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市場調查報告書
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1802306

2025年全球模塑互連設備（MID）市場報告

Molded Interconnect Device (MID) Global Market Report 2025
出版日期: | 出版商: The Business Research Company | 英文 250 Pages | 商品交期: 2-10個工作天內

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簡介目錄

預計未來幾年，模塑互連設備 (MID) 市場將快速成長，到 2029 年將達到 35.5 億美元，複合年成長率為 15.4%。預測期內的成長歸因於消費性電子產品的持續發展、醫療設備整合度的提高、汽車電子產品的成長以及快速原型製作和製造技術的創新。預測期內的主要趨勢包括法規合規性和品質標準、客製化和設計靈活性、快速原型製作和製造技術、永續性和材料創新，以及工業 4.0 和智慧製造。

未來五年15.4%的預測成長率，較我們先前對該市場的預測略有下降0.7%。這一下降主要源自於美國與其他國家之間關稅的影響。這可能會直接影響美國，限制其從德國和日本大量進口的3D電路元件的供應，並擾亂其先進汽車感測器和醫療設備的生產。由於互惠關稅以及不斷升級的貿易緊張局勢和限制措施對全球經濟和貿易的負面影響，影響也將更加廣泛。

物聯網設備需求的不斷成長有望推動模塑互連設備市場的成長。物聯網設備包括大量連接到網際網路並在設備和系統之間交換資料的實體實體。這一成長主要源自於半導體和電子產業對更高運算速度、效率、低功耗設備和智慧晶片組的需求。根據 Techjury 於 2022 年 8 月基於 IoT Analytics 數據的報告，企業的物聯網舉措特別專注於智慧城市（23%）、連網產業（17%）和連網建築（12%）。然而，從物聯網相關數據中提取價值對於 97% 的公司來說仍然是一項挑戰，這凸顯了市場的成長潛力。

目錄

第1章執行摘要

第2章 市場特徵

第3章 市場趨勢與策略

第4章 市場：宏觀經濟情景，包括利率、通膨、地緣政治、貿易戰和關稅，以及新冠疫情和復甦對市場的影響

第5章 全球成長分析與策略分析框架

  • 全球模製互連設備 (MID) 市場：PESTEL 分析（政治、社會、技術、環境、法律因素、促進因素和限制因素）
  • 最終用途產業分析
  • 全球模製互連設備（MID）市場：成長率分析
  • 全球模塑互連設備 (MID) 市場表現：規模與成長，2019-2024 年
  • 全球模塑互連設備 (MID) 市場預測：規模與成長，2024-2029 年，2034 年預測
  • 全球模塑互連設備 (MID)：總目標市場 (TAM)

第6章市場區隔

  • 全球模塑互連設備 (MID) 市場：按產品、性能和預測，2019-2024 年、2024-2029 年、2034 年
  • 天線和連接模組
  • 連接器和開關
  • 感應器
  • 燈光
  • 全球模塑互連設備 (MID) 市場：按製程、實際狀況及預測，2019-2024 年、2024-2029 年、2034 年
  • 雷射直接成型 (LDS)
  • 雙色注塑成型
  • 其他流程
  • 全球模塑互連設備 (MID) 市場：按應用、效能及預測，2019-2024 年、2024-2029 年、2034 年
  • 車
  • 消費品
  • 衛生保健
  • 產業
  • 軍事和航太
  • 通訊和計算
  • 全球模塑互連設備 (MID) 市場、天線和連接模組、按類型細分：實際結果和預測，2019-2024 年、2024-2029 年、2034 年
  • 整合天線
  • 射頻模組
  • 全球模塑互連設備 (MID) 市場、連接器和開關（按類型細分）：實際結果和預測（2019-2024 年、2024-2029 年、2034 年）
  • 電連接器
  • 機械開關
  • 全球模塑互連設備 (MID) 市場、感測器、按類型細分：實際結果和預測，2019-2024 年、2024-2029 年、2034 年
  • 溫度感測器
  • 壓力感測器
  • 接近感測器
  • 全球模塑互連設備 (MID) 市場、照明（按類型細分）：實際結果和預測（2019-2024 年、2024-2029 年預測、2034 年預測）
  • LED照明模組
  • 裝飾照明解決方案

第7章 區域和國家分析

  • 全球模塑互連設備 (MID) 市場：區域表現及預測（2019-2024 年、2024-2029 年及 2034 年）
  • 全球模塑互連設備 (MID) 市場：國家/地區、績效及預測（2019-2024 年、2024-2029 年及 2034 年）

第8章 亞太市場

第9章：中國市場

第10章 印度市場

第11章 日本市場

第12章：澳洲市場

第13章 印尼市場

第14章 韓國市場

第15章 西歐市場

第16章英國市場

第17章：德國市場

第18章：法國市場

第19章：義大利市場

第20章：西班牙市場

第21章 東歐市場

第22章 俄羅斯市場

第23章 北美市場

第24章美國市場

第25章：加拿大市場

第26章 南美洲市場

第27章：巴西市場

第28章 中東市場

第29章：非洲市場

第30章：競爭格局與公司概況

  • 模製互連設備 (MID) 市場：競爭格局
  • 模製互連設備 (MID) 市場：公司簡介
    • Molex LLC Overview, Products and Services, Strategy and Financial Analysis
    • TE Connectivity Ltd. Overview, Products and Services, Strategy and Financial Analysis
    • Amphenol Corporation Overview, Products and Services, Strategy and Financial Analysis
    • LPKF Laser & Electronics AG Overview, Products and Services, Strategy and Financial Analysis
    • 2E mechatronic GmbH & Co. KG Overview, Products and Services, Strategy and Financial Analysis

第31章：其他領先和創新企業

  • Harting Technologiegruppe
  • Arlington Plating Company
  • MID Solutions LLC
  • MacDermid Inc.
  • JOHNAN Corporation
  • TactoTek Oy
  • Axon'Cable SAS
  • S2P Solutions
  • Suzhou Cicor Technology Co. Ltd
  • Chogori Technology Co. Ltd.
  • Mitsubishi Engineering-Plastics Corporation
  • Galtronics Corporation Ltd.
  • RTP Company
  • BASF SE
  • EMS-Chemie Holding AG

第 32 章全球市場競爭基準化分析與儀表板

第33章 重大併購

第34章近期市場趨勢

第 35 章：高潛力市場國家、細分市場與策略

  • 2029 年模製互連設備 (MID) 市場：提供新機會的國家
  • 2029 年模塑互連設備 (MID) 市場：細分市場帶來新機會
  • 2029 年模製互連設備 (MID) 市場：成長策略
    • 基於市場趨勢的策略
    • 競爭對手的策略

第36章 附錄

簡介目錄
Product Code: r22792u

Molded Interconnect Devices (MIDs) represent sophisticated electromechanical components integrating mechanical and electrical engineering principles in three dimensions. They amalgamate traditional product interfaces-circuit boards, housing, connectors, and wiring-into a singular, compact, and fully functional unit. MIDs typify a production method utilizing selectively plated plastic pieces.

The primary processes employed in Molded Interconnect Devices encompass Laser Direct Structuring (LDS), Two-Shot Molding, and other relevant techniques. Laser Direct Structuring stands out as an environmentally friendly, precise, and pioneering manufacturing method for three-dimensional molded connector devices. These products include antenna and connectivity modules, connectors and switches, sensors, lighting, and other relevant items. Applications span across automotive, consumer products, healthcare, industrial, military and aerospace, as well as telecommunication and computing sectors.

Note that the outlook for this market is being affected by rapid changes in trade relations and tariffs globally. The report will be updated prior to delivery to reflect the latest status, including revised forecasts and quantified impact analysis. The report's Recommendations and Conclusions sections will be updated to give strategies for entities dealing with the fast-moving international environment.

The sharp escalation of U.S. tariffs and resulting trade tensions in spring 2025 are significantly affecting the electrical and electronics sector. Key components such as semiconductors, display panels, and rare-earth metals crucial for batteries and motors are now facing heavy duties. Consumer electronics companies are seeing profit margins shrink, as fierce competition makes it difficult to pass on rising costs to consumers. At the same time, industrial electronics firms are experiencing project delays due to shortages of tariff-impacted parts like printed circuit boards. In response, businesses are shifting assembly operations to tariff-exempt nations, building up inventory reserves, and redesigning products to reduce reliance on restricted materials.

The molded interconnected device market research report is one of a series of new reports from The Business Research Company that provides molded interconnected device market statistics, including molded interconnected device industry global market size, regional shares, competitors with a molded interconnected device market share, detailed molded interconnected device market segments, market trends and opportunities, and any further data you may need to thrive in the molded interconnected device industry. This molded interconnected device market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

The molded interconnect device (mid) market size has grown rapidly in recent years. It will grow from $1.75 billion in 2024 to $2 billion in 2025 at a compound annual growth rate (CAGR) of 14.4%. The growth in the historic period can be attributed to miniaturization trends, consumer electronics evolution, automotive electronics development, medical device innovations, shift towards smart manufacturing.

The molded interconnect device (mid) market size is expected to see rapid growth in the next few years. It will grow to $3.55 billion in 2029 at a compound annual growth rate (CAGR) of 15.4%. The growth in the forecast period can be attributed to ongoing evolution of consumer electronics, rise in medical device integration, automotive electronics growth, rapid prototyping and manufacturing innovations. Major trends in the forecast period include regulatory compliance and quality standards, customization and design flexibility, rapid prototyping and manufacturing technologies, sustainability and material innovations, industry 4.0 and smart manufacturing.

The forecast of 15.4% growth over the next five years reflects a modest reduction of 0.7% from the previous estimate for this market. This reduction is primarily due to the impact of tariffs between the US and other countries. This is likely to directly affect the US through constrained availability of 3D circuitry components, heavily imported from Germany and Japan, disrupting production of advanced automotive sensors and medical devices. The effect will also be felt more widely due to reciprocal tariffs and the negative effect on the global economy and trade due to increased trade tensions and restrictions.

The rising demand for IoT devices is poised to drive the growth of the molded interconnect devices market. IoT devices encompass a multitude of physical items connected to the internet, exchanging data across devices and systems. This surge is fueled by the demand for higher computational speed, efficiency, low-power devices, and intelligent chipsets, primarily within the semiconductor & electronics industry. As reported in August 2022 by Techjury sourced from IoT Analytics, corporate IoT initiatives focused notably on Smart City (23%), Connected Industry (17%), and Connected Building (12%). However, the extraction of value from IoT-related data remains a challenge for 97% of firms, underscoring the market's potential growth.

The burgeoning demand within the aerospace industry is expected to propel the growth of the molded interconnect devices market. Molded interconnect devices offer significant advantages such as space savings, weight reduction, reliability, thermal management, manufacturing efficiency, and design flexibility, aligning well with diverse aerospace applications. For instance, as reported in August 2023 by Cadrex, the aerospace industry recorded revenue of $741 billion in 2022, marking a 3% increase from the previous year. This industry's expanding requirements are a key driver stimulating growth within the molded interconnect devices market.

Technological advancement is a prominent trend gaining traction in the molded interconnect device market. Leading companies in this sector are focusing on developing innovative technological solutions that can adapt to various applications, which has spurred the evolution of technologies like laser plastic welding. For example, in April 2022, SABIC, a Saudi Arabia-based chemical company known for producing chemicals, plastics, agri-nutrients, and metals, introduced the LNP THERMOCOMP OFC08V compound. This high-performance solution is tailored for 5G base station dipole antennas and other electrical and electronic applications. The compound is a glass fiber-reinforced material derived from polyphenylene sulfide (PPS) resin, specifically designed to facilitate lightweight and cost-effective all-plastic antenna designs. It exhibits excellent performance in laser direct structuring (LDS) plating, ensuring strong adhesion between layers, effective warpage control, and reliable dielectric and radio frequency (RF) characteristics.

Major companies operating in the molded interconnect device market are focusing on pioneering products such as light antennas to bolster market revenues. Light antennas represent a breakthrough in wireless communications, being smaller than a US dime and pivotal in enabling widespread LiFi (Light Fidelity) usage in smartphones and connected devices. As unveiled in February 2023 by pureLiFi Limited, the LiFi Light Antenna is engineered for seamless integration, optimizing performance, size, cost, and production needs. Leveraging the light spectrum, LiFi surpasses conventional technologies like WiFi and 5G in speed, reliability, and security, offering scalability for widespread adoption in smartphones and connected devices.

In September 2022, Tide Rock Holdings completed the acquisition of Plastic Molding Technology (PMT), a strategic move that expands their service capabilities across multiple sites. This acquisition brings onboard a highly skilled team and 95 molding machines ranging from 20 to 500 tons, positioning Tide Rock Holdings to cater to a broader client base in plastic injection and inserts molding. Plastic Molding Technology is renowned in the industry for its expertise and strategic site locations.

Major companies operating in the molded interconnect device (MID) market are Molex LLC, TE Connectivity Ltd., Amphenol Corporation, LPKF Laser & Electronics AG, 2E mechatronic GmbH & Co. KG, Harting Technologiegruppe, Arlington Plating Company, MID Solutions LLC, MacDermid Inc., JOHNAN Corporation, TactoTek Oy, Axon' Cable S.A.S, S2P Solutions, Suzhou Cicor Technology Co. Ltd, Chogori Technology Co. Ltd., Mitsubishi Engineering-Plastics Corporation, Galtronics Corporation Ltd., RTP Company, BASF SE, EMS-Chemie Holding AG, Ensinger GmbH, Zeon Corporation, SelectConnect Technologies, Multiple Dimensions AG, Cicor Group, Tesa SE, Yomura Technologies Inc., T-Ink Inc., ODU GmbH & Co. KG

Asia-Pacific was the largest region in the molded interconnect device (MID) market share in 2024. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the molded interconnect device (mid) market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the molded interconnect device (mid) market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The molded interconnect device market consists of sales of metal spraying and film techniques. Values in this market are 'factory gate' values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

Molded Interconnect Device (MID) Global Market Report 2025 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses on molded interconnect device (mid) market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

Reasons to Purchase

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  • Create regional and country strategies on the basis of local data and analysis.
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  • Report will be updated with the latest data and delivered to you within 2-3 working days of order along with an Excel data sheet for easy data extraction and analysis.
  • All data from the report will also be delivered in an excel dashboard format.

Where is the largest and fastest growing market for molded interconnect device (mid) ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward, including technological disruption, regulatory shifts, and changing consumer preferences? The molded interconnect device (mid) market global report from the Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

  • The market characteristics section of the report defines and explains the market.
  • The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
  • The forecasts are made after considering the major factors currently impacting the market. These include:

The forecasts are made after considering the major factors currently impacting the market. These include the technological advancements such as AI and automation, Russia-Ukraine war, trade tariffs (government-imposed import/export duties), elevated inflation and interest rates.

  • Market segmentations break down the market into sub markets.
  • The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth.
  • The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
  • The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.

Scope

  • Markets Covered:1) By Product: Antenna And Connectivity Modules; Connectors And Switches; Sensors; Lighting
  • 2) By Process: Laser Direct Structuring (LDS); Two-Shot Molding; Other Processes
  • 3) By Application: Automotive; Consumer Products; Healthcare; Industrial; Military And Aerospace; Telecommunication And Computing
  • Subsegments:
  • 1) By Antenna And Connectivity Modules: Integrated Antennas; RF Modules
  • 2) By Connectors And Switches: Electrical Connectors; Mechanical Switches
  • 3) By Sensors: Temperature Sensors; Pressure Sensors; Proximity Sensors
  • 4) By Lighting: LED Lighting Modules; Decorative Lighting Solutions
  • Companies Mentioned:Molex LLC; TE Connectivity Ltd.; Amphenol Corporation; LPKF Laser & Electronics AG; 2E mechatronic GmbH & Co. KG; Harting Technologiegruppe; Arlington Plating Company; MID Solutions LLC; MacDermid Inc.; JOHNAN Corporation; TactoTek Oy; Axon' Cable S.A.S; S2P Solutions; Suzhou Cicor Technology Co. Ltd; Chogori Technology Co. Ltd.; Mitsubishi Engineering-Plastics Corporation; Galtronics Corporation Ltd.; RTP Company; BASF SE; EMS-Chemie Holding AG; Ensinger GmbH; Zeon Corporation; SelectConnect Technologies; Multiple Dimensions AG; Cicor Group; Tesa SE; Yomura Technologies Inc.; T-Ink Inc.; ODU GmbH & Co. KG
  • Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain
  • Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
  • Time Series: Five years historic and ten years forecast.
  • Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita,
  • Data Segmentations: country and regional historic and forecast data, market share of competitors, market segments.
  • Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
  • Delivery Format: PDF, Word and Excel Data Dashboard.

Table of Contents

1. Executive Summary

2. Molded Interconnect Device (MID) Market Characteristics

3. Molded Interconnect Device (MID) Market Trends And Strategies

4. Molded Interconnect Device (MID) Market - Macro Economic Scenario Including The Impact Of Interest Rates, Inflation, Geopolitics, Trade Wars and Tariffs, And Covid And Recovery On The Market

  • 4.1. Supply Chain Impact from Tariff War & Trade Protectionism

5. Global Molded Interconnect Device (MID) Growth Analysis And Strategic Analysis Framework

  • 5.1. Global Molded Interconnect Device (MID) PESTEL Analysis (Political, Social, Technological, Environmental and Legal Factors, Drivers and Restraints)
  • 5.2. Analysis Of End Use Industries
  • 5.3. Global Molded Interconnect Device (MID) Market Growth Rate Analysis
  • 5.4. Global Molded Interconnect Device (MID) Historic Market Size and Growth, 2019 - 2024, Value ($ Billion)
  • 5.5. Global Molded Interconnect Device (MID) Forecast Market Size and Growth, 2024 - 2029, 2034F, Value ($ Billion)
  • 5.6. Global Molded Interconnect Device (MID) Total Addressable Market (TAM)

6. Molded Interconnect Device (MID) Market Segmentation

  • 6.1. Global Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Antenna And Connectivity Modules
  • Connectors And Switches
  • Sensors
  • Lighting
  • 6.2. Global Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Laser Direct Structuring (LDS)
  • Two-Shot Molding
  • Other Processes
  • 6.3. Global Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Automotive
  • Consumer Products
  • Healthcare
  • Industrial
  • Military And Aerospace
  • Telecommunication And Computing
  • 6.4. Global Molded Interconnect Device (MID) Market, Sub-Segmentation Of Antenna And Connectivity Modules, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Integrated Antennas
  • RF Modules
  • 6.5. Global Molded Interconnect Device (MID) Market, Sub-Segmentation Of Connectors And Switches, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Electrical Connectors
  • Mechanical Switches
  • 6.6. Global Molded Interconnect Device (MID) Market, Sub-Segmentation Of Sensors, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Temperature Sensors
  • Pressure Sensors
  • Proximity Sensors
  • 6.7. Global Molded Interconnect Device (MID) Market, Sub-Segmentation Of Lighting, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • LED Lighting Modules
  • Decorative Lighting Solutions

7. Molded Interconnect Device (MID) Market Regional And Country Analysis

  • 7.1. Global Molded Interconnect Device (MID) Market, Split By Region, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 7.2. Global Molded Interconnect Device (MID) Market, Split By Country, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

8. Asia-Pacific Molded Interconnect Device (MID) Market

  • 8.1. Asia-Pacific Molded Interconnect Device (MID) Market Overview
  • Region Information, Market Information, Background Information, Government Initiatives, Regulations, Regulatory Bodies, Major Associations, Taxes Levied, Corporate Tax Structure, Investments, Major Companies
  • 8.2. Asia-Pacific Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 8.3. Asia-Pacific Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 8.4. Asia-Pacific Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

9. China Molded Interconnect Device (MID) Market

  • 9.1. China Molded Interconnect Device (MID) Market Overview
  • 9.2. China Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion
  • 9.3. China Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion
  • 9.4. China Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion

10. India Molded Interconnect Device (MID) Market

  • 10.1. India Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 10.2. India Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 10.3. India Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

11. Japan Molded Interconnect Device (MID) Market

  • 11.1. Japan Molded Interconnect Device (MID) Market Overview
  • 11.2. Japan Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 11.3. Japan Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 11.4. Japan Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

12. Australia Molded Interconnect Device (MID) Market

  • 12.1. Australia Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 12.2. Australia Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 12.3. Australia Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

13. Indonesia Molded Interconnect Device (MID) Market

  • 13.1. Indonesia Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 13.2. Indonesia Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 13.3. Indonesia Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

14. South Korea Molded Interconnect Device (MID) Market

  • 14.1. South Korea Molded Interconnect Device (MID) Market Overview
  • 14.2. South Korea Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 14.3. South Korea Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 14.4. South Korea Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

15. Western Europe Molded Interconnect Device (MID) Market

  • 15.1. Western Europe Molded Interconnect Device (MID) Market Overview
  • 15.2. Western Europe Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 15.3. Western Europe Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 15.4. Western Europe Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

16. UK Molded Interconnect Device (MID) Market

  • 16.1. UK Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 16.2. UK Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 16.3. UK Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

17. Germany Molded Interconnect Device (MID) Market

  • 17.1. Germany Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 17.2. Germany Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 17.3. Germany Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

18. France Molded Interconnect Device (MID) Market

  • 18.1. France Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 18.2. France Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 18.3. France Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

19. Italy Molded Interconnect Device (MID) Market

  • 19.1. Italy Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 19.2. Italy Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 19.3. Italy Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

20. Spain Molded Interconnect Device (MID) Market

  • 20.1. Spain Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 20.2. Spain Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 20.3. Spain Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

21. Eastern Europe Molded Interconnect Device (MID) Market

  • 21.1. Eastern Europe Molded Interconnect Device (MID) Market Overview
  • 21.2. Eastern Europe Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 21.3. Eastern Europe Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 21.4. Eastern Europe Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

22. Russia Molded Interconnect Device (MID) Market

  • 22.1. Russia Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 22.2. Russia Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 22.3. Russia Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

23. North America Molded Interconnect Device (MID) Market

  • 23.1. North America Molded Interconnect Device (MID) Market Overview
  • 23.2. North America Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 23.3. North America Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 23.4. North America Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

24. USA Molded Interconnect Device (MID) Market

  • 24.1. USA Molded Interconnect Device (MID) Market Overview
  • 24.2. USA Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 24.3. USA Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 24.4. USA Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

25. Canada Molded Interconnect Device (MID) Market

  • 25.1. Canada Molded Interconnect Device (MID) Market Overview
  • 25.2. Canada Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 25.3. Canada Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 25.4. Canada Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

26. South America Molded Interconnect Device (MID) Market

  • 26.1. South America Molded Interconnect Device (MID) Market Overview
  • 26.2. South America Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 26.3. South America Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 26.4. South America Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

27. Brazil Molded Interconnect Device (MID) Market

  • 27.1. Brazil Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 27.2. Brazil Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 27.3. Brazil Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

28. Middle East Molded Interconnect Device (MID) Market

  • 28.1. Middle East Molded Interconnect Device (MID) Market Overview
  • 28.2. Middle East Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 28.3. Middle East Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 28.4. Middle East Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

29. Africa Molded Interconnect Device (MID) Market

  • 29.1. Africa Molded Interconnect Device (MID) Market Overview
  • 29.2. Africa Molded Interconnect Device (MID) Market, Segmentation By Product, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 29.3. Africa Molded Interconnect Device (MID) Market, Segmentation By Process, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 29.4. Africa Molded Interconnect Device (MID) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

30. Molded Interconnect Device (MID) Market Competitive Landscape And Company Profiles

  • 30.1. Molded Interconnect Device (MID) Market Competitive Landscape
  • 30.2. Molded Interconnect Device (MID) Market Company Profiles
    • 30.2.1. Molex LLC Overview, Products and Services, Strategy and Financial Analysis
    • 30.2.2. TE Connectivity Ltd. Overview, Products and Services, Strategy and Financial Analysis
    • 30.2.3. Amphenol Corporation Overview, Products and Services, Strategy and Financial Analysis
    • 30.2.4. LPKF Laser & Electronics AG Overview, Products and Services, Strategy and Financial Analysis
    • 30.2.5. 2E mechatronic GmbH & Co. KG Overview, Products and Services, Strategy and Financial Analysis

31. Molded Interconnect Device (MID) Market Other Major And Innovative Companies

  • 31.1. Harting Technologiegruppe
  • 31.2. Arlington Plating Company
  • 31.3. MID Solutions LLC
  • 31.4. MacDermid Inc.
  • 31.5. JOHNAN Corporation
  • 31.6. TactoTek Oy
  • 31.7. Axon' Cable S.A.S
  • 31.8. S2P Solutions
  • 31.9. Suzhou Cicor Technology Co. Ltd
  • 31.10. Chogori Technology Co. Ltd.
  • 31.11. Mitsubishi Engineering-Plastics Corporation
  • 31.12. Galtronics Corporation Ltd.
  • 31.13. RTP Company
  • 31.14. BASF SE
  • 31.15. EMS-Chemie Holding AG

32. Global Molded Interconnect Device (MID) Market Competitive Benchmarking And Dashboard

33. Key Mergers And Acquisitions In The Molded Interconnect Device (MID) Market

34. Recent Developments In The Molded Interconnect Device (MID) Market

35. Molded Interconnect Device (MID) Market High Potential Countries, Segments and Strategies

  • 35.1 Molded Interconnect Device (MID) Market In 2029 - Countries Offering Most New Opportunities
  • 35.2 Molded Interconnect Device (MID) Market In 2029 - Segments Offering Most New Opportunities
  • 35.3 Molded Interconnect Device (MID) Market In 2029 - Growth Strategies
    • 35.3.1 Market Trend Based Strategies
    • 35.3.2 Competitor Strategies

36. Appendix

  • 36.1. Abbreviations
  • 36.2. Currencies
  • 36.3. Historic And Forecast Inflation Rates
  • 36.4. Research Inquiries
  • 36.5. The Business Research Company
  • 36.6. Copyright And Disclaimer