市場調查報告書
商品編碼
1418410
晶粒邦定機市場報告:2030 年趨勢、預測與競爭分析Die Bonding Machine Market Report: Trends, Forecast and Competitive Analysis to 2030 |
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晶粒國定機的趨勢與預測
預計到 2030 年,全球晶粒機市場將達到 17 億美元,2024 年至 2030 年複合年成長率為 5.5%。該市場的主要促進因素是對半導體裝置的需求不斷成長、先進封裝技術的日益採用以及電子裝置小型化趨勢的增強。全球晶粒機市場的未來性充滿希望,消費性電子、汽車、通訊、航太和國防以及醫療市場充滿機會。
晶粒邦定機市場洞察
Lucintel 預測,全自動預計將在預測期內實現最高成長。
在這個市場中,由於智慧型手機、平板電腦、筆記型電腦和其他小工具等家用電器的普及不斷提高,家用電器預計將經歷最高的成長。
由於其強大的電子製造基礎,特別是在中國和韓國,亞太地區在預測期內可能仍然是最大的地區。
Q1.市場規模有多大?
A1. 到2030年,全球晶粒機市場預計將達到17億美元。
Q2.市場成長預測如何?
A2. 2024年至2030年,全球晶粒機市場預計將以5.5%的複合年成長率成長。
Q3.影響市場成長的主要促進因素有哪些?
A3. 該市場的主要驅動力是對半導體裝置的需求不斷成長、先進封裝技術的日益採用以及電子裝置小型化趨勢的增強。
Q4.市場的主要細分市場是什麼?
A4.晶粒機市場的未來前景廣闊,消費性電子、汽車、通訊、航太和國防、醫療市場都有機遇。
Q5.市場上主要企業有哪些?
A5. 生產晶粒機的主要企業如下。
Q6.未來最大的細分市場是什麼?
A6.Lucintel預測全自動將在預測期內達到最高成長。
Q7. 未來五年預計哪個地區將成為最大的市場?
A7.亞太地區由於其強大的電子製造基礎,特別是在中國和韓國,在預測期內將繼續成為最大的地區。
Q8. 可以客製化報告嗎?
A8. 是的,Lucintel 提供 10% 的客製化服務,無需額外付費。
Die Bonding Machine Trends and Forecast
The future of the global die bonding machine market looks promising with opportunities in the consumer electronic, automotive, telecommunication, aerospace & defense, and medical markets. The global die bonding machine market is expected to reach an estimated $1.7 billion by 2030 with a CAGR of 5.5% from 2024 to 2030. The major drivers for this market are growing demand for semiconductor devices, increasing adoption of advanced packaging technologies, and risng trend of miniaturization in electronic devices.
A more than 150-page report is developed to help in your business decisions.
Die Bonding Machine by Segment
The study includes a forecast for the global die bonding machine by type, component, end use, and region.
List of Die Bonding Machine Companies
Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies die bonding machine companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the die bonding machine companies profiled in this report include-
Die Bonding Machine Market Insights
Lucintel forecasts that fully automatic is expected to witness the highest growth over the forecast period.
Within this market, consumer electronic is expected to witness the highest growth due to growing adoption of consumer electronics such as smartphones, tablets, laptops, and other gadgets.
APAC will remain the largest region over the forecast period due to the region's strong electronics manufacturing base, particularly in China and South Korea.
Features of the Global Die Bonding Machine Market
Market Size Estimates: Die bonding machine market size estimation in terms of value ($B).
Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.
Segmentation Analysis: Die bonding machine market size by type, component, end use, and region in terms of value ($B).
Regional Analysis: Die bonding machine market breakdown by North America, Europe, Asia Pacific, and Rest of the World.
Growth Opportunities: Analysis of growth opportunities in different types, components, end uses, and regions for the die bonding machine market.
Strategic Analysis: This includes M&A, new product development, and competitive landscape of the die bonding machine market.
Analysis of competitive intensity of the industry based on Porter's Five Forces model.
FAQ
Q1. What is the die bonding machine market size?
Answer: The global die bonding machine market is expected to reach an estimated $1.7 billion by 2030.
Q2. What is the growth forecast for die bonding machine market?
Answer: The global die bonding machine market is expected to grow with a CAGR of 5.5% from 2024 to 2030.
Q3. What are the major drivers influencing the growth of the die bonding machine market?
Answer: The major drivers for this market are growing demand for semiconductor devices, increasing adoption of advanced packaging technologies, and risng trend of miniaturization in electronic devices.
Q4. What are the major segments for die bonding machine market?
Answer: The future of the die bonding machine market looks promising with opportunities in the consumer electronic, automotive, telecommunication, aerospace & defense, and medical markets.
Q5. Who are the key die bonding machine market companies?
Answer: Some of the key die bonding machine companies are as follows.
Q6. Which die bonding machine market segment will be the largest in future?
Answer: Lucintel forecasts that fully automatic is expected to witness the highest growth over the forecast period.
Q7. In die bonding machine market, which region is expected to be the largest in next 5 years?
Answer: APAC will remain the largest region over the forecast period due to the region's strong electronics manufacturing base, particularly in China and South Korea.
Q.8 Do we receive customization in this report?
Answer: Yes, Lucintel provides 10% customization without any additional cost.