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2031 年歐洲 3D 堆疊市場預測 - 按互連技術、設​​備類型和最終用戶進行的區域分析
市場調查報告書
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1764908

2031 年歐洲 3D 堆疊市場預測 - 按互連技術、設​​備類型和最終用戶進行的區域分析

Europe 3D Stacking Market Forecast to 2031 - Regional Analysis by Interconnecting Technology, Device Type, and End User
出版日期: | 出版商: The Insight Partners | 英文 179 Pages | 訂單完成後即時交付

價格

2023 年歐洲 3D 堆疊市場價值為 3.9861 億美元，預計到 2031 年將達到 12.577 億美元；預計 2023 年至 2031 年的複合年成長率為 15.4%。

異質整合和組件最佳化的日益普及推動了歐洲 3D 堆疊市場的發展

異質整合和組件最佳化在改進電子元件製造流程方面的應用日益廣泛，這是推動 3D 堆疊市場發展的主要因素。這種方法允許將晶片堆疊在基板上，從而在更小、更節能的封裝中創建晶片。 3D 堆疊技術允許使用各種方法和晶圓類型來創建電路層，從而實現異質整合。與單晶圓生產相比，這種巨大的靈活性使製造商能夠顯著最佳化單個組件。這支援製造商設計出滿足特定要求的電子元件，並實現精確度和客製化，這在以前是無法實現的。異質整合和組件最佳化涉及將多種技術整合到一個複合設備中，其中可能包括晶片和封裝的堆疊；使用多種半導體材料；以及採用各種電氣佈線技術，例如球柵陣列、矽通孔 (TSV)、中介層和引線鍵合。

歐洲3D堆疊市場概覽

晶片對於各種科技和數位產品至關重要，例如家用電器、智慧汽車和消費性電子產品。 《歐盟晶片法案》旨在增強歐洲半導體生態系統。該法案旨在促進歐洲半導體產業與亞太地區和北美公司之間的競爭。該地區的半導體產業需要提升規模並增強創新能力，才能獲得競爭優勢。此外，該地區各國政府正在投資半導體研發。例如，2024年2月，半導體聯合計畫（Chips JU）宣布啟動2.16億美元的計畫徵集，以支持半導體領域的創新和研究計畫。 3D堆疊技術廣泛應用於半導體和記憶體製造。 3D混合鍵結代表了半導體技術的重大進步，在電氣性能、機械強度、設計靈活性和空間效率方面具有顯著優勢。歐洲的電子設備（包括筆記型電腦、智慧型手機和其他穿戴式裝置）正在快速普及。歐洲大多數人口擁有並使用這些設備。隨著人們越來越依賴科技來完成多項任務，對智慧型手機和筆記型電腦的需求也持續成長。筆記型電腦主要用於存取網際網路、參與線上活動以及執行日常任務。歐洲眾多市場參與者正在增加這些設備的產量。宏碁於2023年1月推出了搭載第13代英特爾酷睿處理器的新款Acer Aspire 5筆記型電腦。該處理器與NVIDIA GeForce RTX 2050顯示卡搭配使用，可提高影片編輯等任務或其他可從額外GPU效能中受益的任務的效率。 2022年2月，諾基亞在歐洲推出了G11和G21智慧型手機。 3D堆疊記憶體用於滿足現代行動裝置的高容量和效能要求。智慧手錶、健身追蹤器和其他穿戴式裝置受益於3D堆疊技術，因為它將多種功能整合在一個緊湊的外形中，包括感測器、處理器和記憶體。因此，隨著電子產業的蓬勃發展，該地區對3D堆疊的需求正在成長。

歐洲 3D 堆疊市場收入及預測（至 2031 年）（百萬美元）

歐洲3D堆疊市場細分

歐洲 3D 堆疊市場分為互連技術、設​​備類型、最終用戶和國家。

根據互連技術，歐洲3D堆疊市場細分為矽通孔互連、單晶片3D整合和3D混合鍵結。矽通孔互連在2023年佔據了最大的市場。

按設備類型分類，歐洲3D堆疊市場細分為儲存設備、微機電系統/感測器、LED、成像和光電子裝置以及其他。儲存設備領域在2023年佔據了最大的市場佔有率。

從終端用戶來看，歐洲3D堆疊市場細分為消費性電子、電信、汽車、製造、醫療保健等。消費性電子領域在2023年佔據了最大的市場。

按國家/地區分類，歐洲 3D 堆疊市場分為英國、德國、法國、義大利、俄羅斯和歐洲其他地區。 2023 年，德國佔據了歐洲 3D 堆疊市場佔有率的主導地位。

台灣半導體製造有限公司、三星電子有限公司、英特爾公司、聯發科技公司、德州儀器公司、安靠科技公司、日月光科技控股有限公司、超微半導體公司、3M 公司和格芯公司是歐洲 3D 堆疊市場的一些領先公司。

目錄

第1章：簡介

第2章：執行摘要

  • 關鍵見解
  • 市場吸引力

第3章：研究方法

  • 二次研究
  • 初步研究
    • 假設表述：
    • 宏觀經濟因素分析：
    • 顯影基數：
    • 數據三角測量：
    • 國家級資料：

第4章：3D堆疊市場格局

  • 概述
  • PEST分析
  • 生態系分析
    • 價值鏈中的供應商列表

第5章：歐洲 3D 堆疊市場 - 主要市場動態

  • 3D堆疊市場－關鍵市場動態
  • 市場促進因素
    • 消費性電子產品需求不斷成長
    • 異質整合和組件最佳化的使用日益增多
  • 市場限制
    • 3D堆疊技術的複雜性
  • 市場機會
    • 高頻寬記憶體需求激增
  • 未來趨勢
    • 用於遊戲的快速處理器
  • 促進因素和限制因素的影響：

第6章：3D堆疊市場 - 歐洲分析

  • 歐洲3D堆疊市場概覽-
  • 2021-2031年歐洲3D堆疊市場收入
  • 歐洲3D堆疊市場預測分析

第7章：歐洲3D堆疊市場分析-按互連技術

  • 矽通孔
  • 單晶片3D整合
  • 3D混合鍵合

第8章：歐洲 3D 堆疊市場分析 - 按設備類型

  • 儲存裝置
  • MEMS/感測器
  • 發光二極體
  • 成像與光電子學
  • 其他

第9章：歐洲 3D 堆疊市場分析 - 按最終用戶

  • 消費性電子產品
  • 電信
  • 汽車
  • 製造業
  • 衛生保健
  • 其他

第10章：歐洲 3D 堆疊市場 - 國家分析

  • 歐洲
    • 英國
    • 德國
    • 法國
    • 義大利
    • 俄羅斯
    • 歐洲其他地區

第 11 章：競爭格局

  • 關鍵參與者的熱圖分析
  • 公司定位與集中度

第 12 章：產業格局

  • 概述
  • 市場計劃
  • 產品開發

第13章：公司簡介

  • Taiwan Semiconductor Manufacturing Co Ltd
  • Samsung Electronics Co Ltd
  • Intel Corp
  • MediaTek Inc
  • Texas Instruments Inc
  • Amkor Technology Inc
  • ASE Technology Holding Co Ltd
  • Advanced Micro Devices Inc
  • 3M Co
  • Globalfoundries Inc

第 14 章：附錄

Product Code: BMIRE00031568

The Europe 3D stacking market was valued at US$ 398.61 million in 2023 and is expected to reach US$ 1,257.70 million by 2031; it is expected to record a CAGR of 15.4% from 2023 to 2031.

Increasing Use of Heterogeneous Integration and Component Optimization Drives Europe 3D Stacking Market

The increasing use of heterogeneous integration and component optimization to improve the manufacturing of electronic components is a major factor driving the 3D stacking market. This approach allows for the stacking of dies on a substrate, creating chips in packages that are smaller and more energy-efficient. 3D stacking technology allows heterogeneous integration by allowing circuit layers to be created using various methods and wafer types. This tremendous flexibility allows manufacturers to significantly optimize individual components when compared to single-wafer production. This supports manufacturers in designing electrical components that meet specific requirements with precision and customization, which was previously unattainable. Heterogeneous integration and component optimization involve integrating diverse technologies into a composite device, which might include stacking of chips and packages; using multiple semiconductor materials; and employing various electrical routing techniques such as ball grid arrays, through-silicon vias (TSVs), interposers, and wire bonding.

Europe 3D Stacking Market Overview

Chips are critical for a wide range of technological and digital products, such as household appliances, smart cars, and consumer electronics. The EU Chips Act aims to boost the ecosystem for semiconductors in Europe. The act supports the target to promote competition between the semiconductor industry in Europe with companies from APAC and North America. The semiconductor industry in the region needs to upscale and become more innovative to gain a competitive edge. Also, governments of various countries in the region are investing in research and development in semiconductors. For instance, in February 2024, the Semiconductor Joint Undertaking (Chips JU) announced the launch of US$ 216 million in calls for proposals to support innovation and research initiatives in the fields of semiconductors. 3D stacking technology is widely utilized in semiconductor and memory manufacturing. 3D hybrid bonding represents a significant advancement in semiconductor technology, providing substantial benefits in terms of electrical performance, mechanical strength, design flexibility, and space efficiency. Europe is experiencing a high penetration rate of electronic devices, including laptops, smartphones, and other wearable devices. A majority portion of the population in European countries owns and uses these devices. The need for smartphones and laptops continues to rise as people increasingly rely on technology for multiple tasks. Laptops are primarily used to access the internet, engage in online activities, and perform daily tasks. Numerous market players in Europe are increasing the production of these devices. Acer launched a new Acer Aspire 5 laptop, powered by a 13th-generation Intel Core processor, in January 2023. The processor is paired with Nvidia GeForce RTX 2050 graphics to boost the productivity of tasks such as video editing or other tasks that can benefit from the extra GPU power. In February 2022, Nokia launched the G11 and G21 smartphones in Europe. 3D stacked memory is used to meet the high capacity and performance requirements of modern mobile devices. Smartwatches, fitness trackers, and other wearables benefit from 3D stacking by integrating multiple functionalities in a compact form factor, including sensors, processors, and memory. Therefore, the demand for 3D stacking is increasing in the region, with the presence of a growing electronic industry.

Europe 3D Stacking Market Revenue and Forecast to 2031 (US$ Million)

Europe 3D Stacking Market Segmentation

The Europe 3D stacking market is categorized into interconnecting technology, device type, end user, and country.

Based on interconnecting technology, the Europe 3D stacking market is segmented into through-silicon via, monolithic 3D integration, and 3D hybrid bonding. The through-silicon via segment held the largest market share in 2023.

By device type, the Europe 3D stacking market is segmented into memory devices, mems/sensors, LEDs, imaging & optoelectronics, and others. The memory devices segment held the largest market share in 2023.

In the terms of end user, the Europe 3D stacking market is segmented into consumer electronics, telecommunication, automotive, manufacturing, healthcare, and others. The consumer electronics segment held the largest market share in 2023.

By country, the Europe 3D stacking market is segmented into the UK, Germany, France, Italy, Russia, and the Rest of Europe. Germany dominated the Europe 3D stacking market share in 2023.

Taiwan Semiconductor Manufacturing Co Ltd; Samsung Electronics Co Ltd; Intel Corp; MediaTek Inc.; Texas Instruments Inc; Amkor Technology Inc; ASE Technology Holding Co Ltd; Advanced Micro Devices Inc.; 3M Co.; and Globalfoundries Inc are some of the leading companies operating in the Europe 3D stacking market.

Table Of Contents

1. Introduction

  • 1.1 The Insight Partners Research Report Guidance
  • 1.2 Market Segmentation

2. Executive Summary

  • 2.1 Key Insights
  • 2.2 Market Attractiveness

3. Research Methodology

  • 3.1 Secondary Research
  • 3.2 Primary Research
    • 3.2.1 Hypothesis formulation:
    • 3.2.2 Macro-economic factor analysis:
    • 3.2.3 Developing base number:
    • 3.2.4 Data Triangulation:
    • 3.2.5 Country level data:

4. 3D Stacking Market Landscape

  • 4.1 Overview
  • 4.2 PEST Analysis
  • 4.3 Ecosystem Analysis
    • 4.3.1 List of Vendors in the Value Chain

5. Europe 3D Stacking Market - Key Market Dynamics

  • 5.1 3D Stacking Market - Key Market Dynamics
  • 5.2 Market Drivers
    • 5.2.1 Rising Demand for Consumer Electronics
    • 5.2.2 Increasing Use of Heterogeneous Integration and Component Optimization
  • 5.3 Market Restraints
    • 5.3.1 Complexity Associated with 3D Stacking Technology
  • 5.4 Market Opportunities
    • 5.4.1 Surge in Demand for High-Bandwidth Memory
  • 5.5 Future Trends
    • 5.5.1 Fast Processors for Gaming Purposes
  • 5.6 Impact of Drivers and Restraints:

6. 3D Stacking Market - Europe Analysis

  • 6.1 Europe 3D Stacking Market Overview-
  • 6.2 Europe 3D Stacking Market Revenue (US$ Million), 2021-2031
  • 6.3 Europe 3D Stacking Market Forecast Analysis

7. Europe 3D Stacking Market Analysis - by Interconnecting Technology

  • 7.1 Through-Silicon Via
    • 7.1.1 Overview
    • 7.1.2 Through-Silicon Via: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 7.2 Monolithic 3D Integration
    • 7.2.1 Overview
    • 7.2.2 Monolithic 3D Integration: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 7.3 3D Hybrid Bonding
    • 7.3.1 Overview
    • 7.3.2 3D Hybrid Bonding: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)

8. Europe 3D Stacking Market Analysis - by Device Type

  • 8.1 Memory Devices
    • 8.1.1 Overview
    • 8.1.2 Memory Devices: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 8.2 MEMS/Sensors
    • 8.2.1 Overview
    • 8.2.2 MEMS/Sensors: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 8.3 LEDs
    • 8.3.1 Overview
    • 8.3.2 LEDs: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 8.4 Imaging and Optoelectronics
    • 8.4.1 Overview
    • 8.4.2 Imaging and Optoelectronics: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 8.5 Others
    • 8.5.1 Overview
    • 8.5.2 Others: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)

9. Europe 3D Stacking Market Analysis - by End User

  • 9.1 Consumer Electronics
    • 9.1.1 Overview
    • 9.1.2 Consumer Electronics: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 9.2 Telecommunication
    • 9.2.1 Overview
    • 9.2.2 Telecommunication: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 9.3 Automotive
    • 9.3.1 Overview
    • 9.3.2 Automotive: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 9.4 Manufacturing
    • 9.4.1 Overview
    • 9.4.2 Manufacturing: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 9.5 Healthcare
    • 9.5.1 Overview
    • 9.5.2 Healthcare: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 9.6 Others
    • 9.6.1 Overview
    • 9.6.2 Others: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)

10. Europe 3D Stacking Market -Country Analysis

  • 10.1 Europe
    • 10.1.1 Europe: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
    • 10.1.2 Europe: 3D Stacking Market - Revenue and Forecast Analysis - by Country
      • 10.1.2.1 Europe: 3D Stacking Market - Revenue and Forecast Analysis - by Country
      • 10.1.2.2 United Kingdom: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
        • 10.1.2.2.1 United Kingdom: 3D Stacking Market Breakdown, by Interconnecting Technology
        • 10.1.2.2.2 United Kingdom: 3D Stacking Market Breakdown, by Device Type
        • 10.1.2.2.3 United Kingdom: 3D Stacking Market Breakdown, by End User
      • 10.1.2.3 Germany: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
        • 10.1.2.3.1 Germany: 3D Stacking Market Breakdown, by Interconnecting Technology
        • 10.1.2.3.2 Germany: 3D Stacking Market Breakdown, by Device Type
        • 10.1.2.3.3 Germany: 3D Stacking Market Breakdown, by End User
      • 10.1.2.4 France: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
        • 10.1.2.4.1 France: 3D Stacking Market Breakdown, by Interconnecting Technology
        • 10.1.2.4.2 France: 3D Stacking Market Breakdown, by Device Type
        • 10.1.2.4.3 France: 3D Stacking Market Breakdown, by End User
      • 10.1.2.5 Italy: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
        • 10.1.2.5.1 Italy: 3D Stacking Market Breakdown, by Interconnecting Technology
        • 10.1.2.5.2 Italy: 3D Stacking Market Breakdown, by Device Type
        • 10.1.2.5.3 Italy: 3D Stacking Market Breakdown, by End User
      • 10.1.2.6 Russia: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
        • 10.1.2.6.1 Russia: 3D Stacking Market Breakdown, by Interconnecting Technology
        • 10.1.2.6.2 Russia: 3D Stacking Market Breakdown, by Device Type
        • 10.1.2.6.3 Russia: 3D Stacking Market Breakdown, by End User
      • 10.1.2.7 Rest of Europe: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
        • 10.1.2.7.1 Rest of Europe: 3D Stacking Market Breakdown, by Interconnecting Technology
        • 10.1.2.7.2 Rest of Europe: 3D Stacking Market Breakdown, by Device Type
        • 10.1.2.7.3 Rest of Europe: 3D Stacking Market Breakdown, by End User

11. Competitive Landscape

  • 11.1 Heat Map Analysis by Key Players
  • 11.2 Company Positioning & Concentration

12. Industry Landscape

  • 12.1 Overview
  • 12.2 Market Initiative
  • 12.3 Product Development

13. Company Profiles

  • 13.1 Taiwan Semiconductor Manufacturing Co Ltd
    • 13.1.1 Key Facts
    • 13.1.2 Business Description
    • 13.1.3 Products and Services
    • 13.1.4 Financial Overview
    • 13.1.5 SWOT Analysis
    • 13.1.6 Key Developments
  • 13.2 Samsung Electronics Co Ltd
    • 13.2.1 Key Facts
    • 13.2.2 Business Description
    • 13.2.3 Products and Services
    • 13.2.4 Financial Overview
    • 13.2.5 SWOT Analysis
    • 13.2.6 Key Developments
  • 13.3 Intel Corp
    • 13.3.1 Key Facts
    • 13.3.2 Business Description
    • 13.3.3 Products and Services
    • 13.3.4 Financial Overview
    • 13.3.5 SWOT Analysis
    • 13.3.6 Key Developments
  • 13.4 MediaTek Inc
    • 13.4.1 Key Facts
    • 13.4.2 Business Description
    • 13.4.3 Products and Services
    • 13.4.4 Financial Overview
    • 13.4.5 SWOT Analysis
    • 13.4.6 Key Developments
  • 13.5 Texas Instruments Inc
    • 13.5.1 Key Facts
    • 13.5.2 Business Description
    • 13.5.3 Products and Services
    • 13.5.4 Financial Overview
    • 13.5.5 SWOT Analysis
    • 13.5.6 Key Developments
  • 13.6 Amkor Technology Inc
    • 13.6.1 Key Facts
    • 13.6.2 Business Description
    • 13.6.3 Products and Services
    • 13.6.4 Financial Overview
    • 13.6.5 SWOT Analysis
    • 13.6.6 Key Developments
  • 13.7 ASE Technology Holding Co Ltd
    • 13.7.1 Key Facts
    • 13.7.2 Business Description
    • 13.7.3 Products and Services
    • 13.7.4 Financial Overview
    • 13.7.5 SWOT Analysis
    • 13.7.6 Key Developments
  • 13.8 Advanced Micro Devices Inc
    • 13.8.1 Key Facts
    • 13.8.2 Business Description
    • 13.8.3 Products and Services
    • 13.8.4 Financial Overview
    • 13.8.5 SWOT Analysis
    • 13.8.6 Key Developments
  • 13.9 3M Co
    • 13.9.1 Key Facts
    • 13.9.2 Business Description
    • 13.9.3 Products and Services
    • 13.9.4 Financial Overview
    • 13.9.5 SWOT Analysis
    • 13.9.6 Key Developments
  • 13.10 Globalfoundries Inc
    • 13.10.1 Key Facts
    • 13.10.2 Business Description
    • 13.10.3 Products and Services
    • 13.10.4 Financial Overview
    • 13.10.5 SWOT Analysis
    • 13.10.6 Key Developments

14. Appendix

  • 14.1 About The Insight Partners
  • 14.2 Word Index

List Of Tables

  • Table 1. 3D Stacking Market Segmentation
  • Table 2. List of Vendors
  • Table 3. 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Table 4. 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Interconnecting Technology
  • Table 5. 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Device Type
  • Table 6. 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by End User
  • Table 7. Europe: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Country
  • Table 8. United Kingdom: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Interconnecting Technology
  • Table 9. United Kingdom: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Device Type
  • Table 10. United Kingdom: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by End User
  • Table 11. Germany: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Interconnecting Technology
  • Table 12. Germany: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Device Type
  • Table 13. Germany: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by End User
  • Table 14. France: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Interconnecting Technology
  • Table 15. France: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Device Type
  • Table 16. France: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by End User
  • Table 17. Italy: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Interconnecting Technology
  • Table 18. Italy: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Device Type
  • Table 19. Italy: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by End User
  • Table 20. Russia: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Interconnecting Technology
  • Table 21. Russia: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Device Type
  • Table 22. Russia: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by End User
  • Table 23. Rest of Europe: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Interconnecting Technology
  • Table 24. Rest of Europe: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Device Type
  • Table 25. Rest of Europe: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by End User
  • Table 26. List of Abbreviation

List Of Figures

  • Figure 1. 3D Stacking Market Segmentation, by Country
  • Figure 2. PEST Analysis
  • Figure 3. Impact Analysis of Drivers and Restraints
  • Figure 4. 3D Stacking Market Revenue (US$ Million), 2021-2031
  • Figure 5. 3D Stacking Market Share (%) - by Interconnecting Technology (2023 and 2031)
  • Figure 6. Through-Silicon Via: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 7. Monolithic 3D Integration: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 8. 3D Hybrid Bonding: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 9. 3D Stacking Market Share (%) - by Device Type (2023 and 2031)
  • Figure 10. Memory Devices: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 11. MEMS/Sensors: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 12. LEDs: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 13. Imaging and Optoelectronics: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 14. Others: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 15. 3D Stacking Market Share (%) - by End User (2023 and 2031)
  • Figure 16. Consumer Electronics: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 17. Telecommunication: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 18. Automotive: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 19. Manufacturing: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 20. Healthcare: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 21. Others: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 22. Europe: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 23. Europe: 3D Stacking Market Breakdown, by Key Countries, 2023 and 2031 (%)
  • Figure 24. United Kingdom: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 25. Germany: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 26. France: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 27. Italy: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 28. Russia: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 29. Rest of Europe: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 30. Heat Map Analysis by Key Players
  • Figure 31. Company Positioning & Concentration