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市場調查報告書
商品編碼
1418459
晶片邦定機設備市場報告:2030 年趨勢、預測與競爭分析Die Bonder Equipment Market Report: Trends, Forecast and Competitive Analysis to 2030 |
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晶片黏合機設備趨勢和預測
預計到 2030 年,全球貼片機設備市場將達到 8.333 億美元,2024 年至 2030 年複合年成長率為 3.0%。該市場的主要驅動力是,由於半導體 IC 設計的複雜性不斷增加,堆疊晶粒技術在物聯網(IoT) 設備中的使用越來越多,對微型電子元件的需求不斷增加,以及用於無線應用的高品質半導體IC。需求的擴大。全球貼片機設備市場的未來前景廣闊,家用電子電器、汽車、工業、通訊、醫療保健、航太和國防市場充滿機會。
晶片接合機設備市場洞察
根據Lucintel的預測,由於全自動晶片焊接機具有大規模組裝和封裝、提高精度以及自動化組裝和封裝等優勢特點,預計在預測期內將出現最高成長。
由於平板電腦和智慧型手機的需求不斷成長以及製造商的豐富,預計亞太地區在預測期內將出現最高的成長。
Q1.市場規模有多大?
A1. 到 2030 年,全球貼片機設備市場預計將達到 8.333 億美元。
Q2.市場成長預測如何?
A2. 2024年至2030年,全球貼片機設備市場預計將以3.0%的複合年成長率成長。
Q3.影響市場成長的主要促進因素有哪些?
A3. 該市場的主要驅動力是物聯網 (IoT) 設備中擴大使用堆疊晶粒技術、對微型電子元件的需求不斷增加,以及由於半導體IC 設計的複雜性不斷增加而提高無線應用的質量。半導體積體電路正在不斷擴大。
Q4.市場的主要細分市場是什麼?
A4. 全球貼片機設備市場的未來充滿希望,家用電子電器、汽車、工業、通訊、醫療保健、航太和國防市場都有機遇。
Q5. 市場上主要企業有哪些?
A5. 生產貼片機設備的主要企業如下。
Q6.未來最大的細分市場是什麼?
A6.根據Lucintel的預測,由於大規模組裝和封裝、精度提高以及自動化組裝和封裝等有利特徵,全自動晶片黏合機預計將在預測期內實現最高成長。
Q7. 未來五年預計哪個地區將成為最大的市場?
A7.由於平板電腦和智慧型手機的需求不斷成長以及該地區製造商數量眾多,預計亞太地區將在預測期內實現最高成長。
Q8. 可以客製化報告嗎?
A8. 是的,Lucintel 提供 10% 的客製化服務,無需額外付費。
Die Bonder Equipment Trends and Forecast
The future of the global die bonder equipment market looks promising with opportunities in the consumer electronic, automotive, industrial, telecommunication, healthcare, and aerospace & defense markets. The global die bonder equipment market is expected to reach an estimated $833.3 million by 2030 with a CAGR of 3.0% from 2024 to 2030. The major drivers for this market are increasing use of stacked die technology in Internet of Things (IoT) devices, growing demand for tiny electronic components, need for high-quality semiconductor ICs for wireless applications is expanding along with the complexity of semiconductor IC designs.
A more than 150-page report is developed to help in your business decisions.
Die Bonder Equipment by Segment
The study includes a forecast for the global die bonder equipment by type, bonding technique, device, application, and region.
List of Die Bonder Equipment Companies
Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies die bonder equipment companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the die bonder equipment companies profiled in this report include-
Die Bonder Equipment Market Insights
Lucintel forecasts that fully automatic die bonders is expected to witness the highest growth over the forecast period due to its advantageous characteristics such as, large-scale assembly and packaging, precision enhancement, and automated assembly and packaging.
APAC is expected to witness highest growth over the forecast period due to growing need for tablets and smartphones as well as the region's abundance of manufacturers.
Features of the Global Die Bonder Equipment Market
Market Size Estimates: Die bonder equipment market size estimation in terms of value ($M).
Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.
Segmentation Analysis: Die bonder equipment market size by bonding technique, device, application, and region in terms of value ($M).
Regional Analysis: Die bonder equipment market breakdown by North America, Europe, Asia Pacific, and Rest of the World.
Growth Opportunities: Analysis of growth opportunities in different type, bonding technique, device, application, and regions for the die bonder equipment market.
Strategic Analysis: This includes M&A, new product development, and competitive landscape of the die bonder equipment market.
Analysis of competitive intensity of the industry based on Porter's Five Forces model.
FAQ
Q1. What is the die bonder equipment market size?
Answer: The global die bonder equipment market is expected to reach an estimated $833.3 million by 2030.
Q2. What is the growth forecast for die bonder equipment market?
Answer: The global die bonder equipment market is expected to grow with a CAGR of 3.0% from 2024 to 2030.
Q3. What are the major drivers influencing the growth of the die bonder equipment market?
Answer: The major drivers for this market are increasing use of stacked die technology in Internet of Things (IoT) devices, growing demand for tiny electronic components, need for high-quality semiconductor ICs for wireless applications is expanding along with the complexity of semiconductor IC designs.
Q4. What are the major segments for die bonder equipment market?
Answer: The future of the global die bonder equipment market looks promising with opportunities in the consumer electronic, automotive, industrial, telecommunication, healthcare, and aerospace & defense markets.
Q5. Who are the key die bonder equipment market companies?
Answer: Some of the key die bonder equipment companies are as follows.
Q6. Which die bonder equipment market segment will be the largest in future?
Answer: Lucintel forecasts that fully automatic die bonders is expected to witness the highest growth over the forecast period due to its advantageous characteristics such as, large-scale assembly and packaging, precision enhancement, and automated assembly and packaging.
Q7. In die bonder equipment market, which region is expected to be the largest in next 5 years?
Answer: APAC is expected to witness highest growth over the forecast period due to growing need for tablets and smartphones as well as the region's abundance of manufacturers.
Q.8 Do we receive customization in this report?
Answer: Yes, Lucintel provides 10% customization without any additional cost.