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市場調查報告書
商品編碼
2119918

全球光電封裝市場（2027-2037 年）

The Global Photonics Packaging Market 2027-2037
出版日期: | 出版商: Future Markets, Inc. | 英文 336 Pages, 74 Tables, 41 Figures | 訂單完成後即時交付

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光電技術經歷了一場悄悄卻意義深遠的變革，從最初僅限於光收發器製造後端的一個工程分支，發展成為全球技術基礎設施中最具戰略意義的領域之一。三大強勁因素 - 人工智慧規模計算對頻寬的無限需求、矽光電作為大規模代工晶圓代工廠日趨成熟，以及從擴增實境到量子運算等新興終端市場的拓展 - 共同促成了光電技術成為支撐數位經濟的硬體堆疊的核心組成部分。

目前市場以光收發器模組封裝為主導，該封裝技術歷經30年的資料通訊標準化發展而不斷改進。如今的800G連貫和直接檢測模組代表了傳統插入式收發器封裝的巔峰之作，實現了成本最佳化和高良率，並正日益被Fabrinet、Jabil、Luxshare等契約製造廠商在模組組裝層面實現商品化。然而，這一成熟領域正被共封裝光元件即時顛覆，後者需要截然不同的封裝方法。具體而言，這包括在矽中介層上採用覆晶合技術將矽光電（PIC）和5nm CMOS電子積體電路（EIC）連接起來，採用符合CPO-FC介面標準的可拆卸光纖連接器，以及與功耗高達數百瓦的交換器專用積體電路（ASIC）進行熱協同管理。

向CPO（複合光封裝）的轉變是由不可避免的物理限制所驅動的。人工智慧訓練和推理叢集現在需要每個交換器超過51.2Terabit/秒的總交換頻寬，而傳統的PCB級SerDes電氣介面在可接受的功耗限制下無法實現這一目標。 NVIDIA的NVLink光連接模組和博通的Tomahawk 6和7 CPO交換器系列是首批商業化部署的技術，這些技術將在2030年代重塑整個光電封裝供應鏈。借助台積電的CoWoS平台和ASE Group的VIPack共封裝服務，晶圓代工廠和先進的OSAT（外包半導體組裝）取代傳統的模組組裝，成為供應鏈中新的重心。

展望未來，擴增實境（AR）顯示引擎代表著第二個主要成長領域。像素間距小於5微米的MicroLED晶片轉移、每小時超過1億顆晶片的高產量轉移吞吐量以及與CMOS背板的整合，都帶來了與CPO封裝相當的複雜度挑戰，其單位成本必須達到消費級價格水準。採用光電技術的封裝 - 包括低溫光纖耦合器、單光子檢測器整合和超低損耗氮化矽波導管組件 - 雖然週期更長，但卻為結構上重要的成長點增添了新的動力。

《全球光電封裝市場（2027-2037）》報告對2027-2037年這11年間六大關鍵應用領域的收入、出貨量和技術普及情況進行了嚴謹的自下而上預測。本報告的核心觀點是，光電封裝已迎來轉折點。隨著人工智慧基礎設施的擴展，光連接模組封裝已成為運算集群效能的瓶頸，迫使領先的半導體晶圓代工廠、OSAT供應商和系統OEM廠商從根本上重新思考光元件的設計、組裝和供應鏈。特別是對於CPO（計算封裝）而言，本報告詳細分析了I型、II型和III型封裝結構以及光引擎架構，並基於區分橫向擴展乙太網路切換器應用和縱向擴展GPU光I/O的完整模型進行了預測，同時分別對2037年的出貨量和收入進行了預測。

除了人工智慧資料中心，本報告也對擴增實境（AR）顯示封裝進行了全面分析。這包括從LCoS到MicroLED的技術過渡、大規模轉移良率的經濟性以及依技術類型分類的顯示引擎封裝收入。此外，報告還涵蓋了用於汽車應用的FMCW雷射雷達、涵蓋四種硬體平台的量子光電封裝，以及包括醫療、國防和工業感測在內的廣泛的「其他應用」領域。 「生態系統和供應鏈」章節涵蓋了從SOI晶圓供應到系統整合的整個價值鏈，並對台灣、北美、歐洲和亞太地區的生態系統進行了詳細的區域分析。 「競爭格局」章節評估了垂直整合趨勢和併購趨勢，並透過79家公司簡介，提供了價值鏈各個層級參與企業的詳細資訊。

報告內容：

  • 執行摘要：主要發現、市場概況（從2026年的41億美元成長到2037年的300億美元以上，CAGR為 21.9%）和策略見解。
  • 市場脈絡：從單一模組組裝到晶圓級異質整合的歷史性轉變；人工智慧主導的頻寬需求作為結構性成長的催化劑。
  • 技術趨勢：光源整合（混合式、異質式、MicroLED-on-Si）；晶圓級封裝（WLP、FOWLP、扇出型）；2.5D和3D封裝（矽中介層、玻璃中介層、有機基板）；混合鍵結（Cu-Cu無凸塊直接鍵結）；光纖到晶片耦合技術（V型槽FAU、可拆卸CPO-FC、光柵和邊緣耦合器）；EIC/PIC整合方案（2D、2.5D、3D）；模組級封裝；2026-2037年長期技術藍圖
  • 共封裝光模組（CPO）：定義、光引擎架構、CPO 與插件光模組的比較、人工智慧資料中心的網路架構（橫向擴展和縱向擴展）、NVIDIA 和 Broadcom 的策略分析、CPO 封裝結構類型 I/II/III，以及到2037年的完整市場預測（銷售和收入）。分別涵蓋 GPU 的光 I/O 和交換器的CPO。
  • 應用領域：光收發器（資料通訊與通訊）；人工智慧資料中心；擴增實境（AR）顯示器（從LCoS到MicroLED的過渡，微顯示器供應鏈）；用於汽車應用的FMCW雷射雷達；量子技術（光子量子計算、囚禁離子、中性原子）；其他應用（醫療、國防、工業）
  • 生態系統與供應鏈：從晶片到系統的完整價值鏈圖；依細分市場進行供應鏈分析；依地區進行生態系統分析 - 台灣、NVIDIA 生態系統、歐洲、北美、亞太地區
  • 2026-2037年全球市場預測：整體市場、依應用領域、封裝技術和地區分類的市場；CPO、光收發器、AR、雷射雷達、量子技術和其他領域的預測（包括銷售和收入資料）
  • 競爭格局：市場佔有率分析、垂直整合趨勢、併購活動及未來競爭趨勢
  • 本資源提供了涵蓋整個光電封裝價值鏈的79家公司的概況。每家公司的概況都包括公司概述、近期新聞和資金籌措情況、產品和技術以及策略意義。涵蓋整個光電封裝價值鏈的公司簡介包括：Aeva、AIM Photonics、Alcyon Photonics SL、Amkor Technology、Anello Photonics、Applied Materials、ASE Group、ASM AMICRA、ASMPT、Aurora Innovation、AyarLabs、Bay Photonics、Broadcom、CCRAFT SA、Cisco、Coherent Corp.、Corning Incorporated、Diamond Photonics、DustPhotonics、Eoptolink、EV Group、Fabrinet、FEMTOprint、Ficontec、Finetech、FOXCONN、GIS（General Interface Solution）、GlobalFoundries、Goertek、Google、ICON Photonics、IMEC、Innolight、IonQ、izmomicro（izmo Microsystems Private Limited）、Jabil、JBD (Jade Bird Display)、LAM Research、Lightmatter、LightSpeed Photonics、LioniX International、Luceda Photonics、Lumentum Holdings、Luxshare、Marvell Technology、Meta Platforms、MicroVision、Mixx Technologies、MPI Corporation、Nanoscribe、Nanosystec等。

目錄

第1章 執行摘要

第2章 市場環境與背景

  • 光電封裝：歷史演變
  • 人工智慧時代的光電
  • 半導體封裝技術概述
  • 光電封裝與傳統半導體封裝有何不同？
  • 標準化的必要性

第3章 技術概述

  • 光源整合技術
  • 用於光電的先進封裝技術
  • 光電封裝中的互連技術
  • 光纖和晶片耦合
  • EIC/PIC整合
  • 模組級包裝
  • 技術藍圖

第4章 共封裝光學元件（CPO）

  • 共封裝光學元件概述
  • CPO和插入式光學系統的比較
  • 資料中心架構和CPO應用
  • CPO包裝結構
  • 2026-2037年CPO市場預測
  • 首席產品長面臨的挑戰與未來機會

第5章 應用領域

  • 通訊和資料通訊
  • 人工智慧資料中心
  • 擴增實境顯示
  • 汽車領域：FMCW雷射雷達
  • 量子技術
  • 其他

第6章 生態系與供應鏈

  • 光電封裝價值鏈概述
  • 基於細分市場的供應鏈分析
  • 區域生態系分析

第7章 全球市場預測：2026-2037年

  • 市場預測
  • 細分市場預測
  • 區域預測

第8章 競爭情勢

  • 競爭環境概述
  • 市場佔有率分析
  • 定位和併購活動
  • 垂直整合趨勢
  • 未來展望：2026-2037年競爭力趨勢

第9章 公司簡介（79家公司簡介）

第10章 附錄

Photonics packaging has undergone a quiet but decisive transformation, emerging from an engineering sub-discipline confined to the back end of optical transceiver manufacturing into one of the most strategically consequential sectors in global technology infrastructure. The convergence of three powerful forces - the insatiable bandwidth demands of AI-scale computing, the maturation of silicon photonics as a high-volume foundry platform, and the proliferation of new end markets from augmented reality to quantum computing - has elevated photonics packaging to a central role in the hardware stack that underpins the digital economy.

The current market is dominated by optical transceiver module packaging, which has been refined across three decades of datacom standardisation. Today's 800G coherent and direct-detection modules represent the peak of conventional pluggable transceiver packaging - cost-optimised, high-yield, and increasingly commoditised at the module assembly level by contract manufacturers such as Fabrinet, Jabil, and Luxshare. Yet this mature segment is being disrupted in real time by co-packaged optics, which requires fundamentally different packaging approaches: flip-chip bonding of silicon photonics PICs with 5nm CMOS EICs on silicon interposers, detachable fibre connectors qualified to CPO-FC interface standards, and thermal co-management with switch ASICs consuming hundreds of watts.

The CPO transition is being driven by an inescapable physics constraint. AI training and inference clusters now demand aggregate switch bandwidths exceeding 51.2 terabits per second per switch, a target that conventional PCB-level SerDes electrical interfaces cannot meet within acceptable power budgets. NVIDIA's NVLink Optical interconnect and Broadcom's Tomahawk 6 and 7 CPO switch families are the first commercial deployments of a technology that will reshape the entire photonics packaging supply chain through the 2030s. TSMC's CoWoS platform and ASE Group's VIPack co-packaging service have repositioned foundries and advanced OSATs as the new centre of gravity in a supply chain that previously revolved around module assemblers.

Looking further ahead, augmented reality display engines represent the second major growth frontier. MicroLED die transfer at sub-5 micron pixel pitch, mass transfer throughput exceeding 100 million dies per hour, and CMOS backplane integration are packaging challenges of comparable complexity to CPO, with unit economics that must reach consumer price points. Quantum technology photonics packaging - encompassing cryogenic fibre couplers, single-photon detector integration, and ultra-low-loss silicon nitride waveguide assembly - adds a further long-cycle but structurally significant growth vector.

The Global Photonics Packaging Market 2027-2037 provides a rigorous bottom-up forecast of revenues, unit shipments, and technology adoption across six major application segments over an eleven-year horizon to 2037. The report's central thesis is that photonics packaging has crossed an inflection point. The AI infrastructure build-out has made optical interconnect packaging a limiting constraint on compute cluster performance, forcing the semiconductor industry's most powerful foundries, OSAT providers, and system OEMs to rethink the design, assembly, and supply chain of photonic components from first principles. CPO is treated with particular depth, with detailed analysis of Type I, Type II, and Type III packaging structures, optical engine architectures, and a fully modelled forecast distinguishing scale-out Ethernet switch applications from scale-up GPU optical I/O, with separate unit and revenue trajectories through 2037.

Beyond AI data centres, the report provides equal rigour in its treatment of augmented reality display packaging - covering the LCoS-to-MicroLED technology transition, mass transfer yield economics, and display engine packaging revenue by technology type - as well as FMCW LiDAR for automotive, quantum photonics packaging across four hardware platforms, and a broad other-applications segment covering medical, defence, and industrial sensing. The ecosystem and supply chain chapter maps the full value chain from SOI wafer supply through system integration, with dedicated regional analyses of the Taiwanese, North American, European, and Asia-Pacific ecosystems. A competitive landscape chapter assesses vertical integration trends and M&A dynamics, and 79 company profiles provide detailed intelligence on participants spanning every tier of the value chain.

Report Contents:

  • Executive Summary: key findings, market at a glance ($4.1B in 2026 to >$30B by 2037, 21.9% CAGR), and strategic implications
  • Market Context and Background: historical evolution from discrete module assembly to wafer-level heterogeneous integration; the role of AI-driven bandwidth demand as a structural growth catalyst
  • Technology Landscape: light source integration (hybrid, heterogeneous, MicroLED-on-Si); wafer-level packaging (WLP, FOWLP, fan-out); 2.5D and 3D packaging (silicon interposer, glass interposer, organic substrate); hybrid bonding (Cu-Cu bumpless direct bonding); fibre-to-chip coupling technologies (V-groove FAU, detachable CPO-FC, grating and edge couplers); EIC/PIC integration approaches (2D, 2.5D, 3D); module-level packaging; long-term technology roadmap 2026-2037
  • Co-Packaged Optics (CPO): definition, optical engine architecture, CPO vs pluggable comparison, AI data centre network architecture (scale-out and scale-up), NVIDIA vs Broadcom strategic analysis, CPO packaging structure types I/II/III, and full market forecast (units and revenue) to 2037 covering GPU optical I/O and switch CPO separately
  • Application Segments: optical transceivers (datacom and telecom); AI data centres; augmented reality displays (LCoS to MicroLED transition, microdisplay supply chain); automotive FMCW LiDAR; quantum technologies (photonic QC, trapped-ion, neutral atom); other applications (medical, defence, industrial)
  • Ecosystem and Supply Chain: full value chain map from die to system; supply chain analysis by segment; regional ecosystem analysis - Taiwan, NVIDIA ecosystem, Europe, North America, Asia-Pacific
  • Global Market Forecasts 2026-2037: total market, by application segment, by packaging technology, by region; segment-level forecasts with unit and revenue data for CPO, optical transceivers, AR, LiDAR, quantum, and other
  • Competitive Landscape: market share analysis, vertical integration trends, M&A activity, future competitive dynamics
  • 79 Company Profiles across the full photonics packaging value chain, each covering company description, recent news and funding, products and technology, and strategic significance. Companies Profiled spanning the full photonics packaging value chain include Aeva, AIM Photonics, Alcyon Photonics SL, Amkor Technology, Anello Photonics, Applied Materials, ASE Group, ASM AMICRA, ASMPT, Aurora Innovation, AyarLabs, Bay Photonics, Broadcom, CCRAFT SA, Cisco, Coherent Corp., Corning Incorporated, Diamond Photonics, DustPhotonics, Eoptolink, EV Group, Fabrinet, FEMTOprint, Ficontec, Finetech, FOXCONN, GIS (General Interface Solution), GlobalFoundries, Goertek, Google, ICON Photonics, IMEC, Innolight, IonQ, izmomicro (izmo Microsystems Private Limited), Jabil, JBD (Jade Bird Display), LAM Research, Lightmatter, LightSpeed Photonics, LioniX International, Luceda Photonics, Lumentum Holdings, Luxshare, Marvell Technology, Meta Platforms, MicroVision, Mixx Technologies, MPI Corporation, Nanoscribe, Nanosystec and more....

Table of Contents

1. EXECUTIVE SUMMARY

  • 1.1 Report Overview and Key Findings
  • 1.2 Market Definition and Scope
    • 1.2.1 Definition of Photonics Packaging
    • 1.2.2 Boundary Between Photonics Packaging and Broader Semiconductor Packaging
    • 1.2.3 Scope: Applications Addressed in This Report
  • 1.3 Key Market Drivers and Restraints
  • 1.4 Market Size and Growth
  • 1.5 Photonics Packaging: From Backend Activity to Strategic Enabler
  • 1.6 Photonics Packaging in the AI Era
  • 1.7 The Shift to Advanced Packaging: From Module-Level to Wafer-Level Integration
  • 1.8 Competitive and Ecosystem Snapshot
  • 1.9 Key Conclusions and Strategic Implications

2. MARKET CONTEXT AND BACKGROUND

  • 2.1 Photonics Packaging: Historical Evolution
    • 2.1.1 Origins in Optical Transceivers for Datacom and Telecom
    • 2.1.2 The Shift Toward Heterogeneous Integration
    • 2.1.3 AI-Driven Bandwidth Demand as a Structural Growth Catalyst
  • 2.2 Photonics in the AI Era
    • 2.2.1 The Explosive Growth of Generative AI and LLMs
    • 2.2.2 Compute Demand Scaling and Network Bottlenecks
    • 2.2.3 The Role of Optical Interconnects in AI Infrastructure
  • 2.3 Semiconductor Packaging Technology Overview
    • 2.3.1 Conventional Packaging Approaches
    • 2.3.2 Advanced Packaging Approaches
    • 2.3.3 From 1D to 3D Integration: The Packaging Evolution Continuum
  • 2.4 Why Photonics Packaging Differs from Conventional Semiconductor Packaging
  • 2.5 The Standardization Imperative
    • 2.5.1 PDK and ADK-Driven Design Environments
    • 2.5.2 Role of Standards Bodies and Industry Consortia
    • 2.5.3 Barriers to High-Volume Photonics Packaging Deployment

3. TECHNOLOGY LANDSCAPE

  • 3.1 Light Source Integration Technologies
    • 3.1.1 Integration Approach Overview
    • 3.1.2 Hybrid Integration
    • 3.1.3 Heterogeneous Integration
    • 3.1.4 Heterogeneously Integrated Light Sources on Silicon Photonics (for Pluggables)
    • 3.1.5 MicroLED-on-Si Hybridization
  • 3.2 Advanced Packaging Technologies for Photonics
    • 3.2.1 Wafer-Level Packaging (WLP)
      • 3.2.1.1 Wafer-Level Chip Scale Packaging (WLCSP)
      • 3.2.1.2 Fan-Out Wafer-Level Packaging (FO-WLP)
      • 3.2.1.3 WLP Manufacturing Processes
    • 3.2.2 2.5D and 3D Packaging
      • 3.2.2.1 Silicon Interposer 2.5D (Through-Silicon Via)
      • 3.2.2.2 Organic-Based 2.5D Packaging
      • 3.2.2.3 Glass-Based 2.5D Packaging
      • 3.2.2.4 3D Stacked Packages
    • 3.2.3 Hybrid Bonding
      • 3.2.3.1 Fusion Bond and Direct Molecular Bonding
      • 3.2.3.2 Cu-Cu Bumpless Hybrid Bonding
      • 3.2.3.3 Devices Using Hybrid Bonding
    • 3.2.4 Photonics-Compatible Advanced Packaging Platform Comparison
  • 3.3 Interconnection Techniques in Photonics Packaging
    • 3.3.1 Wire Bonding
    • 3.3.2 Flip-Chip Bumping
    • 3.3.3 Micro-Bumping
    • 3.3.4 Through-Silicon Via (TSV)
    • 3.3.5 Redistribution Layer (RDL)
    • 3.3.6 Photonic Wire Bonding
  • 3.4 Fiber-to-Chip Coupling
    • 3.4.1 Fiber-to-Chip Coupling Modalities Overview
    • 3.4.2 V-Groove Technology: From 260μm to 130μm Pitch
    • 3.4.3 Detachable Fiber-to-Chip Couplers
    • 3.4.4 Serviceability and Detachability Design Considerations
    • 3.4.5 Fiber Array Units (FAUs) and Connectorization
  • 3.5 EIC/PIC Integration
    • 3.5.1 Photonic Integrated Circuits (PICs) - Key Concepts
      • 3.5.1.1 What are PICs? Material Platforms and Integration Levels
      • 3.5.1.2 PICs vs Silicon Photonics - Differences and Overlap
    • 3.5.2 Electronic-Photonic Integration Requirements
    • 3.5.3 2D EIC/PIC Integration
    • 3.5.4 2.5D EIC/PIC Integration
    • 3.5.5 3D EIC/PIC Integration
    • 3.5.6 3D Optical Engine Configuration Examples
      • 3.5.6.1 Configuration 1: EIC-on-PIC with Micro-Bumps
      • 3.5.6.2 Configuration 2: PIC-on-EIC with Through-Silicon Vias
      • 3.5.6.3 Configuration 3: 3D SoIC with Hybrid Bonding
    • 3.5.7 TSMC's Role in Heterogeneous EIC/PIC Integration
  • 3.6 Module-Level Packaging
    • 3.6.1 Optical Transceiver Module Architecture
    • 3.6.2 Typical Process Steps and Major Equipment Suppliers
    • 3.6.3 Which Packaging Approach for Which Application?
    • 3.6.4 Solutions for Quantum Packaging
  • 3.7 Technology Roadmap
    • 3.7.1 Long-Term Technology Evolution Roadmap 2026-2037
    • 3.7.2 Long-Term Evolution of Co-Packaged Optics

4. CO-PACKAGED OPTICS (CPO)

  • 4.1 Introduction to Co-Packaged Optics
    • 4.1.1 Definition and Core Concepts
      • 4.1.1.1 Concept 1: Proximity Integration
      • 4.1.1.2 Concept 2: Functional Partitioning
      • 4.1.1.3 Concept 3: Coherent Ecosystem Development
    • 4.1.2 What is an Optical Engine (OE)?
      • 4.1.2.1 Optical Engine Composition and Components
      • 4.1.2.2 Optical Engine vs Pluggable Transceiver
      • 4.1.2.3 Critical Performance Parameters
    • 4.1.3 Key Technology Building Blocks for CPO
      • 4.1.3.1 Silicon Photonics PIC
      • 4.1.3.2 Electronic IC (EIC)
      • 4.1.3.3 External Laser Sources and Optical Power Supply
  • 4.2 CPO vs Pluggable Optics
    • 4.2.1 Pluggable Optics - Current Status, Bottlenecks and Limitations
      • 4.2.1.1 Form Factor Constraints
      • 4.2.1.2 Electrical Interface and SerDes Limitations
      • 4.2.1.3 Thermal Management Challenges
      • 4.2.1.4 On-Board Optics (OBO) as a Transitional Step
    • 4.2.2 Power Efficiency Comparison: CPO vs Pluggable vs Copper
    • 4.2.3 Design Decisions: Choosing Between CPO and Pluggables
  • 4.3 Data Centre Architecture and CPO Applications
    • 4.3.1 Modern High-Performance AI Data Centre Architecture
      • 4.3.1.1 Physical Infrastructure Hierarchy
      • 4.3.1.2 Network Architecture: Scale-Out and Scale-Up
      • 4.3.1.3 Power and Cooling Considerations
    • 4.3.2 Switches: Key Components in AI Data Centres
      • 4.3.2.1 Switch Architecture Evolution
      • 4.3.2.2 Switch ASIC Technology and Bandwidth Scaling
    • 4.3.3 Scale-Out Network Switching Applications
    • 4.3.4 Scale-Up Computing Optical I/O Applications
    • 4.3.5 NVIDIA vs Broadcom: Strategic Comparison in AI Infrastructure and CPO
      • 4.3.5.1 NVIDIA's CPO Strategy: Vertical Integration
      • 4.3.5.2 Broadcom's CPO Strategy: Open Ecosystem
      • 4.3.5.3 Competitive Dynamics
    • 4.3.6 L2 Frontside Network Architecture: CPO vs Non-CPO
    • 4.3.7 Migration from Copper to Optical Interconnects in AI Systems
  • 4.4 CPO Packaging Structures
    • 4.4.1 Types of CPO + XPU/Switch ASIC Packaging Structures
      • 4.4.1.1 Type I: Optical Engines on Package Periphery
      • 4.4.1.2 Type II: Optical Engines Co-Located with ASIC on Interposer
      • 4.4.1.3 Type III: 3D Stacked Optical Engines
    • 4.4.2 System Integration of Network Switches by Packaging Technologies
    • 4.4.3 System Integration of Optical I/O by Packaging Technologies
  • 4.5 CPO Market Forecasts 2026-2037
    • 4.5.1 Server Boards, CPUs and GPUs/Accelerators Shipment Forecast
    • 4.5.2 Optical I/O for AI Interconnect CPO Forecast (Units Shipped)
    • 4.5.3 Optical I/O for AI Interconnect CPO Forecast (Revenue)
    • 4.5.4 CPO Network Switches for AI Accelerators (Units Shipped)
    • 4.5.5 CPO Network Switches for AI Accelerators (Market Size)
    • 4.5.6 Total CPO Market Overview
    • 4.5.7 CPO by EIC/PIC Integration Technology (Unit Shipments)
    • 4.5.8 CPO Roadmap: Scale-Out Networks
  • 4.6 CPO Challenges and Future Potential
    • 4.6.1 Technical Challenges
    • 4.6.2 Commercial and Standardization Challenges
    • 4.6.3 Future Potential and Outlook

5. APPLICATION SEGMENTS

  • 5.1 Telecom and Datacom
    • 5.1.1 Optical Transceiver Market Overview
    • 5.1.2 Photonics Packaging for Optical Transceivers
    • 5.1.3 Market Forecast: Optical Transceivers 2026-2037
    • 5.1.4 Transition from Pluggable to Co-Packaged: Hybrid Period 2026-2030
    • 5.1.5 Supply Chain Concentration and Verticality Trends
  • 5.2 AI Data Centres
    • 5.2.1 AI Data Centre Photonics Packaging Demand
    • 5.2.2 Hyperscaler Capex and Photonics Intensity
    • 5.2.3 Current AI System Architecture: NVIDIA DGX/HGX Platforms
    • 5.2.4 Future AI Architecture (Short to Mid-Term: 2026-2030)
    • 5.2.5 Future AI Architecture (Long-Term: 2031-2037)
  • 5.3 Augmented Reality Displays
    • 5.3.1 Consumer AR Market Overview and Inflection Point (2026-2028)
    • 5.3.2 Display Engine Technologies for AR
      • 5.3.2.1 LCoS-Based Optical Engines
      • 5.3.2.2 MicroLED-Based Optical Engines
      • 5.3.2.3 Laser-Based Architectures and New Coupling Challenges
      • 5.3.2.4 LCoS to MicroLED 2026-2037
    • 5.3.3 AR Photonics Packaging: Form Factor as Key Differentiator
    • 5.3.4 Market Forecast: AR Display Volumes 2026-2037
    • 5.3.5 Market Forecast: AR Packaging Revenue 2026-2037
    • 5.3.6 Microdisplay Supply Chain: MicroLED Focus
  • 5.4 Automotive: FMCW LiDAR
    • 5.4.1 FMCW LiDAR Technology and Photonics Packaging Requirements
    • 5.4.2 FMCW LiDAR Photonics Integration Challenges
    • 5.4.3 Market Forecast: FMCW LiDAR Volume and Packaging Revenue 2026-2037
  • 5.5 Quantum Technologies
    • 5.5.1 Photonics as the Hidden Bottleneck in Scalable Quantum Technologies
    • 5.5.2 Photonics in Quantum Computer Architectures
      • 5.5.2.1 Photonic Quantum Computers
      • 5.5.2.2 Trapped-Ion Quantum Systems
      • 5.5.2.3 Neutral Atom Quantum Systems
    • 5.5.3 Photonics Packaging Requirements for Quantum
      • 5.5.3.1 Ultra-Low-Loss Fiber Alignment
      • 5.5.3.2 High-Density Laser Integration for Qubit Scaling
      • 5.5.3.3 Extreme Precision Assembly
    • 5.5.4 Quantum Photonics Packaging Solutions and Outlook
  • 5.6 Other Application Segments

6. ECOSYSTEM AND SUPPLY CHAIN

  • 6.1 Photonics Packaging Value Chain Overview
    • 6.1.1 Generic Value Chain: From Die to System
    • 6.1.2 Value Capture by Chain Segment
  • 6.2 Supply Chain Analysis by Segment
    • 6.2.1 PIC Design Segment
    • 6.2.2 ASIC and xPU Design Segment
    • 6.2.3 Laser Sources Segment
    • 6.2.4 SOI Wafer and Epi-Wafer Segment
    • 6.2.5 EIC, Retimers, SerDes and PHY Segment
    • 6.2.6 Connectors and Fibers Segment
    • 6.2.7 Foundries Segment
    • 6.2.8 Packaging, Assembling and Testing Segment
    • 6.2.9 System and Equipment Segment
    • 6.2.10 End Customers (Hyperscalers) Segment
    • 6.2.11 Ecosystem Interdependencies and Strategic Implications
  • 6.3 Regional Ecosystem Analysis
    • 6.3.1 The Taiwanese Ecosystem
    • 6.3.2 NVIDIA's Ecosystem
    • 6.3.3 The European Ecosystem
    • 6.3.4 North American Ecosystem
    • 6.3.5 Asia-Pacific (Excluding Taiwan) Ecosystem

7. GLOBAL MARKET FORECASTS 2026-2037

  • 7.1 Overall Market Forecast
    • 7.1.1 Total Global Photonics Packaging Market: Revenue ($M) 2026-2037
    • 7.1.2 Market Revenue by Application Segment
    • 7.1.3 Market Revenue by Packaging Technology
  • 7.2 Segment Forecasts
    • 7.2.1 Optical Transceivers (Datacom & Telecom)
    • 7.2.2 Co-Packaged Optics (CPO)
    • 7.2.3 Augmented Reality
    • 7.2.4 Automotive LiDAR (FMCW)
    • 7.2.5 Quantum Technologies
    • 7.2.6 Other Applications (Medical, Defense, Industrial)
  • 7.3 Regional Forecasts
    • 7.3.1 Regional Analysis

8. COMPETITIVE LANDSCAPE

  • 8.1 Competitive Environment Overview
  • 8.2 Market Share Analysis
  • 8.3 Positioning and M&A Activity
  • 8.4 Vertical Integration Trends
  • 8.5 Future Outlook: Competitive Dynamics 2026-2037

9. COMPANY PROFILES (79 company profiles)

10. APPENDIX

  • 10.1 Definitions & Terminology
  • 10.2 Research Methodology

List of Tables

  • Table 1. Photonics Packaging Market at a Glance - Revenue ($M) 2026-2037
  • Table 2. Key Market Metrics and CAGR Summary by Segment
  • Table 3. Application Segments and Packaging Value Chain Boundaries
  • Table 4. Market Drivers, Restraints, Opportunities and Threats (DROT Framework)
  • Table 5. Global Photonics Packaging Market Revenue ($M), 2026-2037
  • Table 6. Market Revenue by Application Segment (%), 2026-2037
  • Table 7. Key Milestones in Photonics Packaging Technology Development
  • Table 8. Semiconductor Packaging Technology Landscape - Conventional to Advanced
  • Table 9. Conventional vs Advanced Packaging - Feature and Performance Comparison
  • Table 10. Key Differences Between Electronic and Photonic Packaging Requirements
  • Table 11. Integration Approach Comparison at a Glance
  • Table 12. WLP Variants - Characteristics, Benefits and Photonics Applications
  • Table 13. 2.5D vs 3D Packaging - Performance, Cost and Complexity Trade-offs
  • Table 14. Fan-Out vs Hybrid Bonding - Photonics-Compatible Platform Comparison
  • Table 15. Photonics-Compatible Advanced Packaging Platform Benchmark
  • Table 16. Interconnection Technique Comparison - Electrical and Optical Performance
  • Table 17. Fiber-to-Chip Coupling Modalities Comparison
  • Table 18. Fiber-to-Chip Coupling Methods - Edge Coupling vs Grating Coupling vs Lensed Fiber
  • Table 19. Coupling Technology Supplier Landscape
  • Table 20. Benchmark of Packaging Technologies for EIC/PIC Integration
  • Table 21. Typical Process Steps and Key Equipment Suppliers for Photonics Packaging
  • Table 22. Integrated Optics for Datacom - Process and Integration Roadmap
  • Table 23. Packaging Technology Selection Matrix by Application Segment
  • Table 24. CPO Key Technology Building Blocks - Specifications and Suppliers
  • Table 25. Transmission Losses in Pluggable vs CPO Connections
  • Table 26. Pluggable Optics vs CPO - Performance, Cost and Operational Comparison
  • Table 27. Power Consumption Breakdown - CPO vs Pluggable Optics vs Copper Interconnects
  • Table 28. Decision Framework - CPO vs Pluggables by Use Case
  • Table 29. Scale-Up vs Scale-Out - Volume Forecast 2026-2037 (Units)
  • Table 30. CPO Product Benchmark - NVIDIA vs Broadcom
  • Table 31. NVIDIA and Broadcom - Divergent CPO Ecosystem Strategies
  • Table 32. Supporting data - Copper vs Optical Benchmark by Parameter
  • Table 33. Copper vs Optical - Benchmark for High-Bandwidth AI Systems
  • Table 34. CPO Packaging Structure Benchmark by Integration Type
  • Table 35. System Integration of Optical I/O by Packaging Technology 2026-2037
  • Table 36. Server Board, CPU and GPU/Accelerator Shipment Forecast 2026-2037
  • Table 37. Optical I/O for AI Interconnect CPO - Units Shipped 2026-2037
  • Table 38. Optical I/O for AI Interconnect CPO - Revenue ($M) 2026-2037
  • Table 39. CPO Network Switches - Units Shipped Forecast 2026-2037
  • Table 40. CPO Network Switches - Revenue ($M) Forecast 2026-2037
  • Table 41. Total CPO Market Revenue ($M) and Units - 2026-2037 Overview
  • Table 42. Total CPO by EIC/PIC Integration Technology - Unit Shipments 2026-2037
  • Table 43. CPO Challenges - Technical and Commercial Assessment Matrix
  • Table 44. Optical Transceiver Market Segmentation
  • Table 45. Photonics Packaging for Optical Transceivers - Revenue Forecast ($M) 2026-2037
  • Table 46. Optical Transceiver Packaging Market Share by Key Players 2026
  • Table 47. AI Data Centre Photonics Packaging Demand by Segment 2026-2037 ($M)
  • Table 48. Display Engine Technology Comparison for AR Applications
  • Table 49. AR Market Forecast - Volume (Units) 2026-2037
  • Table 50. Display Engines for AR - Volume Forecast 2026-2037
  • Table 51. AR Display Engine Packaging Revenue Forecast ($M) by Technology 2026-2037
  • Table 52. FMCW LiDAR Photonics Packaging Revenue Forecast ($M) 2026-2037
  • Table 53. Key Players in FMCW LiDAR Photonics Packaging
  • Table 54. Map of Quantum Companies- By Photonics-Based Approach
  • Table 55. Quantum Technology Photonics Packaging Requirements by Platform
  • Table 56. Quantum Photonics Packaging Solutions Landscape
  • Table 57. Other Application Segments - Market Characteristics and Packaging Requirements
  • Table 58. Value Chain Segment - Revenue and Margin Profile
  • Table 59. Supply Chain Segments - Key Players by Tier
  • Table 60. Global Photonics Packaging Market Revenue ($M) 2026-2037 by Segment
  • Table 61. Photonics Packaging Market Revenue Share by Segment (%), 2026 vs 2037
  • Table 62. Photonics Packaging Market Revenue by Technology ($M) 2026-2037
  • Table 63. OT Packaging Revenue by Sub-Segment ($M)
  • Table 64. CPO Revenue by Sub-Segment ($M)
  • Table 65. AR Packaging Revenue by Technology ($M)
  • Table 66. FMCW LiDAR Packaging Revenue by Application ($M)
  • Table 67. Quantum Photonics Packaging Revenue by Platform ($M)
  • Table 68. Other Applications Packaging Revenue ($M)
  • Table 69. Regional Photonics Packaging Market Forecast ($M) 2026-2037
  • Table 70. Market Share by Key Player and Segment 2026
  • Table 71. Notable M&A and Partnership Activity in Photonics Packaging 2023-2026
  • Table 72. Strategic Outlook - Key Competitive Moves by Player Tier 2026-2037
  • Table 73. Glossary of Key Terms and Abbreviations
  • Table 74. Report Scope - Applications, Technologies and Geographies Covered

List of Figures

  • Figure 1. Photonics Packaging Market at a Glance - Revenue ($M) 2026-2037
  • Figure 2. Market Revenue by Application Segment (%), 2026-2037
  • Figure 3. AI Datacenter Network Hierarchy - Scale-Out and Scale-Up Networks
  • Figure 4. Evolution from Hybrid to Heterogeneous Integration in Photonics Packaging
  • Figure 5. Photonics Packaging Ecosystem Map - Key Players by Value Chain Segment
  • Figure 6. Historical Evolution of Photonics Packaging Architectures
  • Figure 7. Generative AI Compute Demand Scaling vs. Electrical Interconnect Capacity
  • Figure 8. Photonics Packaging Standardization Roadmap
  • Figure 9. Integration Approach Spectrum - Hybrid to Monolithic
  • Figure 10. Heterogeneous Light Source Integration on Silicon Photonics
  • Figure 11. Wafer-Level Packaging Process Flow
  • Figure 12. 2.5D vs 3D Packaging Architecture Comparison
  • Figure 13. Hybrid Bonding Architecture and Process
  • Figure 14. V-Groove Pitch Evolution Roadmap
  • Figure 15. Detachable Fiber-to-Chip Coupler Architecture
  • Figure 16. PIC Architecture - Transmit and Receive Path
  • Figure 17. 3D Optical Engine Configuration Examples
  • Figure 18. Optical Transceiver at the Module Level - 400G Architecture
  • Figure 19. Photonics Packaging Technology Trends Roadmap 2026-2037
  • Figure 20. Long-Term CPO Integration Architecture Evolution
  • Figure 21. Optical Engine Architecture and Transmit/Receive Path
  • Figure 22. CPO vs Non-CPO Network Architecture Diagram
  • Figure 23. Copper-to-Optical Migration Roadmap for High-End AI Systems
  • Figure 24. CPO Packaging Structure Types I, II and III
  • Figure 26. CPO System Roadmap for Scale-Out Networks
  • Figure 27. Optical Transceiver at the Module Level - Key Components
  • Figure 28. Optical Transceiver Packaging - Module-Level Anatomy
  • Figure 29. Technology Migration Path - Pluggables to CPO Timeline
  • Figure 30. Current and Future AI System Architecture Comparison
  • Figure 31. Consumer AR Technology Roadmap - LCoS to MicroLED 2026-2037
  • Figure 32. Microdisplay Supply Chain Map - MicroLED Focus
  • Figure 33. Progression of FMCW LiDAR - Technology Architecture
  • Figure 34. Photonics in Quantum Computer Architectures - By Technology Platform
  • Figure 35. Photonics Packaging Value Chain Overview
  • Figure 36. Generic Outline of Optical Modules in the Data Centre Value Chain
  • Figure 37. CPO Industrial Ecosystem - Full Supply Chain Map
  • Figure 38. Taiwanese Photonics Packaging Ecosystem
  • Figure 39. NVIDIA's Photonics Packaging Ecosystem
  • Figure 40. Aeries II LiDAR system.
  • Figure 41. NVIDIA's silicon photonics switches.