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市場調查報告書
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2048952

全球矽光子和光子積體電路市場（2026-2036 年）

The Global Silicon Photonics and Photonics Integrated Circuits Market 2026-2036
出版日期: | 出版商: Future Markets, Inc. | 英文 380 Pages, 160 Tables, 40 Figures | 訂單完成後即時交付

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矽光子和光子積體電路（PIC）已經從極具前景的技術轉變為現代計算不可或缺的結構性組成部分。推動這一轉變的動力是人工智慧（AI）。 AI 的訓練和推理需要在加速器、伺服器和機架之間以極低的延遲傳輸海量數據，但支撐該行業數十年的銅互連已經達到了其物理極限。這被稱為「互連瓶頸」，即昂貴且功耗極高的加速器只能閒置等待資料。光電是業界提出的解決方案。光子傳播速度更快，遠距離訊號損耗更小，並且每個通道可以攜帶更多資訊。 PIC 將這些優勢帶到了基於半導體產業成熟的 CMOS 基礎設施製造的矽晶片上。

光收發器仍然是市場的主要驅動力。資料傳輸速度每隔幾年就會加倍，預計 1.6Terabit)的收發器將於 2026 年實現商業化。 3.2 Tbps 的樣品預計將於 2027 年左右面世，量產預計將在 2028 年左右擴大規模。隨著資料速率的提高，即使是光引擎與交換或加速 ASIC 之間的短銅線連接也會成為效能瓶頸。因此，將光元件封裝在 ASIC基板上的「共封裝光元件 (CPO)」在過去十年一直是封裝領域的核心主題。產業預測表明，到 2030 年，人工智慧資料中心約 35% 的光學模組可能採用 CPO 封裝。

競爭格局反映了這一發展動能。晶圓代工廠扮演核心角色。台積電與輝達合作開發的 Quantum-X 和 Spectrum-X 光子開關的 COUPE 平台已成為業界標準。同時，三星晶圓晶圓代工廠正式進軍矽光子領域，擁有完整的製程設計套件、300mm 平台、大規模光學模組訂單以及面向 2029 年的承包CPO藍圖。產業重組也在加速進行。 Marvell訂單了等離子體調製器開發商 Polariton Technologies，以將其光模組藍圖擴展至 3.2T 及以上。 Credo 也同意以約 7.5 億美元收購 DustPhotonics，以實現矽光子積體電路 (PIC) 的自主研發。此外，Ciena 收購了 Nubis Communications，以獲得共封裝光引擎業務。獨立設計公司仍擁有充足的資金。 OpenLight 在 A 輪融資中籌集了額外的 5000 萬美元，用於開發符合標準的 1.6T 和 3.2T 參考 PIC。

光子積體電路（PIC）與邏輯晶片的差別在於材料的多樣性。矽在CMOS相容性和可擴展性方面具有優勢，但其間接帶隙半導體的特性限制了其發光效率，因此通常與磷化銦結合用於雷射和檢測器。薄膜鈮酸鋰具有低損耗和強大的電光效應，正逐漸成為高性能調製和量子系統的新興材料，而鈦酸鋇和氮化矽則提供了更多選擇。資料通訊、電訊、感測和LiDAR等領域，以及量子光子學領域日益活躍的資金籌措，都在不斷擴大對光子光電的需求。

價值鏈也在改變。光學模組組裝集中在東南亞，高價值雷射仍由美國和日本供應商供應，而磷化銦原料則集中在中國，因此，商業機會和戰略風險緊密交織在一起。產業預測表明，在人工智慧主導的光互連的推動下，矽光子和光子光連接模組（PIC）市場在2036年之前將繼續保持強勁成長，用於收發器和量子技術。

「2026-2036年全球矽光子和光子積體電路市場」是對半導體產業成長最快的細分市場之一——矽光子學和光子積體電路——進行全面市場和技術評估的報告。隨著人工智慧和高效能運算的進步，銅互連的物理性能已接近極限，而矽光子正成為解決資料中心互連瓶頸的結構性方案。本報告對未來十年光子積體電路（PIC）的技術、材料、供應鏈、應用和市場趨勢進行了詳細且獨立的分析。

本報告首先介紹光積體電路（PIC）的基礎知識，包括其定義、與電子積體電路的差異、優勢和挑戰，以及調變器、雷射、波導管和檢測器等關鍵組件。檢驗了所有主要材料平台，比較和評估了矽和絕緣體上矽（SOI）、磷化銦、氮化矽、薄膜鈮酸鋰、鈦酸鋇和電光聚合物，並評估了它們的製造、整合和封裝。報告也詳細討論了共封裝光學元件（CPO）、台積電的COUPE平台和三星晶圓代工平台。

針對光收發器這項產業殺手級應用，專門的分析報告追蹤了從 800G 到 2026 年商用的 1.6T 光收發器，以及未來 3.2T 及更高規格光收發器的發展藍圖。該報告涵蓋了從插入式光學模組到共封裝光元件的過渡、NVIDIA 和 Broadcom 不同的共封裝光元件 (CPO) 生態系統，以及為應對晶片邊緣「前緣」密度危機而湧現的「寬而慢」的 MicroLED光連接模組架構。此外，報告還深入檢驗了用於人工智慧和神經形態計算的光子引擎，以及用於量子計算、量子通訊和量子感測的光子積體電路。

本報告詳細分析了從EDA和晶圓代工廠到OSAT的供應鏈，涵蓋了光學模組組裝向東南亞的轉移、磷化銦晶圓的供應、EML雷射器的短缺以及大中華區的矽光子。報告包含基於銷售、價值和晶圓數量的十年市場預測，涵蓋了整體PIC市場、資料通訊通訊收發器、每Gigabit成本、AI加速器出貨量、共封裝光學元件、MicroLED互連、量子PIC市場以及按材料平台分類的細分市場。

本報告基於廣泛的研究和對行業專家的訪談，重點分析了整個價值鏈上的關鍵參與者和新興企業，展現了推動行業重組的整合浪潮，包括 Marvell 收購 Polariton、Credo 收購 DustPhotonics、Ciena 收購 Nubis 以及一系列重大資金籌措。報告提供分析師洞察、技術成熟度評估和清晰的預測，為元件供應商、晶圓代工廠、系統整合商、超大規模資料中心業者、投資者以及所有希望了解光子積體電路未來發展的人士提供重要資訊。

目錄：

  • 摘要整理：關鍵交易、定義、市場機會、「銅牆鐵壁」、資料中心光電藍圖、分析師觀點
  • 引言與關鍵概念：積體電路、光電與電子學、光子積體電路的優勢與挑戰
  • 光子積體電路的關鍵組件：組件需求、收發器組件、台積電 Coupe PDK
  • 光源與檢測器：化合物半導體雷射、電子發射雷射、垂直腔面發射雷射、複合偏振振盪器超高高功率雷射、電子調製雷射供不應求、光電檢測器的需求
  • 調製器：馬赫-曾德爾調製器、微環調製器、電吸收調製器、SiGe EAM調製器、電光聚合物調製器
  • 被動元件：光子積體電路架構、波導管、光輸入/輸出、耦合和元件密度
  • 材料與製造：晶圓、整合技術、SOI、氮化矽、磷酸銦、有機聚合物、薄膜鈮酸鋰、鈦酸鋇、材料基準測試
  • 供應鏈和市場分析：光電和磷化銦供應鏈、晶圓代工廠、光學模組、向東南亞轉移、輝達和博通首席產品官生態系統、大中華區、監管考量
  • 資料中心光電：網路橫向擴展與縱向擴展、消除瓶頸、從插件式到共封裝光元件、CPO 應用、藍圖
  • 用於微型LED的光連接模組：前沿危機、寬而慢的架構、矽基氮化鎵、應用分析
  • 用於人工智慧和神經形態運算的光子引擎和加速器，可程式光電
  • 用於量子計算、量子網路和量子感測的光子積體電路。
  • 市場預測：整體 PIC 市場、資料通訊通訊收發器、每Gigabit成本、AI 加速器出貨量、共封裝光學元件、MicroLED 互連、量子 PIC 市場、按材料分類的市場。
  • 公司簡介 - ACCRETECH、AEPONYX、Aledia、ALLOS Semiconductors、Amkor、Analog Photonics、ASE、Avicena、Ayar Labs、Black Semiconductor、Broadcom、Broadex、Cambridge Industries Group、CEA-Leti、Celestial AI、Centera 。 Technologies、Lightwave Logic、LioniX、LIPAC、LPKF、Lumentum、Lumiphase、MACOM、Marvell 等。

目錄

第1章：本次修訂的目的與範圍

第2章摘要整理

  • 市場概覽
  • 電子整合與光整合的比較
  • 矽光子收發器的演進
  • 市場地圖
  • 全球矽光子市場趨勢
  • 競爭與互補的光電技術
  • 光子人工智慧加速的潛力
  • 銅牆鐵壁與沿海人口密集危機
  • 製造業產能正轉移到東南亞。
  • 矽光子的商業開發
  • 共封裝光學元件
  • 製造挑戰
  • 市場機遇
  • 區域優勢與研究重點

第3章：矽光子學導論

  • 什麼是矽光子？
  • 矽光子的優勢
  • 矽光子的應用
  • 與其他光子整合技術的比較
  • 從電子整合到光整合的演變
  • 矽光子與傳統電子學的比較
  • 最先進的高效能人工智慧資料中心
  • 核心技術組件
  • 基本光資料傳輸
  • 矽光子電路架構

第4章 材料和部件

  • 矽
  • 鎗
  • 氮化矽
  • 薄膜鈮酸鋰（TFLN）
  • 磷化銦
  • 鈦酸鋇和稀土元素
  • 矽基有機聚合物
  • 晶圓加工
  • 混合異構整合

第5章：先進封裝技術

  • 包裝技術的演變
  • 2.5D整合技術
  • 3D整合方法
  • 整合光學元件（CPO）
  • 光學對準
  • 製造挑戰

第6章 市場與應用

  • 資料通訊應用程式
  • 電訊
  • 感測應用
  • 人工智慧和機器學習
  • 量子計算與通訊
  • 生醫光電與醫學診斷
  • 未來應用

第7章：微型LED光連接模組

  • 引言和沿海危機
  • MicroLED互連架構
  • 微型LED和矽基氮化鎵材料的問題
  • 應用分析
  • 微型LED互連市場預測

第8章 世界市場規模

  • 全球矽光子與光子積體電路市場概覽
  • 資料通訊應用程式
  • 共封裝光學元件
  • 通訊應用
  • 感測應用
  • 光子積體電路市場（按材料分類）

第9章 供應鏈分析

  • 晶圓代工廠及晶圓供應商
  • 整合裝置製造商 (IDM)
  • 晶圓代工廠及晶圓供應商
  • 包裝和測試
  • 系統整合商和最終用戶

第10章 科​​技趨勢

  • 雷射整合技術
  • 調變器技術
  • 檢測器技術
  • 波導管與耦合技術的創新
  • 封裝和整合技術的進步

第11章：挑戰與未來趨勢

  • CMOS晶圓代工廠相容裝置及整合
  • 功耗和溫度控管
  • 包裝和測試
  • 擴充性和成本效益
  • 新興材料和混合整合
  • 技術準備評估

第12章：公司簡介（192家公司簡介）

第13章附錄

第14章參考文獻

Silicon photonics and photonic integrated circuits (PICs) have moved decisively from a promising technology to a structural necessity of modern computing. The driver is artificial intelligence. AI training and inference require enormous volumes of data to move between accelerators, servers and racks at very low latency, and the copper interconnects that served the industry for decades have reached their physical limits ? an "interconnect bottleneck" in which expensive, power-hungry accelerators sit idle waiting for data. Photonics is the industry's answer: photons travel faster, lose less signal over distance, and carry more information per channel. PICs bring those advantages onto silicon chips manufactured with the established CMOS infrastructure of the semiconductor industry.

Optical transceivers remain the engine of the market. The data rate has doubled every few years, and 2026 has seen the commercialisation of 1.6 terabit-per-second transceivers, with 3.2T expected to sample around 2027 and ramp toward 2028. As rates climb, even the short copper trace between an optical engine and a switching or accelerator ASIC limits performance, which is why co-packaged optics (CPO) ? relocating the optics onto the ASIC substrate ? has become the central packaging story of the decade. Industry forecasts suggest CPO could reach roughly 35% of AI-data-centre optical modules by 2030.

The competitive landscape reflects this momentum. Foundries are central: TSMC's COUPE platform, developed alongside NVIDIA for the Quantum-X and Spectrum-X photonic switches, has become a reference point, while Samsung Foundry has formally entered silicon photonics with a completed process design kit, a 300mm platform, a major optical-module order, and a turnkey CPO roadmap targeted for 2029. Consolidation has been intense. Marvell acquired plasmonics-based modulator developer Polariton Technologies to extend its optical roadmap to 3.2T and beyond; Credo agreed to acquire DustPhotonics for approximately $750 million to bring silicon-photonic PICs in-house; and Ciena acquired Nubis Communications for co-packaged optical engines. Independent design houses remain well funded ? OpenLight extended its Series A with an additional $50 million for standards-based 1.6T and 3.2T reference PICs.

Material diversity distinguishes PICs from logic chips. Silicon dominates on CMOS compatibility and scale, but as an indirect-bandgap semiconductor it cannot emit light efficiently, so it is paired with indium phosphide for lasers and detectors. Thin-film lithium niobate, with its low loss and strong electro-optic effect, is emerging for high-performance modulation and quantum systems; barium titanate and silicon nitride add further options. Beyond datacom, telecommunications, sensing and LiDAR, and an increasingly well-funded quantum-photonics segment broaden the demand base.

The supply chain is shifting too: optical-module assembly has concentrated in Southeast Asia, high-value lasers remain with US and Japanese suppliers, and indium-phosphide raw material is concentrated in China, making opportunity and strategic risk tightly coupled. According to industry projections, the silicon photonics and PIC market for transceivers and quantum technologies is set to grow strongly through 2036, led overwhelmingly by AI-driven optical interconnect.

The Global Silicon Photonics and Photonic Integrated Circuits Market 2026-2036 is a comprehensive market and technology assessment of one of the fastest-growing segments of the semiconductor industry. As artificial intelligence and high-performance computing push copper interconnect past its physical limits, silicon photonics has become the structural solution to the data-centre interconnect bottleneck. This report provides an in-depth, independent analysis of the technologies, materials, supply chains, applications and market trajectory of photonic integrated circuits over the coming decade.

The report opens with the fundamentals ? what PICs are, how they differ from electronic integrated circuits, their advantages and challenges, and the key components including modulators, lasers, waveguides and detectors. It examines every major material platform, benchmarking silicon and silicon-on-insulator, indium phosphide, silicon nitride, thin-film lithium niobate, barium titanate and electro-optic polymers, and assesses manufacturing, integration and packaging, including a detailed treatment of co-packaged optics and the TSMC COUPE and Samsung Foundry platforms.

A dedicated analysis covers optical transceivers ? the industry's killer application ? tracing the roadmap from 800G through the 1.6T transceivers commercialised in 2026 to 3.2T and beyond. The report addresses the shift from pluggable optics to co-packaged optics, the divergent NVIDIA and Broadcom CPO ecosystems, and the emerging "wide-and-slow" MicroLED optical interconnect architecture as a response to the chip-edge "beachfront" density crisis. Further chapters examine photonic engines for AI and neuromorphic computing, and a substantial assessment of photonic integrated circuits for quantum computing, quantum communications and quantum sensing.

The report delivers a deep supply-chain analysis from EDA and foundries to OSAT, covering the shift of optical-module assembly to Southeast Asia, indium-phosphide wafer supply, the EML laser shortage, and silicon photonics in Greater China. It includes extensive ten-year market forecasts in units, value and wafers ? covering the total PIC market, datacom transceivers, cost-per-gigabit, AI accelerator shipments, co-packaged optics, MicroLED interconnect, the quantum PIC market, and a breakdown by material platform.

Based on extensive research and interviews with industry experts, the report also profiles the leading and emerging companies across the value chain, capturing the wave of consolidation reshaping the industry ? including the Marvell-Polariton, Credo-DustPhotonics and Ciena-Nubis acquisitions and major fundraising rounds. It offers analyst insight, technology readiness assessments and clear forecasts, providing essential intelligence for component suppliers, foundries, system integrators, hyperscalers, investors and anyone seeking to understand the future of photonic integrated circuits.

Contents include:

  • Executive summary: major deals, definitions, market opportunity, the copper wall, roadmap for photonics in data centres, analyst opinion
  • Introduction and key concepts: integrated circuits, photonics versus electronics, advantages and challenges of PICs
  • Key components of a photonic integrated circuit: component requirements, transceiver component breakdown, TSMC COUPE PDK
  • Light sources and detectors: compound semiconductor lasers, EELs, VCSELs, CPO ultra-high-power laser requirements, EML shortages, photodetectors
  • Modulators: Mach-Zehnder, micro-ring and electro-absorption modulators, SiGe EAMs, EO-polymer modulators
  • Passive devices: PIC architecture, waveguides, optical I/O, coupling and component density
  • Materials and manufacturing: wafers, integration schemes, SOI, silicon nitride, indium phosphide, organic polymer, thin-film lithium niobate, barium titanate, materials benchmarking
  • Supply chain and market analysis: photonics and InP supply chains, foundries, optical modules, Southeast Asia shift, NVIDIA and Broadcom CPO ecosystems, Greater China, regulatory considerations
  • Photonics for data centres: scale-up and scale-out networks, the bottleneck gap, pluggables to co-packaged optics, CPO applications, roadmap
  • MicroLED optical interconnect: the beachfront crisis, wide-and-slow architecture, GaN-on-silicon, application analysis
  • Photonic engines and accelerators for AI and neuromorphic compute, programmable photonics
  • Photonic integrated circuits for quantum computing, quantum networks and quantum sensing
  • Market forecasts: total PIC market, datacom transceivers, cost per gigabit, AI accelerator shipments, co-packaged optics, MicroLED interconnect, quantum PIC market, market by material
  • Company profiles including ACCRETECH, AEPONYX, Aledia, ALLOS Semiconductors, Amkor, Analog Photonics, ASE, Avicena, Ayar Labs, Black Semiconductor, Broadcom, Broadex, Cambridge Industries Group, CEA-Leti, Celestial AI, Centera Photonics, Ciena, Cisco, Coherent, CompoundTek, Credo, CyberRidge, DustPhotonics, EFFECT Photonics, EVG, GlobalFoundries, HD Microsystems, Henkel, HyperLight, Infineon, Infleqtion, Intel, iPronics, JCET Group, JSR Corporation, Lightelligence, Lightium, Lightmatter, Lightsynq Technologies, Lightwave Logic, LioniX, LIPAC, LPKF, Lumentum, Lumiphase, MACOM, Marvell and more.....

Table of Contents

1 PURPOSE AND SCOPE OF THIS REVISION

2 EXECUTIVE SUMMARY

  • 2.1 Market Overview
  • 2.2 Electronic and Photonic Integration Compared
  • 2.3 Silicon Photonic Transceiver Evolution
  • 2.4 Market Map
  • 2.5 Global Market Trends in Silicon Photonics
  • 2.6 Competing and Complementary Photonics Technologies
    • 2.6.1 Metaphotonics
    • 2.6.2 III-V Photonics
    • 2.6.3 Lithium Niobate Photonics
    • 2.6.4 Polymer Photonics
    • 2.6.5 Plasmonic Photonics
  • 2.7 Potential of Photonic AI Acceleration
  • 2.8 The Copper Wall and the Beachfront-Density Crisis
  • 2.9 Manufacturing Capacity Shifts to Southeast Asia
  • 2.10 Commercial deployment of silicon photonics
  • 2.11 Co-Packaged Optics
    • 2.11.1 Divergent CPO Ecosystems: NVIDIA and Broadcom
    • 2.11.2 The TSMC COUPE Packaging Platform
  • 2.12 Manufacturing challenges
  • 2.13 The Market Opportunity
  • 2.14 Regional Strengths & Research Focus

3 INTRODUCTION TO SILICON PHOTONICS

  • 3.1 What is Silicon Photonics?
    • 3.1.1 Definition and Principles of Silicon Photonics
    • 3.1.2 Comparison with traditional technologies
    • 3.1.3 Silicon and Photonic Integrated Circuits
    • 3.1.4 Optical IO, Coupling and Couplers
    • 3.1.5 Emission and Photon Sources/Lasers
    • 3.1.6 Detection and Photodetectors
    • 3.1.7 Compound Semiconductor Lasers and Photodetectors (III-V)
    • 3.1.8 Modulation, Modulators, and Mach-Zehnder Interferometers
      • 3.1.8.1 New modulator technologies
    • 3.1.9 Light Propagation and Waveguides
    • 3.1.10 Optical Component Density
  • 3.2 Advantages of Silicon Photonics
  • 3.3 Applications of Silicon Photonics
  • 3.4 Comparison with Other Photonic Integration Technologies
  • 3.5 Evolution from Electronic to Photonic Integration
  • 3.6 Silicon Photonics vs Traditional Electronics
  • 3.7 Modern high-performance AI data centers
  • 3.8 Core Technology Components
    • 3.8.1 Optical IO, Coupling and Couplers
    • 3.8.2 Emission and Photon Sources/Lasers
      • 3.8.2.1 III-V Integration Challenges
      • 3.8.2.2 Laser Integration Approaches
    • 3.8.3 Detection and Photodetectors
    • 3.8.4 Modulation Technologies
      • 3.8.4.1 Mach-Zehnder Interferometers
      • 3.8.4.2 Ring Modulators
      • 3.8.4.3 Micro-Ring Modulators as a Competitive Differentiator
    • 3.8.5 Light Propagation and Waveguides
    • 3.8.6 Optical Component Density
  • 3.9 Basic Optical Data Transmission
  • 3.10 Silicon Photonic Circuit Architecture

4 MATERIALS AND COMPONENTS

  • 4.1 Silicon
    • 4.1.1 Silicon as a Photonic Material
      • 4.1.1.1 Optical Properties of Silicon
      • 4.1.1.2 Fabrication Processes for Silicon Photonics
    • 4.1.2 Silicon-on-insulator (SOI)
      • 4.1.2.1 SOI Manufacturing Process
      • 4.1.2.2 Key SOI Players
  • 4.2 Germanium
    • 4.2.1 Germanium Integration in Silicon Photonics
    • 4.2.2 Germanium Photodetectors
    • 4.2.3 Germanium-on-Silicon Modulators
  • 4.3 Silicon Nitride
    • 4.3.1 Silicon Nitride (SiN) in Photonics Integrated Circuits
    • 4.3.2 Optical Properties and Fabrication of SiN
    • 4.3.3 SiN Modulator Technologies
    • 4.3.4 SiN Applications in Photonics Integrated Circuits
    • 4.3.5 Advances in SiN Modulator Technologies
    • 4.3.6 SiN-based Waveguides and Devices
    • 4.3.7 SiN Performance Analysis
    • 4.3.8 Applications of SiN in Photonics
    • 4.3.9 SiN PIC Players
    • 4.3.10 SiN Key Foundries
  • 4.4 Thin Film Lithium Niobate (TFLN)
    • 4.4.1 Overview
    • 4.4.2 Lithium Niobate on Insulator (LNOI)
      • 4.4.2.1 Overview of LNOI Technology
      • 4.4.2.2 Characteristics and Properties of LNOI
      • 4.4.2.3 LNOI Fabrication Processes
      • 4.4.2.4 LNOI-based Modulator and Switch Technologies
      • 4.4.2.5 Trends Toward Higher Speed and Improved Power Efficiency
      • 4.4.2.6 High-Speed LNOI Modulators
        • 4.4.2.6.1 Energy-Efficient LNOI Devices
        • 4.4.2.6.2 Emerging LNOI Device Technologies
  • 4.5 Indium Phosphide
    • 4.5.1 Indium Phosphide (InP) Integration
      • 4.5.1.1 InP as a Direct Bandgap Semiconductor
      • 4.5.1.2 InP-based Active Components
      • 4.5.1.3 Hybrid Integration of InP with Silicon Photonics
    • 4.5.2 InP PIC Players
  • 4.6 Barium Titanite and Rare Earth metals
    • 4.6.1 Barium Titanate (BTO) Modulators
  • 4.7 Organic Polymer on Silicon
    • 4.7.1 Polymer-based Modulators
  • 4.8 Wafer Processing
    • 4.8.1 Wafer Sizes by Platform
    • 4.8.2 Processing Challenges
    • 4.8.3 Yield Management
  • 4.9 Hybrid and Heterogeneous Integration
    • 4.9.1 Monolithic Integration
    • 4.9.2 Hybrid Integration
    • 4.9.3 Heterogeneous Integration
    • 4.9.4 III-V-on-Silicon
    • 4.9.5 Bonding and Die-Attachment Techniques
    • 4.9.6 Monolithic versus Hybrid Integration

5 ADVANCED PACKAGING TECHNOLOGIES

  • 5.1 Evolution of Packaging Technologies
    • 5.1.1 Traditional Packaging Approaches
    • 5.1.2 Advanced Packaging Roadmap
    • 5.1.3 Key Performance Metrics
  • 5.2 2.5D Integration Technologies
    • 5.2.1 Silicon Interposer Technology
    • 5.2.2 Glass Interposer Solutions
    • 5.2.3 Organic Substrate Options
  • 5.3 3D Integration Approaches
    • 5.3.1 Through-Silicon Via (TSV)
      • 5.3.1.1 TSV Manufacturing Process
      • 5.3.1.2 TSV Challenges and Solutions
    • 5.3.2 Hybrid Bonding Technologies
      • 5.3.2.1 Cu-Cu Bonding
      • 5.3.2.2 Direct Bonding
  • 5.4 Co-Packaged Optics (CPO)
    • 5.4.1 CPO Architecture Overview
    • 5.4.2 Benefits and Challenges
    • 5.4.3 Integration Approaches
      • 5.4.3.1 2D Integration
      • 5.4.3.2 2.5D Integration
      • 5.4.3.3 3D Integration
    • 5.4.4 Thermal Management
    • 5.4.5 Optical Coupling Solutions
  • 5.5 Optical Alignment
    • 5.5.1 Active vs Passive Alignment
    • 5.5.2 Coupling Efficiency
  • 5.6 Manufacturing Challenges

6 MARKETS AND APPLICATIONS

  • 6.1 Datacom Applications
    • 6.1.1 Data Center Architecture Evolution
    • 6.1.2 Transceivers
      • 6.1.2.1 Integration
    • 6.1.3 Artificial intelligence (AI) and machine learning (ML)
    • 6.1.4 Pluggable optics
    • 6.1.5 Linear drive and linear pluggable optics (LPO)
    • 6.1.6 Interconnects
      • 6.1.6.1 PIC-based on-device interconnects
      • 6.1.6.2 Advanced Packaging and Co-Packaged Optics
        • 6.1.6.2.1 Glass materials
        • 6.1.6.2.2 Co-Packaged Optics
      • 6.1.6.3 Photonic Engines and Accelerators
        • 6.1.6.3.1 Photonic processing for AI
        • 6.1.6.3.2 Convergence with software
        • 6.1.6.3.3 Photonic field-programmable gate arrays (FPGAs)
      • 6.1.6.4 Photonic Integrated Circuits for Quantum Computing
        • 6.1.6.4.1 Photonic qubits
    • 6.1.7 Optical Transceivers
      • 6.1.7.1 Architecture and Operation
      • 6.1.7.2 Market Players
      • 6.1.7.3 Technology Roadmap
    • 6.1.8 Co-Packaged Optics for Switches
      • 6.1.8.1 CPO vs Pluggable Solutions
      • 6.1.8.2 Power and Performance Benefits
      • 6.1.8.3 Implementation Challenges
    • 6.1.9 Data Center Networks
    • 6.1.10 High-Performance Computing
      • 6.1.10.1 On-Device Interconnects
      • 6.1.10.2 Chip-to-Chip Communication
      • 6.1.10.3 System Architecture Impact
    • 6.1.11 Chip-to-Chip and Board-to-Board Interconnects
    • 6.1.12 Ethernet Networking
  • 6.2 Telecommunications
    • 6.2.1 5G/6G Infrastructure
    • 6.2.2 Bandwidth Requirements
    • 6.2.3 Long-Haul and Metro Networks
    • 6.2.4 5G and Fiber-to-the-X (FTTx) Applications
    • 6.2.5 Optical Transceivers and Transponders
  • 6.3 Sensing Applications
    • 6.3.1 Lidar and Automotive Sensing
      • 6.3.1.1 Photonic Integrated Circuit-based LiDAR
    • 6.3.2 Chemical and Biological Sensing
    • 6.3.3 Optical Coherence Tomography
  • 6.4 Artificial Intelligence and Machine Learning
    • 6.4.1 AI Data Traffic Requirements
    • 6.4.2 Silicon Photonics for AI Accelerators
    • 6.4.3 Photonic Processors
    • 6.4.4 Photonic Processing for AI
    • 6.4.5 Programmable Photonics
    • 6.4.6 Neural Network Applications
    • 6.4.7 Future AI Architecture Requirements
  • 6.5 Quantum Computing and Communication
    • 6.5.1 Quantum Photonic Requirements
    • 6.5.2 Integration Challenges
    • 6.5.3 Photonic Platform Quantum Computing
    • 6.5.4 PICs for Quantum systems
    • 6.5.5 Operational cycle of photonic quantum computers
    • 6.5.6 Market Players and Development
  • 6.6 Biophotonics and Medical Diagnostics
  • 6.7 Future Applications

7 MICROLED OPTICAL INTERCONNECT

  • 7.1 Introduction and the Beachfront Crisis
    • 7.1.1 Why density, not speed, is the new constraint
    • 7.1.2 The link dilemma
  • 7.2 The MicroLED Interconnect Architecture
    • 7.2.1 Wide-and-slow versus narrow-and-fast
    • 7.2.2 Operational mechanism and link architecture
    • 7.2.3 Challenges of the MicroLED approach
  • 7.3 MicroLEDs and the GaN-on-Silicon Materials Question
  • 7.4 Application Analysis
  • 7.5 MicroLED Interconnect Market Forecast

8 GLOBAL MARKET SIZE

  • 8.1 Global Silicon Photonics and Photonic Integrated Circuits Market Overview
    • 8.1.1 Market Size and Growth Trends
    • 8.1.2 Market Segmentation by Application
    • 8.1.3 Server Boards, CPUs and Accelerators
    • 8.1.4 Modules & PICs (Dies) Market Forecast 2023-2035
    • 8.1.5 SOI Wafers for Silicon Photonics
    • 8.1.6 LPO & New Modulator Materials Market Forecast 2023-2035
  • 8.2 Datacom Applications
    • 8.2.1 Market Forecast
      • 8.2.1.1 Datacom and Telecom Modules and PICs
      • 8.2.1.2 PIC Transceivers for AI
      • 8.2.1.3 PIC Transceiver Pricing
    • 8.2.2 PIC Transceiver Cost per Gigabit
    • 8.2.3 PIC Datacom Transceiver Market
    • 8.2.4 Datacom Transceiver Revenue by Customer Type
    • 8.2.5 Key Drivers and Restraints
  • 8.3 Co-Packaged Optics
  • 8.4 Telecom Applications
    • 8.4.1 Market Forecast
      • 8.4.1.1 PIC-based Transceivers for 5G and 6G
    • 8.4.2 Key Drivers and Restraints
  • 8.5 Sensing Applications
    • 8.5.1 Market Forecast
    • 8.5.2 Key Drivers and Restraints
  • 8.6 Photonic Integrated Circuit Market, by Material

9 SUPPLY CHAIN ANALYSIS

  • 9.1 Foundries and Wafer Suppliers
    • 9.1.1 CMOS Foundries
    • 9.1.2 Specialty Photonics Foundries
    • 9.1.3 Indium Phosphide Wafer Supply
  • 9.2 Integrated Device Manufacturers (IDMs)
    • 9.2.1 Fabless Companies
    • 9.2.2 Fully Integrated Photonics Companies
  • 9.3 Foundries and Wafer Suppliers
  • 9.4 Packaging and Testing
    • 9.4.1 Chip-Scale Packaging
    • 9.4.2 Module-Level Packaging
    • 9.4.3 Testing and Characterization
    • 9.4.4 Optical Module Assembly: The Shift to Southeast Asia
    • 9.4.5 The EML Laser Shortage
  • 9.5 System Integrators and End-Users
    • 9.5.1 CPO Partner Ecosystems: NVIDIA and Broadco

10 TECHNOLOGY TRENDS

  • 10.1 Laser Integration Techniques
    • 10.1.1 Direct Epitaxial Growth
    • 10.1.2 Flip-Chip Bonding
    • 10.1.3 Hybrid Integration
    • 10.1.4 Advances and Challenges
  • 10.2 Modulator Technologies
    • 10.2.1 Silicon Modulators
    • 10.2.2 Germanium Modulators
    • 10.2.3 Lithium Niobate Modulators
    • 10.2.4 Polymer Modulators
      • 10.2.4.1 Tower Semiconductor and Lightwave Logic EO-Polymer
  • 10.3 Photodetector Technologies
    • 10.3.1 Silicon Photodetectors
    • 10.3.2 Germanium Photodetectors
    • 10.3.3 III-V Photodetectors
  • 10.4 Waveguide and Coupling Innovations
    • 10.4.1 Silicon Waveguides
    • 10.4.2 Silicon Nitride Waveguides
    • 10.4.3 Coupling Techniques
  • 10.5 Packaging and Integration Advancements
    • 10.5.1 Chip-Scale Packaging
    • 10.5.2 Wafer-Scale Integration
    • 10.5.3 3D Integration and Interposer Technologies

11 CHALLENGES AND FUTURE TRENDS

  • 11.1 CMOS-Foundry-Compatible Devices and Integration
    • 11.1.1 Scaling and Miniaturization
    • 11.1.2 Process Complexity and Yield Improvement
  • 11.2 Power Consumption and Thermal Management
    • 11.2.1 Energy-Efficient Photonic Devices
    • 11.2.2 Thermal Optimization Techniques
  • 11.3 Packaging and Testing
    • 11.3.1 Advanced Packaging Solutions
    • 11.3.2 Automated Testing and Characterization
  • 11.4 Scalability and Cost-Effectiveness
    • 11.4.1 Wafer-Scale Integration
    • 11.4.2 Outsourced Semiconductor Assembly and Test (OSAT)
  • 11.5 Emerging Materials and Hybrid Integration
    • 11.5.1 Novel Semiconductor Materials
    • 11.5.2 Heterogeneous Integration Approaches
  • 11.6 Technology Readiness Assessment

12 COMPANY PROFILES (192 company profiles)

13 APPENDICES

  • 13.1 Glossary of Terms
  • 13.2 List of Abbreviations
  • 13.3 Research Methodology

14 REFERENCES

List of Tables

  • Table 1. Headline forecast changes, prior edition vs. 2026-2036 edition
  • Table 2. Photonic Integrated Circuits Applications
  • Table 3. Silicon Photonics vs. Electronics: Key Metrics Comparison.
  • Table 4. Photonic Technologies Comparative Analysis.
  • Table 5. Comparison between electronic and photonic computing.
  • Table 6. Silicon Photonics technical achievements.
  • Table 7. Electronics companies silicon photonics commercial activities.
  • Table 8. Manufacturing Metrics & Challenges.
  • Table 9. Manufacturing Targets vs Current State.
  • Table 10. Regional Strengths & Research Focus.
  • Table 11. Comparative cost analysis.
  • Table 12. Challenges for CMOS-Foundry-Compatible Photonic Devices.
  • Table 13. Silicon Photonics Integration Schemes.
  • Table 14. Benefits of PICs.
  • Table 15. Current & Future Photonic Integrated Circuits Applications.
  • Table 16. Photodetector Performance.
  • Table 17. III-V Device Performance.
  • Table 18. Optical Modulator Performance Comparison.
  • Table 19. Silicon Photonic Waveguide Characteristics.
  • Table 20. Optical Component Integration Metrics.
  • Table 21. Advantages of Silicon Photonics.
  • Table 22. Applications of Silicon Photonics.
  • Table 23. Comparison with Other Photonic Integration Technologies.
  • Table 24. Silicon Photonics vs Traditional Electronics: Performance Metrics.
  • Table 25. Switch IC Bandwidth and CPO Technology Evolution.
  • Table 26. Challenges in data center architectures.
  • Table 27. Key Trends of Optical Transceivers in High-End Data Centers.
  • Table 28. Core Components Specifications and Requirements
  • Table 29. Types of Emission and Photon Sources/Lasers.
  • Table 30. III-V Integration Challenges.
  • Table 31. Laser Integration Approaches Comparison.
  • Table 32. Modulator Types and Configurations.
  • Table 33. Waveguide Specifications and Requirements.
  • Table 34. Data Transmission Parameters and Specifications.
  • Table 35. Circuit Architecture Building Blocks.
  • Table 36. Integration Approaches.
  • Table 37. Technology Platforms.
  • Table 38. Silicon Photonics Component Specifications.
  • Table 39. Optical Properties of Silicon.
  • Table 40. Fabrication Processes for Silicon Photonics.
  • Table 41. Silicon Semiconductor Foundry In-House Technologies.
  • Table 42. SOI Platform Benchmarking.
  • Table 43. Silicon Foundry Technology Comparison.
  • Table 44. Silicon-on-insulator (SOI) Platform Benchmarking.
  • Table 45. Key SOI Players.
  • Table 46. Germanium Integration Methods and Applications.
  • Table 47. SiN Key Foundries.
  • Table 48. SiN Modulator Technologies.
  • Table 49. Silicon (SOI and SiN) Device Heterogeneous Integration.
  • Table 50. SiN Benchmarking.
  • Table 51. Applications of SiN in Photonics.
  • Table 52. SiN PIC Players.
  • Table 53. SiN Foundry Analysis.
  • Table 54. Benchmarking of TFLN.
  • Table 55. Characteristics and Properties of LNOI.
  • Table 56. LNOI Fabrication Processes.
  • Table 57. LNOI-based Modulator and Switch Technologies.
  • Table 58. Emerging LNOI Device Technologies.
  • Table 59. InP Benchmarking.
  • Table 60. Integration Technologies.
  • Table 61. InP PIC Players.
  • Table 62. BTO Benchmarking.
  • Table 63. Comparative analysis of materials.
  • Table 64. Benchmarking of Polymer on Insulator.
  • Table 65. Wafer Size Comparison by Platform.
  • Table 66. Wafer Processing Challenges.
  • Table 67. Yield Analysis by Process Step.
  • Table 68. Integration Scheme Comparison.
  • Table 69. Bonding and Die-Attachment Techniques.
  • Table 70. Monolithic versus Hybrid Integration.
  • Table 71. Packaging Technology Comparison Matrix.
  • Table 72. Evolution of semiconductor packaging.
  • Table 73. Summary of key advanced semiconductor packaging approaches.
  • Table 74. Key Performance Metrics for Advanced Packaging Technologies.
  • Table 75. Glass Interposer Solutions.
  • Table 76. Organic Substrate Options.
  • Table 77. TSV Specifications by Application.
  • Table 78. TSV Challenges and Solutions.
  • Table 79. Comparative benchmark overview table of key semiconductor interconnection technologies
  • Table 80. CPO Benefits and Challenges.
  • Table 81. Performance Metrics Comparison.
  • Table 82. CPO Integration Approaches Comparison.
  • Table 83. Manufacturing Process Comparison.
  • Table 84. Thermal Management Approaches.
  • Table 85. Optical Coupling Solutions.
  • Table 86. Alignment Tolerance Analysis.
  • Table 87. Active vs Passive Alignment Comparison.
  • Table 88. Coupling Efficiency Analysis.
  • Table 89. Advanced packaging manufacturing challenges.
  • Table 90.Silicon Photonics & Photonic Integrated Circuits Market and Applications
  • Table 91. Energy Consumption Analysis.
  • Table 92. Key Metrics for Advanced Semiconductor Packaging Performance.
  • Table 93. Pluggable Optics vs. Co-Packaged Optics (CPO).
  • Table 94. Future Challenges in Co-Packaged Optics (CPO).
  • Table 95. Key Technology Building Blocks for Co-Packaged Optics.
  • Table 96. Key Packaging Components for Co-Packaged Optics.
  • Table 97. Key Players in Photonic Quantum Computing.
  • Table 98. Comparison of PICs vs Traditional Optical Systems.
  • Table 99. Future PIC Requirements of the Quantum Industry.
  • Table 100. Optical Transceivers Market Players.
  • Table 101. Power and Performance Benefits.
  • Table 102. Implementation Challenges.
  • Table 103. Silicon Photonics in HPC: Technical Parameters
  • Table 104. Applications of Silicon Photonics in Telecommunications.
  • Table 105. Bandwidth Requirements by Segment.
  • Table 106. 5G and FTTx Applications Technical Parameters.
  • Table 107. Opportunities for PIC Sensors in LiDAR Applications.
  • Table 108. Challenges of PIC-based FMCW LiDARs.
  • Table 109. Companies Developing PIC-based LiDAR.
  • Table 110. Companies Developing PIC Biosensors.
  • Table 111. Companies Developing PIC-based Gas Sensors.
  • Table 112. Companies Developing Spectroscopy PICs.
  • Table 113. AI Data Traffic Requirements.
  • Table 114. Neural Network Applications.
  • Table 115. Future AI Architecture Requirements.
  • Table 116. Quantum Photonic Requirements.
  • Table 117. Integration Challenges in Quantum Computing and Communication.
  • Table 118. Future PIC Requirements of the Quantum Industry.
  • Table 119. Roadmap for Photonic Quantum Hardware.
  • Table 120. Market players and development.
  • Table 121. Biophotonics Applications.
  • Table 122. Future Applications.
  • Table 123. MicroLED optical interconnect: advantages and challenges
  • Table 124. MicroLED optical interconnect: application landscape
  • Table 125. MicroLED Optical Interconnect Market Forecast, 2026?2036 (US$ million)
  • Table 126. Global Silicon Photonics and PIC Market, 2026-2036 (US$ billion)
  • Table 127. Market Segmentation by Application 2026-2036 (Billions USD).
  • Table 128. Silicon Photonics on Server Boards, CPUs and Accelerators, 2026-2036
  • Table 129. Modules and PICs (Dies) Market Forecast, 2026-2036 (US$ billion)
  • Table 130. SOI Wafers for Silicon Photonics Market Forecast, 2026-2036
  • Table 131. LPO and New Modulator Materials Market Forecast, 2026-2036 (US$ billion)
  • Table 132. Silicon Photonics in Datacom Applications, 2026-2036 (US$ billion)
  • Table 133. Datacom and Telecom Modules Market Forecast, 2026-2036 (US$ billion)
  • Table 134. Datacom and Telecom PICs (Dies) Market Forecast, 2026-2036 (US$ billion)
  • Table 135. PIC Transceivers for AI, Units Forecast, 2026-2036
  • Table 136. PIC Transceiver Pricing, 2026-2036 (US$ per unit)
  • Table 137. PIC Transceiver Cost per Gigabit, 2026-2036 (US$ per Gb/s)
  • Table 138. PIC Datacom Transceiver Market Forecast, 2026-2036
  • Table 139. PIC Datacom Transceiver Revenue by Customer Type, 2026-2036 (US$ billion)
  • Table 140. Key market drivers and restraints for silicon photonics in Datacom Applications.
  • Table 141. Co-Packaged Optics Market Forecast, 2026-2036 (US$ million)
  • Table 142. Silicon Photonics in Telecom Applications, 2026-2036 (US$ billion)
  • Table 143. PIC-based Transceivers for 5G and 6G, Units and Market, 2026-2036
  • Table 144. Key market drivers and restraints for silicon photonics in Telecom Applications.
  • Table 145. Silicon Photonics in Sensing Applications, 2026-2036 (US$ billion)
  • Table 146. Key market drivers and restraints for silicon photonics in Sensing Applications.
  • Table 147. PIC Market by Material Platform, 2026-2036 (US$ billion)
  • Table 148. CMOS Foundries.
  • Table 149. Specialty Photonics Foundries.
  • Table 150. Fabless Companies.
  • Table 151. Fully Integrated Photonics Companies.
  • Table 152. Foundries and Wafer Suppliers.
  • Table 153. System Integrators and End-Users.
  • Table 154. Laser Integration Methods Comparison.
  • Table 155. Advanced Techniques and Challenges.
  • Table 156. Modulator Technology Benchmarking.
  • Table 157. Photodetector Performance Metrics .
  • Table 158. Novel semiconductor materials for silicon photonics.
  • Table 159. Technology readiness of silicon photonics technologies, 2026
  • Table 160. Glossary of terms.
  • Table 161. List of abbreviations.

List of Figures

  • Figure 1. Silicon Photonic Transceiver Evolution Timeline.
  • Figure 2. Silicon Photonics Player Market Map.
  • Figure 3. Basic Silicon Photonic Circuit Architecture.
  • Figure 4. High Performance AI data center.
  • Figure 5. Optical IO Coupling Mechanisms Diagram.
  • Figure 6. Optical Component Density Evolution.
  • Figure 7. Basic Optical Data Transmission Diagram.
  • Figure 8. SOI Wafer Structure.
  • Figure 9. Manufacturing Process Flow.
  • Figure 10. Germanium Photodetector.
  • Figure 11. Silicon Nitride Layer Stack.
  • Figure 12. AEPONYX SiN PICs.
  • Figure 13. SiN Waveguide Cross-sections.
  • Figure 14. LNOI Device Structures .
  • Figure 15. Timeline of different packaging technologies.
  • Figure 16. Advanced Packaging Roadmap.
  • Figure 17. 2D chip packaging.
  • Figure 18. Typical structure of 2.5D IC package utilizing interposer.
  • Figure 19. TSV Structure and Implementation.
  • Figure 20. Hybrid Bonding Process Flow.
  • Figure 21. Co-Packaged Optics Architecture.
  • Figure 22. Optical module with pluggable fibre interconnect.
  • Figure 23. Roadmap for PIC-Based Transceivers.
  • Figure 24. Evolution Roadmap for Semiconductor Packaging.
  • Figure 25. Roadmap for photonic quantum hardware.
  • Figure 26. Optical Transceivers Technology Roadmap.
  • Figure 27. 5G/6G Implementation Roadmap.
  • Figure 28. LiDAR System Design.
  • Figure 29. Narrow-and-fast versus wide-and-slow interconnect architectures.
  • Figure 30. MicroLED optical interconnect link architecture.
  • Figure 31. Indicative link energy by interconnect technology (pJ/bit).
  • Figure 31. MicroLED Optical Interconnect Market Forecast, 2026?2036 (US$ million).
  • Figure 32. Silicon Photonics Supply Chain and Ecosystem.
  • Figure 33. Concept for advanced packaging for integrated photonics.
  • Figure 34. Aeries II LiDAR system.
  • Figure 35. NVIDIA's silicon photonics switches.
  • Figure 36. PhotoniSol optical isolator chip.
  • Figure 37. PsiQuantum’s modularized quantum computing system networks.
  • Figure 38. Q.ANT Native Processing Unit (NPU).
  • Figure 39. QuiX low-loss photonic quantum processors.
  • Figure 40. A prototype of Taara’s silicon photonics chip device.