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市場調查報告書
商品編碼
1433454

全球3D半導體封裝市場 2023-2030

Global 3D Semiconductor Packaging Market 2023-2030
出版日期: | 出版商: Orion Market Research | 英文 120 Pages | 商品交期: 2-3個工作天內

價格

預計全球3D半導體封裝市場在預測期內（2024-2031年）將以 10.2%的複合CAGR成長。微電子設備對3D半導體封裝的需求增加推動了3D半導體封裝產業的成長。越來越多採用先進封裝技術，提高效率，降低功耗，是支持全球市場成長的關鍵因素。市場參與者也致力於推出3D半導體封裝解決方案，以進一步促進市場成長。例如，2023年 11月，半導體封裝和測試服務供應商 Amkor Technology, Inc. 宣佈在亞利桑那州皮奧裡亞建造先進的封裝和測試設施。到工程全部完成時，Amkor 預計將在新工廠投資約20 億美元並僱用約 2,000 名員工。

細分市場前景

全球3D半導體封裝市場依技術、材料和產業垂直領域進行細分。根據技術，市場可細分為3D矽通孔、3D層疊封裝、基於3D扇出和3D引線接合。根據材料，市場細分為有機基板、鍵合線、引線框架、封裝樹脂和陶瓷封裝。此外，根據垂直產業，市場細分為電子、工業、汽車和運輸、醫療保健、IT 和電信以及航空航太和國防。在垂直行業中，由於透過將多個半導體晶片堆疊在一起的3D封裝整合發展到了新的水準，預計電子子細分市場將佔據相當大的市場佔有率。

3D矽通孔子細分市場預計將在全球3D半導體封裝市場中佔據相當大的佔有率

其中，3D矽通孔技術預計將在全球3D半導體封裝市場中佔據相當大的佔有率。細分市場的成長歸因於3D封裝中矽通孔（TSV）結構的影響力日益增強。 TSV 用於建構包含多個半導體晶片的 2.5D和3D封裝。該結構能夠實現垂直堆疊，無需先前在有機基板上的堆疊封裝中使用的邊緣佈線或引線鍵合。例如，2022年9月，EV Group（EVG）推出了NanoCleave，這是一種革命性的矽層釋放技術，可實現前端處理的超薄層堆疊，包括先進邏輯、記憶體和功率裝置形成，以及3D半導體先進的封裝。

區域展望

全球3D半導體封裝市場根據地理位置進一步細分，包括北美（美國和加拿大）、歐洲（英國、義大利、西班牙、德國、法國和歐洲其他地區）、亞太地區（印度、中國、日本、韓國和亞洲其他地區）以及世界其他地區（中東和非洲以及拉丁美洲）。其中，亞太地區預計將在全球市場中佔據顯著佔有率。為了方便用戶使用，對緊湊電子電路的需求以及電子設備尺寸的減小是該區域市場高佔有率的關鍵因素。

2021年半導體產業按活動和地區分類的增加值（%）

目錄

第1章 報告摘要

  • 目前行業分析及成長潛力展望
  • 研究方法和工具
  • 市場區隔
    • 按細分
    • 依地區

第2章 市場概述與見解

  • 報告範圍
  • 分析師見解和當前市場趨勢
    • 主要發現
    • 建議
    • 結論

第3章 競爭格局

  • 主要公司分析
  • Advanced Micro Devices, Inc.
    • 概述
    • 財務分析
    • SWOT分析
    • 最近的發展
  • Intel Corp.
    • 概述
    • 財務分析
    • SWOT分析
    • 最近的發展
  • Samsung Electronics Co., Ltd.
    • 概述
    • 財務分析
    • SWOT分析
    • 最近的發展
  • 關鍵策略分析

第4章 市場細分

  • 依技術分類的全球3D半導體封裝市場
    • 3D矽通孔
    • 3D封裝
    • 基於3D扇出
    • 3D焊接線
  • 依材料分類的全球3D半導體封裝市場
    • 有機基材
    • 鍵合線
    • 引線框架
    • 封裝樹脂
    • 陶瓷封裝
  • 按垂直產業分類的全球3D半導體封裝市場
    • 電子產品
    • 工業
    • 汽車與運輸
    • 衛生保健
    • 資訊科技與電信
    • 航太與國防

第5章 區域分析

  • 北美洲
    • 美國
    • 加拿大
  • 歐洲
    • 英國
    • 德國
    • 義大利
    • 西班牙
    • 法國
    • 歐洲其他地區
  • 亞太
    • 中國
    • 印度
    • 日本
    • 韓國
    • 亞太其他地區
  • 世界其他地區

第6章 公司簡介

  • Amkor Technology
  • Analog Devices, Inc.
  • Cadence Design Systems, Inc.
  • GlobalFoundries
  • Indium Corp.
  • Micron Technology, Inc.
  • NVIDIA Corp.
  • Qualcomm Technologies, Inc.
  • Semiconductor Components Industries, LLC
  • Siliconware Precision Industries Co., Ltd.
  • SK HYNIX INC.
  • STMicroelectronics
  • Taiwan Semiconductor Manufacturing Company Ltd.
  • TEKTRONIX, INC.
  • Texas Instruments Inc.
  • Thermo Fisher Scientific Inc.
  • Tower Semiconductor
  • United Microelectronics Corp.
Product Code: OMR2028041

Global 3D Semiconductor Packaging Market Size, Share & Trends Analysis Report by Technology (Organic Substrate, Bonding Wire, Leadframe, Encapsulation Resin and Ceramic Package), by Material (Organic Substrate, Bonding Wire, Leadframe, Encapsulation Resin and Ceramic Package), and by Industry Vertical (Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication and Aerospace & Defense), Forecast Period (2024-2031)

The global 3D semiconductor packaging market is anticipated to grow at a considerable CAGR of 10.2% during the forecast period (2024-2031). An increased demand for 3D semiconductor packaging in microelectronic devices drives the growth in the 3D semiconductor packaging industry. The growing adoption of advanced packaging technology with improved efficiency, and less power consumption is the key factor supporting the growth of the market globally. The market players are also focusing on introducing 3D semiconductor packaging solutions that further bolster the market growth. For instance, in November 2023, Amkor Technology, Inc., a provider of semiconductor packaging and test services, announced to building of an advanced packaging and test facility in Peoria, Arizona. By the time of full project completion, Amkor projects to invest approximately $2 billion and employ approximately 2,000 people at the new facility.

Segmental Outlook

The global 3D semiconductor packaging market is segmented on the technology, material, and industry verticals. Based on the technology, the market is sub-segmented into 3D through silicon via, 3D package on package, 3D fan out based and 3D wire bonded. Based on the material, the market is sub-segmented into organic substrate, bonding wire, leadframe, encapsulation resin and ceramic package. Further, on the basis of industry verticals, the market is sub-segmented into electronics, industrial, automotive & transport, healthcare, IT & telecommunication and aerospace & defense. Among the industry vertical, the electronics sub-segment is anticipated to hold a considerable share of the market owing to the rise in the development of 3D packaging integration to the next level by stacking multiple semiconductor dies on top of each other.

The 3D Through silicon via Sub-Segment is Anticipated to Hold a Considerable Share of the Global 3D Semiconductor Packaging Market

Among the technology, the 3D Through silicon via sub-segment is expected to hold a considerable share of the global 3D semiconductor packaging market. The segmental growth is attributed to the growing influence of the Through-Silicon Via (TSV) Structures in 3D Packages. TSVs are used to build 2.5D and 3D packages that contain multiple semiconductor dies. The structures enable vertical stacking without the edge wiring or wire bonding that was formerly used in stacked packages on organic substrates. For instance, in September 2022, EV Group (EVG) launched NanoCleave, a revolutionary layer release technology for silicon that enables ultra-thin layer stacking for front-end processing, including advanced logic, memory and power device formation, as well as 3D semiconductor advanced packaging.

Regional Outlook

The global 3D semiconductor packaging market is further segmented based on geography including North America (the US, and Canada), Europe (UK, Italy, Spain, Germany, France, and the Rest of Europe), Asia-Pacific (India, China, Japan, South Korea, and Rest of Asia), and the Rest of the World (the Middle East & Africa, and Latin America. Among these, Asia-Pacific is anticipated to hold a prominent share of the market across the globe. The increased demand for compact electronic circuitry with the decreasing size of electronic devices for ease of access for users is a key contributor to the high share of the regional market.

Semiconductor Industry Value Added by Activity and Region 2021 (%)

Source: Semiconductor Industry Association

North America is Expected to Grow at a Considerable CAGR in the Global 3D Semiconductor Packaging Market

Among all regions, the North America regions is anticipated to grow at a considerable CAGR over the forecast period. Regional growth is attributed to the increasing production of semiconductor components, the presence of a large consumer base for electronics products, the high penetration of smartphones among the young population and a strong R&D pipeline for the semiconductor industries drive the growth of the market in the region. The key market players include Advanced Micro Devices, Inc., Amkor Technology, Intel Corp., Microchip Technology Inc., NVIDIA Corp. and others.

Making substantial investments in domestic packaging capabilities and R&D is critical to creating a thriving semiconductor ecosystem in the region. For instance, in November 2023, the National Institute of Standards and Technology (NIST) released an approximately $3 billion National Advanced Packaging Manufacturing Program. The program boosts U.S. advanced packaging capabilities for semiconductors.

Market Players Outlook

The major companies serving the 3D semiconductor packaging market include Advanced Micro Devices, Inc., Amkor Technology, Intel Corp., Samsung Electronics Co., Ltd., United Microelectronics Corp., and others. The market players are considerably contributing to the market growth by the adoption of various strategies including mergers and acquisitions, partnerships, collaborations, funding, and new product launches, to stay competitive in the market. For instance, in June 2023, Cadence Design Systems, Inc. expanded collaboration with Samsung Foundry to accelerate 3D-IC design development for integrity 3D-IC platform supports Samsung's new 3D CODE standard, enabling designers to create a variety of advanced packaging technologies.

The Report Covers:

  • Market value data analysis of 2023 and forecast to 2031.
  • Annualized market revenues ($ million) for each market segment.
  • Country-wise analysis of major geographical regions.
  • Key companies operating in the global 3D semiconductor packaging market. Based on the availability of data, information related to new product launches, and relevant news is also available in the report.
  • Analysis of business strategies by identifying the key market segments positioned for strong growth in the future.
  • Analysis of market-entry and market expansion strategies.
  • Competitive strategies by identifying 'who-stands-where' in the market.

Table of Contents

1. Report Summary

  • Current Industry Analysis and Growth Potential Outlook
  • 1.1. Research Methods and Tools
  • 1.2. Market Breakdown
    • 1.2.1. By Segments
    • 1.2.2. By Region

2. Market Overview and Insights

  • 2.1. Scope of the Report
  • 2.2. Analyst Insight & Current Market Trends
    • 2.2.1. Key Findings
    • 2.2.2. Recommendations
    • 2.2.3. Conclusion

3. Competitive Landscape

  • 3.1. Key Company Analysis
  • 3.2. Advanced Micro Devices, Inc.
    • 3.2.1. Overview
    • 3.2.2. Financial Analysis
    • 3.2.3. SWOT Analysis
    • 3.2.4. Recent Developments
  • 3.3. Intel Corp.
    • 3.3.1. Overview
    • 3.3.2. Financial Analysis
    • 3.3.3. SWOT Analysis
    • 3.3.4. Recent Developments
  • 3.4. Samsung Electronics Co., Ltd.
    • 3.4.1. Overview
    • 3.4.2. Financial Analysis
    • 3.4.3. SWOT Analysis
    • 3.4.4. Recent Developments
  • 3.5. Key Strategy Analysis

4. Market Segmentation

  • 4.1. Global 3D Semiconductor Packaging Market by Technology
    • 4.1.1. 3D Through silicon via
    • 4.1.2. 3D Package on Package
    • 4.1.3. 3D Fan Out Based
    • 4.1.4. 3D Wire Bonded
  • 4.2. Global 3D Semiconductor Packaging Market by Material
    • 4.2.1. Organic Substrate
    • 4.2.2. Bonding Wire
    • 4.2.3. Leadframe
    • 4.2.4. Encapsulation Resin
    • 4.2.5. Ceramic Package
  • 4.3. Global 3D Semiconductor Packaging Market by Industry Vertical
    • 4.3.1. Electronics
    • 4.3.2. Industrial
    • 4.3.3. Automotive & Transport
    • 4.3.4. Healthcare
    • 4.3.5. IT & Telecommunication
    • 4.3.6. Aerospace & Defense

5. Regional Analysis

  • 5.1. North America
    • 5.1.1. United States
    • 5.1.2. Canada
  • 5.2. Europe
    • 5.2.1. UK
    • 5.2.2. Germany
    • 5.2.3. Italy
    • 5.2.4. Spain
    • 5.2.5. France
    • 5.2.6. Rest of Europe
  • 5.3. Asia-Pacific
    • 5.3.1. China
    • 5.3.2. India
    • 5.3.3. Japan
    • 5.3.4. South Korea
    • 5.3.5. Rest of Asia-Pacific
  • 5.4. Rest of the World

6. Company Profiles

  • 6.1. Amkor Technology
  • 6.2. Analog Devices, Inc.
  • 6.3. Cadence Design Systems, Inc.
  • 6.4. GlobalFoundries
  • 6.5. Indium Corp.
  • 6.6. Micron Technology, Inc.
  • 6.7. NVIDIA Corp.
  • 6.8. Qualcomm Technologies, Inc.
  • 6.9. Semiconductor Components Industries, LLC
  • 6.10. Siliconware Precision Industries Co., Ltd.
  • 6.11. SK HYNIX INC.
  • 6.12. STMicroelectronics
  • 6.13. Taiwan Semiconductor Manufacturing Company Ltd.
  • 6.14. TEKTRONIX, INC.
  • 6.15. Texas Instruments Inc.
  • 6.16. Thermo Fisher Scientific Inc.
  • 6.17. Tower Semiconductor
  • 6.18. United Microelectronics Corp.

LIST OF TABLES

  • 1. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY TECHNOLOGY, 2023-2031 ($ MILLION)
  • 2. GLOBAL 3D THROUGH SILICON VIA SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 3. GLOBAL 3D PACKAGE ON PACKAGE SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 4. GLOBAL 3D FAN OUT BASED SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 5. GLOBAL 3D WIRE BONDED SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 6. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY MATERIAL, 2023-2031 ($ MILLION)
  • 7. GLOBAL ORGANIC SUBSTRATE 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 8. GLOBAL BONDING WIRE 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 9. GLOBAL LEADFRAME 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 10. GLOBAL ENCAPSULATION RESIN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 11. GLOBAL CERAMIC PACKAGE 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 12. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY INDUSTRY VERTICAL, 2023-2031 ($ MILLION)
  • 13. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR ELECTRONICS MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 14. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR INDUSTRIAL MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 15. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR AUTOMOTIVE & TRANSPORT MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 16. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR HEALTHCARE MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 17. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR IT & TELECOMMUNICATION MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 18. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR AEROSPACE & DEFENSE MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 19. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 20. NORTH AMERICAN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY COUNTRY, 2023-2031 ($ MILLION)
  • 21. NORTH AMERICAN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY TECHNOLOGY, 2023-2031 ($ MILLION)
  • 22. NORTH AMERICAN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY MATERIAL, 2023-2031 ($ MILLION)
  • 23. NORTH AMERICAN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY INDUSTRY VERTICAL, 2023-2031 ($ MILLION)
  • 24. EUROPEAN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY COUNTRY, 2023-2031 ($ MILLION)
  • 25. EUROPEAN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY TECHNOLOGY, 2023-2031 ($ MILLION)
  • 26. EUROPEAN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY MATERIAL, 2023-2031 ($ MILLION)
  • 27. EUROPEAN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY INDUSTRY VERTICAL, 2023-2031 ($ MILLION)
  • 28. ASIA- PACIFIC 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY COUNTRY, 2023-2031 ($ MILLION)
  • 29. ASIA- PACIFIC 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY TECHNOLOGY, 2023-2031 ($ MILLION)
  • 30. ASIA- PACIFIC 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY MATERIAL, 2023-2031 ($ MILLION)
  • 31. ASIA- PACIFIC 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY INDUSTRY VERTICAL, 2023-2031 ($ MILLION)
  • 32. REST OF THE WORLD 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 33. REST OF THE WORLD 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY TECHNOLOGY, 2023-2031 ($ MILLION)
  • 34. REST OF THE WORLD 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY MATERIAL, 2023-2031 ($ MILLION)
  • 35. REST OF THE WORLD 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY INDUSTRY VERTICAL, 2023-2031 ($ MILLION)

LIST OF FIGURES

  • 1. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY TECHNOLOGY, 2023 VS 2031 (%)
  • 2. GLOBAL 3D THROUGH SILICON VIA SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 3. GLOBAL 3D PACKAGE ON PACKAGE SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 4. GLOBAL 3D FAN OUT BASED SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 5. GLOBAL 3D WIRE BONDED SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 6. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY MATERIAL, 2023 VS 2031 (%)
  • 7. GLOBAL ORGANIC SUBSTRATE 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 8. GLOBAL BONDING WIRE 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 9. GLOBAL LEADFRAME 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 10. GLOBAL ENCAPSULATION RESIN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 11. GLOBAL CERAMIC PACKAGE 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 12. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY INDUSTRY VERTICAL, 2023 VS 2031 (%)
  • 13. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR ELECTRONICS MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 14. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR INDUSTRIAL MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 15. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR AUTOMOTIVE & TRANSPORT MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 16. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR HEALTHCARE MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 17. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR IT & TELECOMMUNICATION MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 18. GLOBAL 3D SEMICONDUCTOR PACKAGING AEROSPACE & DEFENSE MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 19. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 20. US 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 21. CANADA 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 22. UK 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 23. FRANCE 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 24. GERMANY 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 25. ITALY 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 26. SPAIN 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 27. REST OF EUROPE 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 28. INDIA 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 29. CHINA 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 30. JAPAN 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 31. SOUTH KOREA 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 32. REST OF ASIA-PACIFIC 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 33. REST OF THE WORLD 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)