查看購物車
  • Simplified Chinese
  • English
  • Japanese
  • Korean
封面
市場調查報告書
商品編碼
1887190

半導體封裝設備市場規模、佔有率、成長及全球產業分析：依類型、應用和地區劃分的洞察與預測（2024-2032 年）

Semiconductor Assembly and Packaging Equipment Market Size, Share, Growth and Global Industry Analysis By Type & Application, Regional Insights and Forecast to 2024-2032
出版日期: | 出版商: Fortune Business Insights Pvt. Ltd. | 英文 140 Pages | 商品交期: 請詢問到貨日

價格

半導體封裝設備市場成長驅動因素

由於對先進半導體封裝的需求激增、數位轉型的推進以及電子製造技術的快速發展，全球半導體封裝設備市場正在加速成長。根據行業估計，該市場預計將在 2024 年達到 90.2 億美元，2025 年增長至 97.2 億美元，並在 2032 年飆升至 174.4 億美元，預測期內複合年增長率 (CAGR) 為 8.72%。 2024 年，亞太地區將以 59.09% 的市佔率引領全球市場，這主要得益於中國、台灣、韓國和日本強大的製造業生態系統。

隨著汽車、通訊、消費性電子和雲端運算等產業對更高效能和更小尺寸的需求不斷增長，半導體封裝技術也持續發展。包括 2.5D/3D IC、晶圓級封裝和系統級封裝 (SiP) 在內的先進封裝解決方案正在變革組裝工藝，並推動對用於鍵合、封裝、減薄和測試的高精度設備的強勁需求。

市場趨勢：人工智慧和高效能運算正在重塑封裝需求

全球向人工智慧加速器、高效能運算 (HPC) 和資料中心處理器的轉型，正在創造對先進封裝結構的空前需求。人工智慧工作負載需要高頻寬、低延遲和高密度互連設計——這些特性只有透過 2.5D/3D 封裝、晶片整合和高頻寬記憶體 (HBM) 才能實現。這些先進架構高度依賴精密晶片鍵合、混合鍵合和扇出型封裝技術。因此，半導體製造商和OSAT（外包組裝服務提供者）正積極投資於能夠支援異質整合和超細間距互連的尖端封裝設備。

市場驅動因素：電動車的擴張和半導體需求的激增

電動車 (EV) 產業的快速發展是半導體封裝創新的主要催化劑。電動車需要高性能、高能效的晶片來實現電池管理、ADAS（高級駕駛輔助系統）、資訊娛樂和動力系統控制。這推動了對SiC和GaN功率裝置、高散熱性能封裝以及穩健的模組級組件的需求。諸如晶圓上晶片、倒裝晶片鍵合和功率模組封裝等技術對於現代電動車應用至關重要，從而推動了對客製化組裝和封裝設備的需求。

此外，受供應鏈中斷和國家安全考量的驅動，全球對國內半導體生產的投資正在推動新型封裝設施的建設。諸如美國 "晶片法案" (CHIPS Act)、歐洲 "晶片法案" (European Chips Act) 以及中國的 "中國製造2025" 計畫等政策，顯著推動了封裝和測試能力的擴張，直接支撐了設備需求。

市場限制因素：高額資本投入

儘管成長強勁，但先進半導體封裝設備的高昂成本構成了市場挑戰。向2.5D/3D封裝、扇出型晶圓級封裝(WLP)和混合鍵結的過渡需要對精密機械、無塵室設施和熟練勞動力進行大量投資。這些資本密集需求限制了中小型OSAT（外包封裝和測試服務）公司的進入，從而促進了行業整合，並加劇了對大型IDM（垂直整合半導體製造商）和資金雄厚的封裝供應商的依賴。

市場機會：在地化生產與政府誘因

半導體製造在地化是未來最重要的機會之一。北美、歐洲和亞洲各國政府正提供財政獎勵措施，以加強其國內半導體生態系統。印度、馬來西亞和越南等國憑藉著成本優勢和不斷擴大的技術人才儲備，正成為新建封裝工廠的首選地點。預計這些趨勢將推動全球對新一代晶片鍵合機、引線鍵合機和晶圓級封裝設備的需求。

區域展望：亞太地區領先，北美和歐洲加速發展

亞太地區

亞太地區仍是規模最大、成長最快的地區，預計到2024年將達到53.3億美元，這主要得益於強大的製造業集群和政府激勵措施。預計到2025年，中國將達到27.8億美元，而印度和日本預計將分別達到5.6億美元和4.5億美元。

北美

在 "晶片法案" （CHIPS Act）投資的推動下，預計北美地區到 2025 年的投資額將達到 19.6 億美元，其中美國將佔 13.6 億美元。先進封裝技術（EMIB、3D 堆疊和晶片組架構）正在迅速發展。

歐洲

預計歐洲地區到 2025 年的投資額將達到 14.1 億美元，其中德國（5.3 億美元）、法國（1.1 億美元）和英國（2.4 億美元）位居前列。投資與電動車需求和工業自動化密切相關。

中東和非洲

預計中東和非洲 (MEA) 地區到 2025 年的投資額將達到 3.1 億美元，受益於不斷擴展的數位基礎設施和人工智慧驅動的區域項目。

依類型、應用、最終用途行業和地區劃分

目錄

第一章：引言

第二章：摘要整理

第三章：市場動態

  • 宏觀與微觀經濟指標
  • 驅動因素、限制因素、機會與趨勢
  • 生成式人工智慧的影響

第四章：競爭格局

  • 主要公司採用的商業策略
  • 主要公司的綜合SWOT分析
  • 全球半導體組裝和封裝設備主要公司（前3-5名）的市場佔有率和排名（2024年）

章節5 全球半導體組裝與封裝設備市場規模估算與預測（依細分市場劃分，2019-2032 年）

  • 主要發現
  • 依類型
    • 晶片鍵合機
    • 引線鍵合機
    • 封裝設備
    • 其他
  • 依應用
    • IDM
    • OSAT
  • 依最終用途行業
    • 消費性電子
    • 汽車電子
    • 工業電子
    • 醫療設備
    • 航空航太與國防
    • 其他
  • 依地區
    • 北美
    • 歐洲
    • 亞太
    • 中東和非洲
    • 南美

章節第六章 北美半導體封裝設備市場規模估算與預測（依細分市場劃分，2019-2032 年）

  • 依國家劃分
    • 美國
    • 加拿大
    • 墨西哥

第七章：南美洲半導體封裝設備市場規模估算與預測（依細分市場劃分，2019-2032 年）

  • 依國家劃分
    • 巴西
    • 阿根廷
    • 南美洲其他地區

第八章：歐洲半導體封裝設備市場規模估算與預測（依細分市場劃分，2019-2032 年）

  • 依國家/地區
    • 英國
    • 德國
    • 法國
    • 義大利
    • 歐洲其他地區

第九章：亞太地區半導體封裝設備市場規模估計與預測（依細分市場劃分，2019-2032 年）

  • 依國家劃分
    • 中國
    • 印度
    • 日本
    • 韓國
    • 亞太其他地區

第十章：中東與非洲半導體封裝設備市場規模估計與預測（依細分市場劃分，2019-2032 年）

  • 依國家劃分
    • 海灣合作委員會
    • 南非
    • 中東其他地區非洲

第十一章：十大公司簡介

  • 庫利克和索法工業公司 (Kulicke and Soffa Industries, Inc.)
  • ASMPT
  • 貝西 (Besi)
  • 東和株式會社 (TOWA Corporation)
  • 新川電氣株式會社 (SHINKAWA Electric Co., Ltd.)
  • 花美光 (Hana Micron)
  • SUSS MicroTec SE
  • ASM國際 (ASM International)
  • 迪斯可株式會社 (Disco Corporation)
  • 艾德萬斯特株式會社 (Advantest Corporation)

第十二章：要點總結

Product Code: FBI112669

Growth Factors of semiconductor assembly and packaging equipment Market

The global semiconductor assembly and packaging equipment market is witnessing accelerated expansion, driven by the surging need for advanced semiconductor packaging, ongoing digital transformation, and rapid advancements in electronics manufacturing. As per industry estimates, the market reached USD 9.02 billion in 2024, is projected to grow to USD 9.72 billion in 2025, and ultimately surge to USD 17.44 billion by 2032, advancing at a CAGR of 8.72% over the forecast period. In 2024, Asia Pacific dominated the global market with a 59.09% share, owing to strong manufacturing ecosystems in China, Taiwan, South Korea, and Japan.

Semiconductor packaging continues to evolve as industries such as automotive, telecommunications, consumer electronics, and cloud computing demand higher performance and miniaturization. Advanced packaging solutions like 2.5D/3D ICs, wafer-level packaging, and system-in-package (SiP) are transforming assembly processes, driving strong demand for high-precision equipment used in bonding, encapsulation, thinning, and testing.

Market Trends: AI and High-Performance Computing Reshape Packaging Needs

The global shift toward AI accelerators, high-performance computing (HPC), and data center processors is creating unprecedented demand for sophisticated packaging architectures. AI workloads require high bandwidth, low latency, and dense interconnect designs-capabilities uniquely provided by 2.5D/3D packaging, chiplet integration, and High-Bandwidth Memory (HBM). These advanced architectures rely heavily on precision die bonding, hybrid bonding, and fan-out packaging technologies. As a result, semiconductor manufacturers and OSATs are investing aggressively in leading-edge packaging equipment capable of supporting heterogeneous integration and ultra-fine pitch interconnects.

Market Drivers: EV Expansion and Semiconductor Demand Surge

The rapid acceleration of the Electric Vehicle (EV) industry is a major catalyst for semiconductor packaging innovation. EVs require powerful, energy-efficient chips for battery management, ADAS, infotainment, and powertrain control. This drives demand for SiC and GaN power devices, high-thermal-performance packaging, and robust module-level assembly. Technologies such as chip-on-wafer, flip-chip bonding, and power module packaging are essential in modern EV applications, boosting the demand for tailored assembly and packaging equipment.

Additionally, global investments in domestic semiconductor production-spurred by supply chain disruptions and national security considerations-are prompting new packaging facility developments. Programs like the U.S. CHIPS Act, European Chips Act, and China's Made in China 2025 are fueling massive expansions in assembly and testing capacity, directly supporting equipment demand.

Market Restraints: High Capital Requirements

Despite strong growth, the market faces challenges due to the high cost of advanced semiconductor packaging equipment. Transitioning to 2.5D/3D packaging, fan-out WLP, and hybrid bonding requires substantial investment in precision machinery, cleanroom infrastructure, and skilled labor. These capital-intensive requirements limit participation from small and mid-tier OSATs, contributing to industry consolidation and dependence on large IDMs and well-funded packaging providers.

Market Opportunities: Localization and Government Incentives

Localization of semiconductor manufacturing presents one of the most significant opportunities for the future. Governments across North America, Europe, and Asia are offering financial incentives to strengthen domestic semiconductor ecosystems. Countries such as India, Malaysia, and Vietnam are emerging as preferred hubs for new packaging facilities due to cost advantages and expanding technical talent pools. These developments are expected to boost global demand for next-generation die bonders, wire bonders, and wafer-level packaging equipment.

Regional Outlook: Asia Pacific Leads, North America and Europe Accelerate

Asia Pacific

Asia Pacific remains the largest and fastest-growing region, valued at USD 5.33 billion in 2024, supported by strong manufacturing clusters and government incentives. China is projected to reach USD 2.78 billion in 2025, while India and Japan are expected to reach USD 0.56 billion and USD 0.45 billion, respectively.

North America

Driven by CHIPS Act investments, North America is projected to reach USD 1.96 billion in 2025, with the U.S. accounting for USD 1.36 billion. Advanced packaging technologies-EMIB, 3D stacking, and chiplet architecture-are expanding rapidly.

Europe

Europe is forecast to hit USD 1.41 billion in 2025, led by Germany (USD 0.53 billion), France (USD 0.11 billion), and the U.K. (USD 0.24 billion). Investments align with EV demand and industrial automation.

Middle East & Africa

MEA is expected to reach USD 0.31 billion in 2025, benefiting from growing digital infrastructure and AI-driven regional projects.

Conclusion

With semiconductor demand surging across AI systems, EVs, 5G networks, and advanced electronics, the assembly and packaging equipment market is positioned for strong long-term growth. Rising from USD 9.72 billion in 2025 to USD 17.44 billion by 2032, the industry will continue evolving through automation, heterogeneous integration, and global manufacturing expansion-maintaining Asia Pacific's leadership while North America and Europe accelerate investment momentum.

Segmentation Type, Application, End-Use Industry and Region

Segmentation By Type

  • Die Bonders
  • Wire Bonders
  • Packaging Equipment
  • Others

By Application

  • IDMs
  • OSAT

By End-Use Industry

  • Consumer Electronics
  • Automotive Electronics
  • Industrial Electronics
  • Medical Devices
  • Aerospace and Defense
  • Others

By Region

  • North America (By Type, By Application, By End-Use Industry, and By Country)
    • U.S. (By Type)
    • Canada (By Type)
    • Mexico (By Type)
  • Europe (By Type, By Application, By End-Use Industry, and By Country)
    • U.K. (By Type)
    • Germany (By Type)
    • France (By Type)
    • Italy (By Type)
    • Rest of Europe
  • Asia Pacific (By Type, By Application, By End-Use Industry, and By Country)
    • China (By Type)
    • Japan (By Type)
    • India (By Type)
    • South Korea (By Type)
    • Rest of Asia Pacific
  • Middle East & Africa (By Type, By Application, By End-Use Industry, and By Country)
    • GCC (By Type)
    • South Africa (By Type)
    • Rest of the Middle East & Africa
  • South America (By Type, By Application, By End-Use Industry, and By Country)
    • Brazil (By Type)
    • Argentina (By Type)
    • Rest of South America

Companies Profiled in the Report Kulicke and Soffa Industries, Inc., Besi, TOWA Corporation, SHINKAWA Electric Co., Ltd., Hana Micron, SUSS MicroTec SE, ASMPT (Singapore), ASM International (U.S.), Disco Corporation, Advantest Corporation

Table of Content

1. Introduction

  • 1.1. Definition, By Segment
  • 1.2. Research Methodology/Approach
  • 1.3. Data Sources

2. Executive Summary

3. Market Dynamics

  • 3.1. Macro and Micro Economic Indicators
  • 3.2. Drivers, Restraints, Opportunities and Trends
  • 3.3. Impact of Generative AI

4. Competition Landscape

  • 4.1. Business Strategies Adopted by Key Players
  • 4.2. Consolidated SWOT Analysis of Key Players
  • 4.3. Global Semiconductor Assembly And Packaging Equipment Key Players (Top 3 - 5) Market Share/Ranking, 2024

5. Global Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Segments, 2019-2032

  • 5.1. Key Findings
  • 5.2. By Type (USD)
    • 5.2.1. Die Bonders
    • 5.2.2. Wire Bonders
    • 5.2.3. Packaging Equipment
    • 5.2.4. Others
  • 5.3. By Application (USD)
    • 5.3.1. IDMs
    • 5.3.2. OSAT
  • 5.4. By End-Use Industry (USD)
    • 5.4.1. Consumer Electronics
    • 5.4.2. Automotive Electronics
    • 5.4.3. Industrial Electronics
    • 5.4.4. Medical Devices
    • 5.4.5. Aerospace and Defense
    • 5.4.6. Others
  • 5.5. By Region (USD)
    • 5.5.1. North America
    • 5.5.2. Europe
    • 5.5.3. Asia Pacific
    • 5.5.4. Middle East & Africa
    • 5.5.5. South America

6. North America Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Segments, 2019-2032

  • 6.1. Key Findings
  • 6.2. By Type (USD)
    • 6.2.1. Die Bonders
    • 6.2.2. Wire Bonders
    • 6.2.3. Packaging Equipment
    • 6.2.4. Others
  • 6.3. By Application (USD)
    • 6.3.1. IDMs
    • 6.3.2. OSAT
  • 6.4. By End-Use Industry (USD)
    • 6.4.1. Consumer Electronics
    • 6.4.2. Automotive Electronics
    • 6.4.3. Industrial Electronics
    • 6.4.4. Medical Devices
    • 6.4.5. Aerospace and Defense
    • 6.4.6. Others
  • 6.5. By Country (USD)
    • 6.5.1. United States
      • 6.5.1.1. By Type (USD)
    • 6.5.2. Canada
      • 6.5.2.1. By Type (USD)
    • 6.5.3. Mexico
      • 6.5.3.1. By Type (USD)

7. South America Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Segments, 2019-2032

  • 7.1. Key Findings
  • 7.2. By Type (USD)
    • 7.2.1. Die Bonders
    • 7.2.2. Wire Bonders
    • 7.2.3. Packaging Equipment
    • 7.2.4. Others
  • 7.3. By Application (USD)
    • 7.3.1. IDMs
    • 7.3.2. OSAT
  • 7.4. By End-Use Industry (USD)
    • 7.4.1. Consumer Electronics
    • 7.4.2. Automotive Electronics
    • 7.4.3. Industrial Electronics
    • 7.4.4. Medical Devices
    • 7.4.5. Aerospace and Defense
    • 7.4.6. Others
  • 7.5. By Country (USD)
    • 7.5.1. Brazil
      • 7.5.1.1. By Type (USD)
    • 7.5.2. Argentina
      • 7.5.2.1. By Type (USD)
    • 7.5.3. Rest of South America

8. Europe Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Segments, 2019-2032

  • 8.1. Key Findings
  • 8.2. By Type (USD)
    • 8.2.1. Die Bonders
    • 8.2.2. Wire Bonders
    • 8.2.3. Packaging Equipment
    • 8.2.4. Others
  • 8.3. By Application (USD)
    • 8.3.1. IDMs
    • 8.3.2. OSAT
  • 8.4. By End-Use Industry (USD)
    • 8.4.1. Consumer Electronics
    • 8.4.2. Automotive Electronics
    • 8.4.3. Industrial Electronics
    • 8.4.4. Medical Devices
    • 8.4.5. Aerospace and Defense
    • 8.4.6. Others
  • 8.5. By Country (USD)
    • 8.5.1. U.K.
      • 8.5.1.1. By Type (USD)
    • 8.5.2. Germany
      • 8.5.2.1. By Type (USD)
    • 8.5.3. France
      • 8.5.3.1. By Type (USD)
    • 8.5.4. Italy
      • 8.5.4.1. By Type (USD)
    • 8.5.5. Rest of Europe

9. Asia Pacific Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Segments, 2019-2032

  • 9.1. Key Findings
  • 9.2. By Type (USD)
    • 9.2.1. Die Bonders
    • 9.2.2. Wire Bonders
    • 9.2.3. Packaging Equipment
    • 9.2.4. Others
  • 9.3. By Application (USD)
    • 9.3.1. IDMs
    • 9.3.2. OSAT
  • 9.4. By End-Use Industry (USD)
    • 9.4.1. Consumer Electronics
    • 9.4.2. Automotive Electronics
    • 9.4.3. Industrial Electronics
    • 9.4.4. Medical Devices
    • 9.4.5. Aerospace and Defense
    • 9.4.6. Others
  • 9.5. By Country (USD)
    • 9.5.1. China
      • 9.5.1.1. By Type (USD)
    • 9.5.2. India
      • 9.5.2.1. By Type (USD)
    • 9.5.3. Japan
      • 9.5.3.1. By Type (USD)
    • 9.5.4. South Korea
      • 9.5.4.1. By Type (USD)
    • 9.5.5. Rest of Asia Pacific

10. Middle East & Africa Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Segments, 2019-2032

  • 10.1. Key Findings
  • 10.2. By Type (USD)
    • 10.2.1. Die Bonders
    • 10.2.2. Wire Bonders
    • 10.2.3. Packaging Equipment
    • 10.2.4. Others
  • 10.3. By Application (USD)
    • 10.3.1. IDMs
    • 10.3.2. OSAT
  • 10.4. By End-Use Industry (USD)
    • 10.4.1. Consumer Electronics
    • 10.4.2. Automotive Electronics
    • 10.4.3. Industrial Electronics
    • 10.4.4. Medical Devices
    • 10.4.5. Aerospace and Defense
    • 10.4.6. Others
  • 10.5. By Country (USD)
    • 10.5.1. GCC
      • 10.5.1.1. By Type (USD)
    • 10.5.2. South Africa
      • 10.5.2.1. By Type (USD)
    • 10.5.3. Rest of MEA

11. Company Profiles for Top 10 Players (Based on data availability in public domain and/or on paid databases)

  • 11.1. Kulicke and Soffa Industries, Inc.
    • 11.1.1. Overview
      • 11.1.1.1. Key Management
      • 11.1.1.2. Headquarters
      • 11.1.1.3. Offerings/Business Segments
    • 11.1.2. Key Details (Key details are consolidated data and not product/service specific)
      • 11.1.2.1. Employee Size
      • 11.1.2.2. Past and Current Revenue
      • 11.1.2.3. Geographical Share
      • 11.1.2.4. Business Segment Share
      • 11.1.2.5. Recent Developments
  • 11.2. ASMPT
    • 11.2.1. Overview
      • 11.2.1.1. Key Management
      • 11.2.1.2. Headquarters
      • 11.2.1.3. Offerings/Business Segments
    • 11.2.2. Key Details (Key details are consolidated data and not product/service specific)
      • 11.2.2.1. Employee Size
      • 11.2.2.2. Past and Current Revenue
      • 11.2.2.3. Geographical Share
      • 11.2.2.4. Business Segment Share
      • 11.2.2.5. Recent Developments
  • 11.3. Besi
    • 11.3.1. Overview
      • 11.3.1.1. Key Management
      • 11.3.1.2. Headquarters
      • 11.3.1.3. Offerings/Business Segments
    • 11.3.2. Key Details (Key details are consolidated data and not product/service specific)
      • 11.3.2.1. Employee Size
      • 11.3.2.2. Past and Current Revenue
      • 11.3.2.3. Geographical Share
      • 11.3.2.4. Business Segment Share
      • 11.3.2.5. Recent Developments
  • 11.4. TOWA Corporation
    • 11.4.1. Overview
      • 11.4.1.1. Key Management
      • 11.4.1.2. Headquarters
      • 11.4.1.3. Offerings/Business Segments
    • 11.4.2. Key Details (Key details are consolidated data and not product/service specific)
      • 11.4.2.1. Employee Size
      • 11.4.2.2. Past and Current Revenue
      • 11.4.2.3. Geographical Share
      • 11.4.2.4. Business Segment Share
      • 11.4.2.5. Recent Developments
  • 11.5. SHINKAWA Electric Co., Ltd.
    • 11.5.1. Overview
      • 11.5.1.1. Key Management
      • 11.5.1.2. Headquarters
      • 11.5.1.3. Offerings/Business Segments
    • 11.5.2. Key Details (Key details are consolidated data and not product/service specific)
      • 11.5.2.1. Employee Size
      • 11.5.2.2. Past and Current Revenue
      • 11.5.2.3. Geographical Share
      • 11.5.2.4. Business Segment Share
      • 11.5.2.5. Recent Developments
  • 11.6. Hana Micron
    • 11.6.1. Overview
      • 11.6.1.1. Key Management
      • 11.6.1.2. Headquarters
      • 11.6.1.3. Offerings/Business Segments
    • 11.6.2. Key Details (Key details are consolidated data and not product/service specific)
      • 11.6.2.1. Employee Size
      • 11.6.2.2. Past and Current Revenue
      • 11.6.2.3. Geographical Share
      • 11.6.2.4. Business Segment Share
      • 11.6.2.5. Recent Developments
  • 11.7. SUSS MicroTec SE
    • 11.7.1. Overview
      • 11.7.1.1. Key Management
      • 11.7.1.2. Headquarters
      • 11.7.1.3. Offerings/Business Segments
    • 11.7.2. Key Details (Key details are consolidated data and not product/service specific)
      • 11.7.2.1. Employee Size
      • 11.7.2.2. Past and Current Revenue
      • 11.7.2.3. Geographical Share
      • 11.7.2.4. Business Segment Share
      • 11.7.2.5. Recent Developments
  • 11.8. ASM International
    • 11.8.1. Overview
      • 11.8.1.1. Key Management
      • 11.8.1.2. Headquarters
      • 11.8.1.3. Offerings/Business Segments
    • 11.8.2. Key Details (Key details are consolidated data and not product/service specific)
      • 11.8.2.1. Employee Size
      • 11.8.2.2. Past and Current Revenue
      • 11.8.2.3. Geographical Share
      • 11.8.2.4. Business Segment Share
      • 11.8.2.5. Recent Developments
  • 11.9. Disco Corporation
    • 11.9.1. Overview
      • 11.9.1.1. Key Management
      • 11.9.1.2. Headquarters
      • 11.9.1.3. Offerings/Business Segments
    • 11.9.2. Key Details (Key details are consolidated data and not product/service specific)
      • 11.9.2.1. Employee Size
      • 11.9.2.2. Past and Current Revenue
      • 11.9.2.3. Geographical Share
      • 11.9.2.4. Business Segment Share
      • 11.9.2.5. Recent Developments
  • 11.10. Advantest Corporation
    • 11.10.1. Overview
      • 11.10.1.1. Key Management
      • 11.10.1.2. Headquarters
      • 11.10.1.3. Offerings/Business Segments
    • 11.10.2. Key Details (Key details are consolidated data and not product/service specific)
      • 11.10.2.1. Employee Size
      • 11.10.2.2. Past and Current Revenue
      • 11.10.2.3. Geographical Share
      • 11.10.2.4. Business Segment Share
      • 11.10.2.5. Recent Developments

12. Key Takeaways

List of Tables

  • Table 1: Global Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, 2019 - 2032
  • Table 2: Global Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 3: Global Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Application, 2019 - 2032
  • Table 4: Global Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By End-Use Industry, 2019 - 2032
  • Table 5: Global Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Region, 2019 - 2032
  • Table 6: North America Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, 2019 - 2032
  • Table 7: North America Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 8: North America Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Application, 2019 - 2032
  • Table 9: North America Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By End-Use Industry, 2019 - 2032
  • Table 10: North America Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Country, 2019 - 2032
  • Table 11: U.S. Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 12: Canada Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 13: Mexico Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 14: Europe Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, 2019 - 2032
  • Table 15: Europe Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 16: Europe Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Application, 2019 - 2032
  • Table 17: Europe Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By End-Use Industry, 2019 - 2032
  • Table 18: Europe Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Country, 2019 - 2032
  • Table 19: U.K. Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 20: Germany Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 21: France Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 22: Italy Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 23: Asia Pacific Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, 2019 - 2032
  • Table 24: Asia Pacific Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 25: Asia Pacific Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Application, 2019 - 2032
  • Table 26: Asia Pacific Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By End-Use Industry, 2019 - 2032
  • Table 27: Asia Pacific Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Country, 2019 - 2032
  • Table 28: China Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 29: Japan Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 30: India Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 31: South Korea Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 32: Middle East & Africa Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, 2019 - 2032
  • Table 33: Middle East & Africa Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 34: Middle East & Africa Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Application, 2019 - 2032
  • Table 35: Middle East & Africa Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By End-Use Industry, 2019 - 2032
  • Table 36: Middle East & Africa Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Country, 2019 - 2032
  • Table 37: GCC Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 38: South Africa Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 39: South America Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, 2019 - 2032
  • Table 40: South America Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 41: South America Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Application, 2019 - 2032
  • Table 42: South America Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By End-Use Industry, 2019 - 2032
  • Table 43: South America Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Country, 2019 - 2032
  • Table 44: Brazil Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032
  • Table 45: Argentina Semiconductor Assembly And Packaging Equipment Market Size Estimates and Forecasts, By Type, 2019 - 2032

List of Figures

  • Figure 1: Global Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), 2024 and 2032
  • Figure 2: Global Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Type, 2024 and 2032
  • Figure 3: Global Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Application, 2024 and 2032
  • Figure 4: Global Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By End-Use Industry, 2024 and 2032
  • Figure 5: Global Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Region, 2024 and 2032
  • Figure 6: North America Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), 2024 and 2032
  • Figure 7: North America Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Type, 2024 and 2032
  • Figure 8: North America Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Application, 2024 and 2032
  • Figure 9: North America Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By End-Use Industry, 2024 and 2032
  • Figure 10: North America Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Country, 2024 and 2032
  • Figure 11: Europe Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), 2024 and 2032
  • Figure 12: Europe Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Type, 2024 and 2032
  • Figure 13: Europe Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Application, 2024 and 2032
  • Figure 14: Europe Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By End-Use Industry, 2024 and 2032
  • Figure 15: Europe Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Country, 2024 and 2032
  • Figure 16: Asia Pacific Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), 2024 and 2032
  • Figure 17: Asia Pacific Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Type, 2024 and 2032
  • Figure 18: Asia Pacific Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Application, 2024 and 2032
  • Figure 19: Asia Pacific Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By End-Use Industry, 2024 and 2032
  • Figure 20: Asia Pacific Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Country, 2024 and 2032
  • Figure 21: Middle East & Africa Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), 2024 and 2032
  • Figure 22: Middle East & Africa Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Type, 2024 and 2032
  • Figure 23: Middle East & Africa Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Application, 2024 and 2032
  • Figure 24: Middle East & Africa Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By End-Use Industry, 2024 and 2032
  • Figure 25: Middle East & Africa Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Country, 2024 and 2032
  • Figure 26: South America Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), 2024 and 2032
  • Figure 27: South America Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Type, 2024 and 2032
  • Figure 28: South America Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Application, 2024 and 2032
  • Figure 29: South America Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By End-Use Industry, 2024 and 2032
  • Figure 30: South America Semiconductor Assembly And Packaging Equipment Market Revenue Share (%), By Country, 2024 and 2032
  • Figure 31: Global Semiconductor Assembly And Packaging Equipment Key Players' Market Share/Ranking (%), 2024