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市場調查報告書
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1698502

半導體封裝市場：2025-2030 年預測

Semiconductor Packaging Market - Forecasts from 2025 to 2030
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 140 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

預計半導體封裝市場將從 2025 年的 531.19 億美元成長到 2030 年的 738.86 億美元，預測期內的複合年成長率為 6.82%。

半導體是應用於汽車、通訊、家電、醫療保健和航太等各行業的重要組件。半導體具有積體電路、電子分離式元件、電晶體等多種特性。半導體是精密的部件，在運送給多個最終用戶之前需要保護性包裝盒。半導體封裝提供了一層保護層，保護半導體免受灰塵和刮傷等物理和環境損害。

預計半導體封裝的需求將隨著全球半導體需求的不斷成長而成長。半導體是汽車的重要部件。半導體具有多種功能，例如支援汽車娛樂系統和網路連接選項。半導體還整合到各種汽車安全系統中，例如ADAS和緊急煞車系統。

市場趨勢：

  • 全球對半導體的需求不斷成長，推動著市場擴張：半導體是電子設備中必不可少的組件，促進了通訊並提高了運算能力。其應用涉及醫療保健、航太、汽車和消費電子等廣泛行業，推動了全球半導體封裝市場大幅成長的預期。由於半導體在許多領域的多功能性，對半導體的需求正在迅速成長。根據半導體產業協會 (SIA) 預測，從 2023 年 4 月到 2024 年 4 月，全球半導體需求預計將成長 15.8%，2024 年產業成長率預計將達到 16% 左右。銷售額將反映這一上升趨勢，預計 2024 年 4 月銷售額將達到 464 億美元，高於 2023 年 4 月的 401 億美元。按地區分類，美洲將在 2024 年顯著成長 32.4%，其次是中國（成長 23.4%）和亞太地區（成長 11.1%）。
  • 全球半導體封裝市場細分：半導體封裝市場分為五個區域：北美、南美、歐洲、中東和非洲以及亞太地區。中國是半導體行業的全球領導者，並制定了提高積體電路（IC）生產和加強國內晶片製造的雄心勃勃的目標。該國擁有蓬勃發展的半導體生態系統，包括代工廠、封裝設備和研究機構。正如美國所指出的，中國政府正在積極支持這一成長，其中包括在2014年至2030年期間投資約1500億美元。這些舉措促進半導體生產的政府措施預計將極大有利於半導體封裝市場。

報告涉及的主要企業包括 ASE、Amkor Technology、Powertech Technology Inc.、富士通半導體有限公司、ChipMOS Technologies Inc.、英特爾公司、三星電子有限公司和 Unisem(M)Berhad。

本報告的主要優點

  • 深刻分析：獲得涵蓋主要和新興地區的深入市場洞察，重點關注客戶群、政府政策和社會經濟因素、消費者偏好、垂直行業和其他子區隔。
  • 競爭格局：了解全球主要企業所採用的策略策略，並了解正確策略帶來的潛在市場滲透。
  • 市場趨勢和促進因素：探索動態因素和關鍵市場趨勢以及它們將如何影響市場的未來發展。
  • 可行的建議：利用洞察力進行策略決策，在動態環境中開闢新的業務流和收益。
  • 適用範圍廣：對於新興企業、研究機構、顧問公司、中小企業和大型企業來說，它都是實用且具有成本效益的。

它有什麼用途？

產業和市場考量、商業機會評估、產品需求預測、打入市場策略、地理擴張、資本支出決策、法律規範與影響、新產品開發、競爭影響

研究範圍

  • 2022 年至 2024 年的歷史數據和 2025 年至 2030 年的預測數據
  • 成長機會、挑戰、供應鏈前景、法律規範與趨勢分析
  • 競爭定位、策略和市場佔有率分析
  • 評估收益成長和預測的地區（包括細分市場和國家）
  • 公司概況（策略、產品、財務資訊、主要趨勢等）

目錄

第1章 引言

  • 市場概覽
  • 市場定義
  • 研究範圍
  • 市場區隔
  • 貨幣
  • 先決條件
  • 基準年和預測年時間表
  • 相關人員的主要利益

第2章調查方法

  • 研究設計
  • 研究過程

第3章執行摘要

  • 主要發現
  • 分析師觀點

第4章 市場動態

  • 市場促進因素
  • 市場限制
  • 波特五力分析
  • 產業價值鏈分析

第5章半導體封裝市場（依材料類型）

  • 介紹
  • 有機基材
  • 鍵合線
  • 陶瓷封裝
  • 其他

第6章半導體封裝市場（依封裝類型）

  • 介紹
  • 先進封裝
  • 覆晶
  • 嵌入式晶粒
  • 扇出級封裝（FO-WLP）
  • 扇入級封裝 (FI-WLP)

第7章半導體封裝市場（依封裝材料）

  • 介紹
  • 有機基材
  • 導線架
  • 陶瓷封裝
  • 鍵合線
  • 其他

第8章半導體封裝市場（依最終使用者）

  • 介紹
  • 家電
  • 航太和國防
  • 醫療設備
  • 通訊和電訊
  • 其他

9. 半導體封裝市場（依地區）

  • 世界概況
  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 南美洲
    • 巴西
    • 阿根廷
    • 其他
  • 歐洲
    • 英國
    • 德國
    • 法國
    • 義大利
    • 其他
  • 中東和非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 其他
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 韓國
    • 泰國
    • 印尼
    • 其他

第10章競爭格局及分析

  • 主要企業和策略分析
  • 市場佔有率分析
  • 合併、收購、協議和合作
  • 競爭儀錶板

第11章 公司簡介

  • ASE
  • Amkor Technology
  • Powertech Technology Inc.
  • Fujitsu Semiconductor Limited
  • ChipMOS Technologies Inc.
  • Intel Corporation
  • Samsung Electronics Co., Ltd.
  • Unisem（M）Berhad
  • ISI-Interconnect Systems
  • Jiangsu Changjiang Electronics Technology Co., Ltd.（JCET）
簡介目錄
Product Code: KSI061616099

The semiconductor packaging market is projected to grow at a CAGR of 6.82% over the forecast period, increasing from US$53.119 billion in 2025 to US$73.886 billion by 2030.

Semiconductors are an important component applicable across multiple industries, like automotive, telecommunications, consumer electronics, healthcare, and aerospace, among others. Semiconductors have various properties like integrated circuits, electronic discrete, and transistors. They are a sensitive component, requiring a protective packaging case before being transported to multiple end-users. The semiconductor packaging offers a protective layer, which helps prevent the semiconductors from dust, scratches, or any other physical or environmental damage.

The demand for semiconductor packaging is expected to grow with the increasing demand for semiconductors globally. Semiconductors are an important component in automobiles. They offer multiple features, such as enabling the entertainment system and internet connectivity options in vehicles. The semiconductors are also embedded into various automobile safety systems, such as the ADAS and emergency braking systems.

Market Trends:

  • Rising Global Semiconductor Demand Set to Drive Market Expansion: Semiconductors are vital components in electronic devices, facilitating communication and enhancing computing capabilities. Their widespread use spans industries such as healthcare, aerospace, automotive, and consumer electronics, fueling expectations of significant growth in the global semiconductor packaging market. The semiconductor sector has experienced a surge in demand due to its versatility across multiple fields. According to the Semiconductor Industry Association (SIA), global semiconductor demand rose by 15.8% from April 2023 to April 2024, with a projected industry growth of approximately 16% for 2024. Sales figures reflect this upward trend, reaching an estimated US$46.4 billion in April 2024, up from US$40.1 billion in April 2023. Regionally, the Americas led with a remarkable 32.4% growth in 2024, followed by China at 23.4%, while the broader Asia-Pacific region saw an 11.1% increase.
  • Global Segmentation of the Semiconductor Packaging Market: The semiconductor packaging market is divided into five regions: North America, South America, Europe, the Middle East and Africa, and Asia-Pacific. China stands out as a global leader in the semiconductor industry, with ambitious goals to advance its integrated circuit (IC) production and bolster domestic chip manufacturing. The country boasts a thriving semiconductor ecosystem, encompassing foundries, packaging equipment, and research institutions. The Chinese government is actively supporting this growth, with initiatives including an estimated US$150 billion investment from 2014 to 2030, as noted by the SIA. These substantial government efforts to enhance semiconductor production are expected to significantly benefit the semiconductor packaging market.

Some of the major players covered in this report include ASE , Amkor Technology, Powertech Technology Inc., Fujitsu Semiconductor Limited, ChipMOS Technologies Inc., Intel Corporation, Samsung Electronics Co., Ltd., Unisem (M) Berhad, among others.

Key Benefits of this Report:

  • Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
  • Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
  • Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
  • Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
  • Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

  • Historical data from 2022 to 2024 & forecast data from 2025 to 2030
  • Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
  • Competitive Positioning, Strategies, and Market Share Analysis
  • Revenue Growth and Forecast Assessment of segments and regions including countries
  • Company Profiling (Strategies, Products, Financial Information, and Key Developments among others)

The Semiconductor Packaging Market is segmented and analyzed as follows:

By Material Type

  • Organic Substrate
  • Bonding Wire
  • Ceramic Package
  • Others
  • Packaging Type
  • Advanced Packaging
  • Flip Chip
  • Embedded Die
  • Fan-Out Level Packaging (FO-WLP)
  • Fan-In Level Packaging (FI-WLP)

By Packaging Material

  • Organic Substrate
  • Leadframe
  • Ceramic Packaging
  • Bonding-Wire
  • Others

By End-User

  • Consumer Electronics
  • Aerospace and Defence
  • Medical Devices
  • Communication and Telecom
  • Others

By Geography

  • North America
  • United States
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • United Kingdom
  • Germany
  • France
  • Italy
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Others
  • Asia Pacific
  • China
  • India
  • Japan
  • South Korea
  • Thailand
  • Indonesia
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study
  • 1.4. Market Segmentation
  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base and Forecast Years Timeline
  • 1.8. Key benefits for the stakeholders

2. RESEARCH METHODOLOGY

  • 2.1. Research Design
  • 2.2. Research Process

3. EXECUTIVE SUMMARY

  • 3.1. Key Findings
  • 3.2. Analyst View

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. The Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis

5. SEMICONDUCTOR PACKAGING MARKET BY MATERIAL TYPE

  • 5.1. Introduction
  • 5.2. Organic Substrate
  • 5.3. Bonding Wire
  • 5.4. Ceramic Package
  • 5.5. Others

6. SEMICONDUCTOR PACKAGING MARKET BY PACKAGING TYPE

  • 6.1. Introduction
  • 6.2. Advanced Packaging
  • 6.3. Flip Chip
  • 6.4. Embedded Die
  • 6.5. Fan-Out Level Packaging (FO-WLP)
  • 6.6. Fan-In Level Packaging (FI-WLP)

7. SEMICONDUCTOR PACKAGING MARKET BY PACKAGING MATERIAL

  • 7.1. Introduction
  • 7.2. Organic Substrate
  • 7.3. Leadframe
  • 7.4. Ceramic Packaging
  • 7.5. Bonding-Wire
  • 7.6. Others

8. SEMICONDUCTOR PACKAGING MARKET BY END-USER

  • 8.1. Introduction
  • 8.2. Consumer Electronics
  • 8.3. Aerospace and Defence
  • 8.4. Medical Devices
  • 8.5. Communication and Telecom
  • 8.6. Others

9. SEMICONDUCTOR PACKAGING MARKET BY GEOGRAPHY

  • 9.1. Global Overview
  • 9.2. North America
    • 9.2.1. United States
    • 9.2.2. Canada
    • 9.2.3. Mexico
  • 9.3. South America
    • 9.3.1. Brazil
    • 9.3.2. Argentina
    • 9.3.3. Others
  • 9.4. Europe
    • 9.4.1. United Kingdom
    • 9.4.2. Germany
    • 9.4.3. France
    • 9.4.4. Italy
    • 9.4.5. Others
  • 9.5. Middle East and Africa
    • 9.5.1. Saudi Arabia
    • 9.5.2. UAE
    • 9.5.3. Others
  • 9.6. Asia-Pacific
    • 9.6.1. China
    • 9.6.2. India
    • 9.6.3. Japan
    • 9.6.4. South Korea
    • 9.6.5. Thailand
    • 9.6.6. Indonesia
    • 9.6.7. Others

10. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 10.1. Major Players and Strategy Analysis
  • 10.2. Market Share Analysis
  • 10.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 10.4. Competitive Dashboard

11. COMPANY PROFILES

  • 11.1. ASE
  • 11.2. Amkor Technology
  • 11.3. Powertech Technology Inc.
  • 11.4. Fujitsu Semiconductor Limited
  • 11.5. ChipMOS Technologies Inc.
  • 11.6. Intel Corporation
  • 11.7. Samsung Electronics Co., Ltd.
  • 11.8. Unisem (M) Berhad
  • 11.9. ISI - Interconnect Systems
  • 11.10. Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET)