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市場調查報告書
商品編碼
2043809

2034年全球最先進的結光刻市場預測－按技術、應用、最終用戶和地區分類的全球分析

Leading-Edge Node Lithography Market Forecasts to 2034 - Global Analysis By Technology (EUV Lithography and High-NA EUV Lithography), Application, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 | 商品交期: 2-3個工作天內

價格

根據 Stratistics MRC 的數據，預計到 2026 年，全球最先進的節點光刻市場規模將達到 75 億美元，並在預測期內以 12.0% 的複合年成長率成長，到 2034 年將達到 186 億美元。

先進節點光刻技術是指用於製造具有超精細幾何形狀（包括 5 奈米、3 奈米及更小節點）的半導體裝置的尖端技術。該技術依賴極紫外光刻 (EUV)、高數值孔徑 (NA) 系統和專用抗蝕劑，以高精度製造極其精細的結構。這種能力能夠實現高密度電晶體封裝、高速運轉和更高的能源效率。然而，在大規模生產環境中，隨機性和變異性日益影響尺寸縮小的極限和長期技術進步目標，因此，先進節點光刻技術也帶來了高成本、複雜的整合製程以及嚴格的缺陷控制要求，以確保良率和產品可靠性。

據 SEMI 稱，光刻技術佔晶圓製造成本的 35-40% 甚至更多，是半導體製造中資本最密集的製程。

先進家用電子電器的廣泛應用

先進家用電子電器的日益普及顯著推動了尖端節點微影市場的擴張。智慧型手機、智慧型手錶和連網裝置等都需要高效且小巧的半導體解決方案。先進的節點技術能夠製造出更小巧、效能更高、能源效率更高的晶片。隨著消費者越來越重視效能和電池續航力，製造商也努力提升設備的功能。這一趨勢促使半導體製造商利用尖端微影術技術，支援晶片生產的持續創新，並提升快速發展的全球家用電子電器市場的功能和用戶體驗。

大量資本投資和設備成本

先進節點微影術市場面臨的主要挑戰之一是與複雜製造基礎設施和設備相關的巨額成本。極紫外光刻系統和精密工具等技術需要巨額投資，通常高達數十億美元。建立最先進的製造工廠需要持續的資金投入，這使得市場參與企業僅限於大型產業企業。這些資金限制使得中小企業難以進入市場或擴大業務。此外，持續升級對於維持技術競爭力至關重要，這也加重了企業的負擔。這些高成本阻礙了先進微影術解決方案在全球半導體產業的應用，並限制了其發展。

下一代半導體材料的開發

半導體材料的進步為尖端微影術技術的發展帶來了巨大的機會。包括改良型抗蝕劑和介電化合物在內的新興材料，能夠提高奈米級圖形化的精度和晶片的整體效率。這些進步使得晶片尺寸能夠進一步縮小，超越現有技術節點。將新材料融入製造程序，可以減少缺陷並提高生產效率。材料科學領域的持續研究與微影術技術的進步同步推動創新。這使得製造商能夠打造差異化解決方案，提升產品性能，保持競爭力，並在全球範圍內推動下一代半導體技術的演進。

地緣政治緊張局勢與貿易限制

地緣政治緊張局勢加劇和貿易限制對尖端微影術市場帶來重大風險。政府的出口限制可能會限制某些地區關鍵半導體技術的供應，從而擾亂國際供應鏈，並使產業相關人員之間的合作更加複雜。先進設備的取得受限可能會減緩製造和創新進程。此外，政治緊張局勢可能導致全球半導體產業分裂，造成效率低落和營運成本上升。這些挑戰造成了不確定性，並可能阻礙全球半導體產業先進微影術技術的整體成長和發展。

新冠疫情的感染疾病：

新冠疫情對尖端微影術市場的影響既充滿挑戰又具有變革意義。疫情初期，供應鏈中斷、勞動力短缺和工廠臨時關閉影響了半導體生產和設備供應。儘管面臨這些不利因素，但對數位基礎設施、線上服務和電子設備的需求迅速成長，推動了對先進半導體的需求。這種轉變刺激了對尖端微影術技術的投資。此外，疫情凸顯了供應鏈的脆弱性，促使各國政府和企業加強國內製造業能力建設，並投資先進半導體基礎設施，以支持全球長期成長和韌性。

在預測期內，EUV光刻產業預計將佔據最大的市場規模。

EUV微影技術是先進晶片製造領域應用最廣泛的技術，因此預計在預測期內將佔據最大的市場佔有率。該技術能夠實現奈米級高精度圖形化，適用於現代半導體的大規模生產。製造商之所以青睞這種方法，是因為它最大限度地減少了複雜多重圖形化製程的需求，並提高了整體效率。與新興技術相比，EUV光刻技術已確立了其領先地位，並被各大製造工廠廣泛採用。性能、穩定性和行業支持的不斷提升進一步鞏固了其主導地位。

在預測期內，研發和原型製作領域預計將呈現最高的複合年成長率。

在預測期內，研發和原型製作領域預計將呈現最高的成長率，這主要得益於創新和先進半導體研究投入的增加。各公司正致力於開發和檢驗新的晶片設計、小型化節點和創新架構。材料、製造程序和微影術技術的不斷進步，推動了該領域的快速發展。在大規模生產之前檢驗和完善技術的需求，也帶動了對原型製作解決方案的需求。隨著產業競爭的加劇，研發活動顯著擴展，研發原型製作已成為全球先進微影術應用領域快速成長與技術進步的關鍵驅動力。

市佔率最大的地區：

在預測期內，亞太地區預計將佔據最大的市場佔有率，這主要得益於其高度發展的半導體產業和眾多大型製造企業的集中。該地區擁有先進的製造基礎設施、高效的供應鏈網路和政府扶持政策。對電子產品、雲端服務和通訊系統日益成長的需求進一步鞏固了該地區的市場地位。持續投資擴大產能並採用最先進的微影術技術，正在推動市場進一步成長。亞太地區高度重視技術創新、營運效率和大規模生產能力，將繼續引領全球市場，並在先進半導體製造技術領域中保持顯著的市場佔有率。

複合年成長率最高的地區：

在預測期內，北美地區預計將呈現最高的複合年成長率，這主要得益於半導體生產和創新領域投資的增加。為確保供應鏈韌性而加強國內製造能力的措施正在加速推進。人工智慧、雲端運算和資料中心等領域日益成長的需求也支撐著這一成長。政府透過資助計畫和優惠政策提供的支持正在促進先進微影術解決方案的普及應用。此外，對研發的高度重視正在加速市場發展，使北美成為全球先進半導體製造領域成長最快的地區。

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所有購買此報告的客戶均可享受以下免費自訂選項之一：

  • 企業概況
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  • 區域細分
    • 應客戶要求，我們提供主要國家的市場估算和預測，以及複合年成長率（註：需進行可行性檢查）。
  • 競爭性標竿分析
    • 根據產品系列、地理覆蓋範圍和策略聯盟對領先公司進行基準分析。

目錄

第1章執行摘要

  • 市場概覽及主要亮點
  • 促進因素、挑戰與機遇
  • 競爭格局概述
  • 戰略洞察與建議

第2章：研究框架

  • 研究目標和範圍
  • 相關人員分析
  • 研究假設和限制
  • 調查方法

第3章 市場動態與趨勢分析

  • 市場定義與結構
  • 主要市場促進因素
  • 市場限制與挑戰
  • 投資成長機會和重點領域
  • 產業威脅與風險評估
  • 技術與創新展望
  • 新興市場/高成長市場
  • 監管和政策環境
  • 新冠疫情的影響及復甦前景

第4章：競爭環境與策略評估

  • 波特五力分析
    • 供應商的議價能力
    • 買方的議價能力
    • 替代品的威脅
    • 新進入者的威脅
    • 競爭公司之間的競爭
  • 主要公司市佔率分析
  • 產品基準評效和效能比較

第5章：全球先進結光刻技術市場：依技術分類

  • 極微影術
  • 高數值微影術極紫外光刻

第6章：全球先進結節光刻市場：依應用領域分類

  • 邏輯和儲存積體電路的製造
  • 先進包裝
  • 研究與開發/原型製作

第7章：全球先進結節光刻市場：依最終用戶分類

  • 專業鑄造廠
  • 垂直整合設備製造商（IDM）
  • 無廠半導體公司

第8章：全球高階結節造影市場：按地區分類

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 英國
    • 德國
    • 法國
    • 義大利
    • 西班牙
    • 荷蘭
    • 比利時
    • 瑞典
    • 瑞士
    • 波蘭
    • 其他歐洲國家
  • 亞太地區
    • 中國
    • 日本
    • 印度
    • 韓國
    • 澳洲
    • 印尼
    • 泰國
    • 馬來西亞
    • 新加坡
    • 越南
    • 其他亞太國家
  • 南美洲
    • 巴西
    • 阿根廷
    • 哥倫比亞
    • 智利
    • 秘魯
    • 其他南美國家
  • 世界其他地區（RoW）
    • 中東
      • 沙烏地阿拉伯
      • 阿拉伯聯合大公國
      • 卡達
      • 以色列
      • 其他中東國家
    • 非洲
      • 南非
      • 埃及
      • 摩洛哥
      • 其他非洲國家

第9章 戰略市場資訊

  • 工業價值網路和供應鏈評估
  • 空白區域和機會地圖
  • 產品演進與市場生命週期分析
  • 通路、經銷商和打入市場策略的評估

第10章：產業趨勢與策略舉措

  • 併購
  • 夥伴關係、聯盟和合資企業
  • 新產品發布和認證
  • 擴大生產能力和投資
  • 其他策略舉措

第11章：公司簡介

  • ASML Holding NV
  • Nikon Corporation
  • Canon Inc.
  • KLA Corporation
  • Carl Zeiss AG
  • Lasertec Corporation
  • TRUMPF
  • AGC Inc.
  • Veeco Instruments Inc.
  • SUSS MicroTec SE
  • SCREEN Holdings Co., Ltd.
  • Onto Innovation Inc.
  • JEOL Ltd.
  • NuFlare Technology Inc.
  • Shanghai Micro Electronics Equipment（SMEE）
  • EV Group（EVG）
  • Neutronix Quintel Inc.（NXQ）
  • Gigaphoton Inc.
Product Code: SMRC36067

According to Stratistics MRC, the Global Leading-Edge Node Lithography Market is accounted for $7.5 billion in 2026 and is expected to reach $18.6 billion by 2034 growing at a CAGR of 12.0% during the forecast period. Advanced node lithography describes the cutting edge methods used to pattern semiconductor devices at ultra small geometries including five nanometer, three nanometer and smaller nodes. It depends on EUV exposure, high NA systems, and engineered resists to print extremely fine features with accuracy. This capability drives greater transistor packing, faster operation, and better energy efficiency. At the same time, it introduces high costs, intricate integration steps, and tight defect management requirements to protect yields and product reliability during mass production settings where randomness and variability increasingly affect scaling limits and long term technology advancement goals across the global semiconductor industry.

According to SEMI, lithography accounts for more than 35-40% of wafer fabrication costs, making it the single most capital-intensive step in semiconductor manufacturing.

Market Dynamics:

Driver:

Increasing adoption of advanced consumer electronics

Growing usage of sophisticated consumer electronics is significantly contributing to the expansion of the leading-edge node lithography market. Devices such as smartphones, smartwatches, and connected gadgets demand efficient and compact semiconductor solutions. Advanced nodes make it possible to produce smaller, high-performance chips with better energy efficiency. As consumers increasingly prioritize performance and battery longevity, manufacturers strive to enhance device capabilities. This trend encourages semiconductor producers to utilize cutting-edge lithography techniques, supporting continuous innovation in chip production and enabling improved functionality and user experience across the rapidly evolving global consumer electronics landscape.

Restraint:

High capital investment and equipment costs

One major challenge in the leading-edge node lithography market is the substantial cost associated with advanced manufacturing infrastructure and equipment. Technologies like EUV systems and precision tools require massive investments, often reaching billions of dollars. Establishing cutting-edge fabrication plants demands ongoing financial resources, restricting market participation to major industry players. Smaller firms find it difficult to enter or expand due to these financial constraints. Moreover, continuous upgrades are essential to stay technologically relevant, adding to the burden. These high costs hinder broader adoption and limit the expansion of advanced lithography solutions within the global semiconductor industry.

Opportunity:

Development of next-generation semiconductor materials

Advancements in semiconductor materials provide strong opportunities for the growth of leading-edge lithography technologies. Emerging materials, including improved resists and dielectric compounds, enhance the accuracy of nanoscale patterning and overall chip efficiency. These developments allow further miniaturization beyond existing technology nodes. Incorporating new materials into fabrication processes helps reduce defects and improve production outcomes. Ongoing research in material science supports innovation alongside lithography advancements. This enables manufacturers to create differentiated solutions, improve product performance, and maintain competitiveness while driving the evolution of next-generation semiconductor technologies globally.

Threat:

Geopolitical tensions and trade restrictions

Rising geopolitical conflicts and trade limitations represent a major risk for the leading-edge lithography market. Government-imposed export regulations can restrict the availability of essential semiconductor technologies in specific regions. This disrupts international supply networks and complicates collaboration between industry players. Limited access to advanced equipment may delay manufacturing and innovation efforts. Furthermore, political tensions can divide the global semiconductor landscape, leading to inefficiencies and higher operational costs. These challenges create uncertainty and may hinder the overall growth and development of advanced lithography technologies across the worldwide semiconductor industry.

Covid-19 Impact:

The impact of the COVID-19 pandemic on the leading-edge lithography market was both challenging and transformative. Early stages saw supply chain disruptions, labor shortages, and temporary factory closures affecting semiconductor production and equipment supply. Despite these setbacks, demand for digital infrastructure, online services, and electronic devices grew rapidly, driving the need for advanced semiconductors. This shift encouraged higher investment in cutting-edge lithography technologies. Additionally, the pandemic highlighted supply chain vulnerabilities, prompting governments and industries to strengthen local manufacturing capabilities and invest in advanced semiconductor infrastructure to support long-term growth and resilience worldwide.

The EUV lithography segment is expected to be the largest during the forecast period

The EUV lithography segment is expected to account for the largest market share during the forecast period as the most widely utilized technology in advanced chip manufacturing. It allows accurate nanoscale patterning, making it suitable for large-scale production of modern semiconductors. Manufacturers favor this approach because it minimizes the need for complex multi-patterning processes and enhances overall efficiency. Its established position compared to newer technologies has resulted in extensive adoption across major fabrication plants. Ongoing advancements in performance, stability, and industry support further reinforce its leadership.

The R&D prototyping segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the R&D prototyping segment is predicted to witness the highest growth rate, driven by rising investments in innovation and advanced semiconductor research. Organizations are focusing on developing and testing new chip designs, smaller nodes, and novel architectures. This segment gains momentum from ongoing improvements in materials, fabrication processes, and lithography methods. The necessity to test and refine technologies before mass production increases demand for prototyping solutions. As industry competition grows, research activities expand significantly, positioning R&D prototyping as a critical driver of rapid growth and technological progress in advanced lithography applications worldwide.

Region with largest share:

During the forecast period, the Asia-Pacific region is expected to hold the largest market share because of its well-developed semiconductor industry and concentration of key manufacturing players. The region benefits from advanced fabrication infrastructure, efficient supply networks, and supportive government policies. Growing demand for electronics, cloud services, and communication systems reinforces its market position. Ongoing investments in capacity expansion and cutting-edge lithography adoption drive further growth. With a strong emphasis on technological advancement, operational efficiency, and large-scale production capabilities, Asia-Pacific continues to lead the global market and maintain its significant share in advanced semiconductor manufacturing technologies.

Region with highest CAGR:

Over the forecast period, the North America region is anticipated to exhibit the highest CAGR, driven by rising investments in semiconductor production and innovation. Efforts to enhance domestic manufacturing capabilities are gaining momentum to ensure supply chain resilience. Increasing demand from sectors such as AI, cloud computing, and data centers supports this growth. Government support through funding programs and favorable policies encourages the adoption of advanced lithography solutions. Furthermore, strong focus on research and technological development accelerates market progress, making North America the most rapidly expanding region in the global advanced semiconductor manufacturing landscape.

Key players in the market

Some of the key players in Leading-Edge Node Lithography Market include ASML Holding N.V., Nikon Corporation, Canon Inc., KLA Corporation, Carl Zeiss AG, Lasertec Corporation, TRUMPF, AGC Inc., Veeco Instruments Inc., SUSS MicroTec SE, SCREEN Holdings Co., Ltd., Onto Innovation Inc., JEOL Ltd., NuFlare Technology Inc., Shanghai Micro Electronics Equipment (SMEE), EV Group (EVG), Neutronix Quintel Inc. (NXQ) and Gigaphoton Inc.

Key Developments:

In April 2026, Canon Inc. and Ross Video announced a partnership to deliver broadcast-grade PTZ camera solutions for modern live production environments. Through this collaboration, Canon's professional PTZ cameras-the Canon CR-N700 and CR-N500-can be deployed alongside Ross Video's production workflows, robotics, and automation platforms, enabling broadcasters and live production teams to incorporate high-quality PTZ cameras into their workflows.

In September 2025, ASML Holding NV (ASML) and Mistral AI announced a strategic partnership based on a long-term collaboration agreement to explore the use of AI models across ASML's product portfolio as well as research, development and operations, to benefit ASML customers with faster time to market and higher performance holistic lithography systems.

In May 2025, Nikon CeLL innovation Co., Ltd. (NCLi), a subsidiary of Nikon Corporation has entered into a strategic licensing agreement with RoosterBio, Inc. (RoosterBio), a leading stem cell technology company in the US. This agreement provides the Japanese biopharma industry with an end-to-end solution for development and manufacturing of human mesenchymal stem cells (MSC) and extracellular vesicle (EV) therapeutics.

Technologies Covered:

  • EUV Lithography
  • High-NA EUV Lithography

Applications Covered:

  • Logic & Memory IC Production
  • Advanced Packaging
  • R&D Prototyping

End Users Covered:

  • Pure-Play Foundries
  • Integrated Device Manufacturers (IDMs)
  • Fabless Companies

Regions Covered:

  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • United Kingdom
    • Germany
    • France
    • Italy
    • Spain
    • Netherlands
    • Belgium
    • Sweden
    • Switzerland
    • Poland
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Australia
    • Indonesia
    • Thailand
    • Malaysia
    • Singapore
    • Vietnam
    • Rest of Asia Pacific
  • South America
    • Brazil
    • Argentina
    • Colombia
    • Chile
    • Peru
    • Rest of South America
  • Rest of the World (RoW)
    • Middle East
  • Saudi Arabia
  • United Arab Emirates
  • Qatar
  • Israel
  • Rest of Middle East
    • Africa
  • South Africa
  • Egypt
  • Morocco
  • Rest of Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2023, 2024, 2025, 2026, 2027, 2028, 2030, 2032 and 2034
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

  • 1.1 Market Snapshot and Key Highlights
  • 1.2 Growth Drivers, Challenges, and Opportunities
  • 1.3 Competitive Landscape Overview
  • 1.4 Strategic Insights and Recommendations

2 Research Framework

  • 2.1 Study Objectives and Scope
  • 2.2 Stakeholder Analysis
  • 2.3 Research Assumptions and Limitations
  • 2.4 Research Methodology
    • 2.4.1 Data Collection (Primary and Secondary)
    • 2.4.2 Data Modeling and Estimation Techniques
    • 2.4.3 Data Validation and Triangulation
    • 2.4.4 Analytical and Forecasting Approach

3 Market Dynamics and Trend Analysis

  • 3.1 Market Definition and Structure
  • 3.2 Key Market Drivers
  • 3.3 Market Restraints and Challenges
  • 3.4 Growth Opportunities and Investment Hotspots
  • 3.5 Industry Threats and Risk Assessment
  • 3.6 Technology and Innovation Landscape
  • 3.7 Emerging and High-Growth Markets
  • 3.8 Regulatory and Policy Environment
  • 3.9 Impact of COVID-19 and Recovery Outlook

4 Competitive and Strategic Assessment

  • 4.1 Porter's Five Forces Analysis
    • 4.1.1 Supplier Bargaining Power
    • 4.1.2 Buyer Bargaining Power
    • 4.1.3 Threat of Substitutes
    • 4.1.4 Threat of New Entrants
    • 4.1.5 Competitive Rivalry
  • 4.2 Market Share Analysis of Key Players
  • 4.3 Product Benchmarking and Performance Comparison

5 Global Leading-Edge Node Lithography Market, By Technology

  • 5.1 EUV Lithography
  • 5.2 High-NA EUV Lithography

6 Global Leading-Edge Node Lithography Market, By Application

  • 6.1 Logic & Memory IC Production
  • 6.2 Advanced Packaging
  • 6.3 R&D Prototyping

7 Global Leading-Edge Node Lithography Market, By End User

  • 7.1 Pure-Play Foundries
  • 7.2 Integrated Device Manufacturers (IDMs)
  • 7.3 Fabless Companies

8 Global Leading-Edge Node Lithography Market, By Geography

  • 8.1 North America
    • 8.1.1 United States
    • 8.1.2 Canada
    • 8.1.3 Mexico
  • 8.2 Europe
    • 8.2.1 United Kingdom
    • 8.2.2 Germany
    • 8.2.3 France
    • 8.2.4 Italy
    • 8.2.5 Spain
    • 8.2.6 Netherlands
    • 8.2.7 Belgium
    • 8.2.8 Sweden
    • 8.2.9 Switzerland
    • 8.2.10 Poland
    • 8.2.11 Rest of Europe
  • 8.3 Asia Pacific
    • 8.3.1 China
    • 8.3.2 Japan
    • 8.3.3 India
    • 8.3.4 South Korea
    • 8.3.5 Australia
    • 8.3.6 Indonesia
    • 8.3.7 Thailand
    • 8.3.8 Malaysia
    • 8.3.9 Singapore
    • 8.3.10 Vietnam
    • 8.3.11 Rest of Asia Pacific
  • 8.4 South America
    • 8.4.1 Brazil
    • 8.4.2 Argentina
    • 8.4.3 Colombia
    • 8.4.4 Chile
    • 8.4.5 Peru
    • 8.4.6 Rest of South America
  • 8.5 Rest of the World (RoW)
    • 8.5.1 Middle East
      • 8.5.1.1 Saudi Arabia
      • 8.5.1.2 United Arab Emirates
      • 8.5.1.3 Qatar
      • 8.5.1.4 Israel
      • 8.5.1.5 Rest of Middle East
    • 8.5.2 Africa
      • 8.5.2.1 South Africa
      • 8.5.2.2 Egypt
      • 8.5.2.3 Morocco
      • 8.5.2.4 Rest of Africa

9 Strategic Market Intelligence

  • 9.1 Industry Value Network and Supply Chain Assessment
  • 9.2 White-Space and Opportunity Mapping
  • 9.3 Product Evolution and Market Life Cycle Analysis
  • 9.4 Channel, Distributor, and Go-to-Market Assessment

10 Industry Developments and Strategic Initiatives

  • 10.1 Mergers and Acquisitions
  • 10.2 Partnerships, Alliances, and Joint Ventures
  • 10.3 New Product Launches and Certifications
  • 10.4 Capacity Expansion and Investments
  • 10.5 Other Strategic Initiatives

11 Company Profiles

  • 11.1 ASML Holding N.V.
  • 11.2 Nikon Corporation
  • 11.3 Canon Inc.
  • 11.4 KLA Corporation
  • 11.5 Carl Zeiss AG
  • 11.6 Lasertec Corporation
  • 11.7 TRUMPF
  • 11.8 AGC Inc.
  • 11.9 Veeco Instruments Inc.
  • 11.10 SUSS MicroTec SE
  • 11.11 SCREEN Holdings Co., Ltd.
  • 11.12 Onto Innovation Inc.
  • 11.13 JEOL Ltd.
  • 11.14 NuFlare Technology Inc.
  • 11.15 Shanghai Micro Electronics Equipment (SMEE)
  • 11.16 EV Group (EVG)
  • 11.17 Neutronix Quintel Inc. (NXQ)
  • 11.18 Gigaphoton Inc.

List of Tables

  • Table 1 Global Leading-Edge Node Lithography Market Outlook, By Region (2023-2034) ($MN)
  • Table 2 Global Leading-Edge Node Lithography Market Outlook, By Technology (2023-2034) ($MN)
  • Table 3 Global Leading-Edge Node Lithography Market Outlook, By EUV Lithography (2023-2034) ($MN)
  • Table 4 Global Leading-Edge Node Lithography Market Outlook, By High-NA EUV Lithography (2023-2034) ($MN)
  • Table 5 Global Leading-Edge Node Lithography Market Outlook, By Application (2023-2034) ($MN)
  • Table 6 Global Leading-Edge Node Lithography Market Outlook, By Logic & Memory IC Production (2023-2034) ($MN)
  • Table 7 Global Leading-Edge Node Lithography Market Outlook, By Advanced Packaging (2023-2034) ($MN)
  • Table 8 Global Leading-Edge Node Lithography Market Outlook, By R&D Prototyping (2023-2034) ($MN)
  • Table 9 Global Leading-Edge Node Lithography Market Outlook, By End User (2023-2034) ($MN)
  • Table 10 Global Leading-Edge Node Lithography Market Outlook, By Pure-Play Foundries (2023-2034) ($MN)
  • Table 11 Global Leading-Edge Node Lithography Market Outlook, By Integrated Device Manufacturers (IDMs) (2023-2034) ($MN)
  • Table 12 Global Leading-Edge Node Lithography Market Outlook, By Fabless Companies (2023-2034) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Rest of the World (RoW) Regions are also represented in the same manner as above.