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市場調查報告書
商品編碼
1789951
先進IC基板市場規模、佔有率及趨勢分析報告:按類型、技術、應用、地區及細分市場預測,2025-2033年Advanced IC Substrates Market Size, Share & Trends Analysis Report By Type (Flip Chip Ball Grid Array (FCBGA) Substrates, Flip Chip Chip Scale Package (FCCSP) Substrates), By Technology, By Application, By Region, And Segment Forecasts, 2025 - 2033 |
先進IC基板市場概述
預計 2024 年全球先進 IC基板市場規模為 167.3 億美元,到 2033 年將達到 372 億美元,2025 年至 2033 年的複合年成長率為 9.4%。異質整合和基於小晶片的架構的採用率不斷提高已成為全球先進 IC基板行業的一個主要趨勢,推動了對更高密度的需求。
這些多層基板可在 AI、5G 和汽車應用中實現緊湊、節能和高性能的半導體封裝。全球對電動車和清潔交通的推動極大地推動了對先進 IC基板的需求。碳化矽和氮化鎵等寬能能隙半導體的採用正成為電動車動力傳動系統和高壓工業系統的核心。自從特斯拉等主要製造商在電動車逆變器中使用碳化矽以來,碳化矽得到了廣泛的認可。其高電場阻力和熱導率等優異性能使其成為苛刻的汽車環境的理想選擇。這一轉變得到了預測的支持,到 2030 年半導體將佔高檔汽車總價值的 20% 以上,高於 2019 年的 4%。因此,對支援高壓和高溫性能的堅固基板材料的需求正在推動汽車領域的市場成長。
人工智慧應用的激增正在重塑半導體格局,並對封裝和基板技術提出了更高的性能要求。人工智慧晶片現在需要更快的資料傳輸、更低的功耗和更好的熱性能,這推動著業界開發更複雜的封裝解決方案。國家先進封裝製造計畫已將人工智慧確定為需要在設備、電力傳輸和小晶片支援系統方面進行技術創新的關鍵驅動力。政府支持的投資正在加速這些領域的研究,預計未來五年將達到 1 億美元。這些發展推動了對高密度、高熱效率基板的需求,尤其是基板針對資料中心和邊緣設備中以人工智慧為中心的硬體進行了最佳化的基板,從而推動了整體市場的成長。
半導體產業正在經歷重大變革時期,向異質整合和基於晶片的系統結構轉變。傳統的單片式晶片設計正在被模組化晶片配置所取代,從而提高了產量比率並降低了成本。這種演進需要先進的 IC基板作為高效能互連平台,支援不同晶片之間的無縫通訊。研究預測,未來的封裝將轉向簡化的層次結構,直接將晶片組裝到基板,從而取代對中階(如內插器)的需求。基板技術正在調整,包括嵌入被動和主動元件的矽芯和玻璃芯。這種架構轉變使更有效率、可擴展且更具成本效益的半導體設計和製造成為可能,從而推動市場發展。
從基於晶圓的圓形製程向大面積面板級封裝的轉變正在重新定義基板製造製程。隨著面板尺寸達到 650 毫米 x 650 毫米,製造商現在能夠在每個週期內處理更多裝置,從而顯著提高產量並降低製造成本。這項發展將對行動電子產品、醫療穿戴式裝置和軟性混合設備等高產量領域產生特別顯著的影響。更大的面板還能將更複雜的設計整合到更薄的基板上,從而拓寬潛在的應用範圍。
為因應近期供應鏈中斷,一些政府正專注於先進積體電路基板的資源配置和國內生產。目前,美國對覆晶球柵陣列和覆晶晶片級封裝等高階基板的製造能力極低,而這些對於尖端晶片封裝至關重要。作為《晶片與科學法案》的一部分,聯邦政府已撥款近 3 億美元用於建立國內產能。這些努力包括對新技術的投資,例如用於基板原型製作的積層製造和 3D 列印,目的是減少對海外供應商的依賴,為半導體行業建立更具彈性和安全的供應鏈。這些策略舉措透過確保持續獲得先進封裝技術並促進主要垂直市場的長期成長,為市場提供了支援。
Advanced IC Substrates Market Summary
The global advanced IC substrates market size was estimated at USD 16.73 billion in 2024, and is projected to reach USD 37.20 billion by 2033, growing at a CAGR of 9.4% from 2025 to 2033. The rising adoption of heterogeneous integration and chiplet-based architectures has emerged as a significant trend in the global advanced IC substrates industry, driving demand for high-density.
These multi-layer substrates enable compact, energy-efficient, and high-performance semiconductor packaging across AI, 5G, and automotive applications. The global push toward electric mobility and cleaner transportation is significantly boosting the demand for advanced IC substrates. The adoption of wide bandgap semiconductors such as silicon carbide and gallium nitride is becoming central to electric vehicle powertrains and high-voltage industrial systems. Silicon carbide has gained widespread traction since its use in electric vehicle inverters by major manufacturers like Tesla. Its superior properties, such as higher electric field tolerance and thermal conductivity, make it ideal for demanding automotive environments. This shift is further supported by projections that semiconductors will account for over 20 percent of a premium vehicle's total value by 2030, up from just four percent in 2019. As a result, demand for robust substrate materials that support high voltage and temperature performance is propelling the market growth in the automotive sector.
The surge in artificial intelligence applications is reshaping the semiconductor landscape, placing intense performance demands on packaging and substrate technologies. AI chips now require rapid data transfer, lower power consumption, and enhanced thermal performance, which is pushing the industry to develop more sophisticated packaging solutions. The National Advanced Packaging Manufacturing Program has identified artificial intelligence as a key driver requiring innovation in equipment, power delivery, and chiplet support systems. Government-backed investments are accelerating research in these areas, with expectations of one hundred million dollars in funding over the next five years. These developments are boosting the demand for high-density and thermally efficient substrates, particularly those optimized for AI-centric hardware in data centers and edge devices, thereby propelling the overall market growth.
The semiconductor industry is undergoing a major transformation as it shifts toward heterogeneous integration and chiplet-based system architectures. Traditional monolithic chip designs are being replaced with modular chiplet configurations that improve yield and lower costs. This evolution requires advanced IC substrates to serve as the high-performance interconnect platform supporting seamless communication between diverse chiplets. Research forecasts indicate that the future of packaging will move toward simplified hierarchy with direct chiplet-to-substrate assembly, replacing the need for intermediary layers like interposers. Substrate technologies are being adapted to include silicon and glass cores, along with embedded passive and active components. This architectural shift is boosting the market by enabling more efficient, scalable, and cost-effective semiconductor design and manufacturing.
The transition from round wafer-based processing to large area panel-level packaging is redefining the substrate manufacturing process. Panel sizes reaching up to six hundred fifty millimeters by six hundred fifty millimeters are enabling manufacturers to process more devices per cycle, significantly improving throughput and lowering production costs. This evolution is particularly impactful for high-volume sectors such as mobile electronics, medical wearables, and flexible hybrid devices. The use of larger panels also allows for the integration of more complex designs on thinner substrates, expanding the range of potential applications.
In response to recent supply chain disruptions, several governments are focusing on reshoring and domesticating the production of advanced IC substrates. The U.S. currently has minimal capacity to manufacture high-end substrates like Flip Chip Ball Grid Array or Flip Chip Chip Scale Package, which are critical to leading-edge chip packaging. As part of the CHIPS and Science Act, federal support totaling nearly three hundred million dollars is being directed toward building domestic capabilities. These efforts include investment in emerging technologies such as additive manufacturing and three-dimensional printing for substrate prototyping. The aim is to reduce dependence on foreign suppliers and establish a more resilient and secure supply network for the semiconductor industry. These strategic moves are boosting the market by ensuring consistent access to advanced packaging technologies and driving long-term growth across key verticals.
Global Advanced IC Substrates Market Report Segmentation
This report forecasts revenue growth at the global, regional, and country levels and provides an analysis of the latest industry trends in each of the sub-segments from 2021 to 2033. For this study, Grand View Research has segmented the global advanced IC substrates market report based on type, technology, application, and region: