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1786802

半導體組裝·包裝設備的全球市場，規模，佔有率，趨勢，產業分析報告:各產品，各包裝類型，各最終用途，各地區 - 市場預測，2025年～2034年

Semiconductor Assembly and Packaging Equipment Market Size, Share, Trends, Industry Analysis Report By Product (Dicing Equipment, Bonding Equipment), By Packaging Type, By End Use, By Region - Market Forecast, 2025-2034
出版日期: | 出版商: Polaris Market Research | 英文 129 Pages | 商品交期: 最快1-2個工作天內

價格

根據 Polaris Market Research 的最新研究，預計到 2034 年，半導體組裝和封裝設備市場規模將達到 84.8 億美元。本研究報告深入分析了當前的市場動態，並分析了未來的市場成長。

半導體組裝和封裝設備是指在半導體製造的最後階段使用的精密機械，用於連接和保護單個晶片，並為其整合到電子系統中做好準備。該市場的發展受到柔性封裝技術的快速發展所驅動，這些技術旨在提高晶片性能、提高能源效率並實現小型化。隨著最終用途對更小尺寸、更強大功能的需求，2.5D/3D 整合和系統級封裝 (SiP) 等技術的採用正在加速，這促使設備製造商不斷創新並擴展其產能，以滿足這些複雜的封裝要求。

組裝和封裝製程的自動化和數位化程度不斷提高，將進一步推動對半導體組裝和封裝設備的需求。隨著半導體製造的複雜性和規模不斷增長，各大公司正在投資智慧、高通量設備，這些設備支援精確對準、即時監控和數據驅動的最佳化。這種轉變提高了生產效率和良率，同時也順應了產業向智慧製造環境的轉型。因此，自動化正成為企業保持競爭力並滿足快速發展的新興技術需求的核心策略。

半導體組裝與封裝設備市場報告要點

按封裝類型劃分，鍵合設備將在2024年佔最大的收入佔有率，這得益於其在半導體裝置小型化和先進封裝性能方面的關鍵作用。

按最終用途劃分，OSAT（封測）細分市場預計將成為成長最快的細分市場，這得益於無晶圓廠半導體公司的崛起以及向外包後端處理的轉變。

北美半導體組裝和封裝設備市場預計將經歷顯著成長，這主要得益於對技術創新和高科技製造能力的關注。

在強大的半導體生態系統和對下一代封裝基礎設施的重點投資的推動下，亞太地區將在2024年引領全球市場。

半導體組裝和封裝設備市場的全球領先公司包括應用材料公司、ASM Pacific Technology、Besi、Disco Corporation、Kulicke & Soffa Industries, Inc. (K&S)、尼康公司、Plasma-Therm、Rudolph Technologies, Inc.、SCREEN Semiconductor Solutions Co., Ltd. 和 SUSS MicroT Ltd. SEec。

目錄

第1章 簡介

第2章 摘要整理

第3章 調查手法

第4章 全球半導體組裝·包裝設備市場洞察

  • 市場概述
  • 半導體組裝·包裝設備市場動態
    • 促進因素和機會
      • 對先進技術和自動化的投資不斷增加
      • 人工智慧、物聯網和 5G 設備的採用日益普及
    • 限制因素與課題
      • 高資本投入與技術複雜性
    • 公眾輿論與隱私先例
  • PESTEL分析
  • 半導體組裝·包裝設備市場趨勢
  • 價值鏈分析

第5章 全球半導體組裝·包裝設備市場:各產品

  • 主要調查結果
  • 簡介
  • 切割設備
  • 綁定設備
  • 包裝設備
  • 其他

第6章 全球半導體組裝·包裝設備市場:各包裝類型

  • 主要調查結果
  • 簡介
  • 覆晶構裝設備
  • WLP設備
  • FO包裝設備
  • SiP設備
  • 3D/2.5D包裝設備
  • 其他

第7章 全球半導體組裝·包裝設備市場:各最終用途

  • 主要調查結果
  • 簡介
  • IDM
  • OSAT

第8章 全球半導體組裝·包裝設備市場:各地區

  • 主要調查結果
  • 簡介
    • 半導體組裝·包裝設備市場分析:各地區，2020～2034年
  • 北美
    • 北美:各產品，2020～2034年
    • 北美:各包裝類型，2020～2034年
    • 北美:各最終用途，2020～2034年
    • 美國
    • 加拿大
  • 歐洲
    • 歐洲:各產品，2020～2034年
    • 歐洲:各包裝類型，2020～2034年
    • 歐洲:各最終用途，2020～2034年
    • 英國
    • 法國
    • 德國
    • 義大利
    • 西班牙
    • 荷蘭
    • 俄羅斯
    • 其他歐洲
  • 亞太地區
    • 亞太地區:各產品，2020～2034年
    • 亞太地區:各包裝類型，2020～2034年
    • 亞太地區:各最終用途，2020～2034年
    • 中國
    • 印度
    • 馬來西亞
    • 日本
    • 印尼
    • 韓國
    • 澳洲
    • 其他亞太地區
  • 中東·非洲
    • 中東·非洲:各產品，2020～2034年
    • 中東·非洲:各包裝類型，2020～2034年
    • 中東·非洲:各最終用途，2020～2034年
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 以色列
    • 南非
    • 其他中東·非洲
  • 南美
    • 南美:各產品，2020～2034年
    • 南美:各包裝類型，2020～2034年
    • 南美:各最終用途，2020～2034年
    • 墨西哥
    • 巴西
    • 阿根廷
    • 其他南美國家

第9章 競爭情形

  • 擴大和收購的分析
    • 擴大
    • 收購
  • 聯盟/合作/協定/公開

第10章 企業簡介

  • Applied Materials
  • ASM Pacific Technology
  • Besi
  • Disco Corporation
  • Kulicke & Soffa Industries, Inc.(K&S)
  • Nikon Corporation
  • Plasma-Therm
  • Rudolph Technologies, Inc.
  • SCREEN Semiconductor Solutions Co., Ltd.
  • SUSS MicroTec SE
Product Code: PM6134

The semiconductor Assembly and Packaging Equipment market size is expected to reach USD 8.48 billion by 2034, according to a new study by Polaris Market Research. The report "Semiconductor Assembly and Packaging Equipment Market Share, Size, Trends, Industry Analysis Report By Product (Dicing Equipment, Bonding Equipment), By Packaging Type, By End Use, By Region; Market Forecast, 2025-2034" gives a detailed insight into current market dynamics and provides analysis on future market growth.

Semiconductor assembly and packaging equipment refers to precision machinery used in the final stages of semiconductor manufacturing, where individual chips are connected, protected, and prepared for integration into electronic systems. This market is driven by the rapid evolution of flexible packaging techniques that aim to enhance chip performance, power efficiency, and miniaturization. The adoption of technologies such as 2.5D/3D integration and system-in-package is accelerating as end-use applications demand greater functionality in smaller form factors, driving equipment manufacturers to innovate and expand their capabilities to meet these complex packaging requirements.

The increasing automation and digitalization of assembly and packaging processes further drive demand for semiconductor assembly and packaging equipment. Companies are investing in intelligent, high-throughput equipment that supports precise alignment, real-time monitoring, and data-driven optimization as semiconductor manufacturing continues to grow in complexity and scale. This shift enhances production efficiency and yield while also aligning with the industry's transition toward smart manufacturing environments. As a result, automation is becoming a core strategy for players aiming to maintain competitiveness and meet the rapidly evolving demands of emerging technologies.

Semiconductor Assembly and Packaging Equipment Market Report Highlights

In terms of packaging type, the bonding equipment segment held the largest revenue share in 2024, as it plays a major role in advancing semiconductor device miniaturization and performance.

Based on end use, the OSAT segment is projected to grow the fastest, fueled by the rise of fabless semiconductor companies and the shift toward outsourcing back-end processes.

The North America semiconductor assembly and packaging equipment market is set for significant growth, supported by its focus on innovation and high-tech manufacturing capabilities.

Asia Pacific led the global market in 2024, owing to its robust semiconductor ecosystem and heavy investments in next-gen packaging infrastructure.

A few global key players in the semiconductor assembly and packaging equipment market include Applied Materials; ASM Pacific Technology; Besi; Disco Corporation; Kulicke & Soffa Industries, Inc. (K&S); Nikon Corporation; Plasma-Therm; Rudolph Technologies, Inc.; SCREEN Semiconductor Solutions Co., Ltd.; and SUSS MicroTec SE.

Polaris Market Research has segmented the semiconductor assembly and packaging equipment market report on the basis of product, packaging type, end use, and region:

By Product Outlook (Revenue, USD Billion, 2020-2034)

Dicing Equipment

Scriber

Dicer

Wafer Mounting Equipment

Bonding Equipment

Die Bonder

Wire Bonder

Others

Packaging Equipment

Molding Equipment

Solder Plating Equipment

Deflasher

Others

Others

By Packaging Type Outlook (Revenue, USD Billion, 2020-2034)

Flip Chip Packaging Equipment

Wafer Level Packaging (WLP) Equipment

Fan-Out Packaging Equipment

System-in-Package (SiP) Equipment

3D/2.5D Packaging Equipment

Others

By End Use Outlook (Revenue, USD Billion, 2020-2034)

IDMs (Integrated Device Manufacturers)

OSAT (Outsourced Semiconductor Assembly and Test)

By Regional Outlook (Revenue, USD Billion, 2020-2034)

North America

U.S.

Canada

Europe

Germany

UK

France

Italy

Spain

Russia

Netherlands

Rest of Europe

Asia Pacific

China

India

Japan

South Korea

Indonesia

Malaysia

Vietnam

Australia

Rest of Asia Pacific

Latin America

Argentina

Brazil

Mexico

Rest of Latin America

Middle East & Africa

UAE

Saudi Arabia

Israel

South Africa

Rest of Middle East & Africa

Table of Contents

1. Introduction

  • 1.1. Report Description
    • 1.1.1. Objectives of the Study
    • 1.1.2. Market Scope
    • 1.1.3. Assumptions
  • 1.2. Stakeholders

2. Executive Summary

  • 2.1. Market Highlights

3. Research Methodology

  • 3.1. Overview
    • 3.1.1. Data Mining
  • 3.2. Data Sources
    • 3.2.1. Primary Sources
    • 3.2.2. Secondary Sources

4. Global Semiconductor Assembly and Packaging Equipment Market Insights

  • 4.1. Semiconductor Assembly and Packaging Equipment Market - Market Snapshot
  • 4.2. Semiconductor Assembly and Packaging Equipment Market Dynamics
    • 4.2.1. Drivers and Opportunities
      • 4.2.1.1. Increasing Investment in Advancement and Automation
      • 4.2.1.2. Rising Adoption of AI, IoT, and 5G-Enabled Devices
    • 4.2.2. Restraints and Challenges
      • 4.2.2.1. High Capital Investment and Technological Complexity
    • 4.2.3. Public opinion and privacy legal precedents
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers (Moderate)
    • 4.3.2. Threats of New Entrants: (Low)
    • 4.3.3. Bargaining Power of Buyers (Moderate)
    • 4.3.4. Threat of Substitute (Moderate)
    • 4.3.5. Rivalry among existing firms (High)
  • 4.4. PESTEL Analysis
  • 4.5. Semiconductor Assembly and Packaging Equipment Market Trends
  • 4.6. Value Chain Analysis

5. Global Semiconductor Assembly and Packaging Equipment Market, By Product

  • 5.1. Key Findings
  • 5.2. Introduction
    • 5.2.1. Global Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • 5.3. Dicing Equipment
    • 5.3.1. Global Semiconductor Assembly and Packaging Equipment Market, by Dicing Equipment, by Region, 2020-2034 (USD Billion)
    • 5.3.2. Scriber
      • 5.3.2.1. Global Semiconductor Assembly and Packaging Equipment Market, by Scriber, by Region, 2020-2034 (USD Billion)
    • 5.3.3. Dicer
      • 5.3.3.1. Global Semiconductor Assembly and Packaging Equipment Market, by Dicer, by Region, 2020-2034 (USD Billion)
    • 5.3.4. Wafer Mounting Equipment
      • 5.3.4.1. Global Semiconductor Assembly and Packaging Equipment Market, by Wafer Mounting Equipment, by Region, 2020-2034 (USD Billion)
  • 5.4. Bonding Equipment
    • 5.4.1. Global Semiconductor Assembly and Packaging Equipment Market, by Bonding Equipment, by Region, 2020-2034 (USD Billion)
    • 5.4.2. Die Bonder
      • 5.4.2.1. Global Semiconductor Assembly and Packaging Equipment Market, by Die Bonder, by Region, 2020-2034 (USD Billion)
    • 5.4.3. Wire Bonder
      • 5.4.3.1. Global Semiconductor Assembly and Packaging Equipment Market, by Wire Bonder, by Region, 2020-2034 (USD Billion)
    • 5.4.4. Others
      • 5.4.4.1. Global Semiconductor Assembly and Packaging Equipment Market, by Others, by Region, 2020-2034 (USD Billion)
  • 5.5. Packaging Equipment
    • 5.5.1. Global Semiconductor Assembly and Packaging Equipment Market, by Packaging Equipment, by Region, 2020-2034 (USD Billion)
    • 5.5.2. Molding Equipment
      • 5.5.2.1. Global Semiconductor Assembly and Packaging Equipment Market, by Molding Equipment, by Region, 2020-2034 (USD Billion)
    • 5.5.3. Solder Plating Equipment
      • 5.5.3.1. Global Semiconductor Assembly and Packaging Equipment Market, by Solder Plating Equipment, by Region, 2020-2034 (USD Billion)
    • 5.5.4. Deflasher
      • 5.5.4.1. Global Semiconductor Assembly and Packaging Equipment Market, by Deflasher, by Region, 2020-2034 (USD Billion)
    • 5.5.5. Others
      • 5.5.5.1. Global Semiconductor Assembly and Packaging Equipment Market, by Others, by Region, 2020-2034 (USD Billion)
  • 5.6. Others
    • 5.6.1. Global Semiconductor Assembly and Packaging Equipment Market, by Others, by Region, 2020-2034 (USD Billion)

6. Global Semiconductor Assembly and Packaging Equipment Market, by Packaging Type

  • 6.1. Key Findings
  • 6.2. Introduction
    • 6.2.1. Global Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • 6.3. Flip Chip Packaging Equipment
    • 6.3.1. Global Semiconductor Assembly and Packaging Equipment Market, by Flip Chip Packaging Equipment, by Region, 2020-2034 (USD Billion)
  • 6.4. Wafer Level Packaging (WLP) Equipment
    • 6.4.1. Global Semiconductor Assembly and Packaging Equipment Market, by Wafer Level Packaging (WLP) Equipment, by Region, 2020-2034 (USD Billion)
  • 6.5. Fan-Out Packaging Equipment
    • 6.5.1. Global Semiconductor Assembly and Packaging Equipment Market, by Fan-Out Packaging Equipment, by Region, 2020-2034 (USD Billion)
  • 6.6. System-in-Package (SiP) Equipment
    • 6.6.1. Global Semiconductor Assembly and Packaging Equipment Market, by System-in-Package (SiP) Equipment, by Region, 2020-2034 (USD Billion)
  • 6.7. 3D/2.5D Packaging Equipment
    • 6.7.1. Global Semiconductor Assembly and Packaging Equipment Market, by 3D/2.5D Packaging Equipment, by Region, 2020-2034 (USD Billion)
  • 6.8. Others
    • 6.8.1. Global Semiconductor Assembly and Packaging Equipment Market, by Others, by Region, 2020-2034 (USD Billion)

7. Global Semiconductor Assembly and Packaging Equipment Market, by End Use

  • 7.1. Key Findings
  • 7.2. Introduction
    • 7.2.1. Global Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 7.3. IDMs (Integrated Device Manufacturers)
    • 7.3.1. Global Semiconductor Assembly and Packaging Equipment Market, by IDMs (Integrated Device Manufacturers), by Region, 2020-2034 (USD Billion)
  • 7.4. OSAT (Outsourced Semiconductor Assembly and Test)
    • 7.4.1. Global Semiconductor Assembly and Packaging Equipment Market, by OSAT (Outsourced Semiconductor Assembly and Test), by Region, 2020-2034 (USD Billion)

8. Global Semiconductor Assembly and Packaging Equipment Market, by Geography

  • 8.1. Key Findings
  • 8.2. Introduction
    • 8.2.1. Semiconductor Assembly and Packaging Equipment Market Assessment, By Geography, 2020-2034 (USD Billion)
  • 8.3. Semiconductor Assembly and Packaging Equipment Market - North America
    • 8.3.1. North America: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.3.2. North America: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.3.3. North America: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.3.4. Semiconductor Assembly and Packaging Equipment Market - US
      • 8.3.4.1. US: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.3.4.2. US: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.3.4.3. US: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.3.5. Semiconductor Assembly and Packaging Equipment Market - Canada
      • 8.3.5.1. Canada: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.3.5.2. Canada: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.3.5.3. Canada: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.4. Semiconductor Assembly and Packaging Equipment Market - Europe
    • 8.4.1. Europe: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.4.2. Europe: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.4.3. Europe: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.4.4. Semiconductor Assembly and Packaging Equipment Market - UK
      • 8.4.4.1. UK: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.4.4.2. UK: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.4.4.3. UK: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.4.5. Semiconductor Assembly and Packaging Equipment Market - France
      • 8.4.5.1. France: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.4.5.2. France: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.4.5.3. France: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.4.6. Semiconductor Assembly and Packaging Equipment Market - Germany
      • 8.4.6.1. Germany: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.4.6.2. Germany: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.4.6.3. Germany: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.4.7. Semiconductor Assembly and Packaging Equipment Market - Italy
      • 8.4.7.1. Italy: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.4.7.2. Italy: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.4.7.3. Italy: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.4.8. Semiconductor Assembly and Packaging Equipment Market - Spain
      • 8.4.8.1. Spain: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.4.8.2. Spain: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.4.8.3. Spain: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.4.9. Semiconductor Assembly and Packaging Equipment Market - Netherlands
      • 8.4.9.1. Netherlands: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.4.9.2. Netherlands: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.4.9.3. Netherlands: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.4.10. Semiconductor Assembly and Packaging Equipment Market - Russia
      • 8.4.10.1. Russia: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.4.10.2. Russia: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.4.10.3. Russia: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.4.11. Semiconductor Assembly and Packaging Equipment Market - Rest of Europe
      • 8.4.11.1. Rest of Europe: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.4.11.2. Rest of Europe: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.4.11.3. Rest of Europe: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.5. Semiconductor Assembly and Packaging Equipment Market - Asia Pacific
    • 8.5.1. Asia Pacific: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.5.2. Asia Pacific: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.5.3. Asia Pacific: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.5.4. Semiconductor Assembly and Packaging Equipment Market - China
      • 8.5.4.1. China: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.5.4.2. China: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.5.4.3. China: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.5.5. Semiconductor Assembly and Packaging Equipment Market - India
      • 8.5.5.1. India: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.5.5.2. India: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.5.5.3. India: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.5.6. Semiconductor Assembly and Packaging Equipment Market - Malaysia
      • 8.5.6.1. Malaysia: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.5.6.2. Malaysia: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.5.6.3. Malaysia: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.5.7. Semiconductor Assembly and Packaging Equipment Market - Japan
      • 8.5.7.1. Japan: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.5.7.2. Japan: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.5.7.3. Japan: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.5.8. Semiconductor Assembly and Packaging Equipment Market - Indonesia
      • 8.5.8.1. Indonesia: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.5.8.2. Indonesia: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.5.8.3. Indonesia: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.5.9. Semiconductor Assembly and Packaging Equipment Market - South Korea
      • 8.5.9.1. South Korea: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.5.9.2. South Korea: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.5.9.3. South Korea: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.5.10. Semiconductor Assembly and Packaging Equipment Market - Australia
      • 8.5.10.1. Australia: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.5.10.2. Australia: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.5.10.3. Australia: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.5.11. Semiconductor Assembly and Packaging Equipment Market - Rest of Asia Pacific
      • 8.5.11.1. Rest of Asia Pacific: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.5.11.2. Rest of Asia Pacific: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.5.11.3. Rest of Asia Pacific: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.6. Semiconductor Assembly and Packaging Equipment Market - Middle East & Africa
    • 8.6.1. Middle East & Africa: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.6.2. Middle East & Africa: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.6.3. Middle East & Africa: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.6.4. Semiconductor Assembly and Packaging Equipment Market - Saudi Arabia
      • 8.6.4.1. Saudi Arabia: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.6.4.2. Saudi Arabia: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.6.4.3. Saudi Arabia: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.6.5. Semiconductor Assembly and Packaging Equipment Market - UAE
      • 8.6.5.1. UAE: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.6.5.2. UAE: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.6.5.3. UAE: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.6.6. Semiconductor Assembly and Packaging Equipment Market - Israel
      • 8.6.6.1. Israel: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.6.6.2. Israel: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.6.6.3. Israel: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.6.7. Semiconductor Assembly and Packaging Equipment Market - South Africa
      • 8.6.7.1. South Africa: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.6.7.2. South Africa: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.6.7.3. South Africa: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.6.8. Semiconductor Assembly and Packaging Equipment Market - Rest of Middle East & Africa
      • 8.6.8.1. Rest of Middle East & Africa: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.6.8.2. Rest of Middle East & Africa: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.6.8.3. Rest of Middle East & Africa: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.7. Semiconductor Assembly and Packaging Equipment Market - Latin America
    • 8.7.1. Latin America: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.7.2. Latin America: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.7.3. Latin America: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.7.4. Semiconductor Assembly and Packaging Equipment Market - Mexico
      • 8.7.4.1. Mexico: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.7.4.2. Mexico: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.7.4.3. Mexico: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.7.5. Semiconductor Assembly and Packaging Equipment Market - Brazil
      • 8.7.5.1. Brazil: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.7.5.2. Brazil: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.7.5.3. Brazil: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.7.6. Semiconductor Assembly and Packaging Equipment Market - Argentina
      • 8.7.6.1. Argentina: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.7.6.2. Argentina: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.7.6.3. Argentina: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
    • 8.7.7. Semiconductor Assembly and Packaging Equipment Market - Rest of Latin America
      • 8.7.7.1. Rest of Latin America: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
      • 8.7.7.2. Rest of Latin America: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
      • 8.7.7.3. Rest of Latin America: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)

9. Competitive Landscape

  • 9.1. Expansion and Acquisition Analysis
    • 9.1.1. Expansion
    • 9.1.2. Acquisitions
  • 9.2. Partnerships/Collaborations/Agreements/Exhibitions

10. Company Profiles

  • 10.1. Applied Materials
    • 10.1.1. Company Overview
    • 10.1.2. Financial Performance
    • 10.1.3. Product Benchmarking
    • 10.1.4. Recent Development
  • 10.2. ASM Pacific Technology
    • 10.2.1. Company Overview
    • 10.2.2. Financial Performance
    • 10.2.3. Product Benchmarking
    • 10.2.4. Recent Development
  • 10.3. Besi
    • 10.3.1. Company Overview
    • 10.3.2. Financial Performance
    • 10.3.3. Product Benchmarking
    • 10.3.4. Recent Development
  • 10.4. Disco Corporation
    • 10.4.1. Company Overview
    • 10.4.2. Financial Performance
    • 10.4.3. Product Benchmarking
    • 10.4.4. Recent Development
  • 10.5. Kulicke & Soffa Industries, Inc. (K&S)
    • 10.5.1. Company Overview
    • 10.5.2. Financial Performance
    • 10.5.3. Product Benchmarking
    • 10.5.4. Recent Development
  • 10.6. Nikon Corporation
    • 10.6.1. Company Overview
    • 10.6.2. Financial Performance
    • 10.6.3. Product Benchmarking
    • 10.6.4. Recent Development
  • 10.7. Plasma-Therm
    • 10.7.1. Company Overview
    • 10.7.2. Financial Performance
    • 10.7.3. Product Benchmarking
    • 10.7.4. Recent Development
  • 10.8. Rudolph Technologies, Inc.
    • 10.8.1. Company Overview
    • 10.8.2. Financial Performance
    • 10.8.3. Product Benchmarking
    • 10.8.4. Recent Development
  • 10.9. SCREEN Semiconductor Solutions Co., Ltd.
    • 10.9.1. Company Overview
    • 10.9.2. Financial Performance
    • 10.9.3. Product Benchmarking
    • 10.9.4. Recent Development
  • 10.10. SUSS MicroTec SE
    • 10.10.1. Company Overview
    • 10.10.2. Financial Performance
    • 10.10.3. Product Benchmarking
    • 10.10.4. Recent Development

List of Tables:

  • Table 1 Global Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 2 Global Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 3 Global Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 4 North America: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 5 North America: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 6 North America: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 7 US: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 8 US: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 9 US: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 10 Canada: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 11 Canada: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 12 Canada: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 13 Europe: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 14 Europe: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 15 Europe: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 16 UK: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 17 UK: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 18 UK: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 19 France: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 20 France: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 21 France: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 22 Germany: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 23 Germany: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 24 Germany: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 25 Italy: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 26 Italy: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 27 Italy: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 28 Spain: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 29 Spain: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 30 Spain: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 31 Netherlands: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 32 Netherlands: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 33 Netherlands: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 34 Russia: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 35 Russia: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 36 Russia: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 37 Rest of Europe: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 38 Rest of Europe: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 39 Rest of Europe: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 40 Asia Pacific: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 41 Asia Pacific: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 42 Asia Pacific: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 43 China: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 44 China: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 45 China: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 46 India: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 47 India: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 48 India: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 49 Malaysia: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 50 Malaysia: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 51 Malaysia: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 52 Japan: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 53 Japan: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 54 Japan: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 55 Indonesia: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 56 Indonesia: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 57 Indonesia: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 58 South Korea: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 59 South Korea: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 60 South Korea: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 61 Australia: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 62 Australia: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 63 Australia: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 64 Rest of Asia Pacific: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 65 Rest of Asia Pacific: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 66 Rest of Asia Pacific: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 67 Middle East & Africa: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 68 Middle East & Africa: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 69 Middle East & Africa: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 70 Saudi Arabia: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 71 Saudi Arabia: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 72 Saudi Arabia: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 73 UAE: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 74 UAE: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 75 UAE: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 76 Israel: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 77 Israel: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 78 Israel: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 79 South Africa: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 80 South Africa: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 81 South Africa: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 82 Rest of Middle East & Africa: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 83 Rest of Middle East & Africa: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 84 Rest of Middle East & Africa: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 85 Latin America: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 86 Latin America: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 87 Latin America: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 88 Mexico: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 89 Mexico: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 90 Mexico: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 91 Brazil: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 92 Brazil: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 93 Brazil: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 94 Argentina: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 95 Argentina: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 96 Argentina: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • Table 97 Rest of Latin America: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • Table 98 Rest of Latin America: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • Table 99 Rest of Latin America: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)

List of Figures:

  • Figure 1. Global Semiconductor Assembly and Packaging Equipment Market, 2020-2034 (USD Billion)
  • Figure 2. Integrated Ecosystem
  • Figure 3. Research Methodology: Top-Down & Bottom-Up Price
  • Figure 4. Market by Geography
  • Figure 5. Porter's Five Forces
  • Figure 6. Market By Product
  • Figure 7. Global Semiconductor Assembly and Packaging Equipment Market, By Product, 2024 & 2034 (USD Billion)
  • Figure 8. Market by Packaging Type
  • Figure 9. Global Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2024 & 2034 (USD Billion)
  • Figure 10. Market by End Use
  • Figure 11. Global Semiconductor Assembly and Packaging Equipment Market, by End Use, 2024 & 2034 (USD Billion)