首頁 > 市場調查報告書 > 電子零件/半導體

市場調查報告書

商品編碼

1746488

日本抗輻射電子產品市場報告（按產品類型、材料類型、技術（按設計抗輻射、按工藝抗輻射、按軟體抗輻射）、組件類型、應用和地區）2025 年至 2033 年

Japan Radiation Hardened Electronics Market Report by Product Type, Material Type, Technique (Radiation Hardening by Design, Radiation Hardening by Process, Radiation Hardening by Software ), Component Type, Application, and Region 2025-2033

出版日期: 2025年06月02日 | 出版商:

IMARC | 英文 115 Pages | 商品交期: 5-7個工作天內

價格

簡介目錄

預計2025年至2033年期間，日本抗輻射電子產品市場規模的複合年成長率（CAGR）將達到4.5%。商業航太專案數量的增加以及半導體產業的蓬勃發展是推動市場成長的主要動力。

抗輻射電子產品涵蓋一系列專為高海拔環境設計的電子元件、封裝和零件。這些元件由矽、碳化矽、氮化鎵和氫化非晶矽等材料製成。因此，它們的獨特之處在於能夠抵禦電離輻射、高能量輻射以及核反應器通常發射的伽馬射線和中子輻射的有害影響。這些專用電子產品廣泛應用於衛星、飛機和核電廠等一系列應用領域，並在其中發揮開關穩壓器、微處理器和電源設備等重要作用。由於其獨特的性能，它們在日本的航空、太空探索以及軍事和國防等各個領域中得到了廣泛的應用。

日本抗輻射電子產品市場趨勢：

日本市場主要受國內不斷成長的太空任務和探索活動所驅動。同時，用於情報、監視和偵察 (ISR) 行動的通訊衛星需求激增，也促進了市場擴張。抗輻射電子設備在保護電子設備免受外太空有害輻射造成的物理損害和故障方面發揮關鍵作用，從而進一步對區域市場產生了積極影響。此外，這些電子設備在電源管理設備生產中的廣泛應用也對市場成長做出了積極貢獻。這些電子設備也可用於製造用於各種國防和軍事用途的二極體、電晶體和金屬氧化物半導體場效電晶體 (MOSFET)，這也是另一個重要的成長誘因。此外，持續的技術進步，例如高可靠性積體電路的改進和現場可編程閘陣列 (FPGA) 技術的增強，正在創造良好的市場格局。其他因素，包括電子產業的大幅成長和廣泛的研發投入，將在未來幾年進一步推動市場擴張。

日本抗輻射電子產品市場細分：

產品類型洞察：

客製化
商用現貨

材料類型洞察：

矽
碳化矽
氮化鎵
其他

技術見解：

輻射加固設計 (RHBD)
輻射加固製程（RHBP）
軟體抗輻射加固 (RHBS)

組件類型洞察：

電源管理
專用積體電路
邏輯
記憶
現場可程式閘陣列
其他

應用程式洞察：

太空衛星
商業衛星
軍隊
航太和國防
核電廠
其他

競爭格局：

市場研究報告也對競爭格局進行了全面的分析。報告涵蓋了市場結構、關鍵參與者定位、最佳制勝策略、競爭儀錶板和公司評估象限等競爭分析。此外，報告還提供了所有主要公司的詳細資料。

本報告回答的關鍵問題：

日本抗輻射電子產品市場迄今表現如何？未來幾年將如何表現？
COVID-19 對日本抗輻射電子產品市場有何影響？
根據產品類型，日本抗輻射電子產品市場是如何分類的？
根據材料類型，日本抗輻射電子產品市場是如何分類的？
日本抗輻射電子產品市場依技術分類是怎樣的？
根據元件類型，日本抗輻射電子產品市場是如何分類的？
日本抗輻射電子產品市場根據應用如何分類？
日本抗輻射電子產品市場的價值鏈分為哪些階段？
日本抗輻射電子產品的主要促進因素和挑戰是什麼？
日本抗輻射電子產品市場的結構是怎麼樣的？主要參與者是誰？
日本抗輻射電子產品市場的競爭程度如何？

本報告回答的關鍵問題：

日本抗輻射電子產品市場迄今表現如何？未來幾年將如何表現？
COVID-19 對日本抗輻射電子產品市場有何影響？
根據產品類型，日本抗輻射電子產品市場是如何分類的？
根據材料類型，日本抗輻射電子產品市場是如何分類的？
日本抗輻射電子產品市場依技術分類是怎樣的？
根據元件類型，日本抗輻射電子產品市場是如何分類的？
日本抗輻射電子產品市場根據應用如何分類？
日本抗輻射電子產品市場的價值鏈分為哪些階段？
日本抗輻射電子產品的主要促進因素和挑戰是什麼？
日本抗輻射電子產品市場的結構是怎麼樣的？主要參與者是誰？
日本抗輻射電子產品市場的競爭程度如何？

Radiation-hardened electronics encompass a range of electronic elements, packages, and items specifically designed for use in high-altitude environments. These components are crafted from materials such as silicon, silicon carbide, gallium nitride, and hydrogenated amorphous silicon. In line with this, their distinctive feature is their resilience to the detrimental effects of ionizing radiation, high-energy radiation, as well as gamma and neutron radiation typically emitted by nuclear reactors. These specialized electronics are widely deployed in an array of applications including satellites, aircraft, and nuclear power plants, where they serve essential roles as switching regulators, microprocessors, and power supply devices. As a result of their unique properties, they find extensive use in diverse industries, including aviation, space exploration, and military and defense sectors across Japan.

Japan Radiation Hardened Electronics Market Trends:

The market in Japan is predominantly steered by the escalating number of space missions and exploratory endeavors within the country. Concurrently, the surging requirement for communication satellites catering to intelligence, surveillance, and reconnaissance (ISR) operations is fostering market expansion. Radiation-hardened electronics play a pivotal role in safeguarding electronic apparatus against physical harm and malfunction caused by detrimental radiations encountered in outer space, thereby further positively influencing the regional market. Furthermore, the widespread adoption of these electronics in the production of power management devices is contributing positively to market growth. These electronics also find applications in manufacturing diodes, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFET) for various defense and military purposes, which is also acting as another significant growth-inducing factor. Additionally, continuous technological advancements, such as the refinement of highly dependable integrated circuits and enhancements in field-programmable gate array (FPGA) technology, are creating a favorable market landscape. Other factors, including substantial growth within the electronics sector and extensive research and development (R&D) endeavors, are poised to further propel market expansion in the coming years.

Japan Radiation Hardened Electronics Market Segmentation:

Product Type Insights:

Custom Made
Commercial-Off-the-Shelf

Material Type Insights:

Silicon
Silicon Carbide
Gallium Nitride
Others

Technique Insights:

Radiation Hardening by Design (RHBD)
Radiation Hardening by Process (RHBP)
Radiation Hardening by Software (RHBS)

Component Type Insights:

Power Management
Application Specific Integrated Circuit
Logic
Memory
Field-Programmable Gate Array
Others

Application Insights:

Space Satellites
Commercial Satellites
Military
Aerospace and Defense
Nuclear Power Plants
Others

Competitive Landscape:

The market research report has also provided a comprehensive analysis of the competitive landscape. Competitive analysis such as market structure, key player positioning, top winning strategies, competitive dashboard, and company evaluation quadrant has been covered in the report. Also, detailed profiles of all major companies have been provided.

Key Questions Answered in This Report:

How has the Japan radiation hardened electronics market performed so far and how will it perform in the coming years?
What has been the impact of COVID-19 on the Japan radiation hardened electronics market?
What is the breakup of the Japan radiation hardened electronics market on the basis of product type?
What is the breakup of the Japan radiation hardened electronics market on the basis of material type?
What is the breakup of the Japan radiation hardened electronics market on the basis of technique?
What is the breakup of the Japan radiation hardened electronics market on the basis of component type?
What is the breakup of the Japan radiation hardened electronics market on the basis of application?
What are the various stages in the value chain of the Japan radiation hardened electronics market?
What are the key driving factors and challenges in the Japan radiation hardened electronics?
What is the structure of the Japan radiation hardened electronics market and who are the key players?
What is the degree of competition in the Japan radiation hardened electronics market?

1 Preface

2 Scope and Methodology

2.1 Objectives of the Study
2.2 Stakeholders
2.3 Data Sources
- 2.3.1 Primary Sources
- 2.3.2 Secondary Sources
2.4 Market Estimation
- 2.4.1 Bottom-Up Approach
- 2.4.2 Top-Down Approach
2.5 Forecasting Methodology

3 Executive Summary

4 Japan Radiation Hardened Electronics Market - Introduction

4.1 Overview
4.2 Market Dynamics
4.3 Industry Trends
4.4 Competitive Intelligence

5 Japan Radiation Hardened Electronics Market Landscape

5.1 Historical and Current Market Trends (2019-2024)
5.2 Market Forecast (2025-2033)

6 Japan Radiation Hardened Electronics Market - Breakup by Product Type

6.1 Custom Made
- 6.1.1 Overview
- 6.1.2 Historical and Current Market Trends (2019-2024)
- 6.1.3 Market Forecast (2025-2033)
6.2 Commercial-Off-the-Shelf
- 6.2.1 Overview
- 6.2.2 Historical and Current Market Trends (2019-2024)
- 6.2.3 Market Forecast (2025-2033)

7 Japan Radiation Hardened Electronics Market - Breakup by Material Type

7.1 Silicon
- 7.1.1 Overview
- 7.1.2 Historical and Current Market Trends (2019-2024)
- 7.1.3 Market Forecast (2025-2033)
7.2 Silicon Carbide
- 7.2.1 Overview
- 7.2.2 Historical and Current Market Trends (2019-2024)
- 7.2.3 Market Forecast (2025-2033)
7.3 Gallium Nitride
- 7.3.1 Overview
- 7.3.2 Historical and Current Market Trends (2019-2024)
- 7.3.3 Market Forecast (2025-2033)
7.4 Others
- 7.4.1 Historical and Current Market Trends (2019-2024)
- 7.4.2 Market Forecast (2025-2033)

8 Japan Radiation Hardened Electronics Market - Breakup by Technique

8.1 Radiation Hardening by Design (RHBD)
- 8.1.1 Overview
- 8.1.2 Historical and Current Market Trends (2019-2024)
- 8.1.3 Market Forecast (2025-2033)
8.2 Radiation Hardening by Process (RHBP)
- 8.2.1 Overview
- 8.2.2 Historical and Current Market Trends (2019-2024)
- 8.2.3 Market Forecast (2025-2033)
8.3 Radiation Hardening by Software (RHBS)
- 8.3.1 Overview
- 8.3.2 Historical and Current Market Trends (2019-2024)
- 8.3.3 Market Forecast (2025-2033)

9 Japan Radiation Hardened Electronics Market - Breakup by Component Type

9.1 Power Management
- 9.1.1 Overview
- 9.1.2 Historical and Current Market Trends (2019-2024)
- 9.1.3 Market Forecast (2025-2033)
9.2 Application Specific Integrated Circuit
- 9.2.1 Overview
- 9.2.2 Historical and Current Market Trends (2019-2024)
- 9.2.3 Market Forecast (2025-2033)
9.3 Logic
- 9.3.1 Overview
- 9.3.2 Historical and Current Market Trends (2019-2024)
- 9.3.3 Market Forecast (2025-2033)
9.4 Memory
- 9.4.1 Overview
- 9.4.2 Historical and Current Market Trends (2019-2024)
- 9.4.3 Market Forecast (2025-2033)
9.5 Field-Programmable Gate Array
- 9.5.1 Overview
- 9.5.2 Historical and Current Market Trends (2019-2024)
- 9.5.3 Market Forecast (2025-2033)
9.6 Others
- 9.6.1 Historical and Current Market Trends (2019-2024)
- 9.6.2 Market Forecast (2025-2033)

10 Japan Radiation Hardened Electronics Market - Breakup by Application

10.1 Space Satellites
- 10.1.1 Overview
- 10.1.2 Historical and Current Market Trends (2019-2024)
- 10.1.3 Market Forecast (2025-2033)
10.2 Commercial Satellites
- 10.2.1 Overview
- 10.2.2 Historical and Current Market Trends (2019-2024)
- 10.2.3 Market Forecast (2025-2033)
10.3 Military
- 10.3.1 Overview
- 10.3.2 Historical and Current Market Trends (2019-2024)
- 10.3.3 Market Forecast (2025-2033)
10.4 Aerospace and Defense
- 10.4.1 Overview
- 10.4.2 Historical and Current Market Trends (2019-2024)
- 10.4.2 Market Forecast (2025-2033)
10.5 Nuclear Power Plants
- 10.5.1 Overview
- 10.5.2 Historical and Current Market Trends (2019-2024)
- 10.5.3 Market Forecast (2025-2033)
10.6 Others
- 10.6.1 Historical and Current Market Trends (2019-2024)
- 10.6.2 Market Forecast (2025-2033)

11 Japan Radiation Hardened Electronics Market - Competitive Landscape

11.1 Overview
11.2 Market Structure
11.3 Market Player Positioning
11.4 Top Winning Strategies
11.5 Competitive Dashboard
11.6 Company Evaluation Quadrant

12 Profiles of Key Players

12.1 Company A
- 12.1.1 Business Overview
- 12.1.2 Product Portfolio
- 12.1.3 Business Strategies
- 12.1.4 SWOT Analysis
- 12.1.5 Major News and Events
12.2 Company B
- 12.2.1 Business Overview
- 12.2.2 Product Portfolio
- 12.2.3 Business Strategies
- 12.2.4 SWOT Analysis
- 12.2.5 Major News and Events
12.3 Company C
- 12.3.1 Business Overview
- 12.3.2 Product Portfolio
- 12.3.3 Business Strategies
- 12.3.4 SWOT Analysis
- 12.3.5 Major News and Events
12.4 Company D
- 12.4.1 Business Overview
- 12.4.2 Product Portfolio
- 12.4.3 Business Strategies
- 12.4.4 SWOT Analysis
- 12.4.5 Major News and Events
12.5 Company E
- 12.5.1 Business Overview
- 12.5.2 Product Portfolio
- 12.5.3 Business Strategies
- 12.5.4 SWOT Analysis
- 12.5.5 Major News and Events

13 Japan Radiation Hardened Electronics Market - Industry Analysis

13.1 Drivers, Restraints, and Opportunities
- 13.1.1 Overview
- 13.1.2 Drivers
- 13.1.3 Restraints
- 13.1.4 Opportunities
13.2 Porters Five Forces Analysis
- 13.2.1 Overview
- 13.2.2 Bargaining Power of Buyers
- 13.2.3 Bargaining Power of Suppliers
- 13.2.4 Degree of Competition
- 13.2.5 Threat of New Entrants
- 13.2.6 Threat of Substitutes
13.3 Value Chain Analysis