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市場調查報告書

商品編碼

1866528

全球模塑互連裝置 (MID) 市場 - 2025-2030 年預測

Global Molded interconnect devices Market - Forecasts from 2025 to 2030

出版日期: 2025年11月06日 | 出版商:

Knowledge Sourcing Intelligence | 英文 145 Pages | 商品交期: 最快1-2個工作天內

價格

簡介目錄

預計到 2025 年，模塑互連裝置 (MID) 市場規模將達到 15.41 億美元，到 2030 年將達到 29.74 億美元，複合年成長率為 14.06%。

模塑互連裝置 (MID) 因其在各行業實現小型化和高級功能方面發揮的作用而備受關注。在家用電子電器領域，尤其是在開發中國家，智慧型手機的普及和小型化設備的趨勢正在推動市場需求。在汽車行業，車載電子設備的日益增多為 MID 製造商創造了商機，因為製造商正致力於提升用戶體驗和便利性。此外，MID 能夠支援先進醫療設備的開發，這推動了醫療保健領域的需求，展現出巨大的市場潛力。主要供應商不斷增加研發投入以推動 MID 技術發展，也將在預測期內進一步推動市場成長。然而，熟練勞動力短缺是限制市場擴張的顯著阻礙因素。

市場的主要促進因素包括MID設計靈活性，它能夠實現創新且緊湊的解決方案，以及各種應用領域對裝置小型化的持續關注。一個關鍵的阻礙因素因素是MID技術熟練專業人員的短缺，這可能會阻礙擴充性和普及。

本研究檢驗了當前市場需求、供應和銷售趨勢，以及影響醫療器材市場發展的最新動態。研究全面分析了關鍵促進因素、限制因素和機遇，並深入探討了行業趨勢、政策和區域法規，使相關人員能夠深入了解法規結構和影響市場環境的關鍵因素。

我們的競爭情報是基於廣泛的二手資料研究，旨在識別關鍵產業參與者及其收入貢獻。資訊來源包括產業協會調查、分析師報告、投資者報告、新聞稿和學術期刊。我們採用由下而上和自上而下的方法計算了整個醫療器材產業及其主要細分市場的市場規模。所有數據均透過全球醫療器材價值鏈相關人員的第一手資訊進行檢驗。我們全面的市場分析整合了各種資訊來源和專有資料集，並運用資料三角驗證技術，以提供準確的市場區隔和預測。

本市場分析報告透過分析敘述、圖表和圖形呈現，旨在有效理解全球MID市場的市場動態。主要參與者包括TE Connectivity、LPKF Laser & Electronics、LANXESS、Multiple Dimensions AG等。

本報告為業內人士提供關於市場趨勢、監管環境和競爭動態的關鍵洞察。報告重點闡述了小型化趨勢、汽車技術進步和醫療設備創新帶來的成長機遇，同時也探討了技術純熟勞工短缺帶來的挑戰。報告採用嚴謹的調查方法，結合一手和二手數據，確保了洞察的可靠性，使相關人員能夠妥善應對複雜的監管環境、競爭壓力和投資重點，從而在一個透過技術創新和不斷拓展的應用領域實現成長的市場中佔據有利地位。

本報告的主要優勢：

深入分析：取得以客戶群、政府政策和社會經濟因素、消費者偏好、垂直產業和其他細分市場為重點的深入市場洞察，涵蓋主要地區和新興地區。
競爭格局：了解主要企業採取的策略舉措，並了解透過正確的策略打入市場的潛力。
市場促進因素與未來趨勢：探索動態因素和關鍵市場趨勢，以及它們將如何塑造未來的市場發展。
可執行的建議：利用洞察力為策略決策提供訊息，從而在動態環境中開拓新的業務管道和收入來源。
受眾範圍廣：對新興企業、研究機構、顧問公司、中小企業和大型企業都有益處且經濟高效。

它是用來做什麼的？

產業與市場洞察、商業機會評估、產品需求預測、打入市場策略、地理擴張、資本投資決策、法律規範及其影響、新產品開發、競爭影響

分析範圍

歷史資料（2022-2024 年）和預測資料（2025-2030 年）
成長機會、挑戰、供應鏈前景、法規結構、客戶行為和趨勢分析
競爭對手定位、策略和市場佔有率分析
按業務板塊和地區（國家）分類的收入成長和預測分析
公司概況（策略、產品、財務資訊、關鍵趨勢等）

介紹
北美洲
- 透過流程
- 依產品類型
- 透過使用
- 按國家/地區
  - 美國
  - 加拿大
  - 墨西哥
南美洲
- 透過流程
- 依產品類型
- 透過使用
- 按國家/地區
  - 巴西
  - 阿根廷
  - 其他
歐洲
- 透過流程
- 依產品類型
- 透過使用
- 按國家/地區
  - 英國
  - 德國
  - 法國
  - 義大利
  - 其他
中東和非洲
- 透過流程
- 依產品類型
- 透過使用
- 按國家/地區
  - 沙烏地阿拉伯
  - 阿拉伯聯合大公國
  - 其他
亞太地區
- 透過流程
- 依產品類型
- 透過使用
- 按國家/地區
  - 日本
  - 中國
  - 印度
  - 韓國
  - 台灣
  - 其他

第9章：競爭格局與分析

主要企業和策略分析
市佔率分析
企業合併、協議、商業合作
競爭對手儀錶板

第10章：公司簡介

TE Connectivity Ltd.
LPFK Laser and Electronics AG
Molex, LLC
MID Solutions GmbH
Lanxess AG
MacDermid, Inc.
RTP Company
Smart Plastic Products（S2P）
Harting Technology Group
Cicor Management AG
Amphenol Corporation

第11章分析方法

簡介目錄

Product Code: KSI061611939

The Molded Interconnect Devices Market is anticipated to increase from USD 1.541 billion in 2025 to USD 2.974 billion by 2030, registering a 14.06% CAGR.

Molded interconnect devices (MIDs) are gaining traction due to their role in enabling miniaturization and advanced functionality across industries. The consumer electronics sector, particularly in developing economies, drives demand through widespread smartphone adoption and the trend toward compact devices. In the automotive industry, manufacturers' focus on enhancing user experience and convenience has increased in-vehicle electronic content, creating revenue opportunities for MID manufacturers. Additionally, MIDs' ability to support the development of sophisticated medical devices bolsters their demand in the healthcare sector, presenting significant market potential. Rising research and development investments by key vendors to advance MID technology further propel market growth over the forecast period. However, a shortage of skilled labor poses a notable constraint on market expansion.

Key market drivers include the flexibility of MID design, which allows for innovative and compact solutions, and the ongoing emphasis on device miniaturization across applications. The primary restraint is the limited availability of skilled professionals capable of working with MID technology, which may hinder scalability and adoption.

This research examines current trends in demand, supply, and sales, alongside recent developments shaping the MID market. It provides a comprehensive analysis of key drivers, restraints, and opportunities. The study details industry trends, policies, and regulations across geographical regions, offering stakeholders a thorough understanding of the regulatory framework and critical factors influencing the market environment.

Competitive intelligence identifies major industry players and their revenue contributions, derived from extensive secondary research. Sources include industry association studies, analyst reports, investor presentations, press releases, and journals. Market size for the overall MID sector and its key segments was determined using both bottom-up and top-down methodologies. Values were validated with primary inputs from stakeholders in the global MID value chain. Comprehensive market engineering integrated data from diverse sources and proprietary datasets, employing data triangulation for accurate market breakdown and forecasting.

Market insights are presented through analytical narratives, charts, and graphics, enabling efficient comprehension of global MID market dynamics. Key players profiled include TE Connectivity, LPKF Laser and Electronics, Lanxess, and Multiple Dimensions AG, among others.

This report equips industry experts with critical insights into market trends, regulatory landscapes, and competitive dynamics. It highlights growth opportunities driven by miniaturization trends, automotive advancements, and medical device innovations, while addressing challenges related to skilled labor shortages. The rigorous methodology, blending primary and secondary data, ensures reliable findings, enabling stakeholders to navigate regulatory complexities, competitive pressures, and investment priorities in a market poised for growth through technological innovation and expanding applications.

Key Benefits of this Report:

Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

Historical data from 2022 to 2024 & forecast data from 2025 to 2030
Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
Competitive Positioning, Strategies, and Market Share Analysis
Revenue Growth and Forecast Assessment of segments and regions including countries
Company Profiling (Strategies, Products, Financial Information, and Key Developments among others.

Segmentation

By Process

Laser Direct Structuring
2-shot molding
Film Techniques

By Product Type

Antennae and Connectivity Modules
Sensors
Connectors and Switches
Lighting
Others

By Application

Telecommunication
Consumer Electronics
Automotive
Medical Devices
Others

By Geography

North America
United States
Canada
Mexico
South America
Brazil
Argentina
Others
Europe
United Kingdom
Germany
France
Italy
Others
Middle East & Africa
Saudi Arabia
UAE
Others
Asia Pacific
Japan
China
India
South Korea
Taiwan
Others

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

2.1. Market Overview
2.2. Market Definition
2.3. Scope of the Study
2.4. Market Segmentation

3. BUSINESS LANDSCAPE

3.1. Market Drivers
3.2. Market Restraints
3.3. Market Opportunities
3.4. Porter's Five Forces Analysis
3.5. Industry Value Chain Analysis
3.6. Policies and Regulations
3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. MOLDED INTERCONNECT DEVICES MARKET BY PROCESS

5.1. Introduction
5.2. Laser Direct Structuring
5.3. 2-shot molding
5.4. Film Techniques

6. MOLDED INTERCONNECT DEVICES MARKET BY PRODUCT TYPE

6.1. Introduction
6.2. Antennae and Connectivity Modules
6.3. Sensors
6.4. Connectors and Switches
6.5. Lighting
6.6. Others

7. MOLDED INTERCONNECT DEVICES MARKET BY APPLICATION

7.1. Introduction
7.2. Telecommunication
7.3. Consumer Electronics
7.4. Automotive
7.5. Medical Devices
7.6. Others
7.7. Manufacturers
7.8. Others

8. MOLDED INTERCONNECT DEVICES MARKET BY GEOGRAPHY

8.1. Introduction
8.2. North America
- 8.2.1. By Process
- 8.2.2. By Product Type
- 8.2.3. By Application
- 8.2.4. By Country
  - 8.2.4.1. United States
  - 8.2.4.2. Canada
  - 8.2.4.3. Mexico
8.3. South America
- 8.3.1. By Process
- 8.3.2. By Product Type
- 8.3.3. By Application
- 8.3.4. By Country
  - 8.3.4.1. Brazil
  - 8.3.4.2. Argentina
  - 8.3.4.3. Others
8.4. Europe
- 8.4.1. By Process
- 8.4.2. By Product Type
- 8.4.3. By Application
- 8.4.4. By Country
  - 8.4.4.1. United Kingdom
  - 8.4.4.2. Germany
  - 8.4.4.3. France
  - 8.4.4.4. Italy
  - 8.4.4.5. Others
8.5. Middle East & Africa
- 8.5.1. By Process
- 8.5.2. By Product Type
- 8.5.3. By Application
- 8.5.4. By Country
  - 8.5.4.1. Saudi Arabia
  - 8.5.4.2. UAE
  - 8.5.4.3. Others
8.6. Asia Pacific
- 8.6.1. By Process
- 8.6.2. By Product Type
- 8.6.3. By Application
- 8.6.4. By Country
  - 8.6.4.1. Japan
  - 8.6.4.2. China
  - 8.6.4.3. India
  - 8.6.4.4. South Korea
  - 8.6.4.5. Taiwan
  - 8.6.4.6. Others