查看購物車
  • Simplified Chinese
  • English
  • Japanese
  • Korean
封面
市場調查報告書
商品編碼
1859945

模塑電路基板（MIS）：全球市場佔有率和排名、總銷售額和需求預測（2025-2031 年）

Molded Interconnect Substrate (MIS) - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031
出版日期: | 出版商: QYResearch | 英文 90 Pages | 商品交期: 2-3個工作天內

價格

※ 本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

全球模塑電路基板(MIS) 市場規模預計在 2024 年達到 9,800 萬美元，預計到 2031 年將達到 2.97 億美元，在 2025 年至 2031 年的預測期內，複合年成長率將達到 15.8%。

本報告全面評估了近期關稅調整和國際戰略反制措施對模塑電路基板(MIS)跨境產業佈局、資本配置模式、區域經濟相互依存關係和供應鏈重組的影響。

模塑電路基板技術 (MIS) 是一種創新的基板解決方案，非常適合行動產業。它涵蓋了廣泛的解決方案，可滿足行動應用積體電路封裝的複雜需求。其嵌入式銅互連技術能夠實現精細的線寬和間距，從而在小外形規格中實現高 I/O 數量。此外，它還提供了一種可靠的覆晶安裝製程。 MIS 的另一個關鍵特性是其銅填充通孔和填充墊片技術，這對於滿足高頻要求至關重要，並能有效提升散熱性能。

目前，世界上只有三家公司生產 MIS：台灣的 PPt、中國的 MiSpak Technology 和馬來西亞的 QDOS。

PPt目前提供1層、2層、3層、4層和6層MIS。 MiSpak Technology提供1層和2層MIS。 QDOS提供1層、2層和3層MIS。

MIS產品在基板應用市場的成長潛力主要來自伺服器和資料中心的網路通訊產品、電動車和智慧汽車驅動的汽車電子控制裝置以及5G和AIoT等應用領域。隨著這些相關產品的出現，半導體封裝用基板的要求也將顯著提高，需要更大的設計靈活性、更高的性能和更強的可靠性。

在先進導線架產品方面，MIS製造商（PPt、MiSpak、QDOS）主要供應的產品並不限於單層基板。 PPt還可以提供多晶片封裝的多層基板可捲繞導線架產品，而傳統導線架供應商則難以提供此類產品。

目前，MIS主要應用於功率/PMIC/模擬、汽車電子、射頻/5G、光學影像防手震（OIS）、指紋認證、第三代半導體、LED等領域。其中，MIS主要應用於功率領域，在第三代半導體領域則主要用於GaN元件。

隨著技術發展，5G應用對訊號速度、延遲和穩定性提出了更高的要求。隨著電腦化和智慧化需求的不斷成長，家用電子電器和工業市場湧現大量新的應用。這導致半導體晶片的性能要求持續提高，包括高速運算、高性能和低損耗。

這一發展趨勢也增加了對具備小型化、窄間距和高散熱等特性的積體電路構裝基板的需求。微整合系統（MIS）製造商經過多年研發，已掌握了窄間距、曲面加工和多層基板的生產技術，這些技術有望在5G和電動車等領域中廣泛應用。

此外，在智慧型手機這一家用電子電器領域，全球知名品牌行動電話製造商佔據相當大的市場。隨著新機型的發布，相機模組的規格也不斷提升，高規格相機模組的普及率也持續成長。隨著攝影機模組在新機型的應用日益普及，受中美貿易摩擦的影響，中國主要廠商也正在加快研發步伐。透過在地採購建立原物料供應體系，MIS廠商在智慧型手機相機模組領域實施了多種策略。隨著新機型的不斷推出，MIS廠商產品的市場滲透率預計將進一步提升。

本報告旨在對全球模塑電路基板(MIS) 市場按地區/國家、類型和應用進行全面分析，重點關注總銷售量、收入、價格、市場佔有率和主要企業的排名。

本報告以2024年為基準年，按銷量（百萬台）和收入（百萬美元）對模塑電路基板（MIS）市場規模、估算和預測進行了呈現，並包含了2020年至2031年的歷史數據和預測數據。報告提供定量和定性分析，以幫助讀者制定業務和成長策略、評估市場競爭、分析自身在當前市場中的地位，並就模塑電路基板（MIS）做出明智的商業決策。

市場區隔

公司

  • PPt
  • MiSpak Technology
  • QDOS

按類型分類的細分市場

  • 1層MIS
  • 雙層MIS
  • 3層MIS
  • 4層MIS
  • 6層MIS
  • 其他

應用領域

  • 類比晶片
  • 功率積體電路
  • RF/5G
  • 指紋感應器
  • OIS（光學影像防手震）
  • 其他

按地區

  • 北美洲
    • 美國
    • 加拿大
  • 亞太地區
    • 中國
    • 日本
    • 韓國
    • 東南亞
    • 印度
    • 澳洲
    • 亞太其他地區
  • 歐洲
    • 德國
    • 法國
    • 英國
    • 義大利
    • 荷蘭
    • 北歐國家
    • 其他歐洲
  • 拉丁美洲
    • 墨西哥
    • 巴西
    • 其他拉丁美洲
  • 中東和非洲
    • 土耳其
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 其他中東和非洲地區

The global market for Molded Interconnect Substrate (MIS) was estimated to be worth US$ 98 million in 2024 and is forecast to a readjusted size of US$ 297 million by 2031 with a CAGR of 15.8% during the forecast period 2025-2031.

This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Molded Interconnect Substrate (MIS) cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.

Molded Interconnect Substrate Technology (MIS) is a novel substrate solution that is ideal for mobile industry. It encompasses a wide range of solutions for the complex needs of IC package for mobile applications. With its embedded copper trace technology, it enable a finer line and space that is needed for high I/O count with smaller form factor. It also provides a robust Flip Chip assembly process. Another important feature of MIS substrate is copper filled-via and filled-pad technologies, which is significantly important for high frequency requirements, and improve thermal dissipation.

Currently, there are currently only three companies in the world that manufacture MIS substrates, China Taiwanese PPt, Chineses MiSpak Technology and Malaysian QDOS.

PPt now can supply 1 layer, 2 layer, 3 layer, 4 layer and 6 layer MIS substrates. MiSpak Technology supplies 1 layer and 2 layer MIS substrates. QDOS supplies 1 layer, 2 layer and 3 layer MIS substrates

The growth potential of MIS products in the substrate application market will come from network communication products such as servers and data centers, automotive electronic control equipment driven by electric vehicles and automotive intelligence, as well as 5G, AIoT and other applications. With the launch of these related products, the requirements for substrates used in semiconductor packaging will also increase significantly, requiring a high degree of design flexibility, improved performance and high reliability.

In terms of advanced lead frame products, MIS manufacturers (PPt, MiSpak and QDOS) mainly supply products that are not limited to single-layer boards. PPt can also provide multi-layer board windable lead frame products for multi-chip packaging, which are products that are difficult for traditional lead frame suppliers to provide.

Currently the MIS substrates are mainly used in power/PMIC/analog, automotive electronics, RF/5G, Optical Image Stabilization (OIS), fingerprint recognition, third generation semiconductor, and LED, etc. Most of MIS substrates are used in power segment. For third generation semiconductor, MIS substrates are mainly used in GaN devices.

As technology continues to update, 5G applications require high speed, low latency technology and stable signals. With the demand for electronicization and intelligence, new applications continue to emerge in the consumer electronics and Industrial markets. This drives the performance requirements of Semiconductor chips to continue, towards high-speed computing, high performance, low loss, etc.

The development direction has also increased the demand for IC packaging substrates to have fine, narrow spacing, high heat dissipation and other characteeristics. The MIS substrates manufacturers have be cultivating its product production Technology capabilities for a long time and has currently developed Narrow pitch, winding, multi-layer board production technologies will be used in 5G, a lot, electric vehicles, etc.

In addition, in terms of consumer electronic smartphone applications, global well-known brand mobile phone manufacturers have a large presence in the market. When launching new mobile phones, the specifications of camera modules are continuously improved, and high-specification camera modules are constantly being. The penetration into new mobile phones has also accelerated the development of major Chinese mobile phone manufacturers due to theimpact of the Sino-US trade war. By introducing local raw Material supply, The MIS substrates manufacturers have laid out multiple plans in the field of mobile phone camera module applications. As new mobile phones are launched in the market one after another, it is expected that the market penetration rate of MIS substrates manufacturers products will increase.

This report aims to provide a comprehensive presentation of the global market for Molded Interconnect Substrate (MIS), focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Molded Interconnect Substrate (MIS) by region & country, by Type, and by Application.

The Molded Interconnect Substrate (MIS) market size, estimations, and forecasts are provided in terms of sales volume (Million Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Molded Interconnect Substrate (MIS).

Market Segmentation

By Company

  • PPt
  • MiSpak Technology
  • QDOS

Segment by Type

  • 1 Layer MIS Substrate
  • 2 Layer MIS Substrate
  • 3 Layer MIS Substrate
  • 4 Layer MIS Substrate
  • 6 Layer MIS Substrate
  • Others

Segment by Application

  • Analog Chip
  • Power IC
  • RF/5G
  • Fingerprint Sensor
  • OIS (Optical Image Stablization)
  • Others

By Region

  • North America
    • United States
    • Canada
  • Asia-Pacific
    • China
    • Japan
    • South Korea
    • Southeast Asia
    • India
    • Australia
    • Rest of Asia-Pacific
  • Europe
    • Germany
    • France
    • U.K.
    • Italy
    • Netherlands
    • Nordic Countries
    • Rest of Europe
  • Latin America
    • Mexico
    • Brazil
    • Rest of Latin America
  • Middle East & Africa
    • Turkey
    • Saudi Arabia
    • UAE
    • Rest of MEA

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of Molded Interconnect Substrate (MIS) manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Sales, revenue of Molded Interconnect Substrate (MIS) in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Sales, revenue of Molded Interconnect Substrate (MIS) in country level. It provides sigmate data by Type, and by Application for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.

Table of Contents

1 Market Overview

  • 1.1 Molded Interconnect Substrate (MIS) Product Introduction
  • 1.2 Global Molded Interconnect Substrate (MIS) Market Size Forecast
    • 1.2.1 Global Molded Interconnect Substrate (MIS) Sales Value (2020-2031)
    • 1.2.2 Global Molded Interconnect Substrate (MIS) Sales Volume (2020-2031)
    • 1.2.3 Global Molded Interconnect Substrate (MIS) Sales Price (2020-2031)
  • 1.3 Molded Interconnect Substrate (MIS) Market Trends & Drivers
    • 1.3.1 Molded Interconnect Substrate (MIS) Industry Trends
    • 1.3.2 Molded Interconnect Substrate (MIS) Market Drivers & Opportunity
    • 1.3.3 Molded Interconnect Substrate (MIS) Market Challenges
    • 1.3.4 Molded Interconnect Substrate (MIS) Market Restraints
  • 1.4 Assumptions and Limitations
  • 1.5 Study Objectives
  • 1.6 Years Considered

2 Competitive Analysis by Company

  • 2.1 Global Molded Interconnect Substrate (MIS) Players Revenue Ranking (2024)
  • 2.2 Global Molded Interconnect Substrate (MIS) Revenue by Company (2020-2025)
  • 2.3 Global Molded Interconnect Substrate (MIS) Players Sales Volume Ranking (2024)
  • 2.4 Global Molded Interconnect Substrate (MIS) Sales Volume by Company Players (2020-2025)
  • 2.5 Global Molded Interconnect Substrate (MIS) Average Price by Company (2020-2025)
  • 2.6 Key Manufacturers Molded Interconnect Substrate (MIS) Manufacturing Base and Headquarters
  • 2.7 Key Manufacturers Molded Interconnect Substrate (MIS) Product Offered
  • 2.8 Key Manufacturers Time to Begin Mass Production of Molded Interconnect Substrate (MIS)
  • 2.9 Molded Interconnect Substrate (MIS) Market Competitive Analysis
    • 2.9.1 Molded Interconnect Substrate (MIS) Market Concentration Rate (2020-2025)
    • 2.9.2 Global 5 and 10 Largest Manufacturers by Molded Interconnect Substrate (MIS) Revenue in 2024
    • 2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Molded Interconnect Substrate (MIS) as of 2024)
  • 2.10 Mergers & Acquisitions, Expansion

3 Segmentation by Type

  • 3.1 Introduction by Type
    • 3.1.1 1 Layer MIS Substrate
    • 3.1.2 2 Layer MIS Substrate
    • 3.1.3 3 Layer MIS Substrate
    • 3.1.4 4 Layer MIS Substrate
    • 3.1.5 6 Layer MIS Substrate
    • 3.1.6 Others
  • 3.2 Global Molded Interconnect Substrate (MIS) Sales Value by Type
    • 3.2.1 Global Molded Interconnect Substrate (MIS) Sales Value by Type (2020 VS 2024 VS 2031)
    • 3.2.2 Global Molded Interconnect Substrate (MIS) Sales Value, by Type (2020-2031)
    • 3.2.3 Global Molded Interconnect Substrate (MIS) Sales Value, by Type (%) (2020-2031)
  • 3.3 Global Molded Interconnect Substrate (MIS) Sales Volume by Type
    • 3.3.1 Global Molded Interconnect Substrate (MIS) Sales Volume by Type (2020 VS 2024 VS 2031)
    • 3.3.2 Global Molded Interconnect Substrate (MIS) Sales Volume, by Type (2020-2031)
    • 3.3.3 Global Molded Interconnect Substrate (MIS) Sales Volume, by Type (%) (2020-2031)
  • 3.4 Global Molded Interconnect Substrate (MIS) Average Price by Type (2020-2031)

4 Segmentation by Application

  • 4.1 Introduction by Application
    • 4.1.1 Analog Chip
    • 4.1.2 Power IC
    • 4.1.3 RF/5G
    • 4.1.4 Fingerprint Sensor
    • 4.1.5 OIS (Optical Image Stablization)
    • 4.1.6 Others
  • 4.2 Global Molded Interconnect Substrate (MIS) Sales Value by Application
    • 4.2.1 Global Molded Interconnect Substrate (MIS) Sales Value by Application (2020 VS 2024 VS 2031)
    • 4.2.2 Global Molded Interconnect Substrate (MIS) Sales Value, by Application (2020-2031)
    • 4.2.3 Global Molded Interconnect Substrate (MIS) Sales Value, by Application (%) (2020-2031)
  • 4.3 Global Molded Interconnect Substrate (MIS) Sales Volume by Application
    • 4.3.1 Global Molded Interconnect Substrate (MIS) Sales Volume by Application (2020 VS 2024 VS 2031)
    • 4.3.2 Global Molded Interconnect Substrate (MIS) Sales Volume, by Application (2020-2031)
    • 4.3.3 Global Molded Interconnect Substrate (MIS) Sales Volume, by Application (%) (2020-2031)
  • 4.4 Global Molded Interconnect Substrate (MIS) Average Price by Application (2020-2031)

5 Segmentation by Region

  • 5.1 Global Molded Interconnect Substrate (MIS) Sales Value by Region
    • 5.1.1 Global Molded Interconnect Substrate (MIS) Sales Value by Region: 2020 VS 2024 VS 2031
    • 5.1.2 Global Molded Interconnect Substrate (MIS) Sales Value by Region (2020-2025)
    • 5.1.3 Global Molded Interconnect Substrate (MIS) Sales Value by Region (2026-2031)
    • 5.1.4 Global Molded Interconnect Substrate (MIS) Sales Value by Region (%), (2020-2031)
  • 5.2 Global Molded Interconnect Substrate (MIS) Sales Volume by Region
    • 5.2.1 Global Molded Interconnect Substrate (MIS) Sales Volume by Region: 2020 VS 2024 VS 2031
    • 5.2.2 Global Molded Interconnect Substrate (MIS) Sales Volume by Region (2020-2025)
    • 5.2.3 Global Molded Interconnect Substrate (MIS) Sales Volume by Region (2026-2031)
    • 5.2.4 Global Molded Interconnect Substrate (MIS) Sales Volume by Region (%), (2020-2031)
  • 5.3 Global Molded Interconnect Substrate (MIS) Average Price by Region (2020-2031)
  • 5.4 North America
    • 5.4.1 North America Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
    • 5.4.2 North America Molded Interconnect Substrate (MIS) Sales Value by Country (%), 2024 VS 2031
  • 5.5 Europe
    • 5.5.1 Europe Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
    • 5.5.2 Europe Molded Interconnect Substrate (MIS) Sales Value by Country (%), 2024 VS 2031
  • 5.6 Asia Pacific
    • 5.6.1 Asia Pacific Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
    • 5.6.2 Asia Pacific Molded Interconnect Substrate (MIS) Sales Value by Region (%), 2024 VS 2031
  • 5.7 South America
    • 5.7.1 South America Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
    • 5.7.2 South America Molded Interconnect Substrate (MIS) Sales Value by Country (%), 2024 VS 2031
  • 5.8 Middle East & Africa
    • 5.8.1 Middle East & Africa Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
    • 5.8.2 Middle East & Africa Molded Interconnect Substrate (MIS) Sales Value by Country (%), 2024 VS 2031

6 Segmentation by Key Countries/Regions

  • 6.1 Key Countries/Regions Molded Interconnect Substrate (MIS) Sales Value Growth Trends, 2020 VS 2024 VS 2031
  • 6.2 Key Countries/Regions Molded Interconnect Substrate (MIS) Sales Value and Sales Volume
    • 6.2.1 Key Countries/Regions Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
    • 6.2.2 Key Countries/Regions Molded Interconnect Substrate (MIS) Sales Volume, 2020-2031
  • 6.3 United States
    • 6.3.1 United States Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
    • 6.3.2 United States Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
    • 6.3.3 United States Molded Interconnect Substrate (MIS) Sales Value by Application, 2024 VS 2031
  • 6.4 Europe
    • 6.4.1 Europe Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
    • 6.4.2 Europe Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
    • 6.4.3 Europe Molded Interconnect Substrate (MIS) Sales Value by Application, 2024 VS 2031
  • 6.5 China
    • 6.5.1 China Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
    • 6.5.2 China Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
    • 6.5.3 China Molded Interconnect Substrate (MIS) Sales Value by Application, 2024 VS 2031
  • 6.6 Japan
    • 6.6.1 Japan Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
    • 6.6.2 Japan Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
    • 6.6.3 Japan Molded Interconnect Substrate (MIS) Sales Value by Application, 2024 VS 2031
  • 6.7 South Korea
    • 6.7.1 South Korea Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
    • 6.7.2 South Korea Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
    • 6.7.3 South Korea Molded Interconnect Substrate (MIS) Sales Value by Application, 2024 VS 2031
  • 6.8 Southeast Asia
    • 6.8.1 Southeast Asia Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
    • 6.8.2 Southeast Asia Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
    • 6.8.3 Southeast Asia Molded Interconnect Substrate (MIS) Sales Value by Application, 2024 VS 2031
  • 6.9 India
    • 6.9.1 India Molded Interconnect Substrate (MIS) Sales Value, 2020-2031
    • 6.9.2 India Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
    • 6.9.3 India Molded Interconnect Substrate (MIS) Sales Value by Application, 2024 VS 2031

7 Company Profiles

  • 7.1 PPt
    • 7.1.1 PPt Company Information
    • 7.1.2 PPt Introduction and Business Overview
    • 7.1.3 PPt Molded Interconnect Substrate (MIS) Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.1.4 PPt Molded Interconnect Substrate (MIS) Product Offerings
    • 7.1.5 PPt Recent Development
  • 7.2 MiSpak Technology
    • 7.2.1 MiSpak Technology Company Information
    • 7.2.2 MiSpak Technology Introduction and Business Overview
    • 7.2.3 MiSpak Technology Molded Interconnect Substrate (MIS) Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.2.4 MiSpak Technology Molded Interconnect Substrate (MIS) Product Offerings
    • 7.2.5 MiSpak Technology Recent Development
  • 7.3 QDOS
    • 7.3.1 QDOS Company Information
    • 7.3.2 QDOS Introduction and Business Overview
    • 7.3.3 QDOS Molded Interconnect Substrate (MIS) Sales, Revenue, Price and Gross Margin (2020-2025)
    • 7.3.4 QDOS Molded Interconnect Substrate (MIS) Product Offerings
    • 7.3.5 QDOS Recent Development

8 Industry Chain Analysis

  • 8.1 Molded Interconnect Substrate (MIS) Industrial Chain
  • 8.2 Molded Interconnect Substrate (MIS) Upstream Analysis
    • 8.2.1 Key Raw Materials
    • 8.2.2 Raw Materials Key Suppliers
    • 8.2.3 Manufacturing Cost Structure
  • 8.3 Midstream Analysis
  • 8.4 Downstream Analysis (Customers Analysis)
  • 8.5 Sales Model and Sales Channels
    • 8.5.1 Molded Interconnect Substrate (MIS) Sales Model
    • 8.5.2 Sales Channel
    • 8.5.3 Molded Interconnect Substrate (MIS) Distributors

9 Research Findings and Conclusion

10 Appendix

  • 10.1 Research Methodology
    • 10.1.1 Methodology/Research Approach
      • 10.1.1.1 Research Programs/Design
      • 10.1.1.2 Market Size Estimation
      • 10.1.1.3 Market Breakdown and Data Triangulation
    • 10.1.2 Data Source
      • 10.1.2.1 Secondary Sources
      • 10.1.2.2 Primary Sources
  • 10.2 Author Details
  • 10.3 Disclaimer

List of Tables

  • Table 1. Molded Interconnect Substrate (MIS) Market Trends
  • Table 2. Molded Interconnect Substrate (MIS) Market Drivers & Opportunity
  • Table 3. Molded Interconnect Substrate (MIS) Market Challenges
  • Table 4. Molded Interconnect Substrate (MIS) Market Restraints
  • Table 5. Global Molded Interconnect Substrate (MIS) Revenue by Company (2020-2025) & (US$ Million)
  • Table 6. Global Molded Interconnect Substrate (MIS) Revenue Market Share by Company (2020-2025)
  • Table 7. Global Molded Interconnect Substrate (MIS) Sales Volume by Company (2020-2025) & (Million Units)
  • Table 8. Global Molded Interconnect Substrate (MIS) Sales Volume Market Share by Company (2020-2025)
  • Table 9. Global Market Molded Interconnect Substrate (MIS) Price by Company (2020-2025) & (US$/Pcs)
  • Table 10. Key Manufacturers Molded Interconnect Substrate (MIS) Manufacturing Base and Headquarters
  • Table 11. Key Manufacturers Molded Interconnect Substrate (MIS) Product Type
  • Table 12. Key Manufacturers Time to Begin Mass Production of Molded Interconnect Substrate (MIS)
  • Table 13. Global Molded Interconnect Substrate (MIS) Manufacturers Market Concentration Ratio (CR5 and HHI)
  • Table 14. Global Top Manufacturers Market Share by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Molded Interconnect Substrate (MIS) as of 2024)
  • Table 15. Mergers & Acquisitions, Expansion Plans
  • Table 16. Global Molded Interconnect Substrate (MIS) Sales Value by Type: 2020 VS 2024 VS 2031 (US$ Million)
  • Table 17. Global Molded Interconnect Substrate (MIS) Sales Value by Type (2020-2025) & (US$ Million)
  • Table 18. Global Molded Interconnect Substrate (MIS) Sales Value by Type (2026-2031) & (US$ Million)
  • Table 19. Global Molded Interconnect Substrate (MIS) Sales Market Share in Value by Type (2020-2025)
  • Table 20. Global Molded Interconnect Substrate (MIS) Sales Market Share in Value by Type (2026-2031)
  • Table 21. Global Molded Interconnect Substrate (MIS) Sales Volume by Type: 2020 VS 2024 VS 2031 (Million Units)
  • Table 22. Global Molded Interconnect Substrate (MIS) Sales Volume by Type (2020-2025) & (Million Units)
  • Table 23. Global Molded Interconnect Substrate (MIS) Sales Volume by Type (2026-2031) & (Million Units)
  • Table 24. Global Molded Interconnect Substrate (MIS) Sales Market Share in Volume by Type (2020-2025)
  • Table 25. Global Molded Interconnect Substrate (MIS) Sales Market Share in Volume by Type (2026-2031)
  • Table 26. Global Molded Interconnect Substrate (MIS) Price by Type (2020-2025) & (US$/Pcs)
  • Table 27. Global Molded Interconnect Substrate (MIS) Price by Type (2026-2031) & (US$/Pcs)
  • Table 28. Global Molded Interconnect Substrate (MIS) Sales Value by Application: 2020 VS 2024 VS 2031 (US$ Million)
  • Table 29. Global Molded Interconnect Substrate (MIS) Sales Value by Application (2020-2025) & (US$ Million)
  • Table 30. Global Molded Interconnect Substrate (MIS) Sales Value by Application (2026-2031) & (US$ Million)
  • Table 31. Global Molded Interconnect Substrate (MIS) Sales Market Share in Value by Application (2020-2025)
  • Table 32. Global Molded Interconnect Substrate (MIS) Sales Market Share in Value by Application (2026-2031)
  • Table 33. Global Molded Interconnect Substrate (MIS) Sales Volume by Application: 2020 VS 2024 VS 2031 (Million Units)
  • Table 34. Global Molded Interconnect Substrate (MIS) Sales Volume by Application (2020-2025) & (Million Units)
  • Table 35. Global Molded Interconnect Substrate (MIS) Sales Volume by Application (2026-2031) & (Million Units)
  • Table 36. Global Molded Interconnect Substrate (MIS) Sales Market Share in Volume by Application (2020-2025)
  • Table 37. Global Molded Interconnect Substrate (MIS) Sales Market Share in Volume by Application (2026-2031)
  • Table 38. Global Molded Interconnect Substrate (MIS) Price by Application (2020-2025) & (US$/Pcs)
  • Table 39. Global Molded Interconnect Substrate (MIS) Price by Application (2026-2031) & (US$/Pcs)
  • Table 40. Global Molded Interconnect Substrate (MIS) Sales Value by Region, (2020 VS 2024 VS 2031) & (US$ Million)
  • Table 41. Global Molded Interconnect Substrate (MIS) Sales Value by Region (2020-2025) & (US$ Million)
  • Table 42. Global Molded Interconnect Substrate (MIS) Sales Value by Region (2026-2031) & (US$ Million)
  • Table 43. Global Molded Interconnect Substrate (MIS) Sales Value by Region (2020-2025) & (%)
  • Table 44. Global Molded Interconnect Substrate (MIS) Sales Value by Region (2026-2031) & (%)
  • Table 45. Global Molded Interconnect Substrate (MIS) Sales Volume by Region (Million Units): 2020 VS 2024 VS 2031
  • Table 46. Global Molded Interconnect Substrate (MIS) Sales Volume by Region (2020-2025) & (Million Units)
  • Table 47. Global Molded Interconnect Substrate (MIS) Sales Volume by Region (2026-2031) & (Million Units)
  • Table 48. Global Molded Interconnect Substrate (MIS) Sales Volume by Region (2020-2025) & (%)
  • Table 49. Global Molded Interconnect Substrate (MIS) Sales Volume by Region (2026-2031) & (%)
  • Table 50. Global Molded Interconnect Substrate (MIS) Average Price by Region (2020-2025) & (US$/Pcs)
  • Table 51. Global Molded Interconnect Substrate (MIS) Average Price by Region (2026-2031) & (US$/Pcs)
  • Table 52. Key Countries/Regions Molded Interconnect Substrate (MIS) Sales Value Growth Trends, (US$ Million): 2020 VS 2024 VS 2031
  • Table 53. Key Countries/Regions Molded Interconnect Substrate (MIS) Sales Value, (2020-2025) & (US$ Million)
  • Table 54. Key Countries/Regions Molded Interconnect Substrate (MIS) Sales Value, (2026-2031) & (US$ Million)
  • Table 55. Key Countries/Regions Molded Interconnect Substrate (MIS) Sales Volume, (2020-2025) & (Million Units)
  • Table 56. Key Countries/Regions Molded Interconnect Substrate (MIS) Sales Volume, (2026-2031) & (Million Units)
  • Table 57. PPt Company Information
  • Table 58. PPt Introduction and Business Overview
  • Table 59. PPt Molded Interconnect Substrate (MIS) Sales (Million Units), Revenue (US$ Million), Price (US$/Pcs) and Gross Margin (2020-2025)
  • Table 60. PPt Molded Interconnect Substrate (MIS) Product Offerings
  • Table 61. PPt Recent Development
  • Table 62. MiSpak Technology Company Information
  • Table 63. MiSpak Technology Introduction and Business Overview
  • Table 64. MiSpak Technology Molded Interconnect Substrate (MIS) Sales (Million Units), Revenue (US$ Million), Price (US$/Pcs) and Gross Margin (2020-2025)
  • Table 65. MiSpak Technology Molded Interconnect Substrate (MIS) Product Offerings
  • Table 66. MiSpak Technology Recent Development
  • Table 67. QDOS Company Information
  • Table 68. QDOS Introduction and Business Overview
  • Table 69. QDOS Molded Interconnect Substrate (MIS) Sales (Million Units), Revenue (US$ Million), Price (US$/Pcs) and Gross Margin (2020-2025)
  • Table 70. QDOS Molded Interconnect Substrate (MIS) Product Offerings
  • Table 71. QDOS Recent Development
  • Table 72. Key Raw Materials Lists
  • Table 73. Raw Materials Key Suppliers Lists
  • Table 74. Molded Interconnect Substrate (MIS) Downstream Customers
  • Table 75. Molded Interconnect Substrate (MIS) Distributors List
  • Table 76. Research Programs/Design for This Report
  • Table 77. Key Data Information from Secondary Sources
  • Table 78. Key Data Information from Primary Sources

List of Figures

  • Figure 1. Molded Interconnect Substrate (MIS) Product Picture
  • Figure 2. Global Molded Interconnect Substrate (MIS) Sales Value, 2020 VS 2024 VS 2031 (US$ Million)
  • Figure 3. Global Molded Interconnect Substrate (MIS) Sales Value (2020-2031) & (US$ Million)
  • Figure 4. Global Molded Interconnect Substrate (MIS) Sales Volume (2020-2031) & (Million Units)
  • Figure 5. Global Molded Interconnect Substrate (MIS) Sales Price (2020-2031) & (US$/Pcs)
  • Figure 6. Molded Interconnect Substrate (MIS) Report Years Considered
  • Figure 7. Global Molded Interconnect Substrate (MIS) Players Revenue Ranking (2024) & (US$ Million)
  • Figure 8. Global Molded Interconnect Substrate (MIS) Players Sales Volume Ranking (2024) & (Million Units)
  • Figure 9. The 5 and 10 Largest Manufacturers in the World: Market Share by Molded Interconnect Substrate (MIS) Revenue in 2024
  • Figure 10. Molded Interconnect Substrate (MIS) Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
  • Figure 11. 1 Layer MIS Substrate Picture
  • Figure 12. 2 Layer MIS Substrate Picture
  • Figure 13. 3 Layer MIS Substrate Picture
  • Figure 14. 4 Layer MIS Substrate Picture
  • Figure 15. 6 Layer MIS Substrate Picture
  • Figure 16. Others Picture
  • Figure 17. Global Molded Interconnect Substrate (MIS) Sales Value by Type (2020 VS 2024 VS 2031) & (US$ Million)
  • Figure 18. Global Molded Interconnect Substrate (MIS) Sales Value Market Share by Type, 2024 & 2031
  • Figure 19. Global Molded Interconnect Substrate (MIS) Sales Volume by Type (2020 VS 2024 VS 2031) & (Million Units)
  • Figure 20. Global Molded Interconnect Substrate (MIS) Sales Volume Market Share by Type, 2024 & 2031
  • Figure 21. Global Molded Interconnect Substrate (MIS) Price by Type (2020-2031) & (US$/Pcs)
  • Figure 22. Product Picture of Analog Chip
  • Figure 23. Product Picture of Power IC
  • Figure 24. Product Picture of RF/5G
  • Figure 25. Product Picture of Fingerprint Sensor
  • Figure 26. Product Picture of OIS (Optical Image Stablization)
  • Figure 27. Product Picture of Others
  • Figure 28. Global Molded Interconnect Substrate (MIS) Sales Value by Application (2020 VS 2024 VS 2031) & (US$ Million)
  • Figure 29. Global Molded Interconnect Substrate (MIS) Sales Value Market Share by Application, 2024 & 2031
  • Figure 30. Global Molded Interconnect Substrate (MIS) Sales Volume by Application (2020 VS 2024 VS 2031) & (Million Units)
  • Figure 31. Global Molded Interconnect Substrate (MIS) Sales Volume Market Share by Application, 2024 & 2031
  • Figure 32. Global Molded Interconnect Substrate (MIS) Price by Application (2020-2031) & (US$/Pcs)
  • Figure 33. North America Molded Interconnect Substrate (MIS) Sales Value (2020-2031) & (US$ Million)
  • Figure 34. North America Molded Interconnect Substrate (MIS) Sales Value by Country (%), 2024 VS 2031
  • Figure 35. Europe Molded Interconnect Substrate (MIS) Sales Value, (2020-2031) & (US$ Million)
  • Figure 36. Europe Molded Interconnect Substrate (MIS) Sales Value by Country (%), 2024 VS 2031
  • Figure 37. Asia Pacific Molded Interconnect Substrate (MIS) Sales Value, (2020-2031) & (US$ Million)
  • Figure 38. Asia Pacific Molded Interconnect Substrate (MIS) Sales Value by Region (%), 2024 VS 2031
  • Figure 39. South America Molded Interconnect Substrate (MIS) Sales Value, (2020-2031) & (US$ Million)
  • Figure 40. South America Molded Interconnect Substrate (MIS) Sales Value by Country (%), 2024 VS 2031
  • Figure 41. Middle East & Africa Molded Interconnect Substrate (MIS) Sales Value, (2020-2031) & (US$ Million)
  • Figure 42. Middle East & Africa Molded Interconnect Substrate (MIS) Sales Value by Country (%), 2024 VS 2031
  • Figure 43. Key Countries/Regions Molded Interconnect Substrate (MIS) Sales Value (%), (2020-2031)
  • Figure 44. Key Countries/Regions Molded Interconnect Substrate (MIS) Sales Volume (%), (2020-2031)
  • Figure 45. United States Molded Interconnect Substrate (MIS) Sales Value, (2020-2031) & (US$ Million)
  • Figure 46. United States Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
  • Figure 47. United States Molded Interconnect Substrate (MIS) Sales Value by Application (%), 2024 VS 2031
  • Figure 48. Europe Molded Interconnect Substrate (MIS) Sales Value, (2020-2031) & (US$ Million)
  • Figure 49. Europe Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
  • Figure 50. Europe Molded Interconnect Substrate (MIS) Sales Value by Application (%), 2024 VS 2031
  • Figure 51. China Molded Interconnect Substrate (MIS) Sales Value, (2020-2031) & (US$ Million)
  • Figure 52. China Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
  • Figure 53. China Molded Interconnect Substrate (MIS) Sales Value by Application (%), 2024 VS 2031
  • Figure 54. Japan Molded Interconnect Substrate (MIS) Sales Value, (2020-2031) & (US$ Million)
  • Figure 55. Japan Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
  • Figure 56. Japan Molded Interconnect Substrate (MIS) Sales Value by Application (%), 2024 VS 2031
  • Figure 57. South Korea Molded Interconnect Substrate (MIS) Sales Value, (2020-2031) & (US$ Million)
  • Figure 58. South Korea Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
  • Figure 59. South Korea Molded Interconnect Substrate (MIS) Sales Value by Application (%), 2024 VS 2031
  • Figure 60. Southeast Asia Molded Interconnect Substrate (MIS) Sales Value, (2020-2031) & (US$ Million)
  • Figure 61. Southeast Asia Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
  • Figure 62. Southeast Asia Molded Interconnect Substrate (MIS) Sales Value by Application (%), 2024 VS 2031
  • Figure 63. India Molded Interconnect Substrate (MIS) Sales Value, (2020-2031) & (US$ Million)
  • Figure 64. India Molded Interconnect Substrate (MIS) Sales Value by Type (%), 2024 VS 2031
  • Figure 65. India Molded Interconnect Substrate (MIS) Sales Value by Application (%), 2024 VS 2031
  • Figure 66. Molded Interconnect Substrate (MIS) Industrial Chain
  • Figure 67. Molded Interconnect Substrate (MIS) Manufacturing Cost Structure
  • Figure 68. Channels of Distribution (Direct Sales, and Distribution)
  • Figure 69. Bottom-up and Top-down Approaches for This Report
  • Figure 70. Data Triangulation
  • Figure 71. Key Executives Interviewed