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1416753

模製電路元件 (MID) 市場報告：2030 年趨勢、預測與競爭分析

Molded Interconnect Device (MID) Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 - page report | 商品交期: 3個工作天內

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簡介目錄

模製電路元件 (MID) 趨勢與預測

預計到 2030 年，全球模製電路元件 (MID) 市場將達到 30 億美元，2024 年至 2030 年年複合成長率為 10.8%。該市場的關鍵促進因素是對輕質耐用電子元件的需求不斷成長以及對小型化電子元件的需求不斷成長。全球模製電路元件 (MID) 市場的未來前景廣闊，通訊、消費性電器產品、汽車、醫療、工業、軍事和航太市場充滿機會。

模製電路元件 (MID) 市場洞察

Lucintel 預測，感測器將在預測期內實現最高成長，因為它們將用於各種應用，例如自適應刮痕控制系統和氣候控制應用。

預計該市場將在預測期內見證汽車的最高成長。

由於該地區擁有技術純熟勞工以及領先的原始設備製造商(OEM)，預計亞太地區將在預測期內實現最高成長。

常問問題

Q1.市場規模為：

A1. 到 2030 年，全球模製電路元件 (MID) 市場預計將達到 30 億美元。

Q2.市場成長預測是多少：

A2. 2024 年至 2030 年，全球模製電路元件 (MID) 市場預計將以 10.8% 的年複合成長率成長。

Q3. 影響市場成長的關鍵促進因素是：

A3. 該市場的關鍵促進因素是對輕質耐用電子設備的需求不斷成長以及對小型化電子設備的需求不斷成長。

Q4.市場的主要細分市場是：

A4. 模製電路元件 (MID) 市場前景廣闊，通訊、消費性電器產品、汽車、醫療、工業、軍事和航太市場充滿機會。

Q5.市場的主要企業是：

A5. 一些主要的模製電路元件 (MID) 公司是：

  • Molex
  • TE Connectivity
  • Amphenol
  • LPKF Laser &Electronics
  • Taoglas

Q6.未來最大的細分市場是什麼？

A6.Lucintel 預計預測期內成長最高，因為感測器將用於各種應用，例如自適應刮痕控制系統和氣候控制應用。

Q7. 未來五年預計哪些地區的市場成長最大？

A7. 由於該地區擁有技術純熟勞工和領先的OEM製造商，預計亞太地區將在預測期內實現最高成長。

Q8. 可以客製化報告嗎？

A8. 是的，Lucintel 列出了 10% 的客製化服務，無需額外費用。

目錄

第1章執行摘要

第2章全球模製電路元件（MID）市場：市場動態

  • 簡介、背景、分類
  • 供應鏈
  • 產業促進因素與挑戰

第3章 2018-2030年市場趨勢及預測分析

  • 宏觀經濟趨勢（2018-2023）與預測（2024-2030）
  • 全球模製電路元件（MID）市場趨勢（2018-2023）與預測（2024-2030）
  • 按產品類型分類的全球模製電路元件 (MID) 市場
    • 天線及連接模組
    • 感應器
    • 連接器和開關
    • 照明系統
    • 其他
  • 按製程分類的全球模製電路元件 (MID) 市場
    • 雷射直接成型
    • 二次注射成型
    • 電影技術
  • 按最終用途行業分類的全球模製電路元件 (MID) 市場
    • 電訊
    • 家用電器
    • 車
    • 醫療保健
    • 工業的
    • 軍事和航太
    • 其他

第4章 2018-2030年區域市場趨勢及預測分析

  • 按地區分類的全球模製電路元件 (MID) 市場
  • 北美模製電路元件 (MID) 市場
  • 歐洲模製電路元件（MID）市場
  • 亞太模製電路元件 (MID) 市場
  • 其他地區模製電路元件（MID）市場

第5章 競爭分析

  • 產品系列分析
  • 營運整合
  • 波特五力分析

第6章 成長機會與策略分析

  • 成長機會分析
    • 按產品類型分類的全球模製電路元件 (MID) 市場成長機會
    • 全球模製電路元件 (MID) 市場成長機會（按製程）
    • 最終用途產業的全球模製電路元件 (MID) 市場成長機會
    • 全球模製電路元件 (MID) 市場成長機會（按地區）
  • 全球模製電路元件（MID）市場新趨勢
  • 戰略分析
    • 新產品開發
    • 擴大全球模製電路元件（MID）市場的產能
    • 全球模製電路元件 (MID) 市場的合併、收購和合資企業
    • 認證和許可

第7章主要企業概況

  • Molex
  • TE Connectivity
  • Amphenol
  • LPKF Laser & Electronics
  • Taoglas
簡介目錄

Molded Interconnect Device (MID) Trends and Forecast

The future of the global molded interconnect device (MID) market looks promising with opportunities in the telecommunication, consumer electronic, automotive, medical, industrial, and military & aerospace markets. The global molded interconnect device (MID) market is expected to reach an estimated $3 billion by 2030 with a CAGR of 10.8% from 2024 to 2030. The major drivers for this market are growing demand for lightweight and durable electronic devices and increasing demand for miniaturized electronic devices.

A more than 150-page report is developed to help in your business decisions.

Molded Interconnect Device (MID) by Segment

The study includes a forecast for the global molded interconnect device (MID) by product type, process, end use industry, and region.

Molded Interconnect Device (MID) Market by Product Type [Shipment Analysis by Value from 2018 to 2030]:

  • Antennae & Connectivity Modules
  • Sensors
  • Connectors & Switches
  • Lighting Systems
  • Others

Molded Interconnect Device (MID) Market by Process [Shipment Analysis by Value from 2018 to 2030]:

  • Laser Direct Structuring
  • Two-Shot Molding
  • Film Techniques

Molded Interconnect Device (MID) Market by End Use Industry [Shipment Analysis by Value from 2018 to 2030]:

  • Telecommunications
  • Consumer Electronics
  • Automotive
  • Medical
  • Industrial
  • Military & Aerospace
  • Others

Molded Interconnect Device (MID) Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Molded Interconnect Device (MID) Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies molded interconnect device (MID) companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the molded interconnect device (MID) companies profiled in this report include-

  • Molex
  • TE Connectivity
  • Amphenol
  • LPKF Laser & Electronics
  • Taoglas

Molded Interconnect Device (MID) Market Insights

Lucintel forecasts that sensor is expected to witness the highest growth over the forecast period due to its variety of application like adaptive scrase control systems and in climate control applications.

Within this market, automotive is expected to witness the highest growth over the forecast period.

APAC is expected to witness highest growth over the forecast period due to availability of skilled labor and presence of major original equipment manufacturers in the region.

Features of the Global Molded Interconnect Device (MID) Market

Market Size Estimates: Molded interconnect device (MID) market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Molded interconnect device (MID) market size by product type, process, end use industry, and region in terms of value ($B).

Regional Analysis: Molded interconnect device (MID) market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different product types, processes, end use industries, and regions for the molded interconnect device (MID) market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the molded interconnect device (MID) market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the molded interconnect device (MID) market size?

Answer: The global molded interconnect device (MID) market is expected to reach an estimated $3 billion by 2030.

Q2. What is the growth forecast for molded interconnect device (MID) market?

Answer: The global molded interconnect device (MID) market is expected to grow with a CAGR of 10.8% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the molded interconnect device (MID) market?

Answer: The major drivers for this market are growing demand for lightweight and durable electronic devices and increasing demand for miniaturized electronic devices.

Q4. What are the major segments for molded interconnect device (MID) market?

Answer: The future of the molded interconnect device (MID) market looks promising with opportunities in the telecommunication, consumer electronic, automotive, medical, industrial, and military & aerospace markets.

Q5. Who are the key molded interconnect device (MID) market companies?

Answer: Some of the key molded interconnect device (MID) companies are as follows:

  • Molex
  • TE Connectivity
  • Amphenol
  • LPKF Laser & Electronics
  • Taoglas

Q6. Which molded interconnect device (MID) market segment will be the largest in future?

Answer: Lucintel forecasts that sensor is expected to witness the highest growth over the forecast period due to its variety of application like adaptive scrase control systems and in climate control applications.

Q7. In molded interconnect device (MID) market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to availability of skilled labor and presence of major original equipment manufacturers in the region.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the molded interconnect device (MID) market by product type (antennae & connectivity modules, sensors, connectors & switches, lighting systems, and others), process (laser direct structuring, two-shot molding, and film techniques), end use industry (telecommunications, consumer electronics, automotive, medical, industrial, military & aerospace, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Molded Interconnect Device (MID) Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Molded Interconnect Device (MID) Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Molded Interconnect Device (MID) Market by Product Type
    • 3.3.1: Antennae & Connectivity Modules
    • 3.3.2: Sensors
    • 3.3.3: Connectors & Switches
    • 3.3.4: Lighting Systems
    • 3.3.5: Others
  • 3.4: Global Molded Interconnect Device (MID) Market by Process
    • 3.4.1: Laser Direct Structuring
    • 3.4.2: Two-Shot Molding
    • 3.4.3: Film Techniques
  • 3.5: Global Molded Interconnect Device (MID) Market by End Use Industry
    • 3.5.1: Telecommunications
    • 3.5.2: Consumer Electronics
    • 3.5.3: Automotive
    • 3.5.4: Medical
    • 3.5.5: Industrial
    • 3.5.6: Military & Aerospace
    • 3.5.7: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Molded Interconnect Device (MID) Market by Region
  • 4.2: North American Molded Interconnect Device (MID) Market
    • 4.2.2: North American Molded Interconnect Device (MID) Market by End Use Industry: Telecommunications, Consumer Electronics, Automotive, Medical, Industrial, Military & Aerospace, and Others
  • 4.3: European Molded Interconnect Device (MID) Market
    • 4.3.1: European Molded Interconnect Device (MID) Market by Product Type: Antennae & Connectivity Modules, Sensors, Connectors & Switches, Lighting Systems, and Others
    • 4.3.2: European Molded Interconnect Device (MID) Market by End Use Industry: Telecommunications, Consumer Electronics, Automotive, Medical, Industrial, Military & Aerospace, and Others
  • 4.4: APAC Molded Interconnect Device (MID) Market
    • 4.4.1: APAC Molded Interconnect Device (MID) Market by Product Type: Antennae & Connectivity Modules, Sensors, Connectors & Switches, Lighting Systems, and Others
    • 4.4.2: APAC Molded Interconnect Device (MID) Market by End Use Industry: Telecommunications, Consumer Electronics, Automotive, Medical, Industrial, Military & Aerospace, and Others
  • 4.5: ROW Molded Interconnect Device (MID) Market
    • 4.5.1: ROW Molded Interconnect Device (MID) Market by Product Type: Antennae & Connectivity Modules, Sensors, Connectors & Switches, Lighting Systems, and Others
    • 4.5.2: ROW Molded Interconnect Device (MID) Market by End Use Industry: Telecommunications, Consumer Electronics, Automotive, Medical, Industrial, Military & Aerospace, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Molded Interconnect Device (MID) Market by Product Type
    • 6.1.2: Growth Opportunities for the Global Molded Interconnect Device (MID) Market by Process
    • 6.1.3: Growth Opportunities for the Global Molded Interconnect Device (MID) Market by End Use Industry
    • 6.1.4: Growth Opportunities for the Global Molded Interconnect Device (MID) Market by Region
  • 6.2: Emerging Trends in the Global Molded Interconnect Device (MID) Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Molded Interconnect Device (MID) Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Molded Interconnect Device (MID) Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Molex
  • 7.2: TE Connectivity
  • 7.3: Amphenol
  • 7.4: LPKF Laser & Electronics
  • 7.5: Taoglas