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市場調查報告書
商品編碼
1803749

半導體 IC 設計、製造、封裝和測試市場（按產品設計、最終用戶和垂直行業）—2025 年至 2030 年全球預測

Semiconductor IC Design, Manufacturing, Packaging & Testing Market by Product Design, End User, Industry Vertical - Global Forecast 2025-2030
出版日期: | 出版商: 360iResearch | 英文 199 Pages | 商品交期: 最快1-2個工作天內

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預計半導體 IC 設計、製造、封裝和測試市場規模將在 2024 年達到 6,864.9 億美元，2025 年達到 7,548.7 億美元，2030 年達到 12863.4 億美元，複合年成長率為 11.03%。

主要市場統計數據
基準年2024年 6864.9億美元
預計2025年 7548.7億美元
預測年份 2030 12,863.40億美元
複合年成長率（%） 11.03%

透過全面的介紹來揭示半導體價值鏈，其中涵蓋設計、製造、封裝和測試的動態

在當今的半導體生態系統中，設計、製造、封裝和測試之間的複雜相互作用決定了創新和競爭力的發展軌跡。設計人員正在大力投資類比和數位架構，整合混合訊號和射頻組件，以滿足新興的應用需求。同時，製造流程正在利用先進的沉積、離子布植和微影術技術來實現更小的製程節點和晶圓級精度。隨著封裝技術從傳統的球柵陣列和四方扁平封裝發展到3D堆疊和系統級封裝解決方案，材料的選擇（涵蓋陶瓷、金屬、複合材料和塑膠）對於最佳化性能至關重要。

新技術和政策將透過先進封裝的永續性和供應鏈彈性重塑半導體生態系統

人工智慧和高效能運算的快速發展，將新材料和裝置架構推向了半導體研究的前沿。向亞3奈米製程節點的過渡需要極紫外光微影術和多重圖形化技術的創新，這推動了資本投資以及代工廠和設備供應商之間的合作。同時，封裝已成為系統級效能的關鍵推動因素，新興的3D堆疊和晶片級解決方案解決了延遲和散熱挑戰。永續性考量正在推動環保材料和節能製造流程的採用，這進一步改變了整個生態系統的優先事項。

評估 2025 年美國關稅對半導體生態系統的累積影響，包括供應鏈、生產成本和國際競爭力

美國將於2025年對半導體元件及相關設備徵收關稅，這為全球供應鏈策略帶來了巨大的複雜性。先前依賴單一地區採購的公司被迫重新評估其供應商關係，並尋求地理多元化。由於關稅導致投入成本上升，設計公司和代工廠正在採取削減成本的措施，重新談判長期契約，並探索近岸外包方案以降低財務風險。

詳細的細分分析揭示了產品設計最終用戶概況和塑造半導體策略的行業特定應用趨勢

我們的細分分析表明，半導體價值鏈的每個階段都表現出不同的動態，這些動態共同推動了市場複雜性。在產品設計層面，類比、數位、記憶體、混合訊號、電源和射頻設計學科融合在一起，以滿足從超低功耗物聯網設備到高頻寬5G基礎設施的各種應用需求。製造流程包括沉澱、離子布植、微影術和晶圓製造，需要在精度和吞吐量之間取得平衡。再下游，封裝材料——陶瓷、複合材料、金屬和塑膠——支援從球柵陣列和雙列直插式格式等傳統封裝到先進的3D堆疊、晶片級模組、多晶片整合和系統級封裝解決方案等各種技術。每種封裝都需要自己獨特的可靠性和溫度控管測試通訊協定。

揭示美洲、歐洲、中東和非洲以及亞太市場中高成長機會和戰略挑戰的區域動態

區域分析重點在於三個市場，每個市場都有不同的市場驅動力和挑戰。在美洲，受政府激勵措施和回流舉措的推動，境內資本投資正在復甦。製造商和服務供應商正在利用國內對汽車電子產品和邊緣運算基礎設施的需求。當地代工廠、設計公司和材料供應商之間的策略夥伴關係正在形成一個面向供應鏈安全和技術主權的綜合生態系統。

主要公司簡介和策略舉措，突顯半導體產業的競爭定位、創新軌跡和合作模式

領先的半導體公司正在採用差異化策略，以保持技術領先地位和營運韌性。領先的代工廠正在擴大5奈米以下節點的產能，建立合作關係以開發極紫外光微影術設備，並將人工智慧整合到製程控制中以提高產量比率。開發人員正在擴展其在類比、數位和混合訊號領域的IP組合，同時與汽車和通訊的夥伴關係合作，共同開發特定應用的解決方案。

為產業領導者提供切實可行的建議，以因應半導體生態系統中的技術顛覆、地緣政治變化和不斷變化的市場需求

產業領導者應優先將先進封裝技術融入其產品藍圖，以滿足日益成長的異質整合和小型化需求。與專業的材料供應商和測試實驗室合作，可以幫助企業加快認證週期，並更快地將差異化解決方案推向市場。此外，跨區域多元化的供應鏈可以減輕關稅波動和地緣政治動盪的影響，確保關鍵流程的連續性。

調查方法，概述了嚴格的數據收集和檢驗過程以及支撐行業分析的分析框架

此調查方法依賴多層次的資料來源，結合一手和二手資訊，以確保全面覆蓋和分析嚴謹。主要見解是透過採訪來自設計工作室、代工廠、組裝和測試供應商的高管、研發主管、供應鏈經理和技術專家來獲得的。這些定性資訊與設備供應商、材料供應商和研究機構的深入簡報相輔相成，以檢驗新興技術藍圖。

結論：整合關鍵見解和策略要點，幫助相關利益者在動態市場環境中做出明智的半導體決策

半導體產業正處於曲折點，其特徵包括技術的快速進步、地緣政治格局的變遷以及終端市場需求的不斷演變。亞3奈米製程技術和先進封裝技術的突破正在重新定義性能基準，而關稅的變動則凸顯了供應鏈韌性的重要性。細分分析揭示了設計學科、製造流程、封裝變體和測試通訊協定等方面的細微機遇，而這些機會均由無廠半導體公司、代工廠、整合裝置製造商 (IDM) 和外包供應商的不同需求所塑造。

目錄

第1章：前言

第2章調查方法

第3章執行摘要

第4章 市場概述

第5章市場動態

  • 採用 3D-IC 異質整合來處理高階運算工作負載
  • 擴展基於晶片的架構以加速高效能運算
  • 整合式扇出型晶圓級技術與先進封裝，協助物聯網設備
  • 主要晶圓代工廠採用 EUV 微影技術進行 3nm 以下節點生產
  • 用於自動駕駛汽車感測系統的人工智慧專用模擬前端 IC 的成長
  • 在高密度伺服器模組中引入先進的溫度控管解決方案
  • 矽光電在資料中心互連封裝中的整合度不斷提高
  • 晶圓級真空封裝在穿戴式電子產品中MEMS感測器的應用
  • 過渡到用於 5G RF 模組的玻璃內插器等先進基板材料
  • 使用機器學習測試模式產生提高半導體測試自動化

第6章 市場洞察

  • 波特五力分析
  • PESTEL分析

第7章 2025年美國關稅的累積影響

8. 半導體IC設計、製造、封裝和測試市場（依產品設計）

  • IC設計
    • 類比IC設計
    • 數位IC設計
    • 記憶體IC設計
    • 混合訊號IC設計
    • 電源IC設計
    • 射頻積體電路設計
  • 積體電路製造
    • 沉積
    • 離子布植
    • 光刻
    • 晶圓製造
  • IC封裝
    • 包裝材料
      • 陶瓷
      • 複合材料
      • 金屬
      • 塑膠
    • 包裝技術
      • 先進封裝
      • 3D封裝技術
      • 晶片級封裝（CSP）
      • 多晶片模組（MCM）
      • 系統級封裝(SiP)
      • 傳統包裝
      • 球柵陣列（BGA）
      • 雙列直插式封裝（DIP）
      • 四方扁平封裝（QFP）
      • 小型封裝（SOP）
  • 積體電路測試
    • 老化測試
    • 環境和機械測試
    • 期末考
    • 封裝測試（預燒測試）
    • 可靠性測試
    • 系統級測試 (SLT)
    • 晶圓測試

9. 半導體IC設計、製造、封裝和測試市場（依最終用戶）

  • 無廠半導體公司
  • 晶圓代工廠
  • 整合設備製造商 (IDM)
  • 外包半導體組裝和測試 (OSAT) 供應商

10. 半導體 IC 設計、製造、封裝和測試市場（按產業垂直分類）

  • 車
  • 消費性電子產品
  • 國防/航太
  • 衛生保健
  • 資訊科技/通訊

11.美國半導體IC設計、製造、封裝與測試市場

  • 美國
  • 加拿大
  • 墨西哥
  • 巴西
  • 阿根廷

12.歐洲、中東和非洲半導體IC設計、製造、封裝和測試市場

  • 英國
  • 德國
  • 法國
  • 俄羅斯
  • 義大利
  • 西班牙
  • 阿拉伯聯合大公國
  • 沙烏地阿拉伯
  • 南非
  • 丹麥
  • 荷蘭
  • 卡達
  • 芬蘭
  • 瑞典
  • 奈及利亞
  • 埃及
  • 土耳其
  • 以色列
  • 挪威
  • 波蘭
  • 瑞士

13.亞太半導體IC設計、製造、封裝與測試市場

  • 中國
  • 印度
  • 日本
  • 澳洲
  • 韓國
  • 印尼
  • 泰國
  • 菲律賓
  • 馬來西亞
  • 新加坡
  • 越南
  • 台灣

第14章競爭格局

  • 2024年市場佔有率分析
  • 2024年FPNV定位矩陣
  • 競爭分析
    • Advanced Micro Devices, Inc.（AMD）
    • Amkor Technology, Inc.
    • Arm Limited
    • ASE Technology Holding Co, Ltd
    • Broadcom Inc.
    • Cadence Design Systems, Inc.
    • GlobalFoundries US Inc.
    • Intel Corporation
    • Jiangsu Changdian Technology Co., Ltd.
    • Marvell Technology, Inc.
    • MediaTek Inc.
    • Micron Technology, Inc.
    • NVIDIA Corporation
    • Powerchip Semiconductor Manufacturing Corporation
    • Qualcomm Incorporated
    • Samsung Electronics Co., Ltd.
    • Siemens AG
    • SK HYNIX INC.
    • Synopsys, Inc.
    • Taiwan Semiconductor Manufacturing Company Limited
    • Texas Instruments Incorporated
    • Tianshui Huatian Technology Co., Ltd.
    • Tongfu Microelectronics Co., Ltd.
    • Tower Semiconductor Ltd.
    • United Microelectronics Corporation
    • Vanguard International Semiconductor Corporation
    • X-FAB Silicon Foundries SE

第15章 研究人工智慧

第16章 研究統計

第17章 研究聯絡人

第18章 研究報導

第19章 附錄

Product Code: MRR-832D81B2C2AF

The Semiconductor IC Design, Manufacturing, Packaging & Testing Market was valued at USD 686.49 billion in 2024 and is projected to grow to USD 754.87 billion in 2025, with a CAGR of 11.03%, reaching USD 1,286.34 billion by 2030.

KEY MARKET STATISTICS
Base Year [2024] USD 686.49 billion
Estimated Year [2025] USD 754.87 billion
Forecast Year [2030] USD 1,286.34 billion
CAGR (%) 11.03%

Semiconductor Value Chain Unveiled Through a Comprehensive Introduction That Frames Design Manufacturing Packaging and Testing Dynamics

In today's semiconductor ecosystem, the intricate interplay between design, manufacturing, packaging and testing defines the trajectory of innovation and competitiveness. Design houses invest heavily in both analog and digital architectures, integrating mixed-signal and radio frequency components to address the requirements of emerging applications. Concurrently, manufacturing processes leverage advanced deposition, ion implantation and lithography techniques to achieve ever finer process nodes and wafer-level precision. As packaging technologies evolve from traditional ball grid array and quad flat packages to three-dimensional stacking and system-in-package solutions, material selections spanning ceramics, metals, composites and plastics become critical to optimizing performance.

Across the value chain, fabless companies, foundries and integrated device manufacturers collaborate closely with outsourced assembly and test providers to streamline costs and compress time to market. Automotive and aerospace sectors increasingly demand reliability under extreme conditions, while consumer electronics, healthcare and telecommunications applications push the boundaries of power efficiency and miniaturization. Testing protocols-from wafer probing to environmental stress screening-ensure that devices meet stringent quality thresholds before deployment in mission-critical environments.

This introduction sets the stage for a detailed executive summary that explores transformative technological shifts, the impact of regulatory measures, segmentation nuances, regional dynamics, competitive landscapes and actionable strategies. By framing the semiconductor value chain within the context of both established methodologies and disruptive innovations, readers gain a comprehensive understanding of the forces that will shape industry direction in the years ahead.

Emerging Technological and Policy Dynamics Are Reshaping Semiconductor Ecosystem Through Advanced Packaging Sustainability and Supply Chain Resilience

Rapid advancements in artificial intelligence and high-performance computing have propelled new materials and device architectures to the forefront of semiconductor research. Transitioning to sub-3 nanometer process nodes demands innovations in extreme ultraviolet lithography and multi-patterning techniques, driving both capital expenditure and collaborative research across foundries and equipment suppliers. Meanwhile, packaging has emerged as a critical enabler of system-level performance, with emerging three-dimensional stacking and chip-scale solutions addressing latency and thermal dissipation challenges. Sustainability considerations are catalyzing the adoption of eco-friendly materials and energy-efficient manufacturing processes, further reshaping priorities across the ecosystem.

Simultaneously, digital twins and advanced analytics have become integral to yield optimization and predictive maintenance, allowing wafer fabs to anticipate process deviations and minimize downtime. Government initiatives worldwide are incentivizing onshore capacity expansions and research collaborations to bolster supply chain resilience and reduce reliance on geopolitically sensitive regions. In response, industry consortia are forming cross-border alliances to co-develop emerging packaging technologies and standardize testing protocols.

Collectively, these transformative shifts underscore a period of intense convergence between technology, policy and sustainability imperatives. As semiconductor stakeholders navigate this evolving landscape, the ability to integrate multidisciplinary innovations and anticipate regulatory changes will define their competitive positioning in the global marketplace.

Assessing the Cumulative Impact of United States Tariffs in 2025 on Semiconductor Ecosystems Including Supply Chains Production Costs and Global Competitiveness

The introduction of United States tariffs on semiconductor components and related equipment in 2025 has introduced significant complexity to global supply chain strategies. Companies that previously relied on single-region sourcing are now compelled to re-evaluate vendor relationships and explore regional diversification. As tariffs elevate input costs, design firms and foundries are adopting cost-engineering measures, renegotiating long-term agreements and exploring near-shoring options to mitigate financial exposure.

Consequently, there has been a marked uptick in investments toward onshore assembly and testing capabilities. Outsourced providers are scaling domestic capacity to capture the growing demand, while integrated device manufacturers are reinforcing in-house operations to maintain margin stability. These shifts have also accelerated the adoption of advanced automation and digital quality assurance, as higher labor costs intensify the drive for process efficiency.

In parallel, strategic partnerships between international equipment vendors and local manufacturing consortia have emerged as a preferred mechanism to navigate tariff-related restrictions. By co-locating R&D and pilot production facilities within tariff-exempt zones, companies can preserve access to cutting-edge technologies while complying with regulatory requirements. Overall, the 2025 tariff landscape has underscored the importance of supply chain agility and strategic foresight, compelling semiconductor enterprises to craft resilient, multi-regional sourcing models.

In-Depth Segmentation Insights Illuminate Trends Across Product Design End-User Profiles and Industry-Specific Applications Shaping Semiconductor Strategy

Segmentation analysis reveals that each stage of the semiconductor value chain exhibits distinct dynamics that collectively drive market complexity. At the product design tier, analog, digital, memory, mixed-signal, power and radio frequency design disciplines converge to address diverse application needs ranging from ultra-low-power IoT devices to high-bandwidth 5G infrastructure. Manufacturing processes, in turn, encompass deposition, ion implantation, lithography and wafer fabrication operations that must balance precision with throughput. Further downstream, packaging materials such as ceramics, composites, metals and plastics underpin technologies spanning traditional packages like ball grid arrays and dual in-line formats to advanced three-dimensional stacking, chip-scale modules, multi-chip integrations and system-in-package solutions. Each of these packaging variants necessitates tailored reliability and thermal management testing protocols.

From an end-user perspective, fabless companies, foundries, integrated device manufacturers and outsourced assembly and test providers each pursue unique strategic priorities, whether optimizing design intellectual property, scaling production, integrating vertically or expanding service portfolios. Moreover, industry vertical segmentation highlights specialized requirements in automotive applications that demand rigorous safety standards, consumer electronics that prioritize form factor and cost, defense and aerospace with extreme reliability imperatives, healthcare devices requiring biocompatibility, and telecommunications systems focused on signal integrity and latency reduction.

Through this layered segmentation lens, stakeholders can pinpoint growth pockets, tailor value propositions and allocate resources to high-impact segments. Recognizing the interplay among design, fabrication, packaging and testing subdivisions across diverse end-user and vertical landscapes is essential for informed strategic planning.

Regional Dynamics Explored to Reveal High-Growth Opportunities and Strategic Challenges Across Americas Europe Middle East Africa and Asia-Pacific Markets

Regional analysis highlights three distinct markets, each with its own drivers and challenges. In the Americas, a resurgence of onshore capacity investments is underpinned by government incentives and reshoring initiatives. Manufacturers and service providers are capitalizing on domestic demand for automotive electronics and edge computing infrastructure. Strategic partnerships among local foundries, design firms and materials suppliers are shaping an integrated ecosystem geared toward supply chain security and technological sovereignty.

Across Europe, the Middle East and Africa, policy frameworks emphasize sustainability and innovation clusters supporting advanced packaging research. Collaborative consortia integrate academic institutions, specialized equipment manufacturers and test laboratories to accelerate the commercialization of environmentally friendly processes. Meanwhile, defense and aerospace applications continue to drive demand for radiation-hardened components and high-reliability testing services.

The Asia-Pacific region remains a global epicenter for capacity expansion, fueled by large-scale wafer fabrication and a robust supplier network. This market combines substantial production capabilities with emerging design hubs and a growing base of outsourced assembly and test providers. While competitive intensity is high, cost advantages, skilled labor pools and manufacturing efficiencies position the region as a critical pillar in the global semiconductor supply chain.

Key Company Profiles and Strategic Initiatives Highlighting Competitive Positioning Innovation Trajectories and Collaboration Models in Semiconductor Industry

Leading semiconductor enterprises have adopted differentiated strategies to maintain technological leadership and operational resilience. Major foundries are expanding capacity for sub-5 nanometer nodes, securing alliances for extreme ultraviolet lithography tool development and integrating artificial intelligence into process control to enhance yield. Design firms are deepening their IP portfolios across analog, digital and mixed-signal domains while forging partnerships with automotive and telecommunications leaders to co-develop application-specific solutions.

Outsourced assembly and test providers are investing in advanced packaging facilities, including three-dimensional stacking and fan-out wafer-level packaging, coupled with enhanced reliability testing to meet stringent performance standards. Companies specializing in packaging materials are innovating novel composites and metal alloys to improve thermal dissipation and reduce form factors. Meanwhile, vertically integrated manufacturers are optimizing end-to-end supply chain orchestration, leveraging digital twins and cloud-based analytics to synchronize design releases with production schedules.

Competitive differentiation increasingly hinges on cross-disciplinary collaboration, rapid prototyping capabilities and the ability to scale emerging technologies. Organizations that cultivate agility in process development, maintain robust intellectual property defenses and foster strategic alliances across the value chain are best positioned to capture evolving market opportunities.

Actionable Recommendations for Industry Leaders to Navigate Technological Disruptions Geopolitical Shifts and Evolving Market Demands in Semiconductor Ecosystem

Industry leaders should prioritize the integration of advanced packaging technologies within their product roadmaps to address the growing demand for heterogeneous integration and miniaturization. By partnering with specialized material suppliers and test laboratories, firms can accelerate qualification cycles and bring differentiated solutions to market more rapidly. Additionally, diversification of supply chains across multiple geographies will mitigate exposure to tariff fluctuations and geopolitical disruptions, ensuring continuity in critical processes.

Investment in digital manufacturing capabilities, including digital twins, machine learning-driven process control and predictive maintenance, will enhance operational efficiency and yield management. These initiatives should be complemented by targeted talent development programs to cultivate specialized expertise in areas such as extreme ultraviolet lithography, reliability testing and advanced materials. Engaging proactively with policy makers through industry consortiums can align regulatory frameworks with innovation objectives, fostering an environment conducive to R&D collaboration.

By embedding sustainability metrics into process selections and material sourcing decisions, organizations can reduce environmental impact and meet evolving end-customer expectations. Finally, establishing cross-functional task forces that integrate design, manufacturing, packaging and testing stakeholders will facilitate end-to-end optimization and accelerate the commercialization of next-generation semiconductor solutions.

Research Methodology Outlining Rigorous Data Collection Validation Processes and Analytical Frameworks Underpinning Industry Analysis

This research draws on a multi-tiered methodology combining primary and secondary data sources to ensure comprehensive coverage and analytical rigor. Primary insights were obtained through interviews with C-level executives, R&D heads, supply chain managers and technical experts across design houses, foundries, assembly and test providers. These qualitative inputs were supplemented by detailed briefings with equipment vendors, material suppliers and research institutions to validate emerging technology roadmaps.

Secondary research included a thorough review of industry publications, patent filings, regulatory filings, white papers and academic journals. Publicly available financial statements, trade data and government policy documents were analyzed to contextualize market dynamics. All data points underwent triangulation across multiple sources, with discrepancies resolved through follow-up interviews or cross-reference with proprietary analyst databases.

Quantitative modeling techniques were applied to assess cost structures, technology adoption curves and regional investment flows. Analysts performed sensitivity analyses on key assumptions to identify potential variability in strategic scenarios. Throughout the process, an internal peer review mechanism ensured methodological consistency and fact-based conclusions. This rigorous approach underpins the credibility and relevance of the insights presented in this executive summary.

Conclusion Synthesizing Seminal Findings and Strategic Imperatives to Equip Stakeholders for Informed Semiconductor Decision-Making in Dynamic Market Conditions

The semiconductor industry stands at an inflection point defined by rapid technological advancement, shifting geopolitical landscapes and evolving end-market requirements. Breakthroughs in sub-3 nanometer process technologies and advanced packaging have redefined performance benchmarks, while tariff developments underscore the importance of supply chain resilience. Segmentation analysis reveals nuanced opportunities across design disciplines, manufacturing processes, packaging variants and testing protocols, each shaped by the distinct needs of fabless firms, foundries, IDMs and outsourced providers.

Regional insights illuminate how government incentives, sustainability mandates and collaborative ecosystems are driving capacity expansions in the Americas, innovation clusters across Europe, Middle East and Africa, and production efficiencies in Asia-Pacific. Leading companies differentiate themselves through deep IP portfolios, strategic partnerships, digital manufacturing adoption and targeted investments in advanced materials and reliability testing. To thrive in this complex environment, organizations must embrace an integrated approach that aligns technology roadmaps, operational excellence and regulatory engagement.

In conclusion, strategic agility, cross-disciplinary collaboration and forward-looking investment will be the hallmarks of industry leaders. By leveraging the insights and recommendations detailed in this summary, stakeholders can capitalize on disruption, mitigate emerging risks and position themselves for sustainable growth in the dynamic semiconductor landscape.

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

  • 4.1. Introduction
  • 4.2. Market Sizing & Forecasting

5. Market Dynamics

  • 5.1. Adoption of 3D-IC heterogeneous integration for advanced compute workloads
  • 5.2. Expansion of chiplet-based architectures to accelerate high-performance computing
  • 5.3. Integration of advanced packaging with fan-out wafer-level technology for IoT devices
  • 5.4. Adoption of EUV lithography for sub-3nm node production at leading foundries
  • 5.5. Growth of AI-specific analog front-end ICs for autonomous vehicle sensing systems
  • 5.6. Deployment of advanced thermal management solutions in high-density server modules
  • 5.7. Expansion of silicon photonics integration in data center interconnect packaging
  • 5.8. Use of wafer-level vacuum packaging for MEMS sensors in wearable consumer electronics
  • 5.9. Migration to advanced substrate materials like glass interposers for 5G RF modules
  • 5.10. Increase in semiconductor test automation using machine-learning-driven test pattern generation

6. Market Insights

  • 6.1. Porter's Five Forces Analysis
  • 6.2. PESTLE Analysis

7. Cumulative Impact of United States Tariffs 2025

8. Semiconductor IC Design, Manufacturing, Packaging & Testing Market, by Product Design

  • 8.1. Introduction
  • 8.2. IC Design
    • 8.2.1. Analog IC Design
    • 8.2.2. Digital IC Design
    • 8.2.3. Memory IC Design
    • 8.2.4. Mixed Signal IC Design
    • 8.2.5. Power IC Design
    • 8.2.6. Radio Frequency IC Design
  • 8.3. IC Manufacturing
    • 8.3.1. Deposition
    • 8.3.2. Ion Implantation
    • 8.3.3. Lithography
    • 8.3.4. Wafer Fabrication
  • 8.4. IC Packaging
    • 8.4.1. Packaging Material
      • 8.4.1.1. Ceramics
      • 8.4.1.2. Composites
      • 8.4.1.3. Metals
      • 8.4.1.4. Plastics
    • 8.4.2. Packaging Technologies
      • 8.4.2.1. Advanced Packaging
      • 8.4.2.1.1. 3D Packaging Techniques
      • 8.4.2.1.2. Chip-scale Packages (CSP)
      • 8.4.2.1.3. Multi-Chip Modules (MCM)
      • 8.4.2.1.4. System-in-Package (SiP)
      • 8.4.2.2. Traditional Packaging
      • 8.4.2.2.1. Ball Grid Array (BGA)
      • 8.4.2.2.2. Dual InLine Packaging (DIP)
      • 8.4.2.2.3. Quad Flat Package (QFP)
      • 8.4.2.2.4. Small Outline Package (SOP)
  • 8.5. IC Testing
    • 8.5.1. Burn-In Testing
    • 8.5.2. Environmental & Mechanical Testing
    • 8.5.3. Final Testing
    • 8.5.4. Package Testing (Pre-Burn-In Testing)
    • 8.5.5. Reliability Testing
    • 8.5.6. System-Level Testing (SLT)
    • 8.5.7. Wafer Testing

9. Semiconductor IC Design, Manufacturing, Packaging & Testing Market, by End User

  • 9.1. Introduction
  • 9.2. Fabless Companies
  • 9.3. Foundries
  • 9.4. Integrated Device Manufacturers (IDMs)
  • 9.5. Outsourced Semiconductor Assembly and Test (OSAT) Providers

10. Semiconductor IC Design, Manufacturing, Packaging & Testing Market, by Industry Vertical

  • 10.1. Introduction
  • 10.2. Automotive
  • 10.3. Consumer Electronics
  • 10.4. Defense & Aerospace
  • 10.5. Healthcare
  • 10.6. IT & Telecommunication

11. Americas Semiconductor IC Design, Manufacturing, Packaging & Testing Market

  • 11.1. Introduction
  • 11.2. United States
  • 11.3. Canada
  • 11.4. Mexico
  • 11.5. Brazil
  • 11.6. Argentina

12. Europe, Middle East & Africa Semiconductor IC Design, Manufacturing, Packaging & Testing Market

  • 12.1. Introduction
  • 12.2. United Kingdom
  • 12.3. Germany
  • 12.4. France
  • 12.5. Russia
  • 12.6. Italy
  • 12.7. Spain
  • 12.8. United Arab Emirates
  • 12.9. Saudi Arabia
  • 12.10. South Africa
  • 12.11. Denmark
  • 12.12. Netherlands
  • 12.13. Qatar
  • 12.14. Finland
  • 12.15. Sweden
  • 12.16. Nigeria
  • 12.17. Egypt
  • 12.18. Turkey
  • 12.19. Israel
  • 12.20. Norway
  • 12.21. Poland
  • 12.22. Switzerland

13. Asia-Pacific Semiconductor IC Design, Manufacturing, Packaging & Testing Market

  • 13.1. Introduction
  • 13.2. China
  • 13.3. India
  • 13.4. Japan
  • 13.5. Australia
  • 13.6. South Korea
  • 13.7. Indonesia
  • 13.8. Thailand
  • 13.9. Philippines
  • 13.10. Malaysia
  • 13.11. Singapore
  • 13.12. Vietnam
  • 13.13. Taiwan

14. Competitive Landscape

  • 14.1. Market Share Analysis, 2024
  • 14.2. FPNV Positioning Matrix, 2024
  • 14.3. Competitive Analysis
    • 14.3.1. Advanced Micro Devices, Inc. (AMD)
    • 14.3.2. Amkor Technology, Inc.
    • 14.3.3. Arm Limited
    • 14.3.4. ASE Technology Holding Co, Ltd
    • 14.3.5. Broadcom Inc.
    • 14.3.6. Cadence Design Systems, Inc.
    • 14.3.7. GlobalFoundries U.S. Inc.
    • 14.3.8. Intel Corporation
    • 14.3.9. Jiangsu Changdian Technology Co., Ltd.
    • 14.3.10. Marvell Technology, Inc.
    • 14.3.11. MediaTek Inc.
    • 14.3.12. Micron Technology, Inc.
    • 14.3.13. NVIDIA Corporation
    • 14.3.14. Powerchip Semiconductor Manufacturing Corporation
    • 14.3.15. Qualcomm Incorporated
    • 14.3.16. Samsung Electronics Co., Ltd.
    • 14.3.17. Siemens AG
    • 14.3.18. SK HYNIX INC.
    • 14.3.19. Synopsys, Inc.
    • 14.3.20. Taiwan Semiconductor Manufacturing Company Limited
    • 14.3.21. Texas Instruments Incorporated
    • 14.3.22. Tianshui Huatian Technology Co., Ltd.
    • 14.3.23. Tongfu Microelectronics Co., Ltd.
    • 14.3.24. Tower Semiconductor Ltd.
    • 14.3.25. United Microelectronics Corporation
    • 14.3.26. Vanguard International Semiconductor Corporation
    • 14.3.27. X-FAB Silicon Foundries SE

15. ResearchAI

16. ResearchStatistics

17. ResearchContacts

18. ResearchArticles

19. Appendix

LIST OF FIGURES

  • FIGURE 1. SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET RESEARCH PROCESS
  • FIGURE 2. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, 2018-2030 (USD MILLION)
  • FIGURE 3. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY REGION, 2024 VS 2025 VS 2030 (USD MILLION)
  • FIGURE 4. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2030 (USD MILLION)
  • FIGURE 5. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PRODUCT DESIGN, 2024 VS 2030 (%)
  • FIGURE 6. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PRODUCT DESIGN, 2024 VS 2025 VS 2030 (USD MILLION)
  • FIGURE 7. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY END USER, 2024 VS 2030 (%)
  • FIGURE 8. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY END USER, 2024 VS 2025 VS 2030 (USD MILLION)
  • FIGURE 9. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY INDUSTRY VERTICAL, 2024 VS 2030 (%)
  • FIGURE 10. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY INDUSTRY VERTICAL, 2024 VS 2025 VS 2030 (USD MILLION)
  • FIGURE 11. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY COUNTRY, 2024 VS 2030 (%)
  • FIGURE 12. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2030 (USD MILLION)
  • FIGURE 13. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY STATE, 2024 VS 2030 (%)
  • FIGURE 14. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY STATE, 2024 VS 2025 VS 2030 (USD MILLION)
  • FIGURE 15. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY COUNTRY, 2024 VS 2030 (%)
  • FIGURE 16. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2030 (USD MILLION)
  • FIGURE 17. ASIA-PACIFIC SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY COUNTRY, 2024 VS 2030 (%)
  • FIGURE 18. ASIA-PACIFIC SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY COUNTRY, 2024 VS 2025 VS 2030 (USD MILLION)
  • FIGURE 19. SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SHARE, BY KEY PLAYER, 2024
  • FIGURE 20. SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET, FPNV POSITIONING MATRIX, 2024
  • FIGURE 21. SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET: RESEARCHAI
  • FIGURE 22. SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET: RESEARCHSTATISTICS
  • FIGURE 23. SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET: RESEARCHCONTACTS
  • FIGURE 24. SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET: RESEARCHARTICLES

LIST OF TABLES

  • TABLE 1. SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2024
  • TABLE 3. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, 2018-2024 (USD MILLION)
  • TABLE 4. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, 2025-2030 (USD MILLION)
  • TABLE 5. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 6. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 7. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 8. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY COUNTRY, 2025-2030 (USD MILLION)
  • TABLE 9. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PRODUCT DESIGN, 2018-2024 (USD MILLION)
  • TABLE 10. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PRODUCT DESIGN, 2025-2030 (USD MILLION)
  • TABLE 11. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC DESIGN, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 12. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC DESIGN, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 13. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ANALOG IC DESIGN, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 14. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ANALOG IC DESIGN, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 15. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY DIGITAL IC DESIGN, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 16. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY DIGITAL IC DESIGN, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 17. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MEMORY IC DESIGN, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 18. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MEMORY IC DESIGN, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 19. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MIXED SIGNAL IC DESIGN, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 20. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MIXED SIGNAL IC DESIGN, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 21. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY POWER IC DESIGN, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 22. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY POWER IC DESIGN, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 23. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY RADIO FREQUENCY IC DESIGN, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 24. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY RADIO FREQUENCY IC DESIGN, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 25. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC DESIGN, 2018-2024 (USD MILLION)
  • TABLE 26. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC DESIGN, 2025-2030 (USD MILLION)
  • TABLE 27. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC MANUFACTURING, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 28. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC MANUFACTURING, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 29. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY DEPOSITION, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 30. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY DEPOSITION, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 31. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ION IMPLANTATION, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 32. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ION IMPLANTATION, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 33. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY LITHOGRAPHY, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 34. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY LITHOGRAPHY, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 35. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY WAFER FABRICATION, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 36. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY WAFER FABRICATION, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 37. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC MANUFACTURING, 2018-2024 (USD MILLION)
  • TABLE 38. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC MANUFACTURING, 2025-2030 (USD MILLION)
  • TABLE 39. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC PACKAGING, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 40. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC PACKAGING, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 41. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING MATERIAL, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 42. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING MATERIAL, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 43. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY CERAMICS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 44. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY CERAMICS, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 45. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY COMPOSITES, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 46. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY COMPOSITES, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 47. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY METALS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 48. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY METALS, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 49. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PLASTICS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 50. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PLASTICS, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 51. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING MATERIAL, 2018-2024 (USD MILLION)
  • TABLE 52. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING MATERIAL, 2025-2030 (USD MILLION)
  • TABLE 53. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING TECHNOLOGIES, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 54. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING TECHNOLOGIES, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 55. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ADVANCED PACKAGING, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 56. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ADVANCED PACKAGING, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 57. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY 3D PACKAGING TECHNIQUES, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 58. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY 3D PACKAGING TECHNIQUES, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 59. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY CHIP-SCALE PACKAGES (CSP), BY REGION, 2018-2024 (USD MILLION)
  • TABLE 60. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY CHIP-SCALE PACKAGES (CSP), BY REGION, 2025-2030 (USD MILLION)
  • TABLE 61. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MULTI-CHIP MODULES (MCM), BY REGION, 2018-2024 (USD MILLION)
  • TABLE 62. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY MULTI-CHIP MODULES (MCM), BY REGION, 2025-2030 (USD MILLION)
  • TABLE 63. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY SYSTEM-IN-PACKAGE (SIP), BY REGION, 2018-2024 (USD MILLION)
  • TABLE 64. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY SYSTEM-IN-PACKAGE (SIP), BY REGION, 2025-2030 (USD MILLION)
  • TABLE 65. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ADVANCED PACKAGING, 2018-2024 (USD MILLION)
  • TABLE 66. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ADVANCED PACKAGING, 2025-2030 (USD MILLION)
  • TABLE 67. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TRADITIONAL PACKAGING, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 68. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TRADITIONAL PACKAGING, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 69. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY BALL GRID ARRAY (BGA), BY REGION, 2018-2024 (USD MILLION)
  • TABLE 70. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY BALL GRID ARRAY (BGA), BY REGION, 2025-2030 (USD MILLION)
  • TABLE 71. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY DUAL INLINE PACKAGING (DIP), BY REGION, 2018-2024 (USD MILLION)
  • TABLE 72. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY DUAL INLINE PACKAGING (DIP), BY REGION, 2025-2030 (USD MILLION)
  • TABLE 73. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY QUAD FLAT PACKAGE (QFP), BY REGION, 2018-2024 (USD MILLION)
  • TABLE 74. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY QUAD FLAT PACKAGE (QFP), BY REGION, 2025-2030 (USD MILLION)
  • TABLE 75. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY SMALL OUTLINE PACKAGE (SOP), BY REGION, 2018-2024 (USD MILLION)
  • TABLE 76. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY SMALL OUTLINE PACKAGE (SOP), BY REGION, 2025-2030 (USD MILLION)
  • TABLE 77. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TRADITIONAL PACKAGING, 2018-2024 (USD MILLION)
  • TABLE 78. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TRADITIONAL PACKAGING, 2025-2030 (USD MILLION)
  • TABLE 79. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING TECHNOLOGIES, 2018-2024 (USD MILLION)
  • TABLE 80. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING TECHNOLOGIES, 2025-2030 (USD MILLION)
  • TABLE 81. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC PACKAGING, 2018-2024 (USD MILLION)
  • TABLE 82. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC PACKAGING, 2025-2030 (USD MILLION)
  • TABLE 83. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC TESTING, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 84. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC TESTING, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 85. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY BURN-IN TESTING, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 86. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY BURN-IN TESTING, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 87. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ENVIRONMENTAL & MECHANICAL TESTING, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 88. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ENVIRONMENTAL & MECHANICAL TESTING, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 89. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY FINAL TESTING, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 90. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY FINAL TESTING, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 91. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGE TESTING (PRE-BURN-IN TESTING), BY REGION, 2018-2024 (USD MILLION)
  • TABLE 92. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGE TESTING (PRE-BURN-IN TESTING), BY REGION, 2025-2030 (USD MILLION)
  • TABLE 93. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY RELIABILITY TESTING, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 94. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY RELIABILITY TESTING, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 95. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY SYSTEM-LEVEL TESTING (SLT), BY REGION, 2018-2024 (USD MILLION)
  • TABLE 96. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY SYSTEM-LEVEL TESTING (SLT), BY REGION, 2025-2030 (USD MILLION)
  • TABLE 97. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY WAFER TESTING, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 98. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY WAFER TESTING, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 99. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC TESTING, 2018-2024 (USD MILLION)
  • TABLE 100. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC TESTING, 2025-2030 (USD MILLION)
  • TABLE 101. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY END USER, 2018-2024 (USD MILLION)
  • TABLE 102. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY END USER, 2025-2030 (USD MILLION)
  • TABLE 103. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY FABLESS COMPANIES, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 104. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY FABLESS COMPANIES, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 105. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY FOUNDRIES, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 106. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY FOUNDRIES, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 107. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY INTEGRATED DEVICE MANUFACTURERS (IDMS), BY REGION, 2018-2024 (USD MILLION)
  • TABLE 108. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY INTEGRATED DEVICE MANUFACTURERS (IDMS), BY REGION, 2025-2030 (USD MILLION)
  • TABLE 109. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) PROVIDERS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 110. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) PROVIDERS, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 111. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY INDUSTRY VERTICAL, 2018-2024 (USD MILLION)
  • TABLE 112. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY INDUSTRY VERTICAL, 2025-2030 (USD MILLION)
  • TABLE 113. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 114. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 115. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 116. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 117. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY DEFENSE & AEROSPACE, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 118. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY DEFENSE & AEROSPACE, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 119. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY HEALTHCARE, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 120. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY HEALTHCARE, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 121. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IT & TELECOMMUNICATION, BY REGION, 2018-2024 (USD MILLION)
  • TABLE 122. GLOBAL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IT & TELECOMMUNICATION, BY REGION, 2025-2030 (USD MILLION)
  • TABLE 123. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PRODUCT DESIGN, 2018-2024 (USD MILLION)
  • TABLE 124. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PRODUCT DESIGN, 2025-2030 (USD MILLION)
  • TABLE 125. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC DESIGN, 2018-2024 (USD MILLION)
  • TABLE 126. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC DESIGN, 2025-2030 (USD MILLION)
  • TABLE 127. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC MANUFACTURING, 2018-2024 (USD MILLION)
  • TABLE 128. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC MANUFACTURING, 2025-2030 (USD MILLION)
  • TABLE 129. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC PACKAGING, 2018-2024 (USD MILLION)
  • TABLE 130. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC PACKAGING, 2025-2030 (USD MILLION)
  • TABLE 131. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING MATERIAL, 2018-2024 (USD MILLION)
  • TABLE 132. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING MATERIAL, 2025-2030 (USD MILLION)
  • TABLE 133. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING TECHNOLOGIES, 2018-2024 (USD MILLION)
  • TABLE 134. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING TECHNOLOGIES, 2025-2030 (USD MILLION)
  • TABLE 135. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ADVANCED PACKAGING, 2018-2024 (USD MILLION)
  • TABLE 136. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ADVANCED PACKAGING, 2025-2030 (USD MILLION)
  • TABLE 137. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TRADITIONAL PACKAGING, 2018-2024 (USD MILLION)
  • TABLE 138. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TRADITIONAL PACKAGING, 2025-2030 (USD MILLION)
  • TABLE 139. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC TESTING, 2018-2024 (USD MILLION)
  • TABLE 140. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC TESTING, 2025-2030 (USD MILLION)
  • TABLE 141. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY END USER, 2018-2024 (USD MILLION)
  • TABLE 142. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY END USER, 2025-2030 (USD MILLION)
  • TABLE 143. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY INDUSTRY VERTICAL, 2018-2024 (USD MILLION)
  • TABLE 144. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY INDUSTRY VERTICAL, 2025-2030 (USD MILLION)
  • TABLE 145. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY COUNTRY, 2018-2024 (USD MILLION)
  • TABLE 146. AMERICAS SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY COUNTRY, 2025-2030 (USD MILLION)
  • TABLE 147. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PRODUCT DESIGN, 2018-2024 (USD MILLION)
  • TABLE 148. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PRODUCT DESIGN, 2025-2030 (USD MILLION)
  • TABLE 149. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC DESIGN, 2018-2024 (USD MILLION)
  • TABLE 150. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC DESIGN, 2025-2030 (USD MILLION)
  • TABLE 151. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC MANUFACTURING, 2018-2024 (USD MILLION)
  • TABLE 152. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC MANUFACTURING, 2025-2030 (USD MILLION)
  • TABLE 153. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC PACKAGING, 2018-2024 (USD MILLION)
  • TABLE 154. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC PACKAGING, 2025-2030 (USD MILLION)
  • TABLE 155. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING MATERIAL, 2018-2024 (USD MILLION)
  • TABLE 156. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING MATERIAL, 2025-2030 (USD MILLION)
  • TABLE 157. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING TECHNOLOGIES, 2018-2024 (USD MILLION)
  • TABLE 158. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING TECHNOLOGIES, 2025-2030 (USD MILLION)
  • TABLE 159. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ADVANCED PACKAGING, 2018-2024 (USD MILLION)
  • TABLE 160. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ADVANCED PACKAGING, 2025-2030 (USD MILLION)
  • TABLE 161. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TRADITIONAL PACKAGING, 2018-2024 (USD MILLION)
  • TABLE 162. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TRADITIONAL PACKAGING, 2025-2030 (USD MILLION)
  • TABLE 163. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC TESTING, 2018-2024 (USD MILLION)
  • TABLE 164. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC TESTING, 2025-2030 (USD MILLION)
  • TABLE 165. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY END USER, 2018-2024 (USD MILLION)
  • TABLE 166. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY END USER, 2025-2030 (USD MILLION)
  • TABLE 167. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY INDUSTRY VERTICAL, 2018-2024 (USD MILLION)
  • TABLE 168. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY INDUSTRY VERTICAL, 2025-2030 (USD MILLION)
  • TABLE 169. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY STATE, 2018-2024 (USD MILLION)
  • TABLE 170. UNITED STATES SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY STATE, 2025-2030 (USD MILLION)
  • TABLE 171. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PRODUCT DESIGN, 2018-2024 (USD MILLION)
  • TABLE 172. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PRODUCT DESIGN, 2025-2030 (USD MILLION)
  • TABLE 173. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC DESIGN, 2018-2024 (USD MILLION)
  • TABLE 174. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC DESIGN, 2025-2030 (USD MILLION)
  • TABLE 175. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC MANUFACTURING, 2018-2024 (USD MILLION)
  • TABLE 176. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC MANUFACTURING, 2025-2030 (USD MILLION)
  • TABLE 177. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC PACKAGING, 2018-2024 (USD MILLION)
  • TABLE 178. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC PACKAGING, 2025-2030 (USD MILLION)
  • TABLE 179. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING MATERIAL, 2018-2024 (USD MILLION)
  • TABLE 180. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING MATERIAL, 2025-2030 (USD MILLION)
  • TABLE 181. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING TECHNOLOGIES, 2018-2024 (USD MILLION)
  • TABLE 182. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING TECHNOLOGIES, 2025-2030 (USD MILLION)
  • TABLE 183. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ADVANCED PACKAGING, 2018-2024 (USD MILLION)
  • TABLE 184. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ADVANCED PACKAGING, 2025-2030 (USD MILLION)
  • TABLE 185. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TRADITIONAL PACKAGING, 2018-2024 (USD MILLION)
  • TABLE 186. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TRADITIONAL PACKAGING, 2025-2030 (USD MILLION)
  • TABLE 187. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC TESTING, 2018-2024 (USD MILLION)
  • TABLE 188. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC TESTING, 2025-2030 (USD MILLION)
  • TABLE 189. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY END USER, 2018-2024 (USD MILLION)
  • TABLE 190. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY END USER, 2025-2030 (USD MILLION)
  • TABLE 191. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY INDUSTRY VERTICAL, 2018-2024 (USD MILLION)
  • TABLE 192. CANADA SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY INDUSTRY VERTICAL, 2025-2030 (USD MILLION)
  • TABLE 193. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PRODUCT DESIGN, 2018-2024 (USD MILLION)
  • TABLE 194. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PRODUCT DESIGN, 2025-2030 (USD MILLION)
  • TABLE 195. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC DESIGN, 2018-2024 (USD MILLION)
  • TABLE 196. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC DESIGN, 2025-2030 (USD MILLION)
  • TABLE 197. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC MANUFACTURING, 2018-2024 (USD MILLION)
  • TABLE 198. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC MANUFACTURING, 2025-2030 (USD MILLION)
  • TABLE 199. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC PACKAGING, 2018-2024 (USD MILLION)
  • TABLE 200. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC PACKAGING, 2025-2030 (USD MILLION)
  • TABLE 201. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING MATERIAL, 2018-2024 (USD MILLION)
  • TABLE 202. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING MATERIAL, 2025-2030 (USD MILLION)
  • TABLE 203. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING TECHNOLOGIES, 2018-2024 (USD MILLION)
  • TABLE 204. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING TECHNOLOGIES, 2025-2030 (USD MILLION)
  • TABLE 205. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ADVANCED PACKAGING, 2018-2024 (USD MILLION)
  • TABLE 206. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ADVANCED PACKAGING, 2025-2030 (USD MILLION)
  • TABLE 207. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TRADITIONAL PACKAGING, 2018-2024 (USD MILLION)
  • TABLE 208. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TRADITIONAL PACKAGING, 2025-2030 (USD MILLION)
  • TABLE 209. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC TESTING, 2018-2024 (USD MILLION)
  • TABLE 210. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC TESTING, 2025-2030 (USD MILLION)
  • TABLE 211. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY END USER, 2018-2024 (USD MILLION)
  • TABLE 212. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY END USER, 2025-2030 (USD MILLION)
  • TABLE 213. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY INDUSTRY VERTICAL, 2018-2024 (USD MILLION)
  • TABLE 214. MEXICO SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY INDUSTRY VERTICAL, 2025-2030 (USD MILLION)
  • TABLE 215. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PRODUCT DESIGN, 2018-2024 (USD MILLION)
  • TABLE 216. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PRODUCT DESIGN, 2025-2030 (USD MILLION)
  • TABLE 217. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC DESIGN, 2018-2024 (USD MILLION)
  • TABLE 218. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC DESIGN, 2025-2030 (USD MILLION)
  • TABLE 219. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC MANUFACTURING, 2018-2024 (USD MILLION)
  • TABLE 220. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC MANUFACTURING, 2025-2030 (USD MILLION)
  • TABLE 221. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC PACKAGING, 2018-2024 (USD MILLION)
  • TABLE 222. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC PACKAGING, 2025-2030 (USD MILLION)
  • TABLE 223. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING MATERIAL, 2018-2024 (USD MILLION)
  • TABLE 224. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING MATERIAL, 2025-2030 (USD MILLION)
  • TABLE 225. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING TECHNOLOGIES, 2018-2024 (USD MILLION)
  • TABLE 226. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY PACKAGING TECHNOLOGIES, 2025-2030 (USD MILLION)
  • TABLE 227. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ADVANCED PACKAGING, 2018-2024 (USD MILLION)
  • TABLE 228. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY ADVANCED PACKAGING, 2025-2030 (USD MILLION)
  • TABLE 229. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TRADITIONAL PACKAGING, 2018-2024 (USD MILLION)
  • TABLE 230. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY TRADITIONAL PACKAGING, 2025-2030 (USD MILLION)
  • TABLE 231. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC TESTING, 2018-2024 (USD MILLION)
  • TABLE 232. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY IC TESTING, 2025-2030 (USD MILLION)
  • TABLE 233. BRAZIL SEMICONDUCTOR IC DESIGN, MANUFACTURING, PACKAGING & TESTING MARKET SIZE, BY END USER, 2018-2024 (USD MILLION)
  • TABLE 234. BRAZIL SEMICONDUCTOR IC