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市場調查報告書
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1747794

全球 PCB 中的 IC基板市場

IC Substrates in PCBs
出版日期: | 出版商: Global Industry Analysts, Inc. | 英文 276 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

預計到 2030 年，全球 PCB 中的 IC基板市場規模將達到 175 億美元

全球PCB（印刷電路板）IC基板市場規模預計在2024年為87億美元，預計到2030年將達到175億美元，2024年至2030年的複合年成長率為12.3%。本報告分析的細分市場之一FC BGA（全快閃球柵陣列）預期複合年成長率為10.7%，到分析期末達到109億美元。 FC CSP（全快閃晶片級封裝）細分市場在分析期間的複合年成長率預計為15.5%。

美國市場預計將成長至 24 億美元，中國市場的複合年成長率將達到 16.3%

預計到2024年，美國積體電路（IC）基板（PCB）市場規模將達24億美元。作為世界第二大經濟體的中國，預計2030年市場規模將達到36億美元，在2024-2030年的分析期間內，複合年成長率為16.3%。其他值得關注的區域市場包括日本和加拿大，預計在分析期間內，這兩個市場的複合年成長率分別為9.1%和10.9%。在歐洲，預計德國市場的複合年成長率約為9.7%。

全球 PCB 市場 IC基板- 主要趨勢與促進因素總結

為什麼IC基板會成為下一代PCB設計的支柱？

積體電路 (IC)基板在印刷電路基板(PCB) 中扮演著越來越重要的角色，是半導體晶片與更廣泛電路組件之間的關鍵介面。這些基板提供機械支撐並實現高密度電氣互連，使其成為先進運算、消費性電子、通訊、汽車電子等領域晶片封裝的關鍵材料。與傳統 PCB 不同，IC基板的設計旨在滿足高性能晶片的需求，包括小型化、散熱、訊號完整性和多層佈線。因此，它們在許多半導體應用中正日益取代導線架和陶瓷封裝。

隨著高效能運算 (HPC)、5G 基礎設施和系統級封裝 (SiP) 架構的日益普及，IC基板已成為現代電子設計的基本要素。半導體封裝正在從被動機殼演變為系統性能的主動組件，而 IC基板能夠在越來越小的尺寸內實現垂直堆疊、電力傳輸和訊號傳輸。這種轉變源於消費者和工業界對更快、更薄、更節能設備的需求，而這些設備都依賴先進的基板技術，以便無縫整合到多層 PCB 環境中。

哪些技術進步正在重塑 PCB 系統中 IC基板的功能？

IC基板市場正經歷材料科學、微型化和製造精度的創新浪潮。其中一個主要趨勢是從傳統的FR4基板，由於其卓越的性能和可靠性，正成為CPU、GPU和AI加速器等先進節點封裝的事實上的標準。

高密度互連 (HDI) 和嵌入式走線基板(ETS) 技術的進步進一步增強了 IC基板在 PCB 組件中的作用。這些技術能夠在不影響電氣性能的情況下實現更高的層數、超細間距佈線和小型化。覆晶封裝、扇出型晶圓級封裝 (FOWLP) 和晶片整合也正在重塑基板設計，因為它們要求在單一封裝內支援多晶片和多功能。為了滿足這些要求，製造商正在投資先進的雷射鑽孔、光刻和檢測系統，以確保在複雜的基板堆疊中實現亞微米級精度和層間對準。

推動 PCB 應用對先進 IC基板需求的最終用途是什麼？

眾多產業正在經歷數位轉型和產品創新，這推動了對積體電路基板的需求。在家用電子電器，智慧型手機、平板電腦和穿戴式裝置依賴基板來承載微型邏輯晶片和儲存晶片，需要超薄、高導熱效率的基板來支援USB4、LPDDR5和Wi-Fi 7等高速介面。在運算領域，伺服器、資料中心和高效能運算系統正在將積體電路基板部署在多晶片模組中，以支援人工智慧工作負載、雲端運算和複雜的資料分析，挑戰電氣性能和溫度控管的極限。

隨著汽車電子元件數量的不斷增加，尤其是電動車、自動駕駛系統、車載資訊娛樂系統等的興起，汽車電子產業正成為重要的驅動力。積體電路基板是電控系統的關鍵元件，這些元件對高可靠性和耐熱性至關重要。同樣，在通訊領域，先進的基板也用於 5G基地台、光學模組和高頻射頻設備，這些零件對訊號完整性和高速資料處理至關重要。在工業自動化和醫療電子領域，積體電路基板在整合精密儀器、成像系統和感測器方面也發揮關鍵作用。

PCB 中 IC基板市場的成長受到多種因素的推動…

PCB IC基板市場的成長受到多種因素的驅動，這些因素與半導體封裝的演進、高速資料需求以及先進電子系統的普及有關。其中，向異構整合和基於晶片組的架構的轉變需要複雜的互連解決方案。人工智慧處理器、圖形加速器和高頻寬記憶體的需求激增，也推動了對支援高 I/O 數量、低訊號損耗和出色散熱性能的基板的需求。

材料創新也是一個關鍵促進因素，基板製造商擴大採用ABF和其他先進的電介質來支援更精細的幾何形狀和多層堆疊。同時，東亞領導企業在供應鏈上的投資和產能擴張，確保了擴充性，以滿足半導體和先進封裝需求的激增。 5G的推出、汽車電氣化以及邊緣運算的成長，都在強化IC基板在下一代PCB組件中的作用。最後，隨著設備功能越來越強大、外形規格越來越小，IC基板正逐漸成為在電子價值鏈各個環節提供效能、功率效率和整合度的戰略賦能器。

部分

類型（FC BGA、FC CSP）、應用程式（平板電腦、智慧型手機、筆記型電腦、穿戴式裝置、其他應用）

受訪公司範例（值得關注的36家公司）

  • ASE Technology Holding Co., Ltd.
  • AT&S（Austria Technologie & Systemtechnik AG）
  • Daeduck Electronics Co., Ltd.
  • HannStar Board Corporation
  • Ibiden Co., Ltd.
  • KCE Electronics Public Company Limited
  • Kinsus Interconnect Technology Corp.
  • Kyocera Corporation
  • LG Innotek Co., Ltd.
  • Nan Ya PCB Corporation
  • Samsung Electro-Mechanics Co., Ltd.
  • Shennan Circuits Co., Ltd.
  • Shinko Electric Industries Co., Ltd.
  • Simmtech Co., Ltd.
  • Toppan Inc.
  • Tripod Technology Corporation
  • TTM Technologies, Inc.
  • Unimicron Technology Corporation
  • WUS Printed Circuit Co., Ltd.
  • Zhen Ding Technology Holding Limited

關稅影響係數

全球產業分析師根據公司總部所在國家、製造地、進出口（成品和原始OEM）來預測其競爭地位的變化。這種複雜且多面向的市場動態預計將以多種方式影響競爭對手，包括人為提高銷貨成本、盈利下降、供應鏈重組以及其他微觀和宏觀市場動態。

全球產業分析師密切關注來自全球頂尖首席經濟學家（14,949位）、智庫（62家）以及貿易和產業協會（171家）的專家的意見，以評估其對生態系統的影響並應對新的市場現實。我們追蹤了來自每個主要國家的專家和經濟學家對關稅及其對本國影響的看法。

全球產業分析師預計，這場動盪將在未來2-3個月內逐漸平息，新的世界秩序將更加清晰地建立。全球產業分析師正在即時追蹤這些事態發展。

2025年4月：談判階段

在4月的報告中，我們將探討關稅對全球整體市場的影響，並提供區域市場調整。我們的預測是基於歷史數據和不斷變化的市場影響因素。

2025年7月：最終關稅調整

在各國宣布最終重置後，客戶將在 7 月收到免費更新，最終更新將包含明確的關稅影響分析。

相互和雙邊貿易及關稅影響分析：

美國<>中國<>墨西哥<>加拿大<>歐盟<>日本<>印度<>其他176個國家

領先的產業經濟學家：全球產業分析師知識庫追蹤了 14,949 位經濟學家，其中包括來自民族國家、智庫、貿易和產業協會、大型企業以及各領域專家的最具影響力的首席經濟學家，他們共用了這場前所未有的全球經濟狀況模式轉移的影響。我們超過 16,491 份報告大多遵循基於里程碑的兩階段發布計劃。

目錄

第1章調查方法

第2章執行摘要

  • 市場概覽
  • 主要企業
  • 市場趨勢和促進因素
  • 全球市場展望

第3章市場分析

  • 美國
  • 加拿大
  • 日本
  • 中國
  • 歐洲
  • 法國
  • 德國
  • 義大利
  • 英國
  • 西班牙
  • 俄羅斯
  • 其他歐洲國家
  • 亞太地區
  • 澳洲
  • 印度
  • 韓國
  • 其他亞太地區
  • 拉丁美洲
  • 阿根廷
  • 巴西
  • 墨西哥
  • 其他拉丁美洲
  • 中東
  • 伊朗
  • 以色列
  • 沙烏地阿拉伯
  • 阿拉伯聯合大公國
  • 其他中東地區
  • 非洲

第4章 競賽

簡介目錄
Product Code: MCP35209

Global IC Substrates in PCBs Market to Reach US$17.5 Billion by 2030

The global market for IC Substrates in PCBs estimated at US$8.7 Billion in the year 2024, is expected to reach US$17.5 Billion by 2030, growing at a CAGR of 12.3% over the analysis period 2024-2030. FC BGA, one of the segments analyzed in the report, is expected to record a 10.7% CAGR and reach US$10.9 Billion by the end of the analysis period. Growth in the FC CSP segment is estimated at 15.5% CAGR over the analysis period.

The U.S. Market is Estimated at US$2.4 Billion While China is Forecast to Grow at 16.3% CAGR

The IC Substrates in PCBs market in the U.S. is estimated at US$2.4 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$3.6 Billion by the year 2030 trailing a CAGR of 16.3% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 9.1% and 10.9% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 9.7% CAGR.

Global IC Substrates in PCBs Market - Key Trends & Drivers Summarized

Why Are IC Substrates Becoming the Backbone of Next-Generation PCB Design?

Integrated Circuit (IC) substrates are increasingly critical in printed circuit boards (PCBs), serving as the essential interface between semiconductor chips and the broader circuit assembly. These substrates provide mechanical support and enable high-density electrical interconnections, making them indispensable for chip packaging in advanced computing, consumer electronics, telecommunications, and automotive electronics. Unlike traditional PCBs, IC substrates are designed to handle the demands of high-performance chips, including miniaturization, heat dissipation, signal integrity, and multi-layer interconnect routing. As a result, they are rapidly replacing lead frames and ceramic packages in many semiconductor applications.

The rising adoption of high-performance computing (HPC), 5G infrastructure, and system-in-package (SiP) architectures has positioned IC substrates as a foundational element of modern electronics design. Semiconductor packaging has evolved from being a passive enclosure to an active component of system performance, with IC substrates enabling vertical stacking, power delivery, and signal transmission at increasingly smaller geometries. This shift is driven by consumer and industrial demand for faster, thinner, and more energy-efficient devices, all of which depend on sophisticated substrate technology that integrates seamlessly into multilayer PCB environments.

What Technological Innovations Are Reshaping IC Substrate Capabilities in PCB Systems?

The IC substrates market is experiencing a wave of innovation in material science, miniaturization, and manufacturing precision. One major trend is the transition from traditional FR4 to high-performance build-up substrates using BT resin, ABF (Ajinomoto Build-up Film), and epoxy-based materials. These enable finer line/space geometries, higher I/O densities, and lower dielectric loss, which are essential for high-speed signal transmission in processors and memory devices. ABF substrates, in particular, are becoming the de facto standard in packaging advanced nodes such as CPUs, GPUs, and AI accelerators due to their superior performance and reliability.

Advancements in high-density interconnect (HDI) and embedded trace substrate (ETS) technologies are further enhancing the role of IC substrates in PCB assemblies. These allow for higher layer counts, ultra-fine pitch wiring, and increased miniaturization-all without compromising electrical performance. Flip-chip packaging, fan-out wafer-level packaging (FOWLP), and chiplet integration are also reshaping substrate design by demanding multi-die and multi-functional support within a single package. To meet these requirements, manufacturers are investing in advanced laser drilling, photolithography, and inspection systems that ensure sub-micron precision and inter-layer alignment across complex substrate stacks.

Which End-Use Sectors Are Driving Demand for Advanced IC Substrates in PCB Applications?

The demand for IC substrates is being fueled by a broad spectrum of industries undergoing digital transformation and product innovation. In consumer electronics, smartphones, tablets, and wearables rely on IC substrates for their miniaturized logic and memory chips, demanding ultra-thin, thermally efficient substrates that support high-speed interfaces like USB4, LPDDR5, and Wi-Fi 7. In the computing sector, servers, data centers, and HPC systems are deploying IC substrates in multi-chip modules that power AI workloads, cloud computing, and complex data analytics-pushing the limits of electrical performance and thermal management.

The automotive electronics segment is emerging as a major growth driver due to the increasing electronic content in vehicles, particularly with the rise of EVs, autonomous driving systems, and in-vehicle infotainment. IC substrates are critical in electronic control units (ECUs), battery management systems (BMS), and radar/lidar modules, where high-reliability and heat resistance are essential. Likewise, the telecom sector is leveraging advanced substrates in 5G base stations, optical modules, and high-frequency RF devices, where signal integrity and high-speed data processing are paramount. Even in industrial automation and medical electronics, IC substrates are playing a crucial role in precision instrumentation, imaging systems, and sensor integration.

The Growth in the IC Substrates in PCBs Market Is Driven by Several Factors…

The growth in the IC substrates in PCBs market is driven by several factors related to semiconductor packaging evolution, high-speed data requirements, and the proliferation of advanced electronic systems. Chief among these is the ongoing transition to heterogeneous integration and chiplet-based architectures, which require complex interconnect solutions that IC substrates are uniquely positioned to deliver. The surge in demand for AI processors, graphics accelerators, and high-bandwidth memory has also intensified the need for substrates that support high I/O counts, minimal signal loss, and superior heat dissipation.

Material innovation is another key driver, with substrate manufacturers increasingly adopting ABF and other advanced dielectrics to support finer geometries and multilayer stacking. At the same time, supply chain investments and capacity expansions by major players in East Asia are ensuring scalability to meet demand surges in semiconductors and advanced packaging. The rollout of 5G, the electrification of vehicles, and the growth of edge computing are all reinforcing the role of IC substrates in next-gen PCB assemblies. Finally, as device functionality increases while form factors shrink, IC substrates are emerging as strategic enablers of performance, power efficiency, and integration in every layer of the electronics value chain.

SCOPE OF STUDY:

The report analyzes the IC Substrates in PCBs market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Type (FC BGA, FC CSP); Application (Tablet PC, Smart Phones, Laptops, Wearable Devices, Other Applications)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 36 Featured) -

  • ASE Technology Holding Co., Ltd.
  • AT&S (Austria Technologie & Systemtechnik AG)
  • Daeduck Electronics Co., Ltd.
  • HannStar Board Corporation
  • Ibiden Co., Ltd.
  • KCE Electronics Public Company Limited
  • Kinsus Interconnect Technology Corp.
  • Kyocera Corporation
  • LG Innotek Co., Ltd.
  • Nan Ya PCB Corporation
  • Samsung Electro-Mechanics Co., Ltd.
  • Shennan Circuits Co., Ltd.
  • Shinko Electric Industries Co., Ltd.
  • Simmtech Co., Ltd.
  • Toppan Inc.
  • Tripod Technology Corporation
  • TTM Technologies, Inc.
  • Unimicron Technology Corporation
  • WUS Printed Circuit Co., Ltd.
  • Zhen Ding Technology Holding Limited

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by artificially increasing the COGS, reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

We are diligently following expert opinions of leading Chief Economists (14,949), Think Tanks (62), Trade & Industry bodies (171) worldwide, as they assess impact and address new market realities for their ecosystems. Experts and economists from every major country are tracked for their opinions on tariffs and how they will impact their countries.

We expect this chaos to play out over the next 2-3 months and a new world order is established with more clarity. We are tracking these developments on a real time basis.

As we release this report, U.S. Trade Representatives are pushing their counterparts in 183 countries for an early closure to bilateral tariff negotiations. Most of the major trading partners also have initiated trade agreements with other key trading nations, outside of those in the works with the United States. We are tracking such secondary fallouts as supply chains shift.

To our valued clients, we say, we have your back. We will present a simplified market reassessment by incorporating these changes!

APRIL 2025: NEGOTIATION PHASE

Our April release addresses the impact of tariffs on the overall global market and presents market adjustments by geography. Our trajectories are based on historic data and evolving market impacting factors.

JULY 2025 FINAL TARIFF RESET

Complimentary Update: Our clients will also receive a complimentary update in July after a final reset is announced between nations. The final updated version incorporates clearly defined Tariff Impact Analyses.

Reciprocal and Bilateral Trade & Tariff Impact Analyses:

USA <> CHINA <> MEXICO <> CANADA <> EU <> JAPAN <> INDIA <> 176 OTHER COUNTRIES.

Leading Economists - Our knowledge base tracks 14,949 economists including a select group of most influential Chief Economists of nations, think tanks, trade and industry bodies, big enterprises, and domain experts who are sharing views on the fallout of this unprecedented paradigm shift in the global econometric landscape. Most of our 16,491+ reports have incorporated this two-stage release schedule based on milestones.

COMPLIMENTARY PREVIEW

Contact your sales agent to request an online 300+ page complimentary preview of this research project. Our preview will present full stack sources, and validated domain expert data transcripts. Deep dive into our interactive data-driven online platform.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • World Market Trajectories
    • Tariff Impact on Global Supply Chain Patterns
    • IC Substrates in PCBs - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Rising Demand for High-Performance Semiconductors Fuels Growth of IC Substrates in Advanced PCB Assemblies
    • Miniaturization of Electronic Devices Drives Adoption of High-Density Interconnect (HDI) and IC Substrate-Based PCB Designs
    • Surge in AI, 5G, and High-Speed Computing Applications Boosts Use of Substrate-Like PCBs (SLPs) for Signal Integrity
    • Increased Complexity of System-in-Package (SiP) and Multi-Chip Modules Expands Demand for Advanced Substrate Materials
    • OEM Focus on Thermal Management and Electrical Performance Enhances Use of IC Substrates With Low Dk/Df Properties
    • Expansion of Automotive Electronics and ADAS Applications Elevates Need for Rigid, High-Reliability IC Substrate Layers
    • Growth in Consumer Electronics and Wearables Supports Volume Production of Miniaturized, Multi-Layer IC Substrate PCBs
    • Technological Innovations in Organic Substrates and Build-Up Layers Improve Functionality in High-I/O Density Packages
    • Rise in Chiplet and 2.5D/3D Packaging Architectures Drives Integration of IC Substrates Into PCB Interposer Structures
    • Global Semiconductor Supply Chain Realignment Encourages Investment in Domestic Substrate Fabrication Facilities
    • Rising Demand for High-Speed Memory and GPU Modules Propels Innovation in BT Resin-Based and ABF Substrate Materials
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World IC Substrates in PCBs Market Analysis of Annual Sales in US$ Million for Years 2015 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for IC Substrates in PCBs by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 3: World Historic Review for IC Substrates in PCBs by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 4: World 15-Year Perspective for IC Substrates in PCBs by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets for Years 2015, 2025 & 2030
    • TABLE 5: World Recent Past, Current & Future Analysis for FC BGA by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 6: World Historic Review for FC BGA by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 7: World 15-Year Perspective for FC BGA by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2015, 2025 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for FC CSP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 9: World Historic Review for FC CSP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 10: World 15-Year Perspective for FC CSP by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2015, 2025 & 2030
    • TABLE 11: World Recent Past, Current & Future Analysis for Tablet PC by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 12: World Historic Review for Tablet PC by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 13: World 15-Year Perspective for Tablet PC by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2015, 2025 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for Smart Phones by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 15: World Historic Review for Smart Phones by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 16: World 15-Year Perspective for Smart Phones by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2015, 2025 & 2030
    • TABLE 17: World Recent Past, Current & Future Analysis for Laptops by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 18: World Historic Review for Laptops by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 19: World 15-Year Perspective for Laptops by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2015, 2025 & 2030
    • TABLE 20: World Recent Past, Current & Future Analysis for Wearable Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 21: World Historic Review for Wearable Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 22: World 15-Year Perspective for Wearable Devices by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2015, 2025 & 2030
    • TABLE 23: World Recent Past, Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 24: World Historic Review for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 25: World 15-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2015, 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 26: USA Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 27: USA Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 28: USA 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 29: USA Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 30: USA Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 31: USA 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • CANADA
    • TABLE 32: Canada Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 33: Canada Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 34: Canada 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 35: Canada Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 36: Canada Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 37: Canada 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • JAPAN
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 38: Japan Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 39: Japan Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 40: Japan 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 41: Japan Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 42: Japan Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 43: Japan 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • CHINA
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 44: China Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 45: China Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 46: China 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 47: China Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 48: China Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 49: China 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • EUROPE
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 50: Europe Recent Past, Current & Future Analysis for IC Substrates in PCBs by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 51: Europe Historic Review for IC Substrates in PCBs by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 52: Europe 15-Year Perspective for IC Substrates in PCBs by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2015, 2025 & 2030
    • TABLE 53: Europe Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 54: Europe Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 55: Europe 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 56: Europe Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 57: Europe Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 58: Europe 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • FRANCE
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
    • TABLE 59: France Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 60: France Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 61: France 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 62: France Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 63: France Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 64: France 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • GERMANY
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
    • TABLE 65: Germany Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 66: Germany Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 67: Germany 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 68: Germany Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 69: Germany Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 70: Germany 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • ITALY
    • TABLE 71: Italy Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 72: Italy Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 73: Italy 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 74: Italy Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 75: Italy Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 76: Italy 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • UNITED KINGDOM
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
    • TABLE 77: UK Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 78: UK Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 79: UK 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 80: UK Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 81: UK Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 82: UK 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • SPAIN
    • TABLE 83: Spain Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 84: Spain Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 85: Spain 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 86: Spain Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 87: Spain Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 88: Spain 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • RUSSIA
    • TABLE 89: Russia Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 90: Russia Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 91: Russia 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 92: Russia Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 93: Russia Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 94: Russia 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • REST OF EUROPE
    • TABLE 95: Rest of Europe Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 96: Rest of Europe Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 97: Rest of Europe 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 98: Rest of Europe Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 99: Rest of Europe Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 100: Rest of Europe 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • ASIA-PACIFIC
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 101: Asia-Pacific Recent Past, Current & Future Analysis for IC Substrates in PCBs by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 102: Asia-Pacific Historic Review for IC Substrates in PCBs by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 103: Asia-Pacific 15-Year Perspective for IC Substrates in PCBs by Geographic Region - Percentage Breakdown of Value Sales for Australia, India, South Korea and Rest of Asia-Pacific Markets for Years 2015, 2025 & 2030
    • TABLE 104: Asia-Pacific Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 105: Asia-Pacific Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 106: Asia-Pacific 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 107: Asia-Pacific Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 108: Asia-Pacific Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 109: Asia-Pacific 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • AUSTRALIA
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Australia for 2025 (E)
    • TABLE 110: Australia Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 111: Australia Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 112: Australia 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 113: Australia Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 114: Australia Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 115: Australia 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • INDIA
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in India for 2025 (E)
    • TABLE 116: India Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 117: India Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 118: India 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 119: India Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 120: India Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 121: India 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • SOUTH KOREA
    • TABLE 122: South Korea Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 123: South Korea Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 124: South Korea 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 125: South Korea Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 126: South Korea Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 127: South Korea 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • REST OF ASIA-PACIFIC
    • TABLE 128: Rest of Asia-Pacific Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 129: Rest of Asia-Pacific Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 130: Rest of Asia-Pacific 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 131: Rest of Asia-Pacific Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 132: Rest of Asia-Pacific Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 133: Rest of Asia-Pacific 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • LATIN AMERICA
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Latin America for 2025 (E)
    • TABLE 134: Latin America Recent Past, Current & Future Analysis for IC Substrates in PCBs by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 135: Latin America Historic Review for IC Substrates in PCBs by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 136: Latin America 15-Year Perspective for IC Substrates in PCBs by Geographic Region - Percentage Breakdown of Value Sales for Argentina, Brazil, Mexico and Rest of Latin America Markets for Years 2015, 2025 & 2030
    • TABLE 137: Latin America Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 138: Latin America Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 139: Latin America 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 140: Latin America Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 141: Latin America Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 142: Latin America 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • ARGENTINA
    • TABLE 143: Argentina Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 144: Argentina Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 145: Argentina 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 146: Argentina Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 147: Argentina Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 148: Argentina 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • BRAZIL
    • TABLE 149: Brazil Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 150: Brazil Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 151: Brazil 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 152: Brazil Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 153: Brazil Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 154: Brazil 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • MEXICO
    • TABLE 155: Mexico Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 156: Mexico Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 157: Mexico 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 158: Mexico Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 159: Mexico Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 160: Mexico 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • REST OF LATIN AMERICA
    • TABLE 161: Rest of Latin America Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 162: Rest of Latin America Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 163: Rest of Latin America 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 164: Rest of Latin America Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 165: Rest of Latin America Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 166: Rest of Latin America 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • MIDDLE EAST
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Middle East for 2025 (E)
    • TABLE 167: Middle East Recent Past, Current & Future Analysis for IC Substrates in PCBs by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 168: Middle East Historic Review for IC Substrates in PCBs by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 169: Middle East 15-Year Perspective for IC Substrates in PCBs by Geographic Region - Percentage Breakdown of Value Sales for Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets for Years 2015, 2025 & 2030
    • TABLE 170: Middle East Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 171: Middle East Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 172: Middle East 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 173: Middle East Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 174: Middle East Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 175: Middle East 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • IRAN
    • TABLE 176: Iran Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 177: Iran Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 178: Iran 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 179: Iran Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 180: Iran Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 181: Iran 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • ISRAEL
    • TABLE 182: Israel Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 183: Israel Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 184: Israel 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 185: Israel Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 186: Israel Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 187: Israel 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • SAUDI ARABIA
    • TABLE 188: Saudi Arabia Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 189: Saudi Arabia Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 190: Saudi Arabia 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 191: Saudi Arabia Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 192: Saudi Arabia Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 193: Saudi Arabia 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • UNITED ARAB EMIRATES
    • TABLE 194: UAE Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 195: UAE Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 196: UAE 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 197: UAE Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 198: UAE Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 199: UAE 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • REST OF MIDDLE EAST
    • TABLE 200: Rest of Middle East Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 201: Rest of Middle East Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 202: Rest of Middle East 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 203: Rest of Middle East Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 204: Rest of Middle East Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 205: Rest of Middle East 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030
  • AFRICA
    • IC Substrates in PCBs Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Africa for 2025 (E)
    • TABLE 206: Africa Recent Past, Current & Future Analysis for IC Substrates in PCBs by Type - FC BGA and FC CSP - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 207: Africa Historic Review for IC Substrates in PCBs by Type - FC BGA and FC CSP Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 208: Africa 15-Year Perspective for IC Substrates in PCBs by Type - Percentage Breakdown of Value Sales for FC BGA and FC CSP for the Years 2015, 2025 & 2030
    • TABLE 209: Africa Recent Past, Current & Future Analysis for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 210: Africa Historic Review for IC Substrates in PCBs by Application - Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 211: Africa 15-Year Perspective for IC Substrates in PCBs by Application - Percentage Breakdown of Value Sales for Tablet PC, Smart Phones, Laptops, Wearable Devices and Other Applications for the Years 2015, 2025 & 2030

IV. COMPETITION