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2031 年北美 3D 堆疊市場預測 - 按互連技術、設​​備類型和最終用戶進行的區域分析
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1764901

2031 年北美 3D 堆疊市場預測 - 按互連技術、設​​備類型和最終用戶進行的區域分析

North America 3D Stacking Market Forecast to 2031 - Regional Analysis by Interconnecting Technology, Device Type, and End User
出版日期: | 出版商: The Insight Partners | 英文 110 Pages | 訂單完成後即時交付

價格

2023 年北美 3D 堆疊市場價值為 5.3848 億美元，預計到 2031 年將達到 19.0441 億美元；預計 2023 年至 2031 年複合年成長率將達到 17.1%。

消費性電子產品需求成長推動北美3D堆疊市場

隨著智慧型手機、平板電腦、智慧型手錶和攜帶式設備等外觀時尚、功能豐富且節能的電子產品需求日益成長，製造商面臨著提供緊湊型高性能解決方案的巨大壓力。例如，據估計，2023年第四季智慧型手機的初步出貨量為3.28億部，較2022年第四季成長8.6%，成為自2021年第二季以來首次大幅成長的季度。全球消費者正廣泛使用智慧型手機進行購物、通訊、娛樂和其他用途。這些設備採用3D堆疊晶片封裝，這正在徹底改變其設計和功能。 3D堆疊晶片封裝能夠在不影響效能的情況下顯著縮小尺寸。透過垂直堆疊多層積體電路，該技術能夠在緊湊的空間內平滑整合各種組件。這種整合不僅簡化了設計和組裝流程，還使製造商能夠打造更輕薄、更美觀的設備，以滿足消費者不斷變化的偏好。

透過 3D 堆疊晶片封裝實現的增強性能在滿足現代消費性電子產品日益成長的性能需求方面發揮著重要作用。從智慧型手機的高級影像處理到智慧型手錶的即時資料分析，對高效且強大的半導體解決方案的需求至關重要。透過利用 3D 堆疊技術，製造商可以以垂直互連的方式整合記憶體、邏輯和感測器組件，從而在保持緊湊外形的同時增強處理能力。因此，對採用 3D 堆疊技術的消費性電子產品的需求不斷成長，正在推動北美 3D 堆疊市場規模的不斷成長。

北美3D堆疊市場概覽

消費性電子產業的蓬勃發展是北美 3D 堆疊市場的重要驅動力。隨著消費者追求更小巧、更便攜的電子設備，對記憶體等緊湊高效電源的需求也顯著成長。此外，物聯網和智慧型裝置的普及是推動北美 3D 堆疊市場發展的另一個關鍵因素。物聯網設備（包括穿戴式裝置、感測器和連網裝置）依賴小巧可靠的電源。智慧手錶、健身追蹤器和其他穿戴式裝置受益於 3D 堆疊技術，因為它將感測器、處理器和記憶體等多種功能整合在一個緊湊的外形中。 3D 堆疊組件降低的功耗延長了穿戴式裝置的電池壽命。

物聯網設備在醫療保健和汽車等各行各業的日益普及，為3D堆疊供應商創造了巨大的機會。此外，北美對MEMS和感測器需求的成長也為從事晶片、晶圓和覆晶鍵合機製造的市場領導者創造了機遇，從而推動了3D堆疊的需求。汽車和電子設備使用率的提高刺激了對MEMS感測器的需求，預計這將在預測期內推動北美3D堆疊市場的發展。

北美 3D 堆疊市場收入及預測（至 2031 年）（百萬美元）

北美3D堆疊市場細分

北美 3D 堆疊市場分為互連技術、設​​備類型、最終用戶和國家。

根據互連技術，北美3D堆疊市場細分為矽通孔互連、單晶片3D整合和3D混合鍵結。矽通孔互連在2023年佔據了最大的市場。

按設備類型分類，北美3D堆疊市場細分為儲存設備、微機電系統/感測器、LED、成像和光電子裝置以及其他。儲存設備領域在2023年佔據了最大的市場佔有率。

從終端用戶來看，北美3D堆疊市場細分為消費性電子、電信、汽車、製造、醫療保健等。消費性電子領域在2023年佔據了最大的市場。

按國家/地區分類，北美 3D 堆疊市場分為美國、加拿大和墨西哥。 2023 年，美國佔據了北美 3D 堆疊市場佔有率的主導地位。

台灣半導體製造有限公司、三星電子有限公司、英特爾公司、聯發科技公司、德州儀器公司、安靠科技公司、日月光科技控股有限公司、超微半導體公司、3M 公司和格芯公司是北美 3D 堆疊市場的一些領先公司。

目錄

第1章：簡介

第2章：執行摘要

  • 關鍵見解
  • 市場吸引力

第3章：研究方法

  • 二次研究
  • 初步研究
    • 假設表述：
    • 宏觀經濟因素分析：
    • 顯影基數：
    • 數據三角測量：
    • 國家級資料：

第4章：北美 3D 堆疊市場格局

  • 概述
  • PEST分析
  • 生態系分析
    • 價值鏈中的供應商列表

第5章：北美 3D 堆疊市場 - 主要市場動態

  • 3D堆疊市場－關鍵市場動態
  • 市場促進因素
    • 消費性電子產品需求不斷成長
    • 異質整合和組件最佳化的使用日益增多
  • 市場限制
    • 3D堆疊技術的複雜性
  • 市場機會
    • 高頻寬記憶體需求激增
  • 未來趨勢
    • 用於遊戲的快速處理器
  • 促進因素和限制因素的影響：

第6章：3D堆疊市場-北美市場分析

  • 北美3D堆疊市場概況-
  • 2021-2031年北美3D堆疊市場收入
  • 北美3D堆疊市場預測分析

第7章：北美3D堆疊市場分析-按互連技術

  • 矽通孔
  • 單晶片3D整合
  • 3D混合鍵合

第8章：北美 3D 堆疊市場分析 - 按設備類型

  • 儲存裝置
  • MEMS/感測器
  • 發光二極體
  • 成像與光電子學
  • 其他

第9章：北美 3D 堆疊市場分析 - 按最終用戶

  • 消費性電子產品
  • 電信
  • 汽車
  • 製造業
  • 衛生保健
  • 其他

第10章：北美 3D 堆疊市場 - 國家分析

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥

第 11 章：競爭格局

  • 關鍵參與者的熱圖分析
  • 公司定位與集中度

第 12 章：產業格局

  • 概述
  • 市場計劃
  • 產品開發

第13章：公司簡介

  • Taiwan Semiconductor Manufacturing Co Ltd
  • Samsung Electronics Co Ltd
  • Intel Corp
  • MediaTek Inc
  • Texas Instruments Inc
  • Amkor Technology Inc
  • ASE Technology Holding Co Ltd
  • Advanced Micro Devices Inc
  • 3M Co
  • Globalfoundries Inc

第 14 章：附錄

Product Code: BMIRE00031567

The North America 3D stacking market was valued at US$ 538.48 million in 2023 and is expected to reach US$ 1,904.41 million by 2031; it is anticipated to reach a CAGR of 17.1% from 2023 to 2031.

Rising Demand for Consumer Electronics Fuels North America 3D Stacking Market

The proliferating demand for sleek, feature-rich, and power-efficient gadgets such as smartphones, tablets, smartwatches, and portable devices has led to immense pressure on manufacturers to deliver compact, high-performance solutions. For instance, according to estimates, the preliminary shipment of smartphones was 328 million units in the fourth quarter of 2023. This represents 8.6% gain over 4Q22, establishing 4Q23 as the first quarter to show major growth since 2Q21. Consumers across the globe are highly adopting smartphones for shopping, communication, entertainment, and other purposes. These devices use 3D stacked die packaging, which is revolutionizing their designs and functionality. 3D stacked die packaging is capable of significantly reducing form factors without compromising performance. By vertically stacking multiple layers of integrated circuits, this technology allows for the smooth integration of diverse components within a compact space. This consolidation not only streamlines the design and assembly processes but also enables manufacturers to create thin, more aesthetically appealing devices that align with the evolving preferences of consumers.

The enhanced performance achieved through 3D stacked die packaging plays a major role in meeting the escalating performance demands of modern consumer electronics. From advanced image processing in smartphones to real-time data analysis in smartwatches, the need for efficient and powerful semiconductor solutions is paramount. By leveraging 3D stacking technology, manufacturers can integrate memory, logic, and sensor components in a vertically interconnected manner, thereby enhancing processing capabilities while maintaining a compact form factor. Thus, the rising demand for consumer electronics that utilize 3D stacking technology is contributing to the growing North America 3D stacking market size.

North America 3D Stacking Market Overview

The rising consumer electronics industry is a significant driver for the 3D stacking market in North America. As consumers seek smaller and more portable electronic devices, the need for compact and efficient power sources, such as memories, has significantly grown. Furthermore, the proliferation of IoT and smart devices is another crucial factor propelling the 3D stacking market in North America. IoT devices, including wearables, sensors, and connected devices, rely on small and reliable power sources. Smartwatches, fitness trackers, and other wearables benefit from 3D stacking by integrating multiple functionalities in a compact form factor, including sensors, processors, and memory. The reduced power consumption from 3D stacked components extends the battery life of wearable devices.

The increasing adoption of IoT devices across various industries, such as healthcare and automotive, creates immense opportunities for 3D stacking providers. Moreover, the rise in demand for MEMS and sensors in North America has also created opportunities for market leaders engaged in the manufacturing of die, wafer, and flip-chip bonders, which boosts the requirement for 3D stacking. The rising utilization of vehicles and electronic devices fuels the demand for MEMS sensors, which is expected to fuel the 3D stacking market in North America during the forecast period.

North America 3D Stacking Market Revenue and Forecast to 2031 (US$ Million)

North America 3D Stacking Market Segmentation

The North America 3D stacking market is categorized into interconnecting technology, device type, end user, and country.

Based on interconnecting technology, the North America 3D stacking market is segmented into through-silicon via, monolithic 3D integration, and 3D hybrid bonding. The through-silicon via segment held the largest market share in 2023.

By device type, the North America 3D stacking market is segmented into memory devices, mems/sensors, LEDs, imaging & optoelectronics, and others. The memory devices segment held the largest market share in 2023.

In the terms of end user, the North America 3D stacking market is segmented into consumer electronics, telecommunication, automotive, manufacturing, healthcare, and others. The consumer electronics segment held the largest market share in 2023.

By country, the North America 3D stacking market is segmented into the US, Canada, and Mexico. The US dominated the North America 3D stacking market share in 2023.

Taiwan Semiconductor Manufacturing Co Ltd; Samsung Electronics Co Ltd; Intel Corp; MediaTek Inc.; Texas Instruments Inc; Amkor Technology Inc; ASE Technology Holding Co Ltd; Advanced Micro Devices Inc.; 3M Co.; and Globalfoundries Inc are some of the leading companies operating in the North America 3D stacking market.

Table Of Contents

1. Introduction

  • 1.1 The Insight Partners Research Report Guidance
  • 1.2 Market Segmentation

2. Executive Summary

  • 2.1 Key Insights
  • 2.2 Market Attractiveness

3. Research Methodology

  • 3.1 Secondary Research
  • 3.2 Primary Research
    • 3.2.1 Hypothesis formulation:
    • 3.2.2 Macro-economic factor analysis:
    • 3.2.3 Developing base number:
    • 3.2.4 Data Triangulation:
    • 3.2.5 Country level data:

4. North America 3D Stacking Market Landscape

  • 4.1 Overview
  • 4.2 PEST Analysis
  • 4.3 Ecosystem Analysis
    • 4.3.1 List of Vendors in the Value Chain

5. North America 3D Stacking Market - Key Market Dynamics

  • 5.1 3D Stacking Market - Key Market Dynamics
  • 5.2 Market Drivers
    • 5.2.1 Rising Demand for Consumer Electronics
    • 5.2.2 Increasing Use of Heterogeneous Integration and Component Optimization
  • 5.3 Market Restraints
    • 5.3.1 Complexity Associated with 3D Stacking Technology
  • 5.4 Market Opportunities
    • 5.4.1 Surge in Demand for High-Bandwidth Memory
  • 5.5 Future Trends
    • 5.5.1 Fast Processors for Gaming Purposes
  • 5.6 Impact of Drivers and Restraints:

6. 3D Stacking Market -North America Market Analysis

  • 6.1 North America 3D Stacking Market Overview-
  • 6.2 North America 3D Stacking Market Revenue (US$ Million), 2021-2031
  • 6.3 North America 3D Stacking Market Forecast Analysis

7. North America 3D Stacking Market Analysis - by Interconnecting Technology

  • 7.1 Through-Silicon Via
    • 7.1.1 Overview
    • 7.1.2 Through-Silicon Via: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 7.2 Monolithic 3D Integration
    • 7.2.1 Overview
    • 7.2.2 Monolithic 3D Integration: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 7.3 3D Hybrid Bonding
    • 7.3.1 Overview
    • 7.3.2 3D Hybrid Bonding: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)

8. North America 3D Stacking Market Analysis - by Device Type

  • 8.1 Memory Devices
    • 8.1.1 Overview
    • 8.1.2 Memory Devices: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 8.2 MEMS/Sensors
    • 8.2.1 Overview
    • 8.2.2 MEMS/Sensors: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 8.3 LEDs
    • 8.3.1 Overview
    • 8.3.2 LEDs: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 8.4 Imaging and Optoelectronics
    • 8.4.1 Overview
    • 8.4.2 Imaging and Optoelectronics: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 8.5 Others
    • 8.5.1 Overview
    • 8.5.2 Others: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)

9. North America 3D Stacking Market Analysis - by End User

  • 9.1 Consumer Electronics
    • 9.1.1 Overview
    • 9.1.2 Consumer Electronics: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 9.2 Telecommunication
    • 9.2.1 Overview
    • 9.2.2 Telecommunication: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 9.3 Automotive
    • 9.3.1 Overview
    • 9.3.2 Automotive: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 9.4 Manufacturing
    • 9.4.1 Overview
    • 9.4.2 Manufacturing: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 9.5 Healthcare
    • 9.5.1 Overview
    • 9.5.2 Healthcare: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • 9.6 Others
    • 9.6.1 Overview
    • 9.6.2 Others: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)

10. North America 3D Stacking Market -Country Analysis

  • 10.1 North America
    • 10.1.1 North America 3D Stacking Market, by Key Country- Revenue (2023) (US$ Million)
    • 10.1.2 North America 3D Stacking Market - Revenue and Forecast Analysis - by Country
      • 10.1.2.1 North America 3D Stacking Market - Revenue and Forecast Analysis - by Country
      • 10.1.2.2 United States: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
        • 10.1.2.2.1 United States: 3D Stacking Market Breakdown, by Interconnecting Technology
        • 10.1.2.2.2 United States: 3D Stacking Market Breakdown, by Device Type
        • 10.1.2.2.3 United States: 3D Stacking Market Breakdown, by End User
      • 10.1.2.3 Canada: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
        • 10.1.2.3.1 Canada: 3D Stacking Market Breakdown, by Interconnecting Technology
        • 10.1.2.3.2 Canada: 3D Stacking Market Breakdown, by Device Type
        • 10.1.2.3.3 Canada: 3D Stacking Market Breakdown, by End User
      • 10.1.2.4 Mexico: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
        • 10.1.2.4.1 Mexico: 3D Stacking Market Breakdown, by Interconnecting Technology
        • 10.1.2.4.2 Mexico: 3D Stacking Market Breakdown, by Device Type
        • 10.1.2.4.3 Mexico: 3D Stacking Market Breakdown, by End User

11. Competitive Landscape

  • 11.1 Heat Map Analysis by Key Players
  • 11.2 Company Positioning & Concentration

12. Industry Landscape

  • 12.1 Overview
  • 12.2 Market Initiative
  • 12.3 Product Development

13. Company Profiles

  • 13.1 Taiwan Semiconductor Manufacturing Co Ltd
    • 13.1.1 Key Facts
    • 13.1.2 Business Description
    • 13.1.3 Products and Services
    • 13.1.4 Financial Overview
    • 13.1.5 SWOT Analysis
    • 13.1.6 Key Developments
  • 13.2 Samsung Electronics Co Ltd
    • 13.2.1 Key Facts
    • 13.2.2 Business Description
    • 13.2.3 Products and Services
    • 13.2.4 Financial Overview
    • 13.2.5 SWOT Analysis
    • 13.2.6 Key Developments
  • 13.3 Intel Corp
    • 13.3.1 Key Facts
    • 13.3.2 Business Description
    • 13.3.3 Products and Services
    • 13.3.4 Financial Overview
    • 13.3.5 SWOT Analysis
    • 13.3.6 Key Developments
  • 13.4 MediaTek Inc
    • 13.4.1 Key Facts
    • 13.4.2 Business Description
    • 13.4.3 Products and Services
    • 13.4.4 Financial Overview
    • 13.4.5 SWOT Analysis
    • 13.4.6 Key Developments
  • 13.5 Texas Instruments Inc
    • 13.5.1 Key Facts
    • 13.5.2 Business Description
    • 13.5.3 Products and Services
    • 13.5.4 Financial Overview
    • 13.5.5 SWOT Analysis
    • 13.5.6 Key Developments
  • 13.6 Amkor Technology Inc
    • 13.6.1 Key Facts
    • 13.6.2 Business Description
    • 13.6.3 Products and Services
    • 13.6.4 Financial Overview
    • 13.6.5 SWOT Analysis
    • 13.6.6 Key Developments
  • 13.7 ASE Technology Holding Co Ltd
    • 13.7.1 Key Facts
    • 13.7.2 Business Description
    • 13.7.3 Products and Services
    • 13.7.4 Financial Overview
    • 13.7.5 SWOT Analysis
    • 13.7.6 Key Developments
  • 13.8 Advanced Micro Devices Inc
    • 13.8.1 Key Facts
    • 13.8.2 Business Description
    • 13.8.3 Products and Services
    • 13.8.4 Financial Overview
    • 13.8.5 SWOT Analysis
    • 13.8.6 Key Developments
  • 13.9 3M Co
    • 13.9.1 Key Facts
    • 13.9.2 Business Description
    • 13.9.3 Products and Services
    • 13.9.4 Financial Overview
    • 13.9.5 SWOT Analysis
    • 13.9.6 Key Developments
  • 13.10 Globalfoundries Inc
    • 13.10.1 Key Facts
    • 13.10.2 Business Description
    • 13.10.3 Products and Services
    • 13.10.4 Financial Overview
    • 13.10.5 SWOT Analysis
    • 13.10.6 Key Developments

14. Appendix

  • 14.1 About The Insight Partners
  • 14.2 Word Index

List Of Tables

  • Table 1. 3D Stacking Market Segmentation
  • Table 2. List of Vendors
  • Table 3. 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Table 4. 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Interconnecting Technology
  • Table 5. 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Device Type
  • Table 6. 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by End User
  • Table 7. North America 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Country
  • Table 8. United States: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Interconnecting Technology
  • Table 9. United States: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Device Type
  • Table 10. United States: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by End User
  • Table 11. Canada: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Interconnecting Technology
  • Table 12. Canada: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Device Type
  • Table 13. Canada: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by End User
  • Table 14. Mexico: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Interconnecting Technology
  • Table 15. Mexico: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by Device Type
  • Table 16. Mexico: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million) - by End User
  • Table 17. List of Abbreviation

List Of Figures

  • Figure 1. 3D Stacking Market Segmentation, by Country
  • Figure 2. PEST Analysis
  • Figure 3. Impact Analysis of Drivers and Restraints
  • Figure 4. 3D Stacking Market Revenue (US$ Million), 2021-2031
  • Figure 5. 3D Stacking Market Share (%) - by Interconnecting Technology (2023 and 2031)
  • Figure 6. Through-Silicon Via: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 7. Monolithic 3D Integration: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 8. 3D Hybrid Bonding: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 9. 3D Stacking Market Share (%) - by Device Type (2023 and 2031)
  • Figure 10. Memory Devices: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 11. MEMS/Sensors: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 12. LEDs: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 13. Imaging and Optoelectronics: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 14. Others: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 15. 3D Stacking Market Share (%) - by End User (2023 and 2031)
  • Figure 16. Consumer Electronics: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 17. Telecommunication: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 18. Automotive: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 19. Manufacturing: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 20. Healthcare: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 21. Others: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 22. North America: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 23. North America: 3D Stacking Market Breakdown, by Key Countries, 2023 and 2031 (%)
  • Figure 24. United States: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 25. Canada: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 26. Mexico: 3D Stacking Market - Revenue and Forecast to 2031 (US$ Million)
  • Figure 27. Heat Map Analysis by Key Players
  • Figure 28. Company Positioning & Concentration