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1594326

模製佈線設備市場：按產品類型、製程和產業分類 - 2025-2030 年全球預測

Molded Interconnect Device Market by Product Type (Antennae & Connectivity Modules, Connectors & Switches, Lighting Systems), Process (Film Techniques, Laser Direct Structuring, Two-Shot Molding), Vertical - Global Forecast 2025-2030
出版日期: | 出版商: 360iResearch | 英文 199 Pages | 商品交期: 最快1-2個工作天內

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2023年模製佈線裝置市場規模為24.4億美元，預計2024年將達27.8億美元，複合年成長率為14.33%，到2030年將達到62.4億美元。

模塑互連裝置 (MID) 是一項創新技術，它使用 3D射出成型電路載體將電氣和機械功能整合到單一封裝中。對 MID 的需求是由家用電子電器、汽車、醫療設備和通訊等各種應用中對更小尺寸、更高功能和更高性能的需求不斷成長所推動的。 MID 透過將電路和外殼組合到一個組件中來減少空間、重量和組裝成本。 MID 最終用途跨越多個產業，應用範圍從LED構裝到天線再到感測器組件。主要市場成長要素包括小型化趨勢的增強、對高效能電子設備的需求不斷增加以及 3D 電路列印技術的進步。車載電子產品的日益普及極大地影響了 MID 市場的機遇，其中 MID 整合可實現無縫連接並增強車輛功能。隨著汽車技術向電動車和自動駕駛汽車發展，MID 將成為一個重要組成部分。然而，該市場面臨初始製造成本高、缺乏標準化製造流程以及整合複雜電氣元件的技術挑戰等限制。為了克服這些障礙，公司需要專注於開發具有成本效益的 3D 電路列印方法和提高材料性能以實現更好的溫度控管等領域。此外，與高分子材料創新研發機構的合作和夥伴關係可能會推動 MID 的新能力。考慮到 MID 市場的競爭格局，主要企業正在專注於策略擴張、合併和技術創新，以保持競爭力。為了利用這條成長路徑，企業應加強對新興市場的關注，並投資先進製造技術，以製造更複雜的 MID 結構，以滿足多樣化和不斷變化的客戶需求。

主要市場統計
基準年[2023] 24.4億美元
預測年份 [2024] 27.8億美元
預測年份 [2030] 62.4億美元
複合年成長率（%） 14.33%

市場動態：快速發展的模製接線設備市場的關鍵市場洞察

供需的動態交互作用正在改變模製接線裝置市場。了解這些不斷變化的市場動態可以幫助企業做出明智的投資決策、策略決策並抓住新的商機。全面了解這些趨勢可以幫助企業降低政治、地理、技術、社會和經濟領域的風險，並了解消費行為及其對製造成本的影響，並更清楚地了解對採購趨勢的影響。

  • 市場促進因素
    • 醫療保健和消費性電子產業不斷成長的需求
    • 在汽車產業的廣泛應用
    • 雷射直接成型使用率高
  • 市場限制因素
    • 對原物料成本的擔憂
  • 市場機會
    • 模製互連裝置的技術進步
    • 投資擴大 IIoT 生態系統
  • 市場挑戰
    • 模製互連設備的相容性問題

波特五力：駕馭模具接線設備市場的策略工具

波特的五力框架是理解市場競爭格局的重要工具。波特的五力框架為評估公司的競爭地位和探索策略機會提供了清晰的方法。該框架可幫助公司評估市場動態並確定新業務的盈利。這些見解使公司能夠利用自己的優勢，解決弱點並避免潛在的挑戰，從而確保更強大的市場地位。

PESTLE分析：了解模具佈線裝置市場的外部影響

外部宏觀環境因素在塑造模具接線裝置市場的績效動態方面發揮著至關重要的作用。對政治、經濟、社會、技術、法律和環境因素的分析提供了應對這些影響所需的資訊。透過調查 PESTLE 因素，公司可以更了解潛在的風險和機會。這種分析可以幫助公司預測法規、消費者偏好和經濟趨勢的變化，並為他們做出積極主動的決策做好準備。

市場佔有率分析 了解模製接線裝置市場的競爭狀況

模製佈線設備市場的詳細市場佔有率分析可以對供應商績效進行全面評估。公司可以透過比較收益、客戶群和成長率等關鍵指標來揭示其競爭地位。該分析揭示了市場集中、分散和整合的趨勢，為供應商提供了製定策略決策所需的洞察力，使他們能夠在日益激烈的競爭中佔有一席之地。

FPNV定位矩陣模具佈線裝置市場廠商績效評估

FPNV 定位矩陣是評估模製佈線設備市場供應商的重要工具。此矩陣允許業務組織根據供應商的商務策略和產品滿意度評估供應商，從而做出符合其目標的明智決策。這四個象限使您能夠清晰、準確地分類供應商，並確定最能滿足您的策略目標的合作夥伴和解決方案。

策略分析和建議，以規劃模具佈線設備市場的成功之路

對於旨在加強其在全球市場的影響力的公司來說，對模製佈線設備市場的策略分析至關重要。透過審查關鍵資源、能力和績效指標，公司可以識別成長機會並努力改進。這種方法使您能夠克服競爭環境中的挑戰，利用新的商機，並取得長期成功。

本報告對市場進行了全面分析，涵蓋關鍵重點領域：

1. 市場滲透率：對當前市場環境的詳細審查、主要企業的廣泛資料、對其在市場中的影響力和整體影響力的評估。

2. 市場開拓：辨識新興市場的成長機會，評估現有領域的擴張潛力，並提供未來成長的策略藍圖。

3. 市場多元化：分析近期產品發布、開拓地區、關鍵產業進展、塑造市場的策略投資。

4. 競爭評估與情報：全面分析競爭格局，檢驗市場佔有率、業務策略、產品系列、認證、核准核准、專利趨勢、主要企業的技術進步等。

5. 產品開發與創新：重點在於有望推動未來市場成長的最尖端科技、研發活動和產品創新。

我們也回答重要問題，以幫助相關人員做出明智的決策：

1.目前的市場規模和未來的成長預測是多少？

2. 哪些產品、區隔市場和地區提供最佳投資機會？

3.塑造市場的主要技術趨勢和監管影響是什麼？

4.主要廠商的市場佔有率和競爭地位如何？

5. 推動供應商市場進入和退出策略的收益來源和策略機會是什麼？

目錄

第1章 前言

第2章調查方法

第3章執行摘要

第4章市場概況

第5章市場洞察

  • 市場動態
    • 促進因素
      • 醫療保健和消費性電子產業的需求不斷成長
      • 在汽車產業的廣泛應用
      • 雷射直接成型的廣泛應用
    • 抑制因素
      • 對原物料成本的擔憂
    • 機會
      • 模製互連裝置的技術進步
      • 投資擴大 IIoT 生態系統
    • 任務
      • 模製互連裝置不相容問題
  • 市場區隔分析
  • 波特五力分析
  • PESTEL分析
    • 政治的
    • 經濟
    • 社群
    • 技術的
    • 合法地
    • 環境

第6章模製佈線裝置市場：依產品類型

  • 天線及連接模組
  • 連接器和開關
  • 照明系統
  • 感應器

第7章模製佈線裝置市場：依製程分類

  • 電影技術
  • 雷射直接成型
  • 2次注射成型

第8章模製接線裝置市場：依行業分類

  • 車
  • 家電
  • 產業
  • 藥品
  • 軍事/航太
  • 通訊

第9章北美和南美模製佈線裝置市場

  • 阿根廷
  • 巴西
  • 加拿大
  • 墨西哥
  • 美國

第10章亞太模製佈線裝置市場

  • 澳洲
  • 中國
  • 印度
  • 印尼
  • 日本
  • 馬來西亞
  • 菲律賓
  • 新加坡
  • 韓國
  • 台灣
  • 泰國
  • 越南

第11章 歐洲、中東和非洲模製佈線裝置市場

  • 丹麥
  • 埃及
  • 芬蘭
  • 法國
  • 德國
  • 以色列
  • 義大利
  • 荷蘭
  • 奈及利亞
  • 挪威
  • 波蘭
  • 卡達
  • 俄羅斯
  • 沙烏地阿拉伯
  • 南非
  • 西班牙
  • 瑞典
  • 瑞士
  • 土耳其
  • 阿拉伯聯合大公國
  • 英國

第12章競爭格局

  • 2023 年市場佔有率分析
  • FPNV 定位矩陣，2023
  • 競爭情境分析
  • 戰略分析和建議

公司名單

  • Amphenol Corporation
  • Arlington Plating Company
  • GALTRONICS Corporation Limited
  • Harting Group
  • KYOCERA AVX Components Corporation
  • LPKF Laser & Electronics SE
  • MID Solutions GmbH
  • Molex LLC
  • RTP Company
  • SUZHOU CICOR TECHNOLOGY CO. LTD
  • Taoglas
  • TE Connectivity
  • Teprosa GmbH
  • Tongda Group
  • Yomura Technologies Inc.
Product Code: MRR-7162E4C41202

The Molded Interconnect Device Market was valued at USD 2.44 billion in 2023, expected to reach USD 2.78 billion in 2024, and is projected to grow at a CAGR of 14.33%, to USD 6.24 billion by 2030.

Molded Interconnect Devices (MIDs) represent an innovative technology that integrates electrical and mechanical functions in a single package, using 3D injection-molded circuit carriers. The necessity for MIDs arises from the growing demand for miniaturization, increased functionality, and enhanced performance in various applications such as consumer electronics, automotive, medical devices, and telecommunications. By combining circuitry and housing into a single component, MIDs reduce space, weight, and assembly costs. The end-use scope of MIDs spans multiple industries, where they serve in applications ranging from LED packages to antennas and sensor assemblies. Key market growth factors include the rising trend toward miniaturization, increasing demand for efficient electronic devices, and advancements in 3D circuit printing technologies. Opportunities in the MID market are significantly influenced by the increasing adoption in automotive electronics, where the integration of MIDs can aid in seamless connectivity and enhanced vehicle functionalities. As automotive technologies evolve towards electric and autonomous vehicles, MIDs stand to gain as essential components. However, the market faces limitations such as high initial manufacturing costs, lack of standardized manufacturing processes, and technical challenges in integrating complex electrical components. To overcome these hurdles, businesses should focus on areas like developing cost-effective 3D circuit printing methods and improving material performance for better thermal management. Moreover, collaborations and partnerships with R&D institutions for innovation in polymer materials could propel new MID capabilities. Insight into the MID market nature reveals a moderately competitive landscape, with key players focusing on strategic expansions, mergers, and technology innovations to maintain a competitive edge. To capitalize on growth avenues, firms should amplify their focus on emerging markets and invest in advanced manufacturing technologies, enabling the production of more complex MID structures that cater to diverse, evolving customer demands.

KEY MARKET STATISTICS
Base Year [2023] USD 2.44 billion
Estimated Year [2024] USD 2.78 billion
Forecast Year [2030] USD 6.24 billion
CAGR (%) 14.33%

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Molded Interconnect Device Market

The Molded Interconnect Device Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

  • Market Drivers
    • Rising need in healthcare and consumer electronics industry
    • Wide applications in automotive industry
    • High use of laser direct structuring
  • Market Restraints
    • Concerns pertaining to raw materials cost
  • Market Opportunities
    • Technological advancements in molded interconnect devices
    • Investments in expanding IIoT ecosystem
  • Market Challenges
    • Incompatibility issues of molded interconnect devices

Porter's Five Forces: A Strategic Tool for Navigating the Molded Interconnect Device Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Molded Interconnect Device Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Molded Interconnect Device Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Molded Interconnect Device Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Molded Interconnect Device Market

A detailed market share analysis in the Molded Interconnect Device Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Molded Interconnect Device Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Molded Interconnect Device Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Molded Interconnect Device Market

A strategic analysis of the Molded Interconnect Device Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Molded Interconnect Device Market, highlighting leading vendors and their innovative profiles. These include Amphenol Corporation, Arlington Plating Company, GALTRONICS Corporation Limited, Harting Group, KYOCERA AVX Components Corporation, LPKF Laser & Electronics SE, MID Solutions GmbH, Molex LLC, RTP Company, SUZHOU CICOR TECHNOLOGY CO. LTD, Taoglas, TE Connectivity, Teprosa GmbH, Tongda Group, and Yomura Technologies Inc..

Market Segmentation & Coverage

This research report categorizes the Molded Interconnect Device Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Based on Product Type, market is studied across Antennae & Connectivity Modules, Connectors & Switches, Lighting Systems, and Sensors.
  • Based on Process, market is studied across Film Techniques, Laser Direct Structuring, and Two-Shot Molding.
  • Based on Vertical, market is studied across Automotive, Consumer Electronics, Industrial, Medical, Military & Aerospace, and Telecommunications.
  • Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Rising need in healthcare and consumer electronics industry
      • 5.1.1.2. Wide applications in automotive industry
      • 5.1.1.3. High use of laser direct structuring
    • 5.1.2. Restraints
      • 5.1.2.1. Concerns pertaining to raw materials cost
    • 5.1.3. Opportunities
      • 5.1.3.1. Technological advancements in molded interconnect devices
      • 5.1.3.2. Investments in expanding IIoT ecosystem
    • 5.1.4. Challenges
      • 5.1.4.1. Incompatibility issues of molded interconnect devices
  • 5.2. Market Segmentation Analysis
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental

6. Molded Interconnect Device Market, by Product Type

  • 6.1. Introduction
  • 6.2. Antennae & Connectivity Modules
  • 6.3. Connectors & Switches
  • 6.4. Lighting Systems
  • 6.5. Sensors

7. Molded Interconnect Device Market, by Process

  • 7.1. Introduction
  • 7.2. Film Techniques
  • 7.3. Laser Direct Structuring
  • 7.4. Two-Shot Molding

8. Molded Interconnect Device Market, by Vertical

  • 8.1. Introduction
  • 8.2. Automotive
  • 8.3. Consumer Electronics
  • 8.4. Industrial
  • 8.5. Medical
  • 8.6. Military & Aerospace
  • 8.7. Telecommunications

9. Americas Molded Interconnect Device Market

  • 9.1. Introduction
  • 9.2. Argentina
  • 9.3. Brazil
  • 9.4. Canada
  • 9.5. Mexico
  • 9.6. United States

10. Asia-Pacific Molded Interconnect Device Market

  • 10.1. Introduction
  • 10.2. Australia
  • 10.3. China
  • 10.4. India
  • 10.5. Indonesia
  • 10.6. Japan
  • 10.7. Malaysia
  • 10.8. Philippines
  • 10.9. Singapore
  • 10.10. South Korea
  • 10.11. Taiwan
  • 10.12. Thailand
  • 10.13. Vietnam

11. Europe, Middle East & Africa Molded Interconnect Device Market

  • 11.1. Introduction
  • 11.2. Denmark
  • 11.3. Egypt
  • 11.4. Finland
  • 11.5. France
  • 11.6. Germany
  • 11.7. Israel
  • 11.8. Italy
  • 11.9. Netherlands
  • 11.10. Nigeria
  • 11.11. Norway
  • 11.12. Poland
  • 11.13. Qatar
  • 11.14. Russia
  • 11.15. Saudi Arabia
  • 11.16. South Africa
  • 11.17. Spain
  • 11.18. Sweden
  • 11.19. Switzerland
  • 11.20. Turkey
  • 11.21. United Arab Emirates
  • 11.22. United Kingdom

12. Competitive Landscape

  • 12.1. Market Share Analysis, 2023
  • 12.2. FPNV Positioning Matrix, 2023
  • 12.3. Competitive Scenario Analysis
  • 12.4. Strategy Analysis & Recommendation

Companies Mentioned

  • 1. Amphenol Corporation
  • 2. Arlington Plating Company
  • 3. GALTRONICS Corporation Limited
  • 4. Harting Group
  • 5. KYOCERA AVX Components Corporation
  • 6. LPKF Laser & Electronics SE
  • 7. MID Solutions GmbH
  • 8. Molex LLC
  • 9. RTP Company
  • 10. SUZHOU CICOR TECHNOLOGY CO. LTD
  • 11. Taoglas
  • 12. TE Connectivity
  • 13. Teprosa GmbH
  • 14. Tongda Group
  • 15. Yomura Technologies Inc.

LIST OF FIGURES

  • FIGURE 1. MOLDED INTERCONNECT DEVICE MARKET RESEARCH PROCESS
  • FIGURE 2. MOLDED INTERCONNECT DEVICE MARKET SIZE, 2023 VS 2030
  • FIGURE 3. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, 2018-2030 (USD MILLION)
  • FIGURE 4. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 5. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 6. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2023 VS 2030 (%)
  • FIGURE 7. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 8. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2023 VS 2030 (%)
  • FIGURE 9. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 10. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2023 VS 2030 (%)
  • FIGURE 11. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 12. AMERICAS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 13. AMERICAS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 14. UNITED STATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY STATE, 2023 VS 2030 (%)
  • FIGURE 15. UNITED STATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 16. ASIA-PACIFIC MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 17. ASIA-PACIFIC MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 18. EUROPE, MIDDLE EAST & AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 19. EUROPE, MIDDLE EAST & AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 20. MOLDED INTERCONNECT DEVICE MARKET SHARE, BY KEY PLAYER, 2023
  • FIGURE 21. MOLDED INTERCONNECT DEVICE MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

  • TABLE 1. MOLDED INTERCONNECT DEVICE MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
  • TABLE 3. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, 2018-2030 (USD MILLION)
  • TABLE 4. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 5. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 6. MOLDED INTERCONNECT DEVICE MARKET DYNAMICS
  • TABLE 7. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 8. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY ANTENNAE & CONNECTIVITY MODULES, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 9. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY CONNECTORS & SWITCHES, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 10. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY LIGHTING SYSTEMS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 11. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY SENSORS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 12. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 13. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY FILM TECHNIQUES, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 14. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY LASER DIRECT STRUCTURING, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 15. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY TWO-SHOT MOLDING, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 16. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 17. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 18. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 19. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY INDUSTRIAL, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 20. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY MEDICAL, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 21. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY MILITARY & AEROSPACE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 22. GLOBAL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY TELECOMMUNICATIONS, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 23. AMERICAS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 24. AMERICAS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 25. AMERICAS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 26. AMERICAS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 27. ARGENTINA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 28. ARGENTINA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 29. ARGENTINA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 30. BRAZIL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 31. BRAZIL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 32. BRAZIL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 33. CANADA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 34. CANADA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 35. CANADA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 36. MEXICO MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 37. MEXICO MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 38. MEXICO MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 39. UNITED STATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 40. UNITED STATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 41. UNITED STATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 42. UNITED STATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
  • TABLE 43. ASIA-PACIFIC MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 44. ASIA-PACIFIC MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 45. ASIA-PACIFIC MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 46. ASIA-PACIFIC MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 47. AUSTRALIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 48. AUSTRALIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 49. AUSTRALIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 50. CHINA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 51. CHINA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 52. CHINA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 53. INDIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 54. INDIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 55. INDIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 56. INDONESIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 57. INDONESIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 58. INDONESIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 59. JAPAN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 60. JAPAN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 61. JAPAN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 62. MALAYSIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 63. MALAYSIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 64. MALAYSIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 65. PHILIPPINES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 66. PHILIPPINES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 67. PHILIPPINES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 68. SINGAPORE MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 69. SINGAPORE MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 70. SINGAPORE MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 71. SOUTH KOREA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 72. SOUTH KOREA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 73. SOUTH KOREA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 74. TAIWAN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 75. TAIWAN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 76. TAIWAN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 77. THAILAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 78. THAILAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 79. THAILAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 80. VIETNAM MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 81. VIETNAM MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 82. VIETNAM MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 83. EUROPE, MIDDLE EAST & AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 84. EUROPE, MIDDLE EAST & AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 85. EUROPE, MIDDLE EAST & AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 86. EUROPE, MIDDLE EAST & AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 87. DENMARK MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 88. DENMARK MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 89. DENMARK MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 90. EGYPT MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 91. EGYPT MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 92. EGYPT MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 93. FINLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 94. FINLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 95. FINLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 96. FRANCE MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 97. FRANCE MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 98. FRANCE MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 99. GERMANY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 100. GERMANY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 101. GERMANY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 102. ISRAEL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 103. ISRAEL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 104. ISRAEL MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 105. ITALY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 106. ITALY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 107. ITALY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 108. NETHERLANDS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 109. NETHERLANDS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 110. NETHERLANDS MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 111. NIGERIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 112. NIGERIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 113. NIGERIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 114. NORWAY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 115. NORWAY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 116. NORWAY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 117. POLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 118. POLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 119. POLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 120. QATAR MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 121. QATAR MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 122. QATAR MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 123. RUSSIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 124. RUSSIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 125. RUSSIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 126. SAUDI ARABIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 127. SAUDI ARABIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 128. SAUDI ARABIA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 129. SOUTH AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 130. SOUTH AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 131. SOUTH AFRICA MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 132. SPAIN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 133. SPAIN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 134. SPAIN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 135. SWEDEN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 136. SWEDEN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 137. SWEDEN MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 138. SWITZERLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 139. SWITZERLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 140. SWITZERLAND MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 141. TURKEY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 142. TURKEY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 143. TURKEY MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 144. UNITED ARAB EMIRATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 145. UNITED ARAB EMIRATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 146. UNITED ARAB EMIRATES MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 147. UNITED KINGDOM MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PRODUCT TYPE, 2018-2030 (USD MILLION)
  • TABLE 148. UNITED KINGDOM MOLDED INTERCONNECT DEVICE MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
  • TABLE 149. UNITED KINGDOM MOLDED INTERCONNECT DEVICE MARKET SIZE, BY VERTICAL, 2018-2030 (USD MILLION)
  • TABLE 150. MOLDED INTERCONNECT DEVICE MARKET SHARE, BY KEY PLAYER, 2023
  • TABLE 151. MOLDED INTERCONNECT DEVICE MARKET, FPNV POSITIONING MATRIX, 2023