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市場調查報告書
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1935005

電子黏合劑市場 - 全球產業規模、佔有率、趨勢、機會及預測（按樹脂類型、形態、產品類型、終端用戶產業、地區和競爭格局分類，2021-2031年）

Electronic Adhesives Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Resin Type, By Form, By Product Type, By End User Industry, By Region & Competition, 2021-2031F
出版日期: | 出版商: TechSci Research | 英文 180 Pages | 商品交期: 2-3個工作天內

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簡介目錄

全球電子黏合劑市場預計將從 2025 年的 52.7 億美元成長到 2031 年的 82.3 億美元，複合年成長率為 7.71%。

這些特殊黏合劑旨在電子組件內部形成牢固的結構連接，同時也具備導電性、熱調節和環境保護等關鍵功能。推動這一成長的關鍵因素包括消費性電子產品的持續小型化、5G基礎設施的全球部署以及汽車產業的電氣化，所有這些都需要高性能黏合劑來黏合高密度電路。 SEMI報告稱，半導體封裝材料的全球銷售額（高度依賴先進的黏合技術）將在2024年成長4.7%，達到246億美元，凸顯了該行業對這些關鍵材料的強勁需求。

市場概覽
預測期 2027-2031
市場規模：2025年 52.7億美元
市場規模：2031年 82.3億美元
複合年成長率：2026-2031年 7.71%
成長最快的細分市場 環氧樹脂
最大的市場 北美洲

儘管市場呈現上升趨勢，但由於原物料價格波動，尤其是銀和環氧樹脂的價格波動，市場仍面臨許多挑戰，這可能導致製造成本難以預測的飆升。此外，嚴格的揮發性有機化合物（VOCs）環境法規也加劇了這種財務不確定性，迫使製造商投入大量資源進行產品配方調整以符合法規要求。這些要求可能會阻礙市場的快速成長，並增加供應鏈營運的複雜性。

市場促進因素

電動車 (EV) 和高級駕駛輔助系統 (ADAS) 的快速普及是電子黏合劑產業的主要驅動力，對具備熱控制和結構完整性的材料產生了顯著需求。製造商越來越依賴特定的黏合劑配方，以同時黏合電池單元、密封感測器、在惡劣的工作環境下保護電力電子設備並保持電氣絕緣。從內燃機到電動動力傳動系統的轉變從根本上改變了汽車產業的材料使用方式，並對能夠承受高電壓和熱循環的黏合劑解決方案提出了更高的要求。正如國際能源總署 (IEA) 在 2024 年 4 月發布的《2024 年全球電動車展望》中所述，預計 2024 年全球電動車銷量將接近 1700 萬輛，這預示著汽車電子組件生產的需求將顯著成長。

此外，電子設備和元件小型化的趨勢正在推動市場發展，製造商正在尋求能夠滿足高密度電路和異構整合需求的黏合劑。隨著設備尺寸越來越小，功能越來越強大，業界需要底部填充膠和導電黏合劑，以便在緊湊型半導體封裝中實現精確塗覆和高效散熱。根據半導體產業協會 (SIA) 2024 年 11 月的最新報告，全球半導體銷售額將在 2024 年 9 月達到 553 億美元，這反映出市場對需要先進黏合技術的元件的巨大需求。這種行業規模也體現在公司的業績上，漢高公司報告稱，其黏合劑技術部門在 2024 年第三季的銷售額達到 28 億歐元，凸顯了黏合劑在現代製造業中持續重要的商業性地位。

市場挑戰

全球電子黏合劑市場成長的主要障礙之一是原物料價格波動，尤其是銀和環氧樹脂等關鍵原料。由於這些材料是製造高性能導電和結構性黏著劑的必要條件，因此不可預測的成本波動會立即給生產成本帶來壓力。這種價格波動阻礙了長期定價模式的建立，降低了利潤率，使得供應商難以向電子產品製造商提供穩定的價格。因此，這種不確定性正在減緩注重成本、大量生產的製造領域對先進膠合劑解決方案的採用。

導電金屬工業需求持續成長與供應持續失衡，進一步加劇了這項經濟挑戰。根據白銀協會預測，2024年全球工業白銀需求將成長4%，達到創紀錄的6.805億盎司，將導致市場出現嚴重的結構性短缺。這種關鍵原料的明顯短缺直接限制了導電黏合劑的生產擴張。由於原物料供應緊張且價格上漲，市場難以在不承擔過高成本的情況下滿足新興產業的高需求，阻礙了整體市場擴張。

市場趨勢

隨著製造商日益轉向永續和生物基黏合劑配方，並更加重視環境保護，市場正在經歷一場變革。供應商正積極以可再生取代化石基原料，以在維持性能標準的同時減少碳足跡。這項變革的驅動力源自於原始設備製造商 (OEM) 嚴格的 ESG（環境、社會和治理）目標，這些目標要求更高的透明度和更低的排放。漢高在 2025 年 3 月發布的《2024 年永續發展報告》中指出，與 2017 年的基準相比，其每噸產品的二氧化碳排放減少了 64%，這充分展現了其致力於化學品製造脫碳的堅定決心。

同時，軟性可折疊電子設備中黏合劑的應用催生了對具有優異機械柔軟性的材料的需求。與剛性解決方案不同，這些黏合劑必須在承受OLED顯示器和可折疊智慧型手機內部反覆彎曲和熱應力的同時保持其完整性。這一趨勢正在推動對生產可彎曲組件所需基礎設施的投資。三星電子在2025年1月發布的「2024會計年度第四季及全年財務報告」中披露，其在2024年全年對顯示器部門的資本投資額已達4.8兆韓元，凸顯了其對開發高性能面板技術的雄厚財力。

目錄

第1章概述

第2章調查方法

第3章執行摘要

第4章：客戶評價

第5章 全球電子黏合劑市場展望

  • 市場規模及預測
    • 按金額
  • 市佔率及預測
    • 依樹脂類型（環氧樹脂、矽酮、聚氨酯、丙烯酸樹脂等）
    • 依形狀（液體、糊狀物、固體）
    • 依產品類型（導電黏合劑、導熱黏合劑、其他）
    • 依最終用戶產業（消費性電子、醫療、工業、運輸、航太和國防、其他）分類
    • 按地區
    • 按公司（2025 年）
  • 市場地圖

第6章 北美電子黏合劑市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 北美洲：國家分析
    • 美國
    • 加拿大
    • 墨西哥

7. 歐洲電子黏合劑市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 歐洲：國家分析
    • 德國
    • 法國
    • 英國
    • 義大利
    • 西班牙

8. 亞太地區電子黏合劑市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 亞太地區：國家分析
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳洲

9. 中東和非洲電子黏合劑市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 中東和非洲：國家分析
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 南非

第10章：南美洲電子黏合劑市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 南美洲：國家分析
    • 巴西
    • 哥倫比亞
    • 阿根廷

第11章 市場動態

  • 促進要素
  • 任務

第12章 市場趨勢與發展

  • 併購
  • 產品發布
  • 最新進展

第13章 全球電子黏合劑市場：SWOT分析

第14章：波特五力分析

  • 產業競爭
  • 新進入者的可能性
  • 供應商電力
  • 顧客權力
  • 替代品的威脅

第15章 競爭格局

  • Dymax Corporation
  • Henkel AG & Co KGaA
  • HB Fuller Company
  • 3M Company
  • Evonik Industries AG
  • Dow Corning
  • Alent Plc
  • BASF SE
  • The DOW Chemical Co.
  • HB Fuller

第16章 策略建議

第17章：關於研究公司及免責聲明

簡介目錄
Product Code: 13002

The Global Electronic Adhesives Market is projected to expand from USD 5.27 Billion in 2025 to USD 8.23 Billion by 2031, registering a CAGR of 7.71%. These specialized adhesives are engineered to establish robust structural bonds within electronic assemblies while delivering essential capabilities such as electrical conductivity, thermal regulation, and environmental protection. Major factors propelling this growth include the continuous miniaturization of consumer electronics, the worldwide rollout of 5G infrastructure, and the electrification of the automotive industry, all of which demand high-performance bonding for densely packed circuits. SEMI reported that global sales of semiconductor packaging materials, which depend heavily on advanced adhesive technologies, increased by 4.7% to reach USD 24.6 billion in 2024, highlighting the strong industrial need for these critical materials.

Market Overview
Forecast Period2027-2031
Market Size 2025USD 5.27 Billion
Market Size 2031USD 8.23 Billion
CAGR 2026-20317.71%
Fastest Growing SegmentEpoxy
Largest MarketNorth America

Despite this upward trajectory, the market faces a substantial hurdle due to fluctuating raw material prices, specifically for silver and epoxy resins, which can cause unpredictable spikes in manufacturing expenses. This financial uncertainty is frequently exacerbated by strict environmental regulations governing volatile organic compounds, compelling manufacturers to allocate significant resources toward compliant reformulations. These requirements can potentially hinder rapid market growth and add complexity to supply chain operations.

Market Driver

The rapid proliferation of electric vehicles and advanced driver-assistance systems acts as a major driver for the electronic adhesives sector, generating significant demand for materials capable of ensuring thermal control and structural integrity. Manufacturers are increasingly dependent on specific adhesive formulas to bond battery units, seal sensors, and safeguard power electronics against rigorous operating environments while preserving electrical insulation. The transition from internal combustion engines to electrified powertrains necessitates bonding solutions that can endure high voltages and thermal cycling, fundamentally altering material usage within the automotive industry. As noted in the 'Global EV Outlook 2024' by the International Energy Agency in April 2024, global electric car sales were forecast to approach 17 million units in 2024, signaling a substantial increase in production needs for automotive electronic assemblies.

Furthermore, the accelerating trend toward miniaturization in electronic devices and components boosts the market as manufacturers look for adhesives compatible with dense circuitry and heterogeneous integration. With devices becoming smaller yet more potent, the industry requires underfills and conductive adhesives that allow for precise application and efficient heat dissipation in compact semiconductor packaging. The Semiconductor Industry Association reported in its November 2024 update that global semiconductor sales reached USD 55.3 billion in September 2024, reflecting the massive volume of components needing advanced bonding technologies. This industrial scale is mirrored in corporate results, with Henkel reporting that its Adhesive Technologies unit generated sales of 2.8 billion Euros in the third quarter of 2024, emphasizing the enduring commercial importance of bonding agents in contemporary manufacturing.

Market Challenge

The main obstacle hindering the growth of the Global Electronic Adhesives Market is the price instability of raw materials, particularly critical inputs such as silver and epoxy resins. Since these materials are essential for manufacturing high-performance conductive and structural adhesives, unpredictable cost fluctuations place immediate strain on production overheads. This financial volatility interferes with long-term pricing models and reduces profit margins, making it challenging for suppliers to offer consistent pricing to electronics manufacturers. As a result, this uncertainty retards the uptake of advanced bonding solutions within cost-conscious mass production sectors.

This economic difficulty is compounded by a continuing disparity between the intense industrial demand for conductive metals and their available supply. According to the Silver Institute, global industrial demand for silver increased by 4 percent in 2024 to a record 680.5 million ounces, leading to a notable structural deficit in the market. Such a clear shortage of a primary raw material directly limits the scalability of conductive adhesive production. As raw material supplies tighten and prices rise, the market finds it difficult to satisfy the high-volume demands of emerging industries without facing prohibitive costs, which subsequently impedes overall market expansion.

Market Trends

The shift toward sustainable and bio-based adhesive formulations is transforming the market as manufacturers place a higher priority on environmental stewardship. Suppliers are actively substituting fossil-based ingredients with renewable alternatives to decrease carbon footprints while maintaining performance standards. This evolution is propelled by strict ESG goals from OEMs that require greater transparency and lower emissions. In its March 2025 'Sustainability Report 2024', Henkel announced it had reduced CO2 emissions in production per ton of product by 64 percent compared to the 2017 baseline, demonstrating a strong commitment to decarbonizing chemical manufacturing.

Concurrently, the incorporation of adhesives into flexible and foldable electronic devices is generating a need for materials that possess superior mechanical flexibility. In contrast to rigid solutions, these adhesives are required to endure repeated bending and thermal stress while preserving their integrity within OLED displays and foldable smartphones. This trend is spurring investment in the infrastructure needed to produce bendable components. Samsung Electronics revealed in its 'Fourth Quarter and FY 2024 Results' report from January 2025 that the company invested KRW 4.8 trillion in capital expenditures for its Display division throughout 2024, highlighting the financial dedication to progressing high-performance panel technologies.

Key Market Players

  • Dymax Corporation
  • Henkel AG & Co KGaA
  • H.B. Fuller Company
  • 3M Company
  • Evonik Industries AG
  • Dow Corning
  • Alent Plc
  • BASF SE
  • The DOW Chemical Co.
  • H.B. Fuller

Report Scope

In this report, the Global Electronic Adhesives Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Electronic Adhesives Market, By Resin Type

  • Epoxy
  • Silicone
  • Polyurethane
  • Acrylic
  • Others

Electronic Adhesives Market, By Form

  • Liquid
  • Paste
  • Solid

Electronic Adhesives Market, By Product Type

  • Electrically Conductive Adhesives
  • Thermally Conductive Adhesives
  • Others

Electronic Adhesives Market, By End User Industry

  • Consumer Electronics
  • Medical
  • Industrial
  • Transportation
  • Aerospace & Defense
  • Others

Electronic Adhesives Market, By Region

  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • France
    • United Kingdom
    • Italy
    • Germany
    • Spain
  • Asia Pacific
    • China
    • India
    • Japan
    • Australia
    • South Korea
  • South America
    • Brazil
    • Argentina
    • Colombia
  • Middle East & Africa
    • South Africa
    • Saudi Arabia
    • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Electronic Adhesives Market.

Available Customizations:

Global Electronic Adhesives Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

  • 1.1. Market Definition
  • 1.2. Scope of the Market
    • 1.2.1. Markets Covered
    • 1.2.2. Years Considered for Study
    • 1.2.3. Key Market Segmentations

2. Research Methodology

  • 2.1. Objective of the Study
  • 2.2. Baseline Methodology
  • 2.3. Key Industry Partners
  • 2.4. Major Association and Secondary Sources
  • 2.5. Forecasting Methodology
  • 2.6. Data Triangulation & Validation
  • 2.7. Assumptions and Limitations

3. Executive Summary

  • 3.1. Overview of the Market
  • 3.2. Overview of Key Market Segmentations
  • 3.3. Overview of Key Market Players
  • 3.4. Overview of Key Regions/Countries
  • 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Electronic Adhesives Market Outlook

  • 5.1. Market Size & Forecast
    • 5.1.1. By Value
  • 5.2. Market Share & Forecast
    • 5.2.1. By Resin Type (Epoxy, Silicone, Polyurethane, Acrylic, Others)
    • 5.2.2. By Form (Liquid, Paste, Solid)
    • 5.2.3. By Product Type (Electrically Conductive Adhesives, Thermally Conductive Adhesives, Others)
    • 5.2.4. By End User Industry (Consumer Electronics, Medical, Industrial, Transportation, Aerospace & Defense, Others)
    • 5.2.5. By Region
    • 5.2.6. By Company (2025)
  • 5.3. Market Map

6. North America Electronic Adhesives Market Outlook

  • 6.1. Market Size & Forecast
    • 6.1.1. By Value
  • 6.2. Market Share & Forecast
    • 6.2.1. By Resin Type
    • 6.2.2. By Form
    • 6.2.3. By Product Type
    • 6.2.4. By End User Industry
    • 6.2.5. By Country
  • 6.3. North America: Country Analysis
    • 6.3.1. United States Electronic Adhesives Market Outlook
      • 6.3.1.1. Market Size & Forecast
        • 6.3.1.1.1. By Value
      • 6.3.1.2. Market Share & Forecast
        • 6.3.1.2.1. By Resin Type
        • 6.3.1.2.2. By Form
        • 6.3.1.2.3. By Product Type
        • 6.3.1.2.4. By End User Industry
    • 6.3.2. Canada Electronic Adhesives Market Outlook
      • 6.3.2.1. Market Size & Forecast
        • 6.3.2.1.1. By Value
      • 6.3.2.2. Market Share & Forecast
        • 6.3.2.2.1. By Resin Type
        • 6.3.2.2.2. By Form
        • 6.3.2.2.3. By Product Type
        • 6.3.2.2.4. By End User Industry
    • 6.3.3. Mexico Electronic Adhesives Market Outlook
      • 6.3.3.1. Market Size & Forecast
        • 6.3.3.1.1. By Value
      • 6.3.3.2. Market Share & Forecast
        • 6.3.3.2.1. By Resin Type
        • 6.3.3.2.2. By Form
        • 6.3.3.2.3. By Product Type
        • 6.3.3.2.4. By End User Industry

7. Europe Electronic Adhesives Market Outlook

  • 7.1. Market Size & Forecast
    • 7.1.1. By Value
  • 7.2. Market Share & Forecast
    • 7.2.1. By Resin Type
    • 7.2.2. By Form
    • 7.2.3. By Product Type
    • 7.2.4. By End User Industry
    • 7.2.5. By Country
  • 7.3. Europe: Country Analysis
    • 7.3.1. Germany Electronic Adhesives Market Outlook
      • 7.3.1.1. Market Size & Forecast
        • 7.3.1.1.1. By Value
      • 7.3.1.2. Market Share & Forecast
        • 7.3.1.2.1. By Resin Type
        • 7.3.1.2.2. By Form
        • 7.3.1.2.3. By Product Type
        • 7.3.1.2.4. By End User Industry
    • 7.3.2. France Electronic Adhesives Market Outlook
      • 7.3.2.1. Market Size & Forecast
        • 7.3.2.1.1. By Value
      • 7.3.2.2. Market Share & Forecast
        • 7.3.2.2.1. By Resin Type
        • 7.3.2.2.2. By Form
        • 7.3.2.2.3. By Product Type
        • 7.3.2.2.4. By End User Industry
    • 7.3.3. United Kingdom Electronic Adhesives Market Outlook
      • 7.3.3.1. Market Size & Forecast
        • 7.3.3.1.1. By Value
      • 7.3.3.2. Market Share & Forecast
        • 7.3.3.2.1. By Resin Type
        • 7.3.3.2.2. By Form
        • 7.3.3.2.3. By Product Type
        • 7.3.3.2.4. By End User Industry
    • 7.3.4. Italy Electronic Adhesives Market Outlook
      • 7.3.4.1. Market Size & Forecast
        • 7.3.4.1.1. By Value
      • 7.3.4.2. Market Share & Forecast
        • 7.3.4.2.1. By Resin Type
        • 7.3.4.2.2. By Form
        • 7.3.4.2.3. By Product Type
        • 7.3.4.2.4. By End User Industry
    • 7.3.5. Spain Electronic Adhesives Market Outlook
      • 7.3.5.1. Market Size & Forecast
        • 7.3.5.1.1. By Value
      • 7.3.5.2. Market Share & Forecast
        • 7.3.5.2.1. By Resin Type
        • 7.3.5.2.2. By Form
        • 7.3.5.2.3. By Product Type
        • 7.3.5.2.4. By End User Industry

8. Asia Pacific Electronic Adhesives Market Outlook

  • 8.1. Market Size & Forecast
    • 8.1.1. By Value
  • 8.2. Market Share & Forecast
    • 8.2.1. By Resin Type
    • 8.2.2. By Form
    • 8.2.3. By Product Type
    • 8.2.4. By End User Industry
    • 8.2.5. By Country
  • 8.3. Asia Pacific: Country Analysis
    • 8.3.1. China Electronic Adhesives Market Outlook
      • 8.3.1.1. Market Size & Forecast
        • 8.3.1.1.1. By Value
      • 8.3.1.2. Market Share & Forecast
        • 8.3.1.2.1. By Resin Type
        • 8.3.1.2.2. By Form
        • 8.3.1.2.3. By Product Type
        • 8.3.1.2.4. By End User Industry
    • 8.3.2. India Electronic Adhesives Market Outlook
      • 8.3.2.1. Market Size & Forecast
        • 8.3.2.1.1. By Value
      • 8.3.2.2. Market Share & Forecast
        • 8.3.2.2.1. By Resin Type
        • 8.3.2.2.2. By Form
        • 8.3.2.2.3. By Product Type
        • 8.3.2.2.4. By End User Industry
    • 8.3.3. Japan Electronic Adhesives Market Outlook
      • 8.3.3.1. Market Size & Forecast
        • 8.3.3.1.1. By Value
      • 8.3.3.2. Market Share & Forecast
        • 8.3.3.2.1. By Resin Type
        • 8.3.3.2.2. By Form
        • 8.3.3.2.3. By Product Type
        • 8.3.3.2.4. By End User Industry
    • 8.3.4. South Korea Electronic Adhesives Market Outlook
      • 8.3.4.1. Market Size & Forecast
        • 8.3.4.1.1. By Value
      • 8.3.4.2. Market Share & Forecast
        • 8.3.4.2.1. By Resin Type
        • 8.3.4.2.2. By Form
        • 8.3.4.2.3. By Product Type
        • 8.3.4.2.4. By End User Industry
    • 8.3.5. Australia Electronic Adhesives Market Outlook
      • 8.3.5.1. Market Size & Forecast
        • 8.3.5.1.1. By Value
      • 8.3.5.2. Market Share & Forecast
        • 8.3.5.2.1. By Resin Type
        • 8.3.5.2.2. By Form
        • 8.3.5.2.3. By Product Type
        • 8.3.5.2.4. By End User Industry

9. Middle East & Africa Electronic Adhesives Market Outlook

  • 9.1. Market Size & Forecast
    • 9.1.1. By Value
  • 9.2. Market Share & Forecast
    • 9.2.1. By Resin Type
    • 9.2.2. By Form
    • 9.2.3. By Product Type
    • 9.2.4. By End User Industry
    • 9.2.5. By Country
  • 9.3. Middle East & Africa: Country Analysis
    • 9.3.1. Saudi Arabia Electronic Adhesives Market Outlook
      • 9.3.1.1. Market Size & Forecast
        • 9.3.1.1.1. By Value
      • 9.3.1.2. Market Share & Forecast
        • 9.3.1.2.1. By Resin Type
        • 9.3.1.2.2. By Form
        • 9.3.1.2.3. By Product Type
        • 9.3.1.2.4. By End User Industry
    • 9.3.2. UAE Electronic Adhesives Market Outlook
      • 9.3.2.1. Market Size & Forecast
        • 9.3.2.1.1. By Value
      • 9.3.2.2. Market Share & Forecast
        • 9.3.2.2.1. By Resin Type
        • 9.3.2.2.2. By Form
        • 9.3.2.2.3. By Product Type
        • 9.3.2.2.4. By End User Industry
    • 9.3.3. South Africa Electronic Adhesives Market Outlook
      • 9.3.3.1. Market Size & Forecast
        • 9.3.3.1.1. By Value
      • 9.3.3.2. Market Share & Forecast
        • 9.3.3.2.1. By Resin Type
        • 9.3.3.2.2. By Form
        • 9.3.3.2.3. By Product Type
        • 9.3.3.2.4. By End User Industry

10. South America Electronic Adhesives Market Outlook

  • 10.1. Market Size & Forecast
    • 10.1.1. By Value
  • 10.2. Market Share & Forecast
    • 10.2.1. By Resin Type
    • 10.2.2. By Form
    • 10.2.3. By Product Type
    • 10.2.4. By End User Industry
    • 10.2.5. By Country
  • 10.3. South America: Country Analysis
    • 10.3.1. Brazil Electronic Adhesives Market Outlook
      • 10.3.1.1. Market Size & Forecast
        • 10.3.1.1.1. By Value
      • 10.3.1.2. Market Share & Forecast
        • 10.3.1.2.1. By Resin Type
        • 10.3.1.2.2. By Form
        • 10.3.1.2.3. By Product Type
        • 10.3.1.2.4. By End User Industry
    • 10.3.2. Colombia Electronic Adhesives Market Outlook
      • 10.3.2.1. Market Size & Forecast
        • 10.3.2.1.1. By Value
      • 10.3.2.2. Market Share & Forecast
        • 10.3.2.2.1. By Resin Type
        • 10.3.2.2.2. By Form
        • 10.3.2.2.3. By Product Type
        • 10.3.2.2.4. By End User Industry
    • 10.3.3. Argentina Electronic Adhesives Market Outlook
      • 10.3.3.1. Market Size & Forecast
        • 10.3.3.1.1. By Value
      • 10.3.3.2. Market Share & Forecast
        • 10.3.3.2.1. By Resin Type
        • 10.3.3.2.2. By Form
        • 10.3.3.2.3. By Product Type
        • 10.3.3.2.4. By End User Industry

11. Market Dynamics

  • 11.1. Drivers
  • 11.2. Challenges

12. Market Trends & Developments

  • 12.1. Merger & Acquisition (If Any)
  • 12.2. Product Launches (If Any)
  • 12.3. Recent Developments

13. Global Electronic Adhesives Market: SWOT Analysis

14. Porter's Five Forces Analysis

  • 14.1. Competition in the Industry
  • 14.2. Potential of New Entrants
  • 14.3. Power of Suppliers
  • 14.4. Power of Customers
  • 14.5. Threat of Substitute Products

15. Competitive Landscape

  • 15.1. Dymax Corporation
    • 15.1.1. Business Overview
    • 15.1.2. Products & Services
    • 15.1.3. Recent Developments
    • 15.1.4. Key Personnel
    • 15.1.5. SWOT Analysis
  • 15.2. Henkel AG & Co KGaA
  • 15.3. H.B. Fuller Company
  • 15.4. 3M Company
  • 15.5. Evonik Industries AG
  • 15.6. Dow Corning
  • 15.7. Alent Plc
  • 15.8. BASF SE
  • 15.9. The DOW Chemical Co.
  • 15.10. H.B. Fuller

16. Strategic Recommendations

17. About Us & Disclaimer