CPO技術革命：人工智慧資料中心的下一代互連技術

CPO Technology Revolution: Next-Gen Interconnect for AI Data Centers

出版日期: 2026年06月05日 | 出版商:

TrendForce | 英文 22 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

受人工智慧資料中心對高頻寬和低功耗需求的推動，共封裝光元件（CPO）技術正進入商業化階段。預計2026年開始量產，大規模採購預計在2027年至2028年進行。光纖對準、溫度控管和測試成本是擴大量產規模的三大主要技術障礙。矽光電晶圓、InP基板和光纖輔助單元（FAU）集中在少數供應商手中，有供應中斷的風險。台灣製造商正透過契約製造和組裝進入市場，而確保上游材料的供應將是下一階段的關鍵策略重點。

主要亮點

2026 年將是 CPO 量產的第一年，2027 年至 2028 年將是大規模部署的關鍵時期。
這三種光連接模組方式將在分層架構中共存。 CPO不會取代LPO。
限制 CPO 大規模生產的三大技術障礙是光纖對準精度、溫度控管以及測試和檢驗成本。
由於關鍵材料來自集中地點，且替代品有限，因此這代表了擴大 CPO（合約產品所有權）規模時最大的供應鏈風險。
台灣製造商正透過契約製造和組裝進入市場，而增強上游原料供應的韌性將是下一階段的關鍵挑戰。

Co-packaged optical (CPO) technology is entering the commercialization stage, driven by AI data center demand for higher bandwidth and lower power consumption. Volume production begins in 2026, with large-scale procurement expected in 2027–2028. Fiber alignment, thermal management, and testing costs are the three core technical barriers to production ramp. Silicon photonics wafers, InP substrates, and FAUs are highly concentrated among a limited number of suppliers, posing supply disruption risks. Taiwanese manufacturers are entering via contract manufacturing and assembly; securing upstream material access will be the defining strategic priority in the next phase.

Key Highlights

2026 marks CPO's first year of volume production, with 2027-2028 as the critical window for large-scale deployment.
The three optical interconnect approaches will coexist in a tiered architecture; CPO will not displace LPO.
Three technical barriers constrain CPO volume production: fiber alignment precision, thermal management, and testing and validation costs.
Key materials are highly concentrated with limited substitutability, the single greatest supply chain risk to CPO scaling.
Taiwanese manufacturers are entering via contract manufacturing and assembly; building upstream material supply resilience is the defining challenge for the next phase.