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市場調查報告書
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1789942

美國半導體組裝和封裝設備市場規模、佔有率和趨勢分析報告：按產品、最終用途和細分市場預測，2025-2033 年

U.S. Semiconductor Assembly And Packaging Equipment Market Size, Share & Trends Analysis Report By Product (Dicing Equipment, Bonding Equipment), By Packaging Type (Flip Chip Packaging Equipment), By End-use (IDMs), And Segment Forecasts, 2025 - 2033
出版日期: | 出版商: Grand View Research | 英文 100 Pages | 商品交期: 2-10個工作天內

價格

美國半導體組裝和封裝設備市場摘要

美國半導體組裝和封裝設備市場規模預計在 2024 年為 4.407 億美元，預計到 2033 年將達到 7.725 億美元，2025 年至 2033 年的複合年成長率為 6.6%。 2.5D/3D IC、扇出型晶圓級封裝 (FOWLP) 和系統級封裝(SiP) 等先進封裝解決方案的日益普及，大大推動了美國的市場需求。

這些技術能夠提升效能、縮小外形規格並提高能源效率，所有這些對於人工智慧 (AI)、物聯網 (IoT) 和 5G 應用都至關重要。聯邦政府透過《晶片與科學法案》等舉措提供的大力支持，正在振興國內半導體製造和封裝基礎設施。這種支援減少了對海外供應商的依賴，並增強了供應鏈的韌性。在地緣政治緊張局勢加劇和全球供應中斷的背景下，促進本地製造尤其重要。

目錄

第1章調查方法與範圍

第2章執行摘要

第3章美國半導體組裝和封裝設備市場變數、趨勢和範圍

  • 繪製市場集中度與成長前景
  • 產業價值鏈分析
    • 原料和零件的前景
    • 製造商的展望
    • 分銷展望
    • 最終使用者視角
  • 法律規範
  • 技術概述
  • 市場動態
    • 市場促進因素分析
    • 市場限制因素分析
    • 市場問題分析
    • 市場機會分析
  • 經濟大趨勢分析
  • 產業分析工具
    • 波特五力分析
    • 宏觀環境分析

第4章美國半導體組裝和封裝設備市場：按最終用途的估計和趨勢分析

  • 2024 年和 2033 年按最終用途分類的變化分析和市場佔有率
  • 依最終用途，2021-2033 年
  • IDM（整合設備製造商）
  • OSAT（外包半導體組裝和測試）

第5章美國半導體組裝與封裝設備市場：依封裝類型估算與趨勢分析

  • 2024年和2033年按包裝類型分類的變化分析和市場佔有率
  • 2021-2033 年包裝類型
  • 覆晶構裝設備
  • 晶圓層次電子構裝（WLP）設備
  • 扇出型封裝設備
  • 系統級封裝(SiP) 設備
  • 3D/2.5D包裝設備
  • 其他

第6章：美國半導體組裝和封裝設備市場：按產品分類的估計和趨勢分析

  • 2024 年和 2033 年產品變化分析和市場佔有率
  • 按產品，2021-2033
  • 切割設備
    • 抄寫員
    • 切丁機
    • 晶圓安裝設備
  • 鍵合設備
    • 晶片焊接機
    • 引線鍵合機
    • 其他
  • 包裝設備
    • 成型設備
    • 焊錫電鍍設備
    • 去毛刺器
    • 其他
  • 其他

第7章美國半導體組裝與封裝設備市場：競爭格局

  • 主要市場參與企業的近期趨勢和影響分析
  • 公司分類
  • 企業儀錶板分析
  • 供應商格局
  • 2024年公司市場佔有率分析
  • 2024年企業定位分析
  • 2024年企業熱圖分析
  • 戰略地圖
  • 公司簡介
  • Applied Materials
  • ASM Pacific Technology
  • Besi
  • Disco Corporation
  • Kulicke & Soffa Industries, Inc. (K&S)
  • Lam Research Corporation
  • Nikon Corporation
  • Plasma-Therm
  • Rudolph Technologies, Inc.
  • SCREEN Semiconductor Solutions Co., Ltd.
Product Code: GVR-4-68040-676-4

U.S. Semiconductor Assembly And Packaging Equipment Market Summary

The U.S. semiconductor assembly and packaging equipment market size was estimated at USD 440.7 million in 2024 and is projected to reach USD 772.5 million by 2033, growing at a CAGR of 6.6% from 2025 to 2033. The growing adoption of advanced packaging solutions such as 2.5D/3D ICs, fan-out wafer-level packaging (FOWLP), and system-in-package (SiP) is significantly driving market demand in the U.S.

These technologies enhance performance, reduce form factor, and improve power efficiency vital for artificial intelligence (AI), IoT, and 5G applications. Strong federal backing through initiatives like the CHIPS and Science Act is catalyzing domestic semiconductor manufacturing and packaging infrastructure. Substantial funding incentives are encouraging companies to establish or expand advanced packaging facilities in the U.S. This support reduces reliance on overseas providers and enhances supply chain resilience. The push toward localized production is especially critical amid rising geopolitical tensions and global supply disruptions.

U.S. Semiconductor Assembly And Packaging Equipment Market Report Segmentation

This report forecasts revenue growth at the U.S. level and provides an analysis of the latest industry trends in each of the sub-segments from 2021 to 2033. For this study, Grand View Research has segmented the U.S. semiconductor assembly and packaging equipment market report based on packaging type,end use, and product:

  • Packaging Type Outlook (Revenue, USD Million, 2021 - 2033)
  • Flip Chip Packaging Equipment
  • Wafer Level Packaging (WLP) Equipment
  • Fan-Out Packaging Equipment
  • System-in-Package (SiP) Equipment
  • 3D/2.5D Packaging Equipment
  • Others
  • End Use Outlook (Revenue, USD Million, 2021 - 2033)
  • IDMs (Integrated Device Manufacturers)
  • OSAT (Outsourced Semiconductor Assembly and Test)
  • Product Outlook (Revenue, USD Million, 2021 - 2033)
  • Dicing Equipment
    • Scriber
    • Dicer
    • Wafer Mounting Equipment
  • Bonding Equipment
    • Die Bonder
    • Wire Bonder
    • Others
  • Packaging Equipment
    • Molding Equipment
    • Solder Plating Equipment
    • Deflasher
    • Others
  • Others

Table of Contents

Chapter 1. Methodology and Scope

  • 1.1. Market Segmentation & Scope
  • 1.2. Market Definition
  • 1.3. Information Procurement
    • 1.3.1. Purchased Database
    • 1.3.2. GVR's Internal Database
    • 1.3.3. Secondary Sources & Third-Party Perspectives
    • 1.3.4. Primary Research
  • 1.4. Information Analysis
    • 1.4.1. Data Analysis Models
  • 1.5. Market Formulation & Data Visualization
  • 1.6. Data Validation & Publishing

Chapter 2. Executive Summary

  • 2.1. Market Snapshot
  • 2.2. Segment Snapshot
  • 2.3. Competitive Landscape Snapshot

Chapter 3. U.S. Semiconductor Assembly and Packaging Equipment Market Variables, Trends & Scope

  • 3.1. Market Concentration & Growth Prospect Mapping
  • 3.2. Industry Value Chain Analysis
    • 3.2.1. Raw Material/Component Outlook
    • 3.2.2. Manufacturer Outlook
    • 3.2.3. Distribution Outlook
    • 3.2.4. End User Outlook
  • 3.3. Regulatory Framework
  • 3.4. Technology Overview
  • 3.5. Market Dynamics
    • 3.5.1. Market Driver Analysis
    • 3.5.2. Market Restraint Analysis
    • 3.5.3. Market Challenges Analysis
    • 3.5.4. Market Opportunity Analysis
  • 3.6. Economic Mega-Trend Analysis
  • 3.7. Industry Analysis Tools
    • 3.7.1. Porter's Five Forces Analysis
    • 3.7.2. Macro-environmental Analysis

Chapter 4. U.S. Semiconductor Assembly and Packaging Equipment Market: End Use Estimates & Trend Analysis

  • 4.1. End Use Movement Analysis & Market Share, 2024 & 2033
  • 4.2. U.S. Semiconductor Assembly and Packaging Equipment Market Estimates & Forecast, By End Use, 2021 to 2033 (USD Million)
  • 4.3. IDMs (Integrated Device Manufacturers)
    • 4.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 4.4. OSAT (Outsourced Semiconductor Assembly and Test)
    • 4.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 5. U.S. Semiconductor Assembly and Packaging Equipment Market: Packaging Type Estimates & Trend Analysis

  • 5.1. Packaging Type Movement Analysis & Market Share, 2024 & 2033
  • 5.2. U.S. Semiconductor Assembly and Packaging Equipment Market Estimates & Forecast, By Distribution Channel, 2021 to 2033 (USD Million)
  • 5.3. Flip Chip Packaging Equipment
    • 5.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.4. Wafer Level Packaging (WLP) Equipment
    • 5.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.5. Fan-Out Packaging Equipment
    • 5.5.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.6. System-in-Package (SiP) Equipment
    • 5.6.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.7. 3D/2.5D Packaging Equipment
    • 5.7.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 5.8. Others
    • 5.8.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 6. U.S. Semiconductor Assembly and Packaging Equipment Market: Product Estimates & Trend Analysis

  • 6.1. Product Movement Analysis & Market Share, 2024 & 2033
  • 6.2. U.S. Semiconductor Assembly and Packaging Equipment Market Estimates & Forecast, By Product, 2021 to 2033 (USD Million)
  • 6.3. Dicing Equipment
    • 6.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.3.2. Scriber
      • 6.3.2.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.3.3. Dicer
      • 6.3.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.3.4. Wafer Mounting Equipment
      • 6.3.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.4. Bonding Equipment
    • 6.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.4.2. Die Bonder
      • 6.4.2.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.4.3. Wire Bonder
      • 6.4.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.4.4. Others
      • 6.4.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.5. Packaging Equipment
    • 6.5.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.5.2. Molding Equipment
      • 6.5.2.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.5.3. Solder Plating Equipment
      • 6.5.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.5.4. Deflasher
      • 6.5.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
    • 6.5.5. Others
      • 6.5.5.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
  • 6.6. Others
    • 6.6.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)

Chapter 7. U.S. Semiconductor Assembly and Packaging Equipment Market: Competitive Landscape

  • 7.1. Recent Developments & Impact Analysis, By Key Market Participants
  • 7.2. Company Categorization
  • 7.3. Company Dashboard Analysis
  • 7.4. Vendor Landscape
    • 7.4.1. List of Key Raw Material/Component Providers
    • 7.4.2. List of Key Manufacturers
    • 7.4.3. List of Key Distributors
  • 7.5. Company Market Share Analysis, 2024
  • 7.6. Company Positioning Analysis, 2024
  • 7.7. Company Heat Map Analysis, 2024
  • 7.8. Strategy Mapping
  • 7.9. Company Profiles
    • 7.9.1. Applied Materials
      • 7.9.1.1. Participant's overview
      • 7.9.1.2. Financial performance
      • 7.9.1.3. Product benchmarking
      • 7.9.1.4. Recent developments
    • 7.9.2. ASM Pacific Technology
      • 7.9.2.1. Participant's overview
      • 7.9.2.2. Financial performance
      • 7.9.2.3. Product benchmarking
      • 7.9.2.4. Recent developments
    • 7.9.3. Besi
      • 7.9.3.1. Participant's overview
      • 7.9.3.2. Financial performance
      • 7.9.3.3. Product benchmarking
      • 7.9.3.4. Recent developments
    • 7.9.4. Disco Corporation
      • 7.9.4.1. Participant's overview
      • 7.9.4.2. Financial performance
      • 7.9.4.3. Product benchmarking
      • 7.9.4.4. Recent developments
    • 7.9.5. Kulicke & Soffa Industries, Inc. (K&S)
      • 7.9.5.1. Participant's overview
      • 7.9.5.2. Financial performance
      • 7.9.5.3. Product benchmarking
      • 7.9.5.4. Recent developments
    • 7.9.6. Lam Research Corporation
      • 7.9.6.1. Participant's overview
      • 7.9.6.2. Financial performance
      • 7.9.6.3. Product benchmarking
      • 7.9.6.4. Recent developments
    • 7.9.7. Nikon Corporation
      • 7.9.7.1. Participant's overview
      • 7.9.7.2. Financial performance
      • 7.9.7.3. Product benchmarking
      • 7.9.7.4. Recent developments
    • 7.9.8. Plasma-Therm
      • 7.9.8.1. Participant's overview
      • 7.9.8.2. Financial performance
      • 7.9.8.3. Product benchmarking
      • 7.9.8.4. Recent developments
    • 7.9.9. Rudolph Technologies, Inc.
      • 7.9.9.1. Participant's overview
      • 7.9.9.2. Financial performance
      • 7.9.9.3. Product benchmarking
      • 7.9.9.4. Recent developments
    • 7.9.10. SCREEN Semiconductor Solutions Co., Ltd.
      • 7.9.10.1. Participant's overview
      • 7.9.10.2. Financial performance
      • 7.9.10.3. Product benchmarking
      • 7.9.10.4. Recent developments

List of Tables

  • Table 1 U.S. semiconductor assembly and packaging equipment market estimates and forecasts, 2021 - 2033 (USD Million)
  • Table 2 U.S. semiconductor assembly and packaging equipment market estimates and forecasts, by packaging type, 2021 - 2033 (USD Million)
  • Table 3 U.S. semiconductor assembly and packaging equipment market estimates and forecasts, by end use, 2021 - 2033 (USD Million)
  • Table 4 U.S. semiconductor assembly and packaging equipment market estimates and forecasts, by product, 2021 - 2033 (USD Million)
  • Table 5 Company Heat Map Analysis, 2024
  • Table 6 Strategy Mapping

List of Figures

  • Fig. 1 Market research process
  • Fig. 2 Data triangulation techniques
  • Fig. 3 Primary research pattern
  • Fig. 4 Market research approaches
  • Fig. 5 QFD modeling for market share assessment
  • Fig. 6 Information Procurement
  • Fig. 7 Market Formulation and Validation
  • Fig. 8 Data Validating & Publishing
  • Fig. 9 Market Segmentation & Scope
  • Fig. 10 U.S. Semiconductor Assembly and Packaging Equipment Market Snapshot
  • Fig. 11 Segment Snapshot
  • Fig. 12 Competitive Landscape Snapshot
  • Fig. 13 Parent market outlook
  • Fig. 14 U.S. Semiconductor Assembly and Packaging Equipment Market Value, 2024 (USD Million)
  • Fig. 15 U.S. Semiconductor Assembly and Packaging Equipment Market - Value Chain Analysis
  • Fig. 16 U.S. Semiconductor Assembly and Packaging Equipment Market - Market Dynamics
  • Fig. 17 U.S. Semiconductor Assembly and Packaging Equipment Market - PORTER's Analysis
  • Fig. 18 U.S. Semiconductor Assembly and Packaging Equipment Market - PESTEL Analysis
  • Fig. 19 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, By Packaging Type: Key Takeaways
  • Fig. 20 U.S. Semiconductor Assembly and Packaging Equipment Market Share, By Packaging Type, 2024 & 2033
  • Fig. 21 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Flip Chip Packaging Equipment, 2021 - 2033 (USD Million)
  • Fig. 22 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Wafer Level Packaging (WLP) Equipment, 2021 - 2033 (USD Million)
  • Fig. 23 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Fan-Out Packaging Equipment, 2021 - 2033 (USD Million)
  • Fig. 24 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By System-in-Package (SiP) Equipment, 2021 - 2033 (USD Million)
  • Fig. 25 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By 3D/2.5D Packaging Equipment, 2021 - 2033 (USD Million)
  • Fig. 26 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Others 2021 - 2033 (USD Million)
  • Fig. 27 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, By Product: Key Takeaways
  • Fig. 28 U.S. Semiconductor Assembly and Packaging Equipment Market Share, By Product, 2024 & 2033
  • Fig. 29 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Dicing Equipment, 2021 - 2033 (USD Million)
  • Fig. 30 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Scriber, 2021 - 2033 (USD Million)
  • Fig. 31 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Dicer, 2021 - 2033 (USD Million)
  • Fig. 32 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Wafer Mounting Equipment, 2021 - 2033 (USD Million)
  • Fig. 33 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Bonding Equipment, 2021 - 2033 (USD Million)
  • Fig. 34 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Die Bonder, 2021 - 2033 (USD Million)
  • Fig. 35 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Wire Bonder, 2021 - 2033 (USD Million)
  • Fig. 36 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Others, 2021 - 2033 (USD Million)
  • Fig. 37 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Packaging Equipment, 2021 - 2033 (USD Million)
  • Fig. 38 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Molding Equipment, 2021 - 2033 (USD Million)
  • Fig. 39 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Solder Plating Equipment, 2021 - 2033 (USD Million)
  • Fig. 40 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Deflasher, 2021 - 2033 (USD Million)
  • Fig. 41 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Others, 2021 - 2033 (USD Million)
  • Fig. 42 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, By Others, 2021 - 2033 (USD Million)
  • Fig. 43 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates & Forecasts, By End Use: Key Takeaways
  • Fig. 44 U.S. Semiconductor Assembly and Packaging Equipment Market Share, By End Use, 2024 & 2033
  • Fig. 45 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, In IDMs (Integrated Device Manufacturers) 2021 - 2033 (USD Million)
  • Fig. 46 U.S. Semiconductor Assembly and Packaging Equipment Market Estimates and Forecast, In OSAT (Outsourced Semiconductor Assembly and Test) 2021 - 2033 (USD Million)
  • Fig. 47 Key Company Categorization
  • Fig. 48 Company Market Positioning
  • Fig. 49 Key Company Market Share Analysis, 2024
  • Fig. 50 Strategy Mapping