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市場調查報告書
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2113003

電子黏合劑市場預測至2034年－按樹脂類型、固化類型、基材、應用、終端用戶產業和地區分類的全球分析

Electronic Adhesives Market Forecasts to 2034 - Global Analysis By Resin Type, Cure Type, Substrate, Application, End-Use Industry, and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

根據 Stratistics MRC 預測，全球電子黏合劑市場預計到 2026 年將達到 73 億美元，在預測期內以 8.4% 的複合年成長率成長，到 2034 年將達到 140 億美元。

電子黏合劑是專為電子設備的製造、組裝和封裝而配製的專用黏合材料，可提供導電性、熱溫度控管、結構黏合、密封和環境防護等功能。這些黏合劑採用多種樹脂，包括環氧樹脂、矽樹脂、丙烯酸樹脂、聚氨酯樹脂、氰基丙烯酸酯樹脂、聚醯亞胺樹脂和紫外光固化樹脂，其固化方式包括熱固化、紫外光固化、濕氣固化、雙重固化、室溫固化等。電子設備的日益小型化、對先進封裝技術的需求不斷成長、電動車和汽車電子產品的普及以及家用電子電器生產的擴張，是推動各地區市場成長的主要因素。

小型化進程和對先進封裝技術的需求

電子設備小型化和性能提升的趨勢，以及對先進半導體封裝技術日益成長的需求，是電子黏合劑市場的主要驅動力。隨著電子元件尺寸的縮小和封裝密度的提高，黏合劑在黏合、溫度控管和電氣互連方面發揮著至關重要的作用。晶片組、3D堆疊和系統級封裝（SiP）等先進封裝技術需要專用黏合劑來實現晶片黏接、底部填充和封裝。穿戴式裝置、物聯網感測器和小型化家用電子電器的普及，催生了對能夠實現小型化的黏合劑的需求。隨著裝置複雜性的增加和外形規格的縮小，對電子黏合劑的要求也越來越高，從而支撐了市場的強勁成長。

高昂的材料成本和嚴格的性能要求

先進電子黏合劑的高昂成本和嚴格的性能要求是限制市場發展的因素。專用電子黏合劑需要高純度原料、精確配方和嚴格的品管，因此價格較高。熱穩定性、電氣性能、可靠性和製程相容性等性能要求也為研發帶來了挑戰。符合業界標準和客戶規格需要大量的研發投入。與電子產品製造商進行多次認證會進一步延長研發週期。這些成本和性能方面的障礙會限制黏合劑的應用，尤其是在對成本敏感、傳統替代品足以滿足需求的領域。

電動車和汽車電子產品的需求不斷成長

電動車產量的快速成長以及汽車電子元件的日益搭載率，為電子黏合劑市場帶來了巨大的機會。電動車需要專用黏合劑來黏合電力電子、電池組裝、溫度控管和感測器系統。汽車電子產品，例如高級駕駛輔助系統（ADAS）、資訊娛樂系統和照明系統，進一步推動了對黏合劑的需求。汽車產業向電氣化和自動駕駛的轉型，正在推動對可靠、高性能黏合劑的需求。汽車電氣化程度的提高、電池式電動車產量的擴大以及汽車感測器的日益普及，都支撐著黏合劑的消費。隨著汽車電子產品的不斷發展，電子黏合劑在這個高成長領域正不斷擴大市場佔有率。

與替代鍵結技術的競爭

來自焊接、釬焊、機械緊固和膠帶黏合等替代黏合技術的競爭對電子黏合劑市場構成重大威脅。釬焊工藝成熟可靠，在電氣互連領域久經考驗。機械緊固便於拆卸維修和回收。膠帶黏合解決方案在特定應用中安裝簡單。製造商可能會根據成本、製程適用性或性能要求選擇替代技術。這種競爭可能會限制黏合劑的普及，尤其是在替代技術能夠以更低成本提供足夠性能的應用領域。

新型冠狀病毒（COVID-19）的影響：

新冠疫情對電子黏合劑市場產生了正面和負面的雙重影響。初期，供應鏈中斷、生產放緩以及封鎖期間家用電子電器需求下降等因素造成了衝擊。然而，疫情也加速了遠距辦公、醫療保健和通訊等領域對電子產品的需求，從而帶動了某些領域對黏合劑的需求。半導體短缺也影響了部分產業的電子產品生產。疫情過後，電子產品需求的復甦和持續的技術投資正在支撐市場成長，而黏合劑在設備製造和組裝中發揮至關重要的作用。

在預測期內，環氧樹脂細分市場預計將佔據最大的市場佔有率。

預計在預測期內，環氧樹脂膠黏劑將佔據最大的市場佔有率，這主要得益於其多功能性、卓越的黏合力、高熱穩定性以及在電子設備組裝和封裝領域的廣泛應用。環氧樹脂黏合劑對多種基材具有極強的黏合力、優異的耐化學性和出色的機械性能，使其適用於晶片黏合、底部填充、封裝和結構黏合等應用。該細分市場受益於完善的生產基礎設施、久經考驗的性能以及廣泛的行業認可。為滿足溫度控管和導電性要求，環氧樹脂配方不斷創新，從而支撐了市場的持續需求。憑藉其廣泛的適用性和可靠的性能，預計環氧樹脂黏合劑將在整個預測期內保持樹脂類型細分市場中最大的市場佔有率。

預計在預測期內，UV固化領域將呈現最高的複合年成長率。

在預測期內，紫外光固化膠黏劑預計將呈現最高的成長率，這主要得益於其快速固化、低溫加工和精密塗層等優勢，這些優勢能夠實現高速電子組裝。紫外光固化黏合劑在紫外光照射下即可瞬間固化，從而支持高速生產線並減少在製品庫存。該細分市場受益於顯示器製造、光學元件組裝和精密電子應用領域日益成長的需求。此外，紫外光固化配方作為無溶劑體系，也具有環境優勢。隨著電子製造速度的提升和對加工溫度敏感性的提高，紫外光固化黏合劑在各種固化類型中實現了最快的成長。

市佔率最大的地區：

在整個預測期內，亞太地區預計將保持最大的市場佔有率，這主要得益於該地區電子製造業的集中、家用電子電器產品的廣泛生產以及眾多主要半導體和顯示器製造商的位置。中國大陸、台灣、韓國、日本和東南亞地區擁有全球一些最大的電子組裝和半導體封裝企業。該地區在全球電子產品生產和黏合劑消費中佔據重要佔有率。政府對電子製造業擴張的支持力道也不斷增加。憑藉集中的製造地和持續的產量成長，亞太地區預計將繼續保持其市場主導地位。

複合年成長率最高的地區：

在預測期內，亞太地區預計將呈現最高的複合年成長率，這主要得益於中國、印度和東南亞電子產品生產的持續擴張、半導體封裝需求的成長以及汽車電子製造業的發展。該地區的電子產業正透過新建製造工廠、組裝廠和技術升級不斷擴張。政府鼓勵國內電子製造業發展的政策正在加速黏合劑的消費。家用電子電器和汽車生產的擴張也為黏合劑創造了持續的需求。隨著電子製造業的擴張和技術的全部區域普及，亞太地區正經歷著全球成長最快的電子黏合劑市場之一。

免費客製化服務：

所有購買此報告的客戶均可享受以下免費自訂選項之一：

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  • 區域細分
    • 應客戶要求，我們提供主要國家的市場估算和預測，以及複合年成長率（註：需進行可行性檢查）。
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    • 根據產品系列、地理覆蓋範圍和策略聯盟對領先公司進行基準分析。

目錄

第1章執行摘要

  • 市場概覽及主要亮點
  • 促進因素、挑戰與機遇
  • 競爭格局概述
  • 戰略洞察與建議

第2章：研究框架

  • 研究目標和範圍
  • 相關人員分析
  • 研究假設和限制
  • 調查方法

第3章 市場動態與趨勢分析

  • 市場定義與結構
  • 主要市場促進因素
  • 市場限制與挑戰
  • 投資成長機會和重點領域
  • 產業威脅與風險評估
  • 技術與創新展望
  • 新興市場/高成長市場
  • 監管和政策環境
  • 新冠疫情的影響及復甦前景

第4章：競爭環境與策略評估

  • 波特五力分析
    • 供應商的議價能力
    • 買方的議價能力
    • 替代品的威脅
    • 新進入者的威脅
    • 競爭公司之間的競爭
  • 主要公司市佔率分析
  • 產品基準評效和效能比較

第5章 全球電子黏合劑市場：依樹脂類型分類

  • 環氧樹脂
  • 矽酮
  • 丙烯酸纖維
  • 聚氨酯
  • 氰基丙烯酸酯
  • 聚醯亞胺
  • 紫外光固化樹脂
  • 其他樹脂類型

第6章 全球電子黏合劑市場：依固化類型分類

  • 熱固型
  • 紫外線固化型
  • 濕氣固化型
  • 雙重固化
  • 室溫固化（RTV）
  • 其他治療類型

第7章 全球電子黏合劑市場：依基材分類

  • 金屬
  • 塑膠
  • 玻璃
  • 陶瓷
  • 複合材料
  • 印刷基板（PCB）

第8章 全球電子黏合劑市場：依應用領域分類

  • 表面黏著技術組件
  • 死亡觸摸
  • 底部填充
  • 封裝
  • 三防膠
  • 盆栽
  • 金屬絲釘合
  • 溫度控管
  • 電磁干擾屏蔽
  • 展示用黏合劑
  • 組件連接

第9章：全球電子黏合劑市場：依最終用途產業分類

  • 家用電子產品
  • 汽車電子
  • 電訊
  • 醫療用電子設備
  • 航太和國防電子
  • 工業電子設備
  • 能源與電力電子
  • 半導體製造

第10章 全球電子黏合劑市場：按地區分類

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 英國
    • 德國
    • 法國
    • 義大利
    • 西班牙
    • 荷蘭
    • 比利時
    • 瑞典
    • 瑞士
    • 波蘭
    • 其他歐洲國家
  • 亞太地區
    • 中國
    • 日本
    • 印度
    • 韓國
    • 澳洲
    • 印尼
    • 泰國
    • 馬來西亞
    • 新加坡
    • 越南
    • 其他亞太國家
  • 南美洲
    • 巴西
    • 阿根廷
    • 哥倫比亞
    • 智利
    • 秘魯
    • 其他南美國家
  • 世界其他地區（RoW）
    • 中東
      • 沙烏地阿拉伯
      • 阿拉伯聯合大公國
      • 卡達
      • 以色列
      • 其他中東國家
    • 非洲
      • 南非
      • 埃及
      • 摩洛哥
      • 其他非洲國家

第11章 策略市場資訊

  • 工業價值網路和供應鏈評估
  • 空白區域和機會地圖
  • 產品演進與市場生命週期分析
  • 通路、經銷商和打入市場策略的評估

第12章 產業趨勢與策略舉措

  • 併購
  • 夥伴關係、聯盟和合資企業
  • 新產品發布和認證
  • 擴大生產能力和投資
  • 其他策略舉措

第13章：公司簡介

  • Henkel AG & Co. KGaA
  • HB Fuller Company
  • 3M Company
  • Dow Inc.
  • Arkema SA
  • DuPont de Nemours, Inc.
  • Parker Hannifin Corporation
  • Panacol-Elosol GmbH
  • DELO Industrie Klebstoffe GmbH & Co. KGaA
  • Master Bond Inc.
  • Permabond LLC
  • Shin-Etsu Chemical Co., Ltd.
  • ThreeBond Holdings Co., Ltd.
  • Sika AG
  • LORD Corporation（Parker Hannifin）
  • Dymax Corporation
Product Code: SMRC39043

According to Stratistics MRC, the Global Electronic Adhesives Market is accounted for $7.3 billion in 2026 and is expected to reach $14.0 billion by 2034 growing at a CAGR of 8.4% during the forecast period. Electronic adhesives are specialized bonding materials formulated for applications in electronics manufacturing, assembly, and packaging, providing electrical conductivity, thermal management, structural bonding, sealing, and protection against environmental factors. These adhesives utilize various resin types including epoxy, silicone, acrylic, polyurethane, cyanoacrylate, polyimide, UV-curable resin, and others, with cure mechanisms including heat cure, UV cure, moisture cure, dual cure, room temperature cure, and other methods. Growing miniaturization of electronic devices, increasing demand for advanced packaging technologies, rising adoption of electric vehicles and automotive electronics, and expanding consumer electronics production are key drivers of market expansion across all regions.

Market Dynamics:

Driver:

Increasing miniaturization and demand for advanced packaging

The ongoing trend toward smaller, more powerful electronic devices and the growing demand for advanced semiconductor packaging technologies are primary drivers for the electronic adhesives market. As electronic components become smaller and more densely packed, adhesives play a critical role in bonding, thermal management, and electrical interconnection. Advanced packaging including chiplets, 3D stacking, and system-in-package requires specialized adhesives for die attach, underfill, and encapsulation. The proliferation of wearable devices, IoT sensors, and compact consumer electronics is creating demand for adhesives enabling miniaturization. As device complexity increases and form factors shrink, electronic adhesive requirements intensify, sustaining strong market growth.

Restraint:

High material costs and stringent performance requirements

The significant costs of advanced electronic adhesive formulations and stringent performance requirements represent a major restraint for the market. Specialty electronic adhesives require high-purity ingredients, precise formulation, and rigorous quality control, resulting in premium pricing. Performance requirements including thermal stability, electrical properties, reliability, and process compatibility create development challenges. Meeting industry standards and customer specifications requires substantial R&D investment. Multiple qualification cycles with electronics manufacturers extend development timelines. These cost and performance barriers may limit adhesive adoption, particularly in cost-sensitive applications where conventional alternatives remain adequate.

Opportunity:

Growing demand for electric vehicle and automotive electronics

The rapid expansion of electric vehicle production and increasing electronic content in vehicles presents significant opportunities for the electronic adhesives market. Electric vehicles require specialized adhesives for power electronics, battery assembly, thermal management, and sensor systems. Automotive electronics including ADAS, infotainment, and lighting systems create additional adhesive demand. The automotive industry's shift toward electrification and autonomous driving is driving demand for reliable, high-performance adhesives. Growing vehicle electronic content, battery electric vehicle production, and automotive sensor adoption support adhesive consumption. As automotive electronics expand, electronic adhesives capture growing market share in this high-growth segment.

Threat:

Competition from alternative bonding technologies

Competition from alternative bonding technologies including soldering, welding, mechanical fastening, and tape-based solutions poses significant threats to the electronic adhesives market. Soldering offers established processes and proven reliability for electrical interconnections. Mechanical fastening provides disassembly capability for repair and recycling. Tape-based bonding solutions offer ease of application for certain applications. Manufacturers may choose alternatives based on cost, process compatibility, or performance requirements. This competition may limit adhesive adoption, particularly in applications where alternatives offer adequate performance at lower cost.

Covid-19 Impact:

The COVID-19 pandemic had a mixed impact on the electronic adhesives market. Initial disruptions included supply chain interruptions, manufacturing slowdowns, and reduced consumer electronics demand during lockdowns. However, the pandemic accelerated demand for electronics supporting remote work, healthcare, and communication, increasing adhesive demand in certain segments. Semiconductor shortages affected electronics production in some sectors. Post-pandemic, electronics demand recovery and continued technology investment have supported market growth, with adhesives playing essential roles in device manufacturing and assembly.

The Epoxy segment is expected to be the largest during the forecast period

The Epoxy segment is expected to account for the largest market share during the forecast period, driven by its versatility, excellent adhesion properties, high thermal stability, and extensive applications across electronics assembly and packaging. Epoxy adhesives offer strong adhesion to diverse substrates, superior chemical resistance, and excellent mechanical properties, making them suitable for die attach, underfill, encapsulation, and structural bonding applications. The segment benefits from established manufacturing infrastructure, well-characterized performance, and extensive industry acceptance. Continuous innovation in epoxy formulations addressing thermal management and conductivity requirements supports sustained demand. With broad applicability and proven reliability, epoxy adhesives maintain the largest resin type segment share throughout the forecast period.

The UV Cure segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the UV Cure segment is predicted to witness the highest growth rate, fueled by advantages in rapid curing times, low temperature processing, and precision application enabling high-speed electronics assembly. UV-curable adhesives offer instant cure upon UV exposure, enabling high-speed production lines and reduced work-in-process inventory. The segment benefits from growing adoption in display manufacturing, optical component assembly, and precision electronics applications. UV-curable formulations offer environmental advantages as solvent-free systems. As electronics manufacturing speeds increase and processing temperature sensitivity grows, UV-curable adhesives deliver the fastest cure type segment growth.

Region with largest share:

During the forecast period, the Asia-Pacific region is expected to hold the largest market share, supported by concentrated electronics manufacturing, extensive consumer electronics production, and presence of major semiconductor and display manufacturers. China, Taiwan, South Korea, Japan, and Southeast Asia host the world's largest electronics assembly and semiconductor packaging operations. The region accounts for a substantial share of global electronics production and adhesive consumption. Government support for electronics manufacturing expansion is accelerating. With concentrated manufacturing and continuous production growth, Asia Pacific maintains its dominant market position.

Region with highest CAGR:

Over the forecast period, the Asia-Pacific region is anticipated to exhibit the highest CAGR, driven by continued electronics production expansion, rising semiconductor packaging demand, and growing automotive electronics manufacturing across China, India, and Southeast Asia. The region's electronics industry continues expanding with new fabrication facilities, assembly operations, and technology upgrades. Government programs promoting domestic electronics manufacturing are accelerating adhesive consumption. Growing consumer electronics and automotive production create sustained adhesive demand. As electronics manufacturing expands across the region and technology adoption increases, Asia Pacific delivers the fastest electronic adhesives market growth globally.

Key players in the market

Some of the key players in Electronic Adhesives Market include Henkel AG & Co. KGaA, H.B. Fuller Company, 3M Company, Dow Inc., Arkema S.A., DuPont de Nemours, Inc., Parker Hannifin Corporation, Panacol-Elosol GmbH, DELO Industrie Klebstoffe GmbH & Co. KGaA, Master Bond Inc., Permabond LLC, Shin-Etsu Chemical Co., Ltd., ThreeBond Holdings Co., Ltd., Sika AG, LORD Corporation (Parker Hannifin), and Dymax Corporation.

Key Developments:

In March 2026, Panacol (operating under the rebranded Hoenle Adhesives platform) introduced its new UV-curable Formed-In-Place Gasket (FIPG/CIPG) liquid sealant designed for fast automated dispense and instant cure in electronic housing assemblies.

In February 2026, DELO finalized interior construction on its new 65,000-square-foot fully automated logistics warehouse at its Windach headquarters to streamline global supply chains for semiconductor and automotive electronics adhesives.

In July 2025, Panacol released Vitralit(R) UD 8060 F, a new dual-cure (UV/moisture) potting compound engineered for deep-section protection and strain relief in sensitive circuit board components.

Resin Types Covered:

  • Epoxy
  • Silicone
  • Acrylic
  • Polyurethane
  • Cyanoacrylate
  • Polyimide
  • UV-Curable Resin
  • Other Resin Types

Cure Types Covered:

  • Heat Cure
  • UV Cure
  • Moisture Cure
  • Dual Cure
  • Room Temperature Cure (RTV)
  • Other Cure Types

Substrates Covered:

  • Metals
  • Plastics
  • Glass
  • Ceramics
  • Composites
  • Printed Circuit Boards (PCB)

Applications Covered:

  • Surface Mount Assembly
  • Die Attach
  • Underfill
  • Encapsulation
  • Conformal Coating
  • Potting
  • Wire Tacking
  • Thermal Management
  • EMI Shielding
  • Display Bonding
  • Component Bonding

End-Use Industries Covered:

  • Consumer Electronics
  • Automotive Electronics
  • Telecommunications
  • Medical Electronics
  • Aerospace & Defense Electronics
  • Industrial Electronics
  • Energy & Power Electronics
  • Semiconductor Manufacturing

Regions Covered:

  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • United Kingdom
    • Germany
    • France
    • Italy
    • Spain
    • Netherlands
    • Belgium
    • Sweden
    • Switzerland
    • Poland
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Australia
    • Indonesia
    • Thailand
    • Malaysia
    • Singapore
    • Vietnam
    • Rest of Asia Pacific
  • South America
    • Brazil
    • Argentina
    • Colombia
    • Chile
    • Peru
    • Rest of South America
  • Rest of the World (RoW)
    • Middle East
  • Saudi Arabia
  • United Arab Emirates
  • Qatar
  • Israel
  • Rest of Middle East
    • Africa
  • South Africa
  • Egypt
  • Morocco
  • Rest of Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2023, 2024, 2025, 2026, 2027, 2028, 2030, 2032 and 2034
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

  • 1.1 Market Snapshot and Key Highlights
  • 1.2 Growth Drivers, Challenges, and Opportunities
  • 1.3 Competitive Landscape Overview
  • 1.4 Strategic Insights and Recommendations

2 Research Framework

  • 2.1 Study Objectives and Scope
  • 2.2 Stakeholder Analysis
  • 2.3 Research Assumptions and Limitations
  • 2.4 Research Methodology
    • 2.4.1 Data Collection (Primary and Secondary)
    • 2.4.2 Data Modeling and Estimation Techniques
    • 2.4.3 Data Validation and Triangulation
    • 2.4.4 Analytical and Forecasting Approach

3 Market Dynamics and Trend Analysis

  • 3.1 Market Definition and Structure
  • 3.2 Key Market Drivers
  • 3.3 Market Restraints and Challenges
  • 3.4 Growth Opportunities and Investment Hotspots
  • 3.5 Industry Threats and Risk Assessment
  • 3.6 Technology and Innovation Landscape
  • 3.7 Emerging and High-Growth Markets
  • 3.8 Regulatory and Policy Environment
  • 3.9 Impact of COVID-19 and Recovery Outlook

4 Competitive and Strategic Assessment

  • 4.1 Porter's Five Forces Analysis
    • 4.1.1 Supplier Bargaining Power
    • 4.1.2 Buyer Bargaining Power
    • 4.1.3 Threat of Substitutes
    • 4.1.4 Threat of New Entrants
    • 4.1.5 Competitive Rivalry
  • 4.2 Market Share Analysis of Key Players
  • 4.3 Product Benchmarking and Performance Comparison

5 Global Electronic Adhesives Market, By Resin Type

  • 5.1 Epoxy
  • 5.2 Silicone
  • 5.3 Acrylic
  • 5.4 Polyurethane
  • 5.5 Cyanoacrylate
  • 5.6 Polyimide
  • 5.7 UV-Curable Resin
  • 5.8 Other Resin Types

6 Global Electronic Adhesives Market, By Cure Type

  • 6.1 Heat Cure
  • 6.2 UV Cure
  • 6.3 Moisture Cure
  • 6.4 Dual Cure
  • 6.5 Room Temperature Cure (RTV)
  • 6.6 Other Cure Types

7 Global Electronic Adhesives Market, By Substrate

  • 7.1 Metals
  • 7.2 Plastics
  • 7.3 Glass
  • 7.4 Ceramics
  • 7.5 Composites
  • 7.6 Printed Circuit Boards (PCB)

8 Global Electronic Adhesives Market, By Application

  • 8.1 Surface Mount Assembly
  • 8.2 Die Attach
  • 8.3 Underfill
  • 8.4 Encapsulation
  • 8.5 Conformal Coating
  • 8.6 Potting
  • 8.7 Wire Tacking
  • 8.8 Thermal Management
  • 8.9 EMI Shielding
  • 8.10 Display Bonding
  • 8.11 Component Bonding

9 Global Electronic Adhesives Market, By End-Use Industry

  • 9.1 Consumer Electronics
  • 9.2 Automotive Electronics
  • 9.3 Telecommunications
  • 9.4 Medical Electronics
  • 9.5 Aerospace & Defense Electronics
  • 9.6 Industrial Electronics
  • 9.7 Energy & Power Electronics
  • 9.8 Semiconductor Manufacturing

10 Global Electronic Adhesives Market, By Geography

  • 10.1 North America
    • 10.1.1 United States
    • 10.1.2 Canada
    • 10.1.3 Mexico
  • 10.2 Europe
    • 10.2.1 United Kingdom
    • 10.2.2 Germany
    • 10.2.3 France
    • 10.2.4 Italy
    • 10.2.5 Spain
    • 10.2.6 Netherlands
    • 10.2.7 Belgium
    • 10.2.8 Sweden
    • 10.2.9 Switzerland
    • 10.2.10 Poland
    • 10.2.11 Rest of Europe
  • 10.3 Asia Pacific
    • 10.3.1 China
    • 10.3.2 Japan
    • 10.3.3 India
    • 10.3.4 South Korea
    • 10.3.5 Australia
    • 10.3.6 Indonesia
    • 10.3.7 Thailand
    • 10.3.8 Malaysia
    • 10.3.9 Singapore
    • 10.3.10 Vietnam
    • 10.3.11 Rest of Asia Pacific
  • 10.4 South America
    • 10.4.1 Brazil
    • 10.4.2 Argentina
    • 10.4.3 Colombia
    • 10.4.4 Chile
    • 10.4.5 Peru
    • 10.4.6 Rest of South America
  • 10.5 Rest of the World (RoW)
    • 10.5.1 Middle East
      • 10.5.1.1 Saudi Arabia
      • 10.5.1.2 United Arab Emirates
      • 10.5.1.3 Qatar
      • 10.5.1.4 Israel
      • 10.5.1.5 Rest of Middle East
    • 10.5.2 Africa
      • 10.5.2.1 South Africa
      • 10.5.2.2 Egypt
      • 10.5.2.3 Morocco
      • 10.5.2.4 Rest of Africa

11 Strategic Market Intelligence

  • 11.1 Industry Value Network and Supply Chain Assessment
  • 11.2 White-Space and Opportunity Mapping
  • 11.3 Product Evolution and Market Life Cycle Analysis
  • 11.4 Channel, Distributor, and Go-to-Market Assessment

12 Industry Developments and Strategic Initiatives

  • 12.1 Mergers and Acquisitions
  • 12.2 Partnerships, Alliances, and Joint Ventures
  • 12.3 New Product Launches and Certifications
  • 12.4 Capacity Expansion and Investments
  • 12.5 Other Strategic Initiatives

13 Company Profiles

  • 13.1 Henkel AG & Co. KGaA
  • 13.2 H.B. Fuller Company
  • 13.3 3M Company
  • 13.4 Dow Inc.
  • 13.5 Arkema S.A.
  • 13.6 DuPont de Nemours, Inc.
  • 13.7 Parker Hannifin Corporation
  • 13.8 Panacol-Elosol GmbH
  • 13.9 DELO Industrie Klebstoffe GmbH & Co. KGaA
  • 13.10 Master Bond Inc.
  • 13.11 Permabond LLC
  • 13.12 Shin-Etsu Chemical Co., Ltd.
  • 13.13 ThreeBond Holdings Co., Ltd.
  • 13.14 Sika AG
  • 13.15 LORD Corporation (Parker Hannifin)
  • 13.16 Dymax Corporation

List of Tables

  • Table 1 Global Electronic Adhesives Market Outlook, By Region (2023-2034) ($MN)
  • Table 2 Global Electronic Adhesives Market Outlook, By Resin Type (2023-2034) ($MN)
  • Table 3 Global Electronic Adhesives Market Outlook, By Epoxy (2023-2034) ($MN)
  • Table 4 Global Electronic Adhesives Market Outlook, By Silicone (2023-2034) ($MN)
  • Table 5 Global Electronic Adhesives Market Outlook, By Acrylic (2023-2034) ($MN)
  • Table 6 Global Electronic Adhesives Market Outlook, By Polyurethane (2023-2034) ($MN)
  • Table 7 Global Electronic Adhesives Market Outlook, By Cyanoacrylate (2023-2034) ($MN)
  • Table 8 Global Electronic Adhesives Market Outlook, By Polyimide (2023-2034) ($MN)
  • Table 9 Global Electronic Adhesives Market Outlook, By UV-Curable Resin (2023-2034) ($MN)
  • Table 10 Global Electronic Adhesives Market Outlook, By Other Resin Types (2023-2034) ($MN)
  • Table 11 Global Electronic Adhesives Market Outlook, By Cure Type (2023-2034) ($MN)
  • Table 12 Global Electronic Adhesives Market Outlook, By Heat Cure (2023-2034) ($MN)
  • Table 13 Global Electronic Adhesives Market Outlook, By UV Cure (2023-2034) ($MN)
  • Table 14 Global Electronic Adhesives Market Outlook, By Moisture Cure (2023-2034) ($MN)
  • Table 15 Global Electronic Adhesives Market Outlook, By Dual Cure (2023-2034) ($MN)
  • Table 16 Global Electronic Adhesives Market Outlook, By Room Temperature Cure (RTV) (2023-2034) ($MN)
  • Table 17 Global Electronic Adhesives Market Outlook, By Other Cure Types (2023-2034) ($MN)
  • Table 18 Global Electronic Adhesives Market Outlook, By Substrate (2023-2034) ($MN)
  • Table 19 Global Electronic Adhesives Market Outlook, By Metals (2023-2034) ($MN)
  • Table 20 Global Electronic Adhesives Market Outlook, By Plastics (2023-2034) ($MN)
  • Table 21 Global Electronic Adhesives Market Outlook, By Glass (2023-2034) ($MN)
  • Table 22 Global Electronic Adhesives Market Outlook, By Ceramics (2023-2034) ($MN)
  • Table 23 Global Electronic Adhesives Market Outlook, By Composites (2023-2034) ($MN)
  • Table 24 Global Electronic Adhesives Market Outlook, By Printed Circuit Boards (PCB) (2023-2034) ($MN)
  • Table 25 Global Electronic Adhesives Market Outlook, By Application (2023-2034) ($MN)
  • Table 26 Global Electronic Adhesives Market Outlook, By Surface Mount Assembly (2023-2034) ($MN)
  • Table 27 Global Electronic Adhesives Market Outlook, By Die Attach (2023-2034) ($MN)
  • Table 28 Global Electronic Adhesives Market Outlook, By Underfill (2023-2034) ($MN)
  • Table 29 Global Electronic Adhesives Market Outlook, By Encapsulation (2023-2034) ($MN)
  • Table 30 Global Electronic Adhesives Market Outlook, By Conformal Coating (2023-2034) ($MN)
  • Table 31 Global Electronic Adhesives Market Outlook, By Potting (2023-2034) ($MN)
  • Table 32 Global Electronic Adhesives Market Outlook, By Wire Tacking (2023-2034) ($MN)
  • Table 33 Global Electronic Adhesives Market Outlook, By Thermal Management (2023-2034) ($MN)
  • Table 34 Global Electronic Adhesives Market Outlook, By EMI Shielding (2023-2034) ($MN)
  • Table 35 Global Electronic Adhesives Market Outlook, By Display Bonding (2023-2034) ($MN)
  • Table 36 Global Electronic Adhesives Market Outlook, By Component Bonding (2023-2034) ($MN)
  • Table 37 Global Electronic Adhesives Market Outlook, By End-Use Industry (2023-2034) ($MN)
  • Table 38 Global Electronic Adhesives Market Outlook, By Consumer Electronics (2023-2034) ($MN)
  • Table 39 Global Electronic Adhesives Market Outlook, By Automotive Electronics (2023-2034) ($MN)
  • Table 40 Global Electronic Adhesives Market Outlook, By Telecommunications (2023-2034) ($MN)
  • Table 41 Global Electronic Adhesives Market Outlook, By Medical Electronics (2023-2034) ($MN)
  • Table 42 Global Electronic Adhesives Market Outlook, By Aerospace & Defense Electronics (2023-2034) ($MN)
  • Table 43 Global Electronic Adhesives Market Outlook, By Industrial Electronics (2023-2034) ($MN)
  • Table 44 Global Electronic Adhesives Market Outlook, By Energy & Power Electronics (2023-2034) ($MN)
  • Table 45 Global Electronic Adhesives Market Outlook, By Semiconductor Manufacturing (2023-2034) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Rest of the World (RoW) Regions are also represented in the same manner as above.