市場調查報告書
商品編碼
1418043
半導體鍵合設備市場報告:2030 年趨勢、預測與競爭分析Semiconductor Bonding Equipment Market Report: Trends, Forecast and Competitive Analysis to 2030 |
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半導體鍵合設備的趨勢與預測
全球半導體鍵結設備市場預計到 2030 年將達到 11 億美元,2024 年至 2030 年複合年成長率為 10.8%。該市場的主要驅動力是對具有更小尺寸、更高處理能力和更高效率的半導體裝置的需求不斷成長,半導體製造商、汽車、醫療保健和工業對研發活動的投資不斷增加,以及半導體晶片在工業領域的日益採用。各行業。全球半導體鍵合設備市場的未來可能包括先進封裝、功率 IC 和功率分離式元件、光子元件、MEMS 感測器和致動器、工程基板以及 CMOS 影像感測器市場的機會。
半導體鍵合設備市場洞察
Lucintel 預測,混合鍵合設備預計將在預測期內實現最高成長,因為與傳統方法相比,它提供了卓越的電氣和熱性能。
由於國內主要供應商的策略投資以及該地區成熟的半導體產業,預計亞太地區在預測期內將出現最高成長。
Q1.市場規模有多大?
A1. 到2030年,全球半導體鍵結設備市場預計將達到11億美元。
Q2.市場成長預測如何?
A2. 2024年至2030年,全球半導體鍵結設備市場預計將以10.8%的複合年成長率成長。
Q3.影響市場成長的主要促進因素有哪些?
A3. 該市場的主要促進因素是對具有較小佔地面積、更高處理能力和更高效率的半導體裝置的需求不斷成長,半導體製造商、汽車和醫療保健領域對研發活動的投資增加,半導體晶片在各種領域的採用越來越多工業等產業。
Q4.市場的主要細分市場是什麼?
A4. 全球半導體鍵合設備市場的未來前景廣闊,先進封裝、功率 IC 和功率分離式元件、光子元件、MEM 感測器和致動器、工程基板和 CMOS 影像感測器市場充滿機會。
Q5.市場上主要企業有哪些?
A5. 半導體鍵結設備的主要企業如下。
Q6.未來最大的細分市場是什麼?
A6.Lucintel 預測,由於混合鍵合設備與傳統方法相比具有卓越的電氣和熱性能,預計在預測期內將實現最高成長。
Q7. 未來五年預計哪個地區將成為最大的市場?
由於國內主要供應商的策略投資以及該地區成熟的半導體產業,A7.APAC預計將在預測期內實現最高成長。
Q8. 可以客製化報告嗎?
A8. 是的,Lucintel 提供 10% 的客製化服務,無需額外付費。
Semiconductor Bonding Equipment Trends and Forecast
The future of the global semiconductor bonding equipment market looks promising with opportunities in the advanced packaging, power IC and power discrete, photonic device, MEMs sensors and actuators, engineered substrates, CMOS image sensor markets. The global semiconductor bonding equipment market is expected to reach an estimated $1.1 billion by 2030 with a CAGR of 10.8% from 2024 to 2030. The major drivers for this market are growing need for semiconductor devices with reduced footprints, more processing power, and improved efficiency, increasing investments in research and development activities by semiconductor manufacturers, as well as, rising adoption of semiconductor chips in various industries, including automotive, healthcare, and industrial.
A more than 150-page report is developed to help in your business decisions.
Semiconductor Bonding Equipment by Segment
The study includes a forecast for the global semiconductor bonding equipment by type, application, and region.
List of Semiconductor Bonding Equipment Companies
Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies semiconductor bonding equipment companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the semiconductor bonding equipment companies profiled in this report include-
Semiconductor Bonding Equipment Market Insights
Lucintel forecasts that hybrid bonding equipment is expected to witness the highest growth over the forecast period because it can deliver superior electrical and thermal performance compared to traditional methods.
APAC is expected to witness highest growth over the forecast period due to strategic investments by key domestic suppliers and the well-established semiconductor sector in the region.
Features of the Global Semiconductor Bonding Equipment Market
Market Size Estimates: Semiconductor bonding equipment market size estimation in terms of value ($B).
Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.
Segmentation Analysis: Semiconductor bonding equipment market size by type, application, and region in terms of value ($B).
Regional Analysis: Semiconductor bonding equipment market breakdown by North America, Europe, Asia Pacific, and Rest of the World.
Growth Opportunities: Analysis of growth opportunities in different type, application, and regions for the semiconductor bonding equipment market.
Strategic Analysis: This includes M&A, new product development, and competitive landscape of the semiconductor bonding equipment market.
Analysis of competitive intensity of the industry based on Porter's Five Forces model.
FAQ
Q1. What is the semiconductor bonding equipment market size?
Answer: The global semiconductor bonding equipment market is expected to reach an estimated $1.1 billion by 2030.
Q2. What is the growth forecast for semiconductor bonding equipment market?
Answer: The global semiconductor bonding equipment market is expected to grow with a CAGR of 10.8% from 2024 to 2030.
Q3. What are the major drivers influencing the growth of the semiconductor bonding equipment market?
Answer: The major drivers for this market are growing need for semiconductor devices with reduced footprints, more processing power, and improved efficiency, increasing investments in research and development activities by semiconductor manufacturers, as well as, rising adoption of semiconductor chips in various industries, including automotive, healthcare, and industrial.
Q4. What are the major segments for semiconductor bonding equipment market?
Answer: The future of the global semiconductor bonding equipment market looks promising with opportunities in the advanced packaging, power IC and power discrete, photonic device, MEMs sensors and actuators, engineered substrates, CMOS image sensor markets.
Q5. Who are the key semiconductor bonding equipment market companies?
Answer: Some of the key semiconductor bonding equipment companies are as follows.
Q6. Which semiconductor bonding equipment market segment will be the largest in future?
Answer: Lucintel forecasts that hybrid bonding equipment is expected to witness the highest growth over the forecast period because it can deliver superior electrical and thermal performance compared to traditional methods.
Q7. In semiconductor bonding equipment market, which region is expected to be the largest in next 5 years?
Answer: APAC is expected to witness highest growth over the forecast period due to strategic investments by key domestic suppliers and the well-established semiconductor sector in the region.
Q.8 Do we receive customization in this report?
Answer: Yes, Lucintel provides 10% customization without any additional cost.