) ($MN)
Table 22 Global Molded Interconnect Device Market Outlook, By Switches (2024-2032) ($MN)
Table 23 Global Molded Interconnect Device Market Outlook, By Lighting Components (2024-2032) ($MN)
Table 24 Global Molded Interconnect Device Market Outlook, By Application (2024-2032) ($MN)
Table 25 Global Molded Interconnect Device Market Outlook, By Automotive (2024-2032) ($MN)
Table 26 Global Molded Interconnect Device Market Outlook, By Steering Wheel Controls (2024-2032) ($MN)
Table 27 Global Molded Interconnect Device Market Outlook, By Sensors & Switches (2024-2032) ($MN)
Table 28 Global Molded Interconnect Device Market Outlook, By Lighting Systems (2024-2032) ($MN)
Table 29 Global Molded Interconnect Device Market Outlook, By Consumer Electronics (2024-2032) ($MN)
Table 30 Global Molded Interconnect Device Market Outlook, By Smartphones & Wearables (2024-2032) ($MN)
Table 31 Global Molded Interconnect Device Market Outlook, By Home Appliances (2024-2032) ($MN)
Table 32 Global Molded Interconnect Device Market Outlook, By Medical Devices (2024-2032) ($MN)
Table 33 Global Molded Interconnect Device Market Outlook, By Diagnostic Equipment (2024-2032) ($MN)
Table 34 Global Molded Interconnect Device Market Outlook, By Surgical Instruments (2024-2032) ($MN)
Table 35 Global Molded Interconnect Device Market Outlook, By Telecommunications (2024-2032) ($MN)
Table 36 Global Molded Interconnect Device Market Outlook, By Antenna Modules (2024-2032) ($MN)
Table 37 Global Molded Interconnect Device Market Outlook, By Routers & Modems (2024-2032) ($MN)
Table 38 Global Molded Interconnect Device Market Outlook, By Industrial (2024-2032) ($MN)
Table 39 Global Molded Interconnect Device Market Outlook, By Automation Equipment (2024-2032) ($MN)
Table 40 Global Molded Interconnect Device Market Outlook, By Control Systems (2024-2032) ($MN)
Table 41 Global Molded Interconnect Device Market Outlook, By Other Applications (2024-2032) ($MN)
Table 42 Global Molded Interconnect Device Market Outlook, By End User (2024-2032) ($MN)
Table 43 Global Molded Interconnect Device Market Outlook, By Original Equipment Manufacturers (OEMs) (2024-2032) ($MN)
Table 44 Global Molded Interconnect Device Market Outlook, By Electronics Manufacturing Services (2024-2032) ($MN)