光子積體電路市場規模、佔有率和成長分析(按整合類型、組件、原料、應用和地區分類)-2026-2033年產業預測
市場調查報告書
商品編碼
1899761

光子積體電路市場規模、佔有率和成長分析(按整合類型、組件、原料、應用和地區分類)-2026-2033年產業預測

Photonic Integrated Circuit Market Size, Share, and Growth Analysis, By Type of Integration (Hybrid, Monolithic), By Components (Lasers, Modulators), By Raw Materials, By Applications, By Region - Industry Forecast 2026-2033

出版日期: | 出版商: SkyQuest | 英文 193 Pages | 商品交期: 3-5個工作天內

價格
簡介目錄

預計到 2024 年,全球光子積體電路 (PIC) 市場規模將達到 151.1 億美元,到 2025 年將達到 167.3 億美元,到 2033 年將達到 377.2 億美元,在預測期(2026-2033 年)內,複合成長率為 10.7%。

全球光子積體電路(PIC)市場正經歷強勁成長,這主要得益於通訊技術的進步、光電技術在各個領域的廣泛應用以及對高速資料傳輸需求的激增。 PIC 將多個光學元件整合到單一晶片上,具有性能提升、尺寸縮小和功耗降低等顯著優勢。資料中心和通訊網路的快速擴張,以及諸如用於自動駕駛汽車的雷射雷達(LiDAR)和 5G 網路等技術創新,進一步推動了對 PIC 的需求。然而,PIC 也面臨著許多挑戰,例如需要專業知識、初始成本高昂以及設計和製造流程複雜。儘管如此,活性化的研發活動、策略合作以及對量子運算等新興技術的投資,都為創新和市場成長帶來了巨大的機會。

全球光子積體電路市場促進因素

全球光子積體電路 (PIC) 市場的主要驅動力是日益成長的高速資料傳輸需求和頻寬應用需求。隨著電信、資料中心和雲端運算等各領域數位轉型的推進,對先進光纖通訊解決方案的需求變得愈發迫切。 PIC 提供了一種緊湊、擴充性且節能的方式來處理大量資料並實現超高速傳輸。這項技術進步對於建構下一代網路、5G 無線通訊和光連接模組至關重要。因此,對更高傳輸速率和更高網路效率的需求不斷成長,極大地推動了市場擴張。

限制全球光子積體電路市場的因素

全球光子積體電路(PIC)市場面臨的主要挑戰是其設計和製造過程的複雜性和高成本。 PIC製造需要先進的製造技術、整合各種光學元件以及精確對準,這些都需要專業技能和高科技設備。此外,推出製造工廠和維持品質標準所需的大量初始投資會導致生產成本增加、前置作業時間延長和可擴展性受限。這些障礙可能會阻礙市場擴張,而嚴格的監管要求和智慧財產權問題也阻礙了PIC技術的廣泛應用。

全球光子積體電路(PIC)市場趨勢

全球光子積體電路 (PIC) 市場正經歷顯著成長,這主要得益於高速光纖通訊的需求又源於資料密集型應用和 5G 等先進技術的普及。此外,為支援包括資料中心和雲端運算服務在內的不斷擴展的數位基礎設施,對高效數據傳輸解決方案的需求也進一步推動了這一趨勢。隨著各行業追求更高的性能和更低的能耗,將光技術整合到通訊、家用電子電器和汽車等領域正成為策略重點。因此,PIC 設計和製造方面的創新有望推動市場擴張並增強競爭優勢。

目錄

介紹

  • 調查目標
  • 調查範圍
  • 定義

調查方法

  • 資訊收集
  • 二手資料和一手資料方法
  • 市場規模預測
  • 市場假設與限制

執行摘要

  • 全球市場展望
  • 供需趨勢分析
  • 細分市場機會分析

市場動態與展望

  • 市場規模
  • 市場動態
    • 促進因素和機遇
    • 限制與挑戰
  • 波特分析

關鍵市場考察

  • 關鍵成功因素
  • 競爭程度
  • 關鍵投資機會
  • 市場生態系統
  • 市場吸引力指數(2025)
  • PESTEL 分析
  • 總體經濟指標
  • 價值鏈分析
  • 定價分析
  • 技術分析
  • 監管分析
  • 專利分析
  • 案例研究分析

全球光子積體電路市場規模(按整合類型和複合年成長率分類)(2026-2033 年)

  • 混合
  • 整體式
  • 模組

全球光子積體電路市場規模(按組件分類)及複合年成長率(2026-2033 年)

  • 雷射
  • 數據機
  • 檢測器
  • 衰減器
  • 光放大器

全球光子積體電路市場規模(依來源及複合年成長率分類)(2026-2033 年)

  • 鈮酸鋰
  • 矽上二氧化矽
  • 絕緣體上矽
  • 砷化鎵
  • 磷化銦

全球光子積體電路市場規模(按應用及複合年成長率分類)(2026-2033 年)

  • 光纖通訊
  • 光纖感測器
  • 生物醫學
  • 量子計算
  • 其他

全球光子積體電路市場規模及複合年成長率(2026-2033)

  • 北美洲
    • 美國
    • 加拿大
  • 歐洲
    • 德國
    • 西班牙
    • 法國
    • 英國
    • 義大利
    • 其他歐洲地區
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 韓國
    • 亞太其他地區
  • 拉丁美洲
    • 巴西
    • 其他拉丁美洲地區
  • 中東和非洲
    • 海灣合作理事會國家
    • 南非
    • 其他中東和非洲地區

競爭資訊

  • 前五大公司對比
  • 主要企業的市場定位(2025 年)
  • 主要市場參與者所採取的策略
  • 近期市場趨勢
  • 公司市佔率分析(2025 年)
  • 主要企業公司簡介
    • 公司詳情
    • 產品系列分析
    • 依業務板塊進行公司股票分析
    • 2023-2025年營收年比比較

主要企業簡介

  • Avago Technologies(US)
  • Ciena Corporation(US)
  • EMCORE Corporation(US)
  • Enablence Technologies(Canada)
  • Finisar Corporation(US)
  • Hewlett-Packard(US)
  • Infinera Corporation(US)
  • Intel Corporation(US)
  • JDS Uniphase Corporation(US)
  • Kaiam Corporation(US)
  • OneChip Photonics(Canada)
  • TE Connectivity(Switzerland)

結論與建議

簡介目錄
Product Code: SQMIG45N2097

Global Photonic Integrated Circuit Market size was valued at USD 15.11 Billion in 2024 and is poised to grow from USD 16.73 Billion in 2025 to USD 37.72 Billion by 2033, growing at a CAGR of 10.7% during the forecast period (2026-2033).

The global photonic integrated circuit (PIC) market is experiencing robust growth driven by advancements in telecommunications, the increasing application of photonics across various sectors, and the surging demand for high-speed data transmission. PICs offer significant advantages such as enhanced performance, reduced size, and lower power consumption by integrating multiple optical components on a single chip. The rapid expansion of data centers, telecommunication networks, and innovations in technologies like LiDAR for autonomous vehicles and 5G networks further fuel the demand for PICs. Challenges such as the need for specialized expertise, high initial costs, and complex design and manufacturing processes pose hurdles. Nevertheless, heightened research and development initiatives, strategic partnerships, and investments in emerging technologies like quantum computing present promising opportunities for innovation and market growth.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Photonic Integrated Circuit market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Photonic Integrated Circuit Market Segments Analysis

Global Photonic Integrated Circuit Market is segmented by Type of Integration, Components, Raw Materials, Applications and region. Based on Type of Integration, the market is segmented into Hybrid, Monolithic and Module. Based on Components, the market is segmented into Lasers, Modulators, Photo Detectors, Attenuators and Optical Amplifiers. Based on Raw Materials, the market is segmented into Lithium Niobate, Silica-on-Silicon, Silicon-on-Insulator, Gallium Arsenide and Indium Phosphide. Based on Applications, the market is segmented into Optical Fiber Communications, Optical Fiber Sensor, Biomedical, Quantum Computing and Others. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global Photonic Integrated Circuit Market

The global Photonic Integrated Circuit (PIC) market is primarily propelled by the rising need for high-speed data transmission and bandwidth-demanding applications. As digital transformation expands across diverse sectors such as telecommunications, data centers, and cloud computing, the requirement for advanced optical communication solutions becomes increasingly critical. PICs provide a compact, scalable, and energy-efficient means to manage vast data volumes at ultra-fast speeds. This technological advancement is essential for facilitating next-generation networks, 5G wireless communications, and optical interconnects. Consequently, the escalating demand for enhanced data rates and superior network efficiency is significantly contributing to the market's expansion.

Restraints in the Global Photonic Integrated Circuit Market

A key challenge facing the global Photonic Integrated Circuit (PIC) market is the intricate complexity and high expenses linked to the design and manufacturing processes. Creating PICs necessitates advanced fabrication methods, the integration of various optical components, and meticulous alignment, which demand specialized skills and high-tech equipment. Furthermore, the considerable initial investment needed to set up fabrication facilities and uphold quality standards adds to production costs, extends lead times, and restricts scalability. These hurdles can impede market expansion, while stringent regulatory demands and intellectual property issues also serve as obstacles to the broader adoption of PIC technology.

Market Trends of the Global Photonic Integrated Circuit Market

The Global Photonic Integrated Circuit (PIC) market is witnessing significant growth driven by the increasing demand for high-speed optical communication, fueled by the proliferation of data-intensive applications and advanced technologies like 5G. This trend is further accelerated by the need for efficient data transmission solutions to support expanding digital infrastructures, including data centers and cloud computing services. As industries seek to enhance performance and reduce energy consumption, the integration of photonic technologies into telecommunications, consumer electronics, and automotive sectors is becoming a strategic focus. Consequently, innovations in PIC design and manufacturing are expected to propel market expansion and foster competitive advantages.

Table of Contents

Introduction

  • Objectives of the Study
  • Scope of the Report
  • Definitions

Research Methodology

  • Information Procurement
  • Secondary & Primary Data Methods
  • Market Size Estimation
  • Market Assumptions & Limitations

Executive Summary

  • Global Market Outlook
  • Supply & Demand Trend Analysis
  • Segmental Opportunity Analysis

Market Dynamics & Outlook

  • Market Overview
  • Market Size
  • Market Dynamics
    • Drivers & Opportunities
    • Restraints & Challenges
  • Porters Analysis
    • Competitive rivalry
    • Threat of substitute
    • Bargaining power of buyers
    • Threat of new entrants
    • Bargaining power of suppliers

Key Market Insights

  • Key Success Factors
  • Degree of Competition
  • Top Investment Pockets
  • Market Ecosystem
  • Market Attractiveness Index, 2025
  • PESTEL Analysis
  • Macro-Economic Indicators
  • Value Chain Analysis
  • Pricing Analysis
  • Technology Analysis
  • Regulatory Analysis
  • Patent Analysis
  • Case Study Analysis

Global Photonic Integrated Circuit Market Size by Type of Integration & CAGR (2026-2033)

  • Market Overview
  • Hybrid
  • Monolithic
  • Module

Global Photonic Integrated Circuit Market Size by Components & CAGR (2026-2033)

  • Market Overview
  • Lasers
  • Modulators
  • Photo Detectors
  • Attenuators
  • Optical Amplifiers

Global Photonic Integrated Circuit Market Size by Raw Materials & CAGR (2026-2033)

  • Market Overview
  • Lithium Niobate
  • Silica-on-Silicon
  • Silicon-on-Insulator
  • Gallium Arsenide
  • Indium Phosphide

Global Photonic Integrated Circuit Market Size by Applications & CAGR (2026-2033)

  • Market Overview
  • Optical Fiber Communications
  • Optical Fiber Sensor
  • Biomedical
  • Quantum Computing
  • Others

Global Photonic Integrated Circuit Market Size & CAGR (2026-2033)

  • North America (Type of Integration, Components, Raw Materials, Applications)
    • US
    • Canada
  • Europe (Type of Integration, Components, Raw Materials, Applications)
    • Germany
    • Spain
    • France
    • UK
    • Italy
    • Rest of Europe
  • Asia Pacific (Type of Integration, Components, Raw Materials, Applications)
    • China
    • India
    • Japan
    • South Korea
    • Rest of Asia-Pacific
  • Latin America (Type of Integration, Components, Raw Materials, Applications)
    • Brazil
    • Rest of Latin America
  • Middle East & Africa (Type of Integration, Components, Raw Materials, Applications)
    • GCC Countries
    • South Africa
    • Rest of Middle East & Africa

Competitive Intelligence

  • Top 5 Player Comparison
  • Market Positioning of Key Players, 2025
  • Strategies Adopted by Key Market Players
  • Recent Developments in the Market
  • Company Market Share Analysis, 2025
  • Company Profiles of All Key Players
    • Company Details
    • Product Portfolio Analysis
    • Company's Segmental Share Analysis
    • Revenue Y-O-Y Comparison (2023-2025)

Key Company Profiles

  • Avago Technologies (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Ciena Corporation (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • EMCORE Corporation (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Enablence Technologies (Canada)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Finisar Corporation (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Hewlett-Packard (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Infinera Corporation (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Intel Corporation (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • JDS Uniphase Corporation (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Kaiam Corporation (US)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • OneChip Photonics (Canada)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • TE Connectivity (Switzerland)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments

Conclusion & Recommendations