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1964043

模塑電路元件市場－全球產業規模、佔有率、趨勢、機會、預測：按製程、應用、區域和競爭格局分類，2021-2031年

Molded Interconnect Device Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Process, By Application, By Region & Competition, 2021-2031F
出版日期: | 出版商: TechSci Research | 英文 180 Pages | 商品交期: 2-3個工作天內

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簡介目錄

全球模塑電路元件市場預計將從 2025 年的 99.4 億美元成長到 2031 年的 216.2 億美元，複合年成長率為 13.83%。

模塑電路元件 (MID) 透過使用射出成型的熱塑性塑膠將電子電路圖案嵌入單一單元中，從而將機械和電氣功能無縫整合。這項市場成長的主要驅動力是電子產業對小型化日益成長的需求，以及為簡化組裝流程、降低製造成本和提高可靠性而做出的努力。汽車和醫療技術等行業正在擴大採用這些裝置，以實現空間最佳化和功能整合。為了證明該領域擁有強大的生態系統支持，3D MID eV 研究協會在 2024 年報告稱，其由致力於推進 MID 技術的眾多製造商和研究機構組成的專業行業網路擁有 87 個成員。

市場概覽
預測期 2027-2031
市場規模：2025年 99.4億美元
市場規模：2031年 216.2億美元
複合年成長率：2026-2031年 13.83%
成長最快的細分市場 雙色注塑成型
最大的市場 亞太地區

然而，市場擴張的主要障礙在於專用射出成型模具和雷射成型設備所需的大量初始投資。與傳統的印刷基板組裝相比，這一巨大的資金門檻往往使得該技術在小批量生產中經濟效益不佳。因此，MID技術的應用通常僅限於大規模生產環境，因為在這些環境中，規模經濟效應可以有效地抵消初始投資成本。

市場促進因素

汽車電子和電動車架構的快速發展是模塑電路元件市場的主要驅動力。製造商正擴大採用這項技術，將電路直接整合到結構件中，從而顯著減輕車輛重量，並消除狹小車廂內繁瑣的佈線。這種整合對於容納現代電動車所必需的複雜感測器陣列和控制系統至關重要，同時又不犧牲空間利用率。根據國際能源總署 (IEA) 於 2024 年 4 月發布的《2024 年全球電動車展望》，2023 年電動車銷量將達到約 1,400 萬輛，從而對這些整合組件產生了巨大的需求。 LPKF Laser & Electronics SE 公司 2024 會計年度的連合收益為 1.243 億歐元，這反映了該公司在必要的雷射結構化系統方面的大量資本投資，也印證了該行業的規模之大。

此外，5G通訊基礎設施的快速部署正在推動市場成長，因為其對天線設計提出了更高的要求，而標準印刷電路基板無法滿足這些要求。模塑互連技術能夠將3D天線結構直接整合到智慧型手機和基地台的內部機殼中，從而在不增加設備尺寸的情況下，提升不同頻寬的訊號品質。這項技術對於維持消費者期望的緊湊設計，同時支援下一代網路所需的MIMO（多重輸入多輸出）配置至關重要。正如愛立信2024年6月發布的《行動報告》所述，光是2024年第一季，全球5G用戶就增加了1.6億，總數達到17億人。這給為這些先進連接解決方案提供組件的製造商帶來了越來越大的壓力。

市場挑戰

模塑電路元件市場成長的主要障礙在於專用製造基礎設施所需的大量前期投資。在開始生產之前，需要對精密射出成型機和雷射直接成型系統等設備進行大量資本投入。這種沉重的財務負擔提高了損益平衡點，使得該技術對於中小批量生產而言經濟效益低。因此，該技術的應用主要局限於汽車和醫療電子等大規模生產行業，而中小企業和小批量生產應用則被排除在外，因為規模經濟無法抵消其初始成本。

這項技術的資本密集特徵在其研發所需的巨額資金投入上體現得淋漓盡致。根據研究協會3-D MID eV統計，截至2024年，該協會管理的研究計劃累積資助金額已達約1.76億歐元。如此龐大的投資規模凸顯了該領域的高進入門檻和複雜的財務狀況，直接限制了其在成本敏感型領域的市場滲透。在這些領域，傳統的印刷電路基板仍然是更具經濟效益的選擇。

市場趨勢

生物相容性互連技術的興起，源自於患者照護設備小型化需求的迫切性，正在改變智慧醫療植入市場。製造商正擴大模塑互連裝置 (MID) 的應用，以在保持生物相容性的同時，將複雜的電路直接整合到助聽器、神經調節系統和智慧藥物傳輸裝置的機殼中。這種策略最大限度地減少了有限空間內所需的組件數量，最大限度地利用了內部空間，並提高了設備的可靠性。 Cicor 集團在 2025 年 7 月發布的「2025 會計年度半年度報告」中指出，得益於其核心醫療技術和工業領域的持續需求，該行業在醫療領域的強勁發展勢頭得以體現，並實現了 2.807 億瑞士法郎的淨銷售額。

同時，積層製造電子技術（AME）的出現正在革新快速原型製作，它消除了傳統射出成型模具高昂的初始成本。這項製造技術的突破使工程師能夠同時列印介電結構和導電走線，從而在數小時內而非數週內創建複雜的3D電路。 AME消除了小批量生產中昂貴模具的經濟障礙，加快了設計迭代周期，並支援客製化電子元件的快速開發。為了展示這項數位製造技術的快速商業性化擴張，Nano Dimension公司於2025年9月宣布，第二季營收達2,580萬美元，年增72.4%。

目錄

第1章概述

第2章：調查方法

第3章執行摘要

第4章：客戶心聲

第5章：模塑電路元件的全球市場展望

  • 市場規模及預測
    • 按金額
  • 市佔率及預測
    • 特定製程方法（雷射直接成型、雙色射出成型）
    • 按應用領域（汽車、消費品、醫療、工業、軍事/航太、電信、其他）
    • 按地區
    • 按公司（2025 年）
  • 市場地圖

第6章：北美模塑電路元件市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 北美洲：國別分析
    • 美國
    • 加拿大
    • 墨西哥

第7章：歐洲模塑電路元件市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 歐洲：國別分析
    • 德國
    • 法國
    • 英國
    • 義大利
    • 西班牙

第8章：亞太地區模塑電路元件市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 亞太地區：國別分析
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳洲

第9章：中東和非洲模塑電路元件市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 中東與非洲：國別分析
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 南非

第10章：南美洲模塑電路元件市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 南美洲：國別分析
    • 巴西
    • 哥倫比亞
    • 阿根廷

第11章 市場動態

  • 促進因素
  • 任務

第12章 市場趨勢與發展

  • 併購
  • 產品發布
  • 近期趨勢

第13章 全球模塑電路元件市場：SWOT分析

第14章：波特五力分析

  • 產業競爭
  • 新進入者的潛力
  • 供應商的議價能力
  • 顧客權力
  • 替代品的威脅

第15章 競爭格局

  • Molex LLC
  • TE Connectivity Ltd.
  • Amphenol Corporation
  • HARTING Technology Group
  • KYOCERA AVX Components Corporation
  • LPKF Laser & Electronics AG
  • MID Solutions GmbH
  • TEPROSA
  • Taoglas
  • RTP Company

第16章 策略建議

第17章：關於研究公司及免責聲明

簡介目錄
Product Code: 21787

The Global Molded Interconnect Device Market is projected to expand from USD 9.94 Billion in 2025 to USD 21.62 Billion by 2031, registering a CAGR of 13.83%. Molded Interconnect Devices (MIDs) utilize injection-molded thermoplastics to embed electronic circuit traces, seamlessly merging mechanical and electrical functionalities into a single unit. This market is primarily fueled by the growing necessity for miniaturization within the electronics sector and the drive to minimize assembly stages, which concurrently reduces production costs and bolsters reliability. Industries such as automotive and medical technology are increasingly adopting these devices to achieve space optimization and functional integration. As evidence of the robust ecosystem supporting this field, the Research Association 3-D MID e.V. reported in 2024 that its specialized industrial network included 87 members, comprising various manufacturers and research institutes committed to furthering MID technology.

Market Overview
Forecast Period2027-2031
Market Size 2025USD 9.94 Billion
Market Size 2031USD 21.62 Billion
CAGR 2026-203113.83%
Fastest Growing SegmentTwo-Shot Molding
Largest MarketAsia Pacific

However, a major obstacle hindering broader market growth is the substantial upfront capital required for specialized injection molding tools and laser structuring machinery. This significant financial threshold often renders the technology economically impractical for low-volume production compared to conventional printed circuit board assemblies. Consequently, the adoption of MIDs is generally constrained to high-volume manufacturing environments where economies of scale can be effectively leveraged to offset the initial investment costs.

Market Driver

The surging growth of automotive electronics and electric vehicle architectures acts as a primary catalyst for the molded interconnect device market. Manufacturers are increasingly adopting this technology to embed circuits directly into structural parts, significantly lowering vehicle weight and removing the need for cumbersome cabling in tight interiors. This integration is vital for housing the intricate sensor arrays and control systems essential to modern electric mobility without sacrificing spatial efficiency. According to the International Energy Agency's 'Global EV Outlook 2024' released in April 2024, electric car sales hit nearly 14 million in 2023, generating immense demand for these integrated assemblies. The industrial magnitude of this sector is further highlighted by LPKF Laser & Electronics SE, which reported a consolidated revenue of EUR 124.3 million for the 2024 fiscal year, reflecting the heavy capital investment in the necessary laser structuring systems.

Furthermore, the rapid rollout of 5G telecommunications infrastructure stimulates market growth by demanding antenna designs that standard printed circuit boards cannot support. Molded interconnects facilitate the creation of three-dimensional antenna structures directly on the internal shells of smartphones and base stations, enhancing signal quality across various frequencies without enlarging the device. This capability is crucial for handling the multiple-input multiple-output configurations required by next-generation networks while preserving the compact designs consumers expect. As noted in the 'Ericsson Mobility Report' from June 2024, global 5G subscriptions surged by 160 million in the first quarter of 2024 alone, totaling 1.7 billion, which places increasing pressure on component makers to supply these advanced connectivity solutions.

Market Challenge

A major impediment to the growth of the Molded Interconnect Device market is the substantial upfront investment needed for specialized manufacturing infrastructure. Companies are required to allocate significant capital for precision injection molding machinery and laser direct structuring tools before production can even begin. This heavy financial burden creates a high break-even point, making the technology economically inefficient for low-to-medium volume production runs. As a result, adoption is largely confined to mass-market industries such as automotive and medical electronics, thereby excluding smaller businesses and lower-volume applications that cannot justify the initial costs through economies of scale.

The capital-intensive nature of this technology is further demonstrated by the immense financial resources necessary for its development. According to the Research Association 3-D MID e.V., the cumulative funding for research projects managed by the association reached approximately 176 million euros in 2024. This level of investment highlights the high entry barriers and financial complexity associated with the sector, directly restricting the market's capacity to penetrate cost-sensitive areas where traditional printed circuit boards continue to be the more financially viable alternative.

Market Trends

The rise of bio-compatible interconnects is transforming the market for smart medical implants, propelled by the urgent requirement for miniaturization in patient-care devices. Manufacturers are increasingly utilizing molded interconnect devices to embed intricate circuitry directly into the casings of hearing aids, neuromodulation systems, and smart drug delivery units while maintaining biocompatibility. This strategy maximizes internal space and boosts device reliability by minimizing the number of distinct components needed within tightly constrained form factors. Underscoring the strong industrial momentum in this healthcare segment, Cicor Group reported in its 'Half Year Report 2025' from July 2025 that it achieved net sales of CHF 280.7 million, fueled by persistent demand in its core medical technology and industrial sectors.

Simultaneously, the advent of Additively Manufactured Electronics (AME) is revolutionizing rapid prototyping by eliminating the steep initial costs tied to conventional injection molding tooling. This manufacturing breakthrough permits engineers to print dielectric structures and conductive traces concurrently, allowing for the creation of complex 3D circuits in a matter of hours instead of weeks. By removing the financial hurdle of costly tooling for low-volume production, AME speeds up design iteration cycles and supports the agile development of tailored electronic components. Highlighting the swift commercial expansion of this digital production technology, Nano Dimension announced in September 2025 that its second-quarter revenue climbed to USD 25.8 million, marking a 72.4% increase compared to the same period the prior year.

Key Market Players

  • Molex LLC
  • TE Connectivity Ltd.
  • Amphenol Corporation
  • HARTING Technology Group
  • KYOCERA AVX Components Corporation
  • LPKF Laser & Electronics AG
  • MID Solutions GmbH
  • TEPROSA
  • Taoglas
  • RTP Company

Report Scope

In this report, the Global Molded Interconnect Device Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Molded Interconnect Device Market, By Process

  • Laser Direct Structuring
  • Two-Shot Molding

Molded Interconnect Device Market, By Application

  • Automotive
  • Consumer Products
  • Healthcare
  • Industrial
  • Military & Aerospace
  • Telecommunication
  • Others

Molded Interconnect Device Market, By Region

  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • France
    • United Kingdom
    • Italy
    • Germany
    • Spain
  • Asia Pacific
    • China
    • India
    • Japan
    • Australia
    • South Korea
  • South America
    • Brazil
    • Argentina
    • Colombia
  • Middle East & Africa
    • South Africa
    • Saudi Arabia
    • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Molded Interconnect Device Market.

Available Customizations:

Global Molded Interconnect Device Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

  • 1.1. Market Definition
  • 1.2. Scope of the Market
    • 1.2.1. Markets Covered
    • 1.2.2. Years Considered for Study
    • 1.2.3. Key Market Segmentations

2. Research Methodology

  • 2.1. Objective of the Study
  • 2.2. Baseline Methodology
  • 2.3. Key Industry Partners
  • 2.4. Major Association and Secondary Sources
  • 2.5. Forecasting Methodology
  • 2.6. Data Triangulation & Validation
  • 2.7. Assumptions and Limitations

3. Executive Summary

  • 3.1. Overview of the Market
  • 3.2. Overview of Key Market Segmentations
  • 3.3. Overview of Key Market Players
  • 3.4. Overview of Key Regions/Countries
  • 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Molded Interconnect Device Market Outlook

  • 5.1. Market Size & Forecast
    • 5.1.1. By Value
  • 5.2. Market Share & Forecast
    • 5.2.1. By Process (Laser Direct Structuring, Two-Shot Molding)
    • 5.2.2. By Application (Automotive, Consumer Products, Healthcare, Industrial, Military & Aerospace, Telecommunication, Others)
    • 5.2.3. By Region
    • 5.2.4. By Company (2025)
  • 5.3. Market Map

6. North America Molded Interconnect Device Market Outlook

  • 6.1. Market Size & Forecast
    • 6.1.1. By Value
  • 6.2. Market Share & Forecast
    • 6.2.1. By Process
    • 6.2.2. By Application
    • 6.2.3. By Country
  • 6.3. North America: Country Analysis
    • 6.3.1. United States Molded Interconnect Device Market Outlook
      • 6.3.1.1. Market Size & Forecast
        • 6.3.1.1.1. By Value
      • 6.3.1.2. Market Share & Forecast
        • 6.3.1.2.1. By Process
        • 6.3.1.2.2. By Application
    • 6.3.2. Canada Molded Interconnect Device Market Outlook
      • 6.3.2.1. Market Size & Forecast
        • 6.3.2.1.1. By Value
      • 6.3.2.2. Market Share & Forecast
        • 6.3.2.2.1. By Process
        • 6.3.2.2.2. By Application
    • 6.3.3. Mexico Molded Interconnect Device Market Outlook
      • 6.3.3.1. Market Size & Forecast
        • 6.3.3.1.1. By Value
      • 6.3.3.2. Market Share & Forecast
        • 6.3.3.2.1. By Process
        • 6.3.3.2.2. By Application

7. Europe Molded Interconnect Device Market Outlook

  • 7.1. Market Size & Forecast
    • 7.1.1. By Value
  • 7.2. Market Share & Forecast
    • 7.2.1. By Process
    • 7.2.2. By Application
    • 7.2.3. By Country
  • 7.3. Europe: Country Analysis
    • 7.3.1. Germany Molded Interconnect Device Market Outlook
      • 7.3.1.1. Market Size & Forecast
        • 7.3.1.1.1. By Value
      • 7.3.1.2. Market Share & Forecast
        • 7.3.1.2.1. By Process
        • 7.3.1.2.2. By Application
    • 7.3.2. France Molded Interconnect Device Market Outlook
      • 7.3.2.1. Market Size & Forecast
        • 7.3.2.1.1. By Value
      • 7.3.2.2. Market Share & Forecast
        • 7.3.2.2.1. By Process
        • 7.3.2.2.2. By Application
    • 7.3.3. United Kingdom Molded Interconnect Device Market Outlook
      • 7.3.3.1. Market Size & Forecast
        • 7.3.3.1.1. By Value
      • 7.3.3.2. Market Share & Forecast
        • 7.3.3.2.1. By Process
        • 7.3.3.2.2. By Application
    • 7.3.4. Italy Molded Interconnect Device Market Outlook
      • 7.3.4.1. Market Size & Forecast
        • 7.3.4.1.1. By Value
      • 7.3.4.2. Market Share & Forecast
        • 7.3.4.2.1. By Process
        • 7.3.4.2.2. By Application
    • 7.3.5. Spain Molded Interconnect Device Market Outlook
      • 7.3.5.1. Market Size & Forecast
        • 7.3.5.1.1. By Value
      • 7.3.5.2. Market Share & Forecast
        • 7.3.5.2.1. By Process
        • 7.3.5.2.2. By Application

8. Asia Pacific Molded Interconnect Device Market Outlook

  • 8.1. Market Size & Forecast
    • 8.1.1. By Value
  • 8.2. Market Share & Forecast
    • 8.2.1. By Process
    • 8.2.2. By Application
    • 8.2.3. By Country
  • 8.3. Asia Pacific: Country Analysis
    • 8.3.1. China Molded Interconnect Device Market Outlook
      • 8.3.1.1. Market Size & Forecast
        • 8.3.1.1.1. By Value
      • 8.3.1.2. Market Share & Forecast
        • 8.3.1.2.1. By Process
        • 8.3.1.2.2. By Application
    • 8.3.2. India Molded Interconnect Device Market Outlook
      • 8.3.2.1. Market Size & Forecast
        • 8.3.2.1.1. By Value
      • 8.3.2.2. Market Share & Forecast
        • 8.3.2.2.1. By Process
        • 8.3.2.2.2. By Application
    • 8.3.3. Japan Molded Interconnect Device Market Outlook
      • 8.3.3.1. Market Size & Forecast
        • 8.3.3.1.1. By Value
      • 8.3.3.2. Market Share & Forecast
        • 8.3.3.2.1. By Process
        • 8.3.3.2.2. By Application
    • 8.3.4. South Korea Molded Interconnect Device Market Outlook
      • 8.3.4.1. Market Size & Forecast
        • 8.3.4.1.1. By Value
      • 8.3.4.2. Market Share & Forecast
        • 8.3.4.2.1. By Process
        • 8.3.4.2.2. By Application
    • 8.3.5. Australia Molded Interconnect Device Market Outlook
      • 8.3.5.1. Market Size & Forecast
        • 8.3.5.1.1. By Value
      • 8.3.5.2. Market Share & Forecast
        • 8.3.5.2.1. By Process
        • 8.3.5.2.2. By Application

9. Middle East & Africa Molded Interconnect Device Market Outlook

  • 9.1. Market Size & Forecast
    • 9.1.1. By Value
  • 9.2. Market Share & Forecast
    • 9.2.1. By Process
    • 9.2.2. By Application
    • 9.2.3. By Country
  • 9.3. Middle East & Africa: Country Analysis
    • 9.3.1. Saudi Arabia Molded Interconnect Device Market Outlook
      • 9.3.1.1. Market Size & Forecast
        • 9.3.1.1.1. By Value
      • 9.3.1.2. Market Share & Forecast
        • 9.3.1.2.1. By Process
        • 9.3.1.2.2. By Application
    • 9.3.2. UAE Molded Interconnect Device Market Outlook
      • 9.3.2.1. Market Size & Forecast
        • 9.3.2.1.1. By Value
      • 9.3.2.2. Market Share & Forecast
        • 9.3.2.2.1. By Process
        • 9.3.2.2.2. By Application
    • 9.3.3. South Africa Molded Interconnect Device Market Outlook
      • 9.3.3.1. Market Size & Forecast
        • 9.3.3.1.1. By Value
      • 9.3.3.2. Market Share & Forecast
        • 9.3.3.2.1. By Process
        • 9.3.3.2.2. By Application

10. South America Molded Interconnect Device Market Outlook

  • 10.1. Market Size & Forecast
    • 10.1.1. By Value
  • 10.2. Market Share & Forecast
    • 10.2.1. By Process
    • 10.2.2. By Application
    • 10.2.3. By Country
  • 10.3. South America: Country Analysis
    • 10.3.1. Brazil Molded Interconnect Device Market Outlook
      • 10.3.1.1. Market Size & Forecast
        • 10.3.1.1.1. By Value
      • 10.3.1.2. Market Share & Forecast
        • 10.3.1.2.1. By Process
        • 10.3.1.2.2. By Application
    • 10.3.2. Colombia Molded Interconnect Device Market Outlook
      • 10.3.2.1. Market Size & Forecast
        • 10.3.2.1.1. By Value
      • 10.3.2.2. Market Share & Forecast
        • 10.3.2.2.1. By Process
        • 10.3.2.2.2. By Application
    • 10.3.3. Argentina Molded Interconnect Device Market Outlook
      • 10.3.3.1. Market Size & Forecast
        • 10.3.3.1.1. By Value
      • 10.3.3.2. Market Share & Forecast
        • 10.3.3.2.1. By Process
        • 10.3.3.2.2. By Application

11. Market Dynamics

  • 11.1. Drivers
  • 11.2. Challenges

12. Market Trends & Developments

  • 12.1. Merger & Acquisition (If Any)
  • 12.2. Product Launches (If Any)
  • 12.3. Recent Developments

13. Global Molded Interconnect Device Market: SWOT Analysis

14. Porter's Five Forces Analysis

  • 14.1. Competition in the Industry
  • 14.2. Potential of New Entrants
  • 14.3. Power of Suppliers
  • 14.4. Power of Customers
  • 14.5. Threat of Substitute Products

15. Competitive Landscape

  • 15.1. Molex LLC
    • 15.1.1. Business Overview
    • 15.1.2. Products & Services
    • 15.1.3. Recent Developments
    • 15.1.4. Key Personnel
    • 15.1.5. SWOT Analysis
  • 15.2. TE Connectivity Ltd.
  • 15.3. Amphenol Corporation
  • 15.4. HARTING Technology Group
  • 15.5. KYOCERA AVX Components Corporation
  • 15.6. LPKF Laser & Electronics AG
  • 15.7. MID Solutions GmbH
  • 15.8. TEPROSA
  • 15.9. Taoglas
  • 15.10. RTP Company

16. Strategic Recommendations

17. About Us & Disclaimer