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市場調查報告書

商品編碼

1692126

2.5D 和 3D 半導體封裝－市場佔有率分析、產業趨勢和統計、成長預測（2025-2030 年）

2.5D & 3D Semiconductor Packaging - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2025 - 2030)

出版日期: 2025年03月18日 | 出版商:

Mordor Intelligence | 英文 129 Pages | 商品交期: 2-3個工作天內

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簡介目錄

2.5D 和 3D 半導體封裝市場規模預計在 2025 年達到 114.7 億美元，預計到 2030 年將達到 253.7 億美元，預測期內（2025-2030 年）的複合年成長率為 17.2%。

2.5D 和 3D 是將多個 IC 整合在一個封裝內的封裝技術。在 2.5D 結構中，多個主動半導體晶片並排放置在矽中介層上，從而實現高晶粒間互連密度。在 3D 架構中，有源晶片採用晶粒堆疊進行整合，以實現最短的互連和最小的封裝佔用空間。近年來，2.5D和3D憑藉其極高的封裝密度和能源效率等優勢，逐漸成為理想的晶片組整合平台。

主要亮點

高效能運算、資料中心網路和自動駕駛汽車正在推動該市場的採用率並加速技術發展。趨勢是在雲端、邊緣運算和設備層面擁有更多的運算資源。此外，通訊和基礎設施行業高階性能應用和人工智慧（AI）的成長正在推動該市場的發展。
數位化的提高、遠端工作和工作趨勢的增加以及消費者對電子產品需求的不斷成長，正在推動對能夠實現各種新功能的先進半導體設備的需求。隨著對半導體元件的需求不斷成長，先進的封裝技術提供了當今數位化世界所需的外形規格和處理能力。
資訊科技正在徹底改變現代消費者和產品消費模式。產品，尤其是電子產品，曾經僅由電氣和機械部件組成，現在正成為以多種方式結合硬體、軟體、感測器、微處理器、資料儲存、微處理器和連接性的複雜系統，從而形成提供不斷增加功能的電子設備。
2.5D/3D半導體封裝單元的設計、開發和安裝需要大量的前期投資，具體取決於各行業的要求。 3D 半導體封裝的主要成本促進因素包括矽通孔 (TSV) 形成產量比率損失、晶圓凸塊、TSV 曝光、組裝產量比率、FOEL 和 BOEL。
根據美國預算辦公室的數據，預計到 2033 年，美國國防支出將逐年增加。 2023 年，美國國防支出將達到 7,460 億美元。同一預測也顯示，到 2033 年，美國國防開支將成長到 1.1 兆美元。全球國防預算的增加可能為所研究市場的成長提供有利機會。

2.5D/3D半導體封裝市場趨勢

通訊和電訊終端用戶產業預計將佔據較大的市場佔有率

通訊和電訊是市場成長最快的領域之一。全球範圍內產生的數據量正在快速成長。數據爆炸是由許多嵌入式設備推動的，這些設備在每次單獨的交易中都會產生少量數據，而這些數據加在一起就形成了巨量資料。組織從各種來源收集數據，包括智慧（物聯網）設備、商業交易、工業設備和社交媒體。
世界各地的組織都希望能夠快速處理和處理資料並從中獲益。高效能運算 (HPC) 使公司能夠增加建立可以利用大量資料的深度學習演算法所需的運算規模。隨著更多數據的出現，對更多運算資源的需求也隨之出現，導致 HPC 的採用率增加，進而推動市場成長。高效能運算的興起推動了對具有更高性能、更低延遲、更大頻寬和更高功率效率的半導體裝置的需求，從而對 2.5D 和 3D 封裝技術產生了巨大的需求。
通訊基地台在確保行動電話和智慧型手機等行動裝置的強大通訊生態系統方面發揮著至關重要的作用。由於高頻率，5G技術有可能以驚人的速度有效地管理大量數據，因此需要更密集的基地台網路。與4G LTE相比，5G基地台將擁有更多的發射天線和元件，導致功耗和發熱量增加。
根據GSMA預測，到2025年，5G行動連線預計將分別佔韓國和日本總連線數的73%和68%。到 2030 年，海灣合作理事會國家約 95% 的行動連線將實現 5G 連接，而亞洲這一比例將達到 93%。 5G智慧型手機和網路的日益普及將創造新的市場機會。
在5G及其後續技術推動下，通訊業正不斷提高資料傳輸速度。這些技術進步需要強大的基礎設施來管理資料量的急劇成長。公司可能會使用 2.5D 和 3D 封裝來開發高效能處理器和網路設備，以滿足產業不斷升級的需求。

中國：預計將實現顯著成長

技術進步透過使用緊湊設計的半導體晶片，促進了各種家用電器、醫療設備、通訊和通訊設備以及汽車的複雜化和小型化，從而推動了中國市場的需求。
隨著該國推出 5G 服務，對智慧型手機的需求正在增加，預計這將在預測期內推動市場成長。連網型設備的成長、支援 5G 的智慧型手機以及中國在生產家用電器方面的強大製造能力正在推動市場的成長。
工信部表示，中國的5G基礎設施正在蓬勃發展，到2023年底將擁有338萬個基地台。在大力投入和積極部署戰略的支持下，中國已實現5G廣泛覆蓋。預計到2024年，基地台數量將超過600萬個。該地區 5G 的不斷普及預計將推動對 5G 設備的需求，從而增加中國對 2.5D 和 3D 半導體封裝的需求。
政府投資和私營部門產品開發的成長，以提高半導體元件的效率並支持對節能電子設備日益成長的需求，可能會支持市場成長。
例如，2023年8月，中國國家自然科學基金委員會（NSFC）啟動了一項新計劃，資助數十個專注於小型晶片技術的計劃。 NSFC是國內基礎研究和前沿發展的主要資金來源。這將有助於推動半導體封裝的進步，並為在中國2.5D和3D半導體封裝市場營運的供應商創造機會。
中國市場龐大的製造能力、現有的工業基礎設施以及對半導體裝置製造的優先考慮可能會支持市場成長。
例如，2024年5月，中國成立了第三個也是最大的國有半導體投資基金，規模達475億美元，以加倍努力打造國內晶片產業。預計這將支持該國對 2.5D 和 3D 半導體封裝的需求，用於為半導體設備提供保護外殼。
因此，政府不斷加強國內半導體生態系統的舉措以及該國作為汽車和家用電子電器領域的全球生產國的崛起可能會支持市場成長。

2.5D和3D半導體封裝產業概況

2.5D和3D半導體市場已呈現半固體，既有全球性企業，也有中小型企業。市場的主要企業包括日月光集團、安靠科技公司、英特爾公司、三星電子和矽品精密工業公司 (SPIL)。市場上的公司正在採取收購和聯盟等策略來加強其產品供應並獲得永續的競爭優勢。

2024年4月，三星AVP團隊訂單NVIDIA AI晶片先進封裝契約，從而實現未來高頻寬記憶體晶片的供應。三星電子的 AVP 團隊可能負責為 Nvidia 的 AI 處理器提供內插器和 2.5D 封裝技術。不過，這些處理器中使用的 HBM 和 GPU 晶片很可能來自其他供應商。 2.5D封裝技術可以將CPU、GPU、HBM等晶片水平整合在內插器上。
2023年10月，日月光科技控股子公司日月光半導體製造股份有限公司（Advanced Semiconductor Engineering Inc.）發布了其整合設計生態系統（IDE）。此協同設計工具集旨在系統化增強 VIPack 平台上的先進封裝架構。這種新方法可以實現從單晶粒SoC 到多晶片分解 IP 區塊（如晶片和記憶體）的平穩過渡，從而利用 2.5D 或先進的扇出結構進行整合。

其他福利：

Excel 格式的市場預測 (ME) 表
3個月的分析師支持

公司簡介
- ASE Group
- Amkor Technology Inc.
- Intel Corporation
- Samsung Electronics Co. Ltd
- Siliconware Precision Industries Co. Ltd（SPIL）
- Powertech Technology Inc.
- Jiangsu Changjiang Electronics Technology Co. Ltd
- TSMC Limited
- GlobalFoundries Inc.
- Tezzaron Semiconductor Corporation.

第8章投資分析

第9章：未來市場展望

簡介目錄

Product Code: 90796

The 2.5D & 3D Semiconductor Packaging Market size is estimated at USD 11.47 billion in 2025, and is expected to reach USD 25.37 billion by 2030, at a CAGR of 17.2% during the forecast period (2025-2030).

2.5D & 3D Semiconductor Packaging - Market - IMG1

2.5D and 3D are packaging methodologies that include multiple ICs inside the package. In a 2.5D structure, multiple active semiconductor chips are placed side-by-side on silicon interposers to achieve high die-to-die interconnect density. In a 3D structure, active chips are integrated by die stacking for the shortest interconnect and smallest package footprint. In recent years, 2.5D and 3D have gained momentum as ideal chipset integration platforms due to their merits in achieving extremely high packaging density and energy efficiency.

Key Highlights

High-performance computing, data center networking, and autonomous vehicles are pushing the adoption rates for the market studied and accelerating its technological evolution. The trend is to have more enormous computing resources at the cloud, edge computing, and device levels. The advancements in the market studied are also possible due to the growth in high-end performance applications and artificial intelligence (AI) in the telecom and infrastructure industry.
Rising digitization, increasing trends of remote work and remote operations, and increasing consumer demand for electronics have sparked the need for advanced semiconductor devices that enable various new capabilities. As the demands for semiconductor devices intensify consistently, advanced packaging techniques provide the form factor and processing power required for today's digitized world.
Information technology is revolutionizing the consumption pattern of modern consumers and products. Once composed solely of electrical and mechanical parts, products, especially electronic ones, are increasingly becoming complex systems that combine hardware, software, sensors, microprocessors, data storage, microprocessors, and connectivity in myriad ways, providing more functionalities to the resulting electronic devices.
Significantly high initial investment is required in the design, development, and setting up of 2.5D/3D semiconductor packaging units as per the requirements of different industries. The major cost-driving processes of 3D semiconductor packaging include Through Silicon Via (TSV) creation yield loss, Wafer bumping, TSV reveals, Assembly yield, FOEL, BOEL, etc.
According to the US Congressional Budget Office, defense spending in the United States was predicted to increase yearly until 2033. Defense outlays in the United States amounted to USD 746 billion in 2023. The forecast predicted an increase to USD 1.1 trillion in 2033. The increasing defense budgets globally are likely to offer lucrative opportunities for the growth of the market studied.

2.5D and 3D Semiconductor Packaging Market Trends

Communications and Telecom End-user Industry is Expected to Hold Significant Market Share

Communications and telecom represent one of the fastest-growing segments of the market. The amount of data generated worldwide is increasing at a rapid pace. The explosion of data is fueled by many embedded devices that produce a small amount of data for each discrete transaction and add up to big data when clubbed together. Organizations collect data from various sources, including smart (IoT) devices, business transactions, industrial equipment, social media, etc.
Organizations worldwide are looking to benefit from processing and acting upon data quickly. High-performance computing (HPC) has enabled businesses to scale computationally to build deep-learning algorithms that may take advantage of high volumes of data. As more data emerges, the need for more significant amounts of computing resources emerges, leading to greater adoption of HPC, which drives the market's growth. With the proliferation of high-performance computing, there is an escalating demand for semiconductor devices that deliver enhanced performance, lower latency, increased bandwidth, and power efficiency, creating significant demand for 2.5D and 3D packaging technologies.
Communication base stations play a pivotal role in ensuring a robust communication ecosystem for mobile devices, including phones and smartphones. Given its high frequencies, 5G technology may efficiently manage vast data volumes at remarkable speeds, requiring a denser network of base stations. In contrast to 4G LTE, 5G base stations feature more transmitting antennas and components, leading to increased power consumption and heat generation.
According to the GSMA, in 2025, the share of 5G mobile connections of total connections in South Korea and Japan are anticipated to account for 73% and 68%, respectively. About 95% of mobile connections will be 5G by 2030 in GCC states and 93% in Asia. The increasing adoption of 5G smartphones and networks creates new market opportunities.
The telecom industry continually advances data transmission speeds, driven by technologies such as 5G and its successors. These innovations demand robust infrastructure to manage the surge in data volumes. Companies may use 2.5D and 3D packaging to develop high-performance processors and network equipment, meeting the industry's escalating requirements.

China Expected to Witness Significant Growth

Advancing technologies have contributed to the advancement and miniaturization of various consumer electronics, medical devices, telecom and communication devices, and automobiles by using compactly designed semiconductor chips, which would fuel the demand for the market in China.
With the launch of 5G services in the country, smartphone demand has been increasing in China, which is likely to fuel the market's growth during the forecast period. The growth of connected devices, 5G-enabled smartphones, and the country's large manufacturing capabilities in the production of consumer electronic products are fueling the market's growth.
According to MIIT, China's 5G infrastructure surged, boasting 3.38 million base stations by the close of 2023. Bolstered by substantial investments and aggressive deployment strategies, the nation achieved broad 5G coverage. Projections indicated a climb to over six million base stations by 2024. The rising execution of 5G in the region is also anticipated to boost the need for 5G-enabled devices, thereby increasing the demand for 2.5D and 3D semiconductor packaging in China.
The growth of governmental investments and private players' product development to increase the efficiency of semiconductor components and support the increasing demand for energy-efficient electronic devices would support the market's growth.
For instance, in August 2023, the National Natural Science Foundation of China (NSFC), a primary domestic funding source for basic research and frontier exploration, launched a new program to finance dozens of projects focused on chiplet technology. This would support the advancement in semiconductor packing and create an opportunity for market vendors operating in the country's 2.5D and 3D semiconductor packaging market.
The Chinese market's large manufacturing capabilities, the existing industrial infrastructure, and the priority of the country's manufacturing of semiconductor devices would support the market's growth.
For instance, in May 2024, China set up its third and largest state-backed semiconductor investment fund, worth USD 47.5 billion, as the country redoubled its efforts to build its domestic chip industry, which would support the demand for the 2.5D and 3D semiconductor packaging in the country due to its application in providing a protective enclosure for semiconductor devices.
Therefore, the growth of governmental initiatives to strengthen the country's semiconductor ecosystem and the country's emergence as a global producer of the automotive and consumer electronic sectors would support the market's growth.

2.5D and 3D Semiconductor Packaging Industry Overview

The 2.5D & 3D Semiconductor market is semi-consolidated due to the presence of global players and small and medium-sized enterprises. Some major players in the market are ASE Group, Amkor Technology Inc., Intel Corporation, Samsung Electronics Co. Ltd, and Siliconware Precision Industries Co. Ltd (SPIL). Players in the market are adopting strategies such as acquisitions and partnerships to enhance their product offerings and gain sustainable competitive advantage.

In April 2024, Samsung's AVP team received an order for advanced packaging for NVIDIA's AI chip, allowing for the future supply of high-bandwidth memory chips. The AVP team at Samsung Electronics may be responsible for providing interposer and 2.5D packaging technology for packaging NVIDIA's AI processors. However, the HBM and GPU chips used in these processors may come from other suppliers. 2.5D packaging technology allows for the horizontal integration of chips such as CPUs, GPUs, and HBMs on an interposer.
In October 2023, Advanced Semiconductor Engineering Inc., a part of ASE Technology Holding Co. Ltd, introduced its Integrated Design Ecosystem (IDE). This collaborative design toolset aims to enhance advanced package architecture on its VIPack platform systematically. This new approach enables a smooth shift from a single-die SoC to multi-die disaggregated IP blocks like chiplets and memory for integration utilizing 2.5D or advanced fanout structures.

Additional Benefits:

The market estimate (ME) sheet in Excel format
3 months of analyst support

1 INTRODUCTION

1.1 Study Assumptions and Market Definition
1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

4.1 Market Overview
4.2 Industry Attractiveness - Porter's Five Forces Analysis
- 4.2.1 Bargaining Power of Suppliers
- 4.2.2 Bargaining Power of Buyers
- 4.2.3 Threat of New Entrants
- 4.2.4 Threat of Substitutes
- 4.2.5 Intensity of Competitive Rivalry
4.3 Value Chain Analysis
4.4 Analysis of Macroeconomic Trends on the Market

5 MARKET DYNAMICS

5.1 Market Drivers
- 5.1.1 Growing Consumption of Semiconductor Devices Across Several Industries
- 5.1.2 Increasing Demand for Compact, High Functionality Electronic Devices
5.2 Market Restraints
- 5.2.1 High Initial Investment and Increasing Complexity of Semiconductor IC Designs
5.3 Market Opportunities
- 5.3.1 Growing Adoption of High-end Computing, Servers, and Data Centers

6 MARKET SEGMENTATION

6.1 By Packaging Technology
- 6.1.1 3D
- 6.1.2 2.5D
- 6.1.3 3D Wafer-level chip-scale packaging (WLCSP) - Qualitative Analysis
6.2 By End-user Industry
- 6.2.1 Consumer Electronics
- 6.2.2 Medical Devices
- 6.2.3 Communications and Telecom
- 6.2.4 Automotive
- 6.2.5 Other End-user Industries
6.3 By Geography
- 6.3.1 United States
- 6.3.2 China
- 6.3.3 Taiwan
- 6.3.4 South Korea
- 6.3.5 Japan
- 6.3.6 Europe
- 6.3.7 Latin America
- 6.3.8 Middle East & Africa

7 COMPETITIVE LANDSCAPE

7.1 Company Profiles
- 7.1.1 ASE Group
- 7.1.2 Amkor Technology Inc.
- 7.1.3 Intel Corporation
- 7.1.4 Samsung Electronics Co. Ltd
- 7.1.5 Siliconware Precision Industries Co. Ltd (SPIL)
- 7.1.6 Powertech Technology Inc.
- 7.1.7 Jiangsu Changjiang Electronics Technology Co. Ltd
- 7.1.8 TSMC Limited
- 7.1.9 GlobalFoundries Inc.
- 7.1.10 Tezzaron Semiconductor Corporation.