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市場調查報告書

商品編碼

1905109

日本抗輻射加固電子產品市場報告（按產品類型、材料類型、技術（設計抗輻射加固、製程抗輻射加固、軟體抗輻射加固）、元件類型、應用和地區分類，2026-2034年）

Japan Radiation Hardened Electronics Market Report by Product Type, Material Type, Technique (Radiation Hardening by Design, Radiation Hardening by Process, Radiation Hardening by Software ), Component Type, Application, and Region 2026-2034

出版日期: 2026年01月01日 | 出版商:

IMARC | 英文 115 Pages | 商品交期: 5-7個工作天內

價格

簡介目錄

2025年，日本抗輻射電子產品市場規模達8,760萬美元。展望未來， IMARC Group預計到2034年，該市場規模將達到1.31億美元，2026年至2034年間的複合年成長率（CAGR）為4.58%。商業航太專案的不斷增加以及半導體產業的擴張是推動市場成長的主要因素。

本報告解答的關鍵問題：

日本抗輻射電子產品市場目前表現如何？未來幾年又將如何發展？
新冠疫情對日本抗輻射電子產品市場產生了哪些影響？
日本抗輻射電子產品市場依產品類型分類的組成是怎樣的？
日本抗輻射電子產品市場依材料類型分類的組成是怎樣的？
日本抗輻射電子產品市場依技術分類的組成是怎樣的？
日本抗輻射電子產品市場依元件類型分類的組成是怎樣的？
日本抗輻射電子產品市場依應用領域分類的組成是怎樣的？
日本抗輻射電子產品市場價值鏈的各個階段有哪些？
日本抗輻射電子產品的關鍵促進因素和挑戰是什麼？
日本抗輻射電子產品市場的結構是怎麼樣的？主要參與者有哪些？
日本抗輻射電子產品市場的競爭程度如何？

Japan radiation hardened electronics market size reached USD 87.6 Million in 2025. Looking forward, IMARC Group expects the market to reach USD 131.0 Million by 2034, exhibiting a growth rate (CAGR) of 4.58% during 2026-2034. The rising number of commercial space projects, along with the expanding semiconductor industry, is primarily driving the market growth.

Radiation-hardened electronics encompass a range of electronic elements, packages, and items specifically designed for use in high-altitude environments. These components are crafted from materials such as silicon, silicon carbide, gallium nitride, and hydrogenated amorphous silicon. In line with this, their distinctive feature is their resilience to the detrimental effects of ionizing radiation, high-energy radiation, as well as gamma and neutron radiation typically emitted by nuclear reactors. These specialized electronics are widely deployed in an array of applications including satellites, aircraft, and nuclear power plants, where they serve essential roles as switching regulators, microprocessors, and power supply devices. As a result of their unique properties, they find extensive use in diverse industries, including aviation, space exploration, and military and defense sectors across Japan.

Japan Radiation Hardened Electronics Market Trends:

The market in Japan is predominantly steered by the escalating number of space missions and exploratory endeavors within the country. Concurrently, the surging requirement for communication satellites catering to intelligence, surveillance, and reconnaissance (ISR) operations is fostering market expansion. Radiation-hardened electronics play a pivotal role in safeguarding electronic apparatus against physical harm and malfunction caused by detrimental radiations encountered in outer space, thereby further positively influencing the regional market. Furthermore, the widespread adoption of these electronics in the production of power management devices is contributing positively to market growth. These electronics also find applications in manufacturing diodes, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFET) for various defense and military purposes, which is also acting as another significant growth-inducing factor. Additionally, continuous technological advancements, such as the refinement of highly dependable integrated circuits and enhancements in field-programmable gate array (FPGA) technology, are creating a favorable market landscape. Other factors, including substantial growth within the electronics sector and extensive research and development (R&D) endeavors, are poised to further propel market expansion in the coming years.

Japan Radiation Hardened Electronics Market Segmentation:

Product Type Insights:

Custom Made
Commercial-Off-the-Shelf

Material Type Insights:

Silicon
Silicon Carbide
Gallium Nitride
Others

Technique Insights:

Radiation Hardening by Design (RHBD)
Radiation Hardening by Process (RHBP)
Radiation Hardening by Software (RHBS)

Component Type Insights:

Power Management
Application Specific Integrated Circuit
Logic
Memory
Field-Programmable Gate Array
Others

Application Insights:

Space Satellites
Commercial Satellites
Military
Aerospace and Defense
Nuclear Power Plants
Others

Regional Insights:

Kanto Region
Kansai/Kinki Region
Central/ Chubu Region
Kyushu-Okinawa Region
Tohoku Region
Chugoku Region
Hokkaido Region
Shikoku Region
The report has also provided a comprehensive analysis of all the major regional markets, which include Kanto Region, Kansai/Kinki Region, Central/ Chubu Region, Kyushu-Okinawa Region, Tohoku Region, Chugoku Region, Hokkaido Region, and Shikoku Region.

Competitive Landscape:

The market research report has also provided a comprehensive analysis of the competitive landscape. Competitive analysis such as market structure, key player positioning, top winning strategies, competitive dashboard, and company evaluation quadrant has been covered in the report. Also, detailed profiles of all major companies have been provided.

Key Questions Answered in This Report:

How has the Japan radiation hardened electronics market performed so far and how will it perform in the coming years?
What has been the impact of COVID-19 on the Japan radiation hardened electronics market?
What is the breakup of the Japan radiation hardened electronics market on the basis of product type?
What is the breakup of the Japan radiation hardened electronics market on the basis of material type?
What is the breakup of the Japan radiation hardened electronics market on the basis of technique?
What is the breakup of the Japan radiation hardened electronics market on the basis of component type?
What is the breakup of the Japan radiation hardened electronics market on the basis of application?
What are the various stages in the value chain of the Japan radiation hardened electronics market?
What are the key driving factors and challenges in the Japan radiation hardened electronics?
What is the structure of the Japan radiation hardened electronics market and who are the key players?
What is the degree of competition in the Japan radiation hardened electronics market?

1 Preface

2 Scope and Methodology

2.1 Objectives of the Study
2.2 Stakeholders
2.3 Data Sources
- 2.3.1 Primary Sources
- 2.3.2 Secondary Sources
2.4 Market Estimation
- 2.4.1 Bottom-Up Approach
- 2.4.2 Top-Down Approach
2.5 Forecasting Methodology

3 Executive Summary

4 Japan Radiation Hardened Electronics Market - Introduction

4.1 Overview
4.2 Market Dynamics
4.3 Industry Trends
4.4 Competitive Intelligence

5 Japan Radiation Hardened Electronics Market Landscape

5.1 Historical and Current Market Trends (2020-2025)
5.2 Market Forecast (2026-2034)

6 Japan Radiation Hardened Electronics Market - Breakup by Product Type

6.1 Custom Made
- 6.1.1 Overview
- 6.1.2 Historical and Current Market Trends (2020-2025)
- 6.1.3 Market Forecast (2026-2034)
6.2 Commercial-Off-the-Shelf
- 6.2.1 Overview
- 6.2.2 Historical and Current Market Trends (2020-2025)
- 6.2.3 Market Forecast (2026-2034)

7 Japan Radiation Hardened Electronics Market - Breakup by Material Type

7.1 Silicon
- 7.1.1 Overview
- 7.1.2 Historical and Current Market Trends (2020-2025)
- 7.1.3 Market Forecast (2026-2034)
7.2 Silicon Carbide
- 7.2.1 Overview
- 7.2.2 Historical and Current Market Trends (2020-2025)
- 7.2.3 Market Forecast (2026-2034)
7.3 Gallium Nitride
- 7.3.1 Overview
- 7.3.2 Historical and Current Market Trends (2020-2025)
- 7.3.3 Market Forecast (2026-2034)
7.4 Others
- 7.4.1 Historical and Current Market Trends (2020-2025)
- 7.4.2 Market Forecast (2026-2034)

8 Japan Radiation Hardened Electronics Market - Breakup by Technique

8.1 Radiation Hardening by Design (RHBD)
- 8.1.1 Overview
- 8.1.2 Historical and Current Market Trends (2020-2025)
- 8.1.3 Market Forecast (2026-2034)
8.2 Radiation Hardening by Process (RHBP)
- 8.2.1 Overview
- 8.2.2 Historical and Current Market Trends (2020-2025)
- 8.2.3 Market Forecast (2026-2034)
8.3 Radiation Hardening by Software (RHBS)
- 8.3.1 Overview
- 8.3.2 Historical and Current Market Trends (2020-2025)
- 8.3.3 Market Forecast (2026-2034)

9 Japan Radiation Hardened Electronics Market - Breakup by Component Type

9.1 Power Management
- 9.1.1 Overview
- 9.1.2 Historical and Current Market Trends (2020-2025)
- 9.1.3 Market Forecast (2026-2034)
9.2 Application Specific Integrated Circuit
- 9.2.1 Overview
- 9.2.2 Historical and Current Market Trends (2020-2025)
- 9.2.3 Market Forecast (2026-2034)
9.3 Logic
- 9.3.1 Overview
- 9.3.2 Historical and Current Market Trends (2020-2025)
- 9.3.3 Market Forecast (2026-2034)
9.4 Memory
- 9.4.1 Overview
- 9.4.2 Historical and Current Market Trends (2020-2025)
- 9.4.3 Market Forecast (2026-2034)
9.5 Field-Programmable Gate Array
- 9.5.1 Overview
- 9.5.2 Historical and Current Market Trends (2020-2025)
- 9.5.3 Market Forecast (2026-2034)
9.6 Others
- 9.6.1 Historical and Current Market Trends (2020-2025)
- 9.6.2 Market Forecast (2026-2034)

10 Japan Radiation Hardened Electronics Market - Breakup by Application

10.1 Space Satellites
- 10.1.1 Overview
- 10.1.2 Historical and Current Market Trends (2020-2025)
- 10.1.3 Market Forecast (2026-2034)
10.2 Commercial Satellites
- 10.2.1 Overview
- 10.2.2 Historical and Current Market Trends (2020-2025)
- 10.2.3 Market Forecast (2026-2034)
10.3 Military
- 10.3.1 Overview
- 10.3.2 Historical and Current Market Trends (2020-2025)
- 10.3.3 Market Forecast (2026-2034)
10.4 Aerospace and Defense
- 10.4.1 Overview
- 10.4.2 Historical and Current Market Trends (2020-2025)
- 10.4.2 Market Forecast (2026-2034)
10.5 Nuclear Power Plants
- 10.5.1 Overview
- 10.5.2 Historical and Current Market Trends (2020-2025)
- 10.5.3 Market Forecast (2026-2034)
10.6 Others
- 10.6.1 Historical and Current Market Trends (2020-2025)
- 10.6.2 Market Forecast (2026-2034)

11 Japan Radiation Hardened Electronics Market - Breakup by Region

11.1 Kanto Region
- 11.1.1 Overview
- 11.1.2 Historical and Current Market Trends (2020-2025)
- 11.1.3 Market Breakup by Product Type
- 11.1.4 Market Breakup by Material Type
- 11.1.5 Market Breakup by Technique
- 11.1.6 Market Breakup by Component Type
- 11.1.7 Market Breakup by Application
- 11.1.8 Key Players
- 11.1.9 Market Forecast (2026-2034)
11.2 Kansai/Kinki Region
- 11.2.1 Overview
- 11.2.2 Historical and Current Market Trends (2020-2025)
- 11.2.3 Market Breakup by Product Type
- 11.2.4 Market Breakup by Material Type
- 11.2.5 Market Breakup by Technique
- 11.2.6 Market Breakup by Component Type
- 11.2.7 Market Breakup by Application
- 11.2.8 Key Players
- 11.2.9 Market Forecast (2026-2034)
11.3 Central/ Chubu Region
- 11.3.1 Overview
- 11.3.2 Historical and Current Market Trends (2020-2025)
- 11.3.3 Market Breakup by Product Type
- 11.3.4 Market Breakup by Material Type
- 11.3.5 Market Breakup by Technique
- 11.3.6 Market Breakup by Component Type
- 11.3.7 Market Breakup by Application
- 11.3.8 Key Players
- 11.3.9 Market Forecast (2026-2034)
11.4 Kyushu-Okinawa Region
- 11.4.1 Overview
- 11.4.2 Historical and Current Market Trends (2020-2025)
- 11.4.3 Market Breakup by Product Type
- 11.4.4 Market Breakup by Material Type
- 11.4.5 Market Breakup by Technique
- 11.4.6 Market Breakup by Component Type
- 11.4.7 Market Breakup by Application
- 11.4.8 Key Players
- 11.4.9 Market Forecast (2026-2034)
11.5 Tohoku Region
- 11.5.1 Overview
- 11.5.2 Historical and Current Market Trends (2020-2025)
- 11.5.3 Market Breakup by Product Type
- 11.5.4 Market Breakup by Material Type
- 11.5.5 Market Breakup by Technique
- 11.5.6 Market Breakup by Component Type
- 11.5.7 Market Breakup by Application
- 11.5.8 Key Players
- 11.5.9 Market Forecast (2026-2034)
11.6 Chugoku Region
- 11.6.1 Overview
- 11.6.2 Historical and Current Market Trends (2020-2025)
- 11.6.3 Market Breakup by Product Type
- 11.6.4 Market Breakup by Material Type
- 11.6.5 Market Breakup by Technique
- 11.6.6 Market Breakup by Component Type
- 11.6.7 Market Breakup by Application
- 11.6.8 Key Players
- 11.6.9 Market Forecast (2026-2034)
11.7 Hokkaido Region
- 11.7.1 Overview
- 11.7.2 Historical and Current Market Trends (2020-2025)
- 11.7.3 Market Breakup by Product Type
- 11.7.4 Market Breakup by Material Type
- 11.7.5 Market Breakup by Technique
- 11.7.6 Market Breakup by Component Type
- 11.7.7 Market Breakup by Application
- 11.7.8 Key Players
- 11.7.9 Market Forecast (2026-2034)
11.8 Shikoku Region
- 11.8.1 Overview
- 11.8.2 Historical and Current Market Trends (2020-2025)
- 11.8.3 Market Breakup by Product Type
- 11.8.4 Market Breakup by Material Type
- 11.8.5 Market Breakup by Technique
- 11.8.6 Market Breakup by Component Type
- 11.8.7 Market Breakup by Application
- 11.8.8 Key Players
- 11.8.9 Market Forecast (2026-2034)

12 Japan Radiation Hardened Electronics Market - Competitive Landscape

12.1 Overview
12.2 Market Structure
12.3 Market Player Positioning
12.4 Top Winning Strategies
12.5 Competitive Dashboard
12.6 Company Evaluation Quadrant

13 Profiles of Key Players

13.1 Company A
- 13.1.1 Business Overview
- 13.1.2 Product Portfolio
- 13.1.3 Business Strategies
- 13.1.4 SWOT Analysis
- 13.1.5 Major News and Events
13.2 Company B
- 13.2.1 Business Overview
- 13.2.2 Product Portfolio
- 13.2.3 Business Strategies
- 13.2.4 SWOT Analysis
- 13.2.5 Major News and Events
13.3 Company C
- 13.3.1 Business Overview
- 13.3.2 Product Portfolio
- 13.3.3 Business Strategies
- 13.3.4 SWOT Analysis
- 13.3.5 Major News and Events
13.4 Company D
- 13.4.1 Business Overview
- 13.4.2 Product Portfolio
- 13.4.3 Business Strategies
- 13.4.4 SWOT Analysis
- 13.4.5 Major News and Events
13.5 Company E
- 13.5.1 Business Overview
- 13.5.2 Product Portfolio
- 13.5.3 Business Strategies
- 13.5.4 SWOT Analysis
- 13.5.5 Major News and Events

14 Japan Radiation Hardened Electronics Market - Industry Analysis

14.1 Drivers, Restraints, and Opportunities
- 14.1.1 Overview
- 14.1.2 Drivers
- 14.1.3 Restraints
- 14.1.4 Opportunities
14.2 Porters Five Forces Analysis
- 14.2.1 Overview
- 14.2.2 Bargaining Power of Buyers
- 14.2.3 Bargaining Power of Suppliers
- 14.2.4 Degree of Competition
- 14.2.5 Threat of New Entrants
- 14.2.6 Threat of Substitutes
14.3 Value Chain Analysis