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市場調查報告書
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1808866

先進積體電路載板市場（按類型、按封裝技術、按材料、按最終用途、按國家和地區）－2025 年至 2032 年全球產業分析、市場規模、市場佔有率及預測

Advanced IC Substrates Market, By Type, By Packaging Technology, By Material, By End Use, By Country, and By Region - Global Industry Analysis, Market Size, Market Share & Forecast from 2025-2032
出版日期: | 出版商: AnalystView Market Insights | 英文 311 Pages | 商品交期: 2-3個工作天內

價格
簡介目錄

2024 年先進 IC 載板市場規模價值為 227.9209 億美元，2025 年至 2032 年的複合年成長率為 11.91%。

IC載板市場涵蓋高密度互連平台的設計、生產和銷售。這些平台可作為半導體晶片和印刷電路板 (PCB) 之間的實體連接，為積體電路提供機械支撐、訊號路由和電源分配。這在智慧型手機、伺服器、AI加速器和汽車電子產品等高效能應用中尤其重要。該市場採用先進的封裝形式，例如覆晶球柵陣列 (FCBGA)、晶片級封裝 (CSP) 和系統級封裝 (SiP)。對更小尺寸、更高I/O密度以及更佳熱性能和電氣性能的需求正在推動材料和載板設計的創新。

先進IC載板市場-市場動態

高效能運算和人工智慧晶片的需求不斷成長

隨著人工智慧演算法、大規模雲端運算和快速資料分析的日益複雜，人們對晶片的需求也隨之增加，這些晶片能夠更快地處理資訊、處理更多輸入/輸出，並更好地管理熱量。傳統的封裝平台無法滿足這些效能標準。先進的IC載板，例如FC-BGA（覆晶球柵陣列）和2.5D/3D封裝，能夠提供高密度連接和更佳的訊號傳輸。這些特性對於未來的計算工作負載至關重要。

NVIDIA、AMD 和 Intel 等頂級晶片製造商正在擴大使用先進封裝來提升 GPU 和 CPU 的效能，尤其是在訓練和使用 AI 模型方面。這些基板可以支援更大的晶片尺寸，整合堆疊內存，並改善散熱性能。這在嚴苛的運算環境中能夠提高可靠性。此外，亞馬遜網路服務和Google雲端等公司正在敦促基板供應商開發更好的封裝解決方案，以滿足其資料中心日益成長的需求。因此，上游在基板技術、材料創新和產能提升方面投入了大量資金。

例如，

2024年1月，英特爾宣佈在其下一代至強和AI加速器中擴展其EMIB（嵌入式多晶片互連橋接）和Foveros 3D封裝技術。這些先進的IC基板支援垂直堆疊和高密度互連，這對於高效能運算和AI晶片封裝至關重要。

先進IC載板市場－關鍵洞察

根據我們的研究分析師的分析，預測期內（2025-2032 年）全球市場預計年複合成長率約為 11.91%

根據類型細分，預計覆晶球柵陣列 (FCBGA) 將在 2024 年佔據最大市場佔有率

根據封裝技術細分，2D覆晶是2024年領先的封裝技術

根據材料細分，FR-4 是 2024 年的主導資料

從最終用途來看，半導體是 2024 年最主要的最終用途

按地區分類，亞太地區是 2024 年的主要收入來源

先進IC載板市場-細分分析：

全球先進積體電路載板市場根據類型、封裝技術、材料、最終用途和地區進行細分。

市場根據類型分為五類：覆晶球柵陣列 (FCBGA) 基板、覆晶晶片級封裝 (FCCSP) 基板、嵌入式基板、引線鍵合基板及其他。覆晶球柵陣列 (FCBGA) 領域佔據市場主導地位，因為它們能夠處理高輸入/輸出 (I/O) 密度、具有更好的散熱性能，並允許細間距佈線。這些特性對於資料中心處理器、AI 加速器和高階顯示卡至關重要。英特爾和 AMD 等公司在其頂級 CPU 和 GPU 設計中使用 FCBGA，因為它能夠在緊湊的佈局中有效地管理熱量和電訊號。異構整合和 2.5D/3D 封裝的持續發展進一步增加了先進半導體應用對 FCBGA 基板的需求。

根據最終用途，市場可分為五類：半導體、電腦硬體、醫療設備、家用電器和行動裝置。受電晶體節點的不斷擴展以及高密度高速運算需求激增的推動，半導體領域仍然是先進積體電路載板市場的主導力量。這些載板構成了邏輯晶片、記憶體模組和異質整合平台先進封裝的支柱。英特爾、AMD 和台積電等公司廣泛使用 FCBGA 和嵌入式橋接結構等高效能載板來支援人工智慧加速器、資料中心處理器和 5G 調變解調器。對訊號完整性、功率傳輸和小型化日益成長的需求，使得先進載板在現代晶片架構中不可或缺，從而鞏固了該領域的領先地位。

先進IC載板市場-地理洞察

在 2024 年的預測期內，亞太地區將主導全球先進 IC 載板市場。

亞太地區憑藉其在台灣、韓國、日本和中國大陸的強大半導體封裝基礎設施，成為半導體封裝市場的主要主導地區。欣興電子、景碩科技、揖斐電和新光電機等公司為台積電、三星和SK海力士等主要廠商提供FCBGA和FCCSP等高品質基板。台灣地區對全球基板製造產能貢獻巨大。該地區在印刷電路板（SLP）等基板和基於晶片的封裝方面投入了大量資金。中國「中國製造2025」的國家政策著重於提升國內晶片和基板的生產能力，這進一步鞏固了亞太地區的領先地位。經濟實惠的製造成本、熟練的工人以及一體化的電子生態系統使亞太地區始終保持領先地位。

預計在 2024 年預測期內，北美將在先進 IC 載板市場中實現最高的複合年成長率。

由於政策變化和新技術的使用，北美正成為成長最快的地區。 《晶片與科學法案》已提供超過 500 億美元的聯邦激勵措施。這些資金正在推動基礎設施建設和基板研發。例如，英特爾正在擴建其位於俄亥俄州的晶圓廠和位於俄勒岡州的研發中心。他們正在採用新的基板技術，如 EMIB（嵌入式多晶片互連橋接）和用於 3D 堆疊的 Foveros Direct。此外，NVIDIA 和 AMD 等美國 AI 晶片製造商正在創造對超高密度基板的更高需求，以支援多晶片設計。將封裝能力帶回美國的地方舉措，加上國防、航太和 AI 雲端基礎設施日益成長的需求，正在推動該地區市場的快速成長。

先進積體電路載板市場-競爭格局：

先進積體電路載板市場高度整合，少數幾家關鍵廠商控制全球供應，尤其是在亞太地區。揖斐電、新光馬達、欣興電子和三星馬達等領先公司正專注於下一代載板技術，例如覆晶球柵陣列 (FCBGA) 和嵌入式走線載板。這些公司正在投資高層數載板、微型化和熱性能改進，以支援用於人工智慧、5G 和高效能運算 (HPC) 應用的先進處理器。與英特爾、AMD 和 NVIDIA 等晶片製造商的策略合作夥伴關係正在推動晶片整合和異質封裝領域的創新。

奧特斯（奧地利）和真鼎科技（中國）等公司正透過新的投資和區域成長積極拓展其製造能力。奧特斯透過在東南亞建立新的積體電路載板工廠，在高效能運算（HPC）領域取得了進展，而真鼎則作為中國半導體自力更生計畫的一部分，正在迅速擴張。競爭優勢日益基於精細佈線、低翹曲和介電材料進步等能力。製造商正在競相滿足超緊湊、高速半導體元件的封裝需求。

最新動態：

2024年5月，三星馬達宣布投資11億美元擴建位於韓國和越南的FC-BGA基板生產線。此次擴建旨在滿足伺服器、AI和HPC處理器日益成長的需求，這些處理器需要複雜的多層基板。

2024年7月，三星馬達與AMD合作，為其釜山和越南工廠供應超高層FCBGA基板。這些基板支援更大的晶片表面積和更密集的互連，適用於超大規模資料中心的GPU和CPU。三星馬達已投資約1.9兆韓元，用於擴大下一代AI和伺服器處理器的生產。

2024年12月，為因應英偉達、英特爾和AMD等客戶對AI晶片基板需求的激增，揖斐電株式會社正加速產能擴張。預計到2025年底，位於岐阜縣的新基板工廠將以25%的產能投入營運，2026年3月將達到50%。管理層正在探索如何盡快將剩餘產能投入營運以滿足需求。

2024年10月，KLA推出了一系列IC載板產品，以開發半導體封裝技術。該產品組合包括檢測、測量和資料分析解決方案，旨在滿足複雜的IC載板生產流程的需求。這些改進旨在解決先進封裝應用中的挑戰，例如系統級封裝設計和異構整合，重點是提高良率、性能和可靠性。

2023年9月，BIWIN推出AP860，一款全新的無DRAM PCIe 4.0 SSD，適用於桌上型電腦、筆記型電腦和一體機系統。繼2022年PCIe SSD價格下降之後，高性能SSD的價格也在下降。這一趨勢提升了客戶PCIe 4.0 SSD的市場佔有率，並增加了其在PC OEM市場的使用率。

目錄

第1章：先進積體電路載板市場概述

  • 研究範圍
  • 市場估計年限

第2章：執行摘要

  • 市場片段
    • 先進積體電路載板市場類型摘要
    • 先進IC載板市場（依封裝技術）
    • 先進積體電路載板市場（按材料）
    • 先進積體電路載板市場片段（依最終用途）
    • 先進積體電路載板市場（按國家/地區）
    • 先進積體電路載板市場（按地區）
  • 競爭洞察

第3章：先進積體電路載板關鍵市場趨勢

  • 先進積體電路載板市場促進因素
    • 市場促進因素的影響分析
  • 先進IC載板市場限制因素
    • 市場限制的影響分析
  • 先進積體電路載板市場機遇
  • 先進IC載板市場未來趨勢

第4章：先進積體電路載板產業研究

  • PESTEL分析
  • 波特五力分析
  • 成長前景圖
  • 規範架構分析

第5章：先進積體電路載板市場：地緣政治緊張局勢升級的影響

  • COVID-19 疫情的影響
  • 俄烏戰爭的影響
  • 中東衝突的影響

第6章：先進IC載板市場格局

  • 2024年先進IC載板市佔率分析
  • 按主要製造商分類的細分數據
    • 成熟玩家分析
    • 新興企業分析

第7章：先進積體電路載板市場－依類型

  • 概述
    • 按類型分類的細分市場佔有率分析
    • 覆晶球柵陣列 (FCBGA) 基板
    • 覆晶晶片級封裝 (FCCSP) 基板
    • 嵌入式基板
    • 引線鍵結基板
    • 其他

第8章：先進IC載板市場-按封裝技術

  • 概述
    • 按封裝技術分類的細分市場佔有率分析
    • 2D覆晶
    • 2.5D中介層
    • 系統級封裝/模組
    • 扇出型晶圓級封裝
    • 3D積體電路/晶片積體電路

第9章：先進積體電路載板市場－依材料

  • 概述
    • 按材料細分的佔有率分析
    • 聚醯亞胺
    • FR-4
    • 矽
    • 低溫共燒陶瓷
    • 高頻層壓板

第10章：先進積體電路載板市場－依最終用途

  • 概述
    • 按最終用途分類的細分市場佔有率分析
    • 半導體
    • 電腦硬體
    • 醫療保健設備
    • 家用電器
    • 行動裝置

第 11 章：先進 IC 載板市場 - 按地區

  • 介紹
    • 按地區分類的細分市場佔有率分析
  • 北美洲
    • 概述
    • 北美先進積體電路載板主要製造商
    • 北美市場規模及預測（按國家/地區）
    • 北美市場規模和預測（按類型）
    • 北美市場規模及預測（依封裝技術）
    • 北美市場規模及預測（按材料）
    • 北美市場規模和預測，按最終用途
    • 美國
    • 加拿大
  • 歐洲
    • 概述
    • 歐洲先進積體電路載板主要製造商
    • 歐洲市場規模及預測（按國家/地區）
    • 歐洲市場規模與預測（按類型）
    • 歐洲市場規模及預測（依包裝技術）
    • 歐洲市場規模及預測（按材料）
    • 歐洲市場規模和預測，按最終用途
    • 德國
    • 英國
    • 法國
    • 義大利
    • 西班牙
    • 荷蘭
    • 瑞典
    • 俄羅斯
    • 波蘭
    • 歐洲其他地區
  • 亞太地區 (APAC)
    • 概述
    • 亞太地區先進積體電路載板主要製造商
    • 亞太地區市場規模及預測（依國家）
    • 亞太地區市場規模及預測（按類型）
    • 亞太地區市場規模及預測（依封裝技術）
    • 亞太地區市場規模及預測（依材料）
    • 亞太地區市場規模及預測（依最終用途）
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳洲
    • 印尼
    • 泰國
    • 菲律賓
    • 亞太地區其他地區
  • 拉丁美洲（LATAM）
    • 概述
    • 拉丁美洲先進積體電路載板主要製造商
    • 拉丁美洲市場規模及預測（按國家/地區）
    • 拉丁美洲市場規模及預測（按類型）
    • 拉丁美洲市場規模及預測（按封裝技術）
    • 拉丁美洲市場規模及預測（按材料）
    • 拉丁美洲市場規模及預測（依最終用途）
    • 巴西
    • 墨西哥
    • 阿根廷
    • 哥倫比亞
    • 拉丁美洲其他地區
  • 中東和非洲（MEA）
    • 概述
    • 中東和非洲先進積體電路載板主要製造商
    • MEA 市場規模及預測（依國家/地區）
    • MEA 市場規模和預測（按類型）
    • MEA 市場規模及預測（依封裝技術）
    • MEA 市場規模及預測（按材料）
    • MEA 市場規模及預測（依最終用途）
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 以色列
    • 土耳其
    • 阿爾及利亞
    • 埃及
    • MEA 其餘地區

第12章：先進IC載板產業關鍵供應商分析

  • 競爭基準化分析
    • Competitive Dashboard
    • Competitive Positioning
  • 公司簡介
    • Amkor Technology
    • ASE Technology Holding Co.
    • Broadcom Inc.
    • Fujitsu
    • Ibiden Co. Ltd
    • Intel Corporation
    • Kinsus Interconnect Technology Corp.
    • LG Innotek
    • Murata Manufacturing Co.
    • Nanya Technology Corporation
    • Osram Licht AG
    • Powertech Technology Inc.
    • Samsung ElectroMechanics
    • Sankoh Co., Ltd.
    • Shinko Electric Industries
    • Taiwan Semiconductor Manufacturing Company
    • Unimicron Technology Corp.
    • Yizumi Technology
    • Eastern
    • Semco
    • Others

第 13 章：360 度分析師視角

第 14 章：附錄

  • 研究方法
  • 參考
  • 縮寫
  • 免責聲明
  • 聯絡我們
簡介目錄
Product Code: ANV5470

Advanced IC substrates market size was valued at US$ 22,792.09 Million in 2024, expanding at a CAGR of 11.91% from 2025 to 2032.

The IC substrates market includes the design, production, and sale of high-density interconnect platforms. These platforms act as the physical connection between semiconductor chips and printed circuit boards (PCBs). They provide mechanical support, signal routing, and power distribution for integrated circuits. This is especially important in high performance applications such as smartphones, servers, AI accelerators, and automotive electronics. The market features advanced packaging formats like flip-chip ball grid array (FCBGA), chip-scale package (CSP), and system-in-package (SiP). The need for smaller sizes, higher I/O density, and better thermal and electrical performance is driving innovation in materials and substrate designs.

Advanced IC Substrates Market- Market Dynamics

Rising Demand for High-Performance Computing and AI Chips

The increasing complexity of AI algorithms, large-scale cloud computing, and fast data analysis has created a need for chips that can process information more quickly, handle more input/output, and manage heat better. Traditional packaging platforms cannot meet these performance standards. Advanced IC substrates like FC-BGA (Flip Chip Ball Grid Array) and 2.5D/3D packages provide high-density connections and better signal transmission. These features are essential for the computing workloads of the future.

Top chip makers such as NVIDIA, AMD, and Intel are using advanced packaging more often to boost the performance of GPUs and CPUs, particularly for training and using AI models. These substrates can support larger chip sizes, integrate stacked memory, and improve heat dissipation. This leads to higher reliability in demanding computing situations. Additionally, companies like Amazon Web Services and Google Cloud are urging substrate suppliers to develop better packaging solutions that can meet the rising needs of their data centers. Consequently, there is significant investment upstream in substrate technologies, material innovation, and increasing manufacturing capacity.

For Instance,

In January 2024, Intel announced expanded deployment of its EMIB (Embedded Multi-die Interconnect Bridge) and Foveros 3D packaging technologies in its next-gen Xeon and AI accelerators. These advanced IC substrates allow vertical stacking and high density interconnects, critical for high performance computing and AI chip packaging.

Advanced IC Substrates Market- Key Insights

As per the analysis shared by our research analyst, the global market is estimated to grow annually at a CAGR of around 11.91% over the forecast period (2025-2032)

Based on type segmentation, flip chip ball grid array (FCBGA) was predicted to show maximum market share in the year 2024

Based on packaging technology segmentation, 2D flip-chip was the leading packaging technology in 2024

Based on material segmentation, FR-4 was the leading material in 2024

Based on end use, semiconductors was the leading end use in 2024

On the basis of region, Asia Pacific was the leading revenue generator in 2024

Advanced IC Substrates Market- Segmentation Analysis:

The global advanced IC substrates market is segmented on the basis of type, packaging technology, material, end use, and region.

The market is divided into five categories based on type: flip chip ball grid array (FCBGA) substrates, flip chip chip scale package (FCCSP) substrates, embedded substrates, wire bond substrates, others. The flip chip ball grid array (FCBGA) sector dominates the market. Due to they can handle high input/output (I/O) density, have better thermal performance, and allow for fine-pitch routing. These features are important for data center processors, AI accelerators, and high-end graphics cards. Companies like Intel and AMD use FCBGA in their top CPU and GPU designs since it effectively manages heat and electrical signals in compact layouts. The ongoing move toward heterogeneous integration and 2.5D/3D packaging further increases the demand for FCBGA substrates in advanced semiconductor applications.

The market is divided into five categories based on end use: semiconductors, computer hardware, healthcare equipment, home appliances, mobile devices. The semiconductor segment remains the dominant force in the Advanced IC Substrates Market, driven by the continual scaling of transistor nodes and the surge in demand for high-density, high-speed computing. These substrates form the backbone of advanced packaging for logic chips, memory modules, and heterogeneous integration platforms. Companies such as Intel, AMD, and TSMC extensively use high-performance substrates like FCBGA and embedded bridge structures to support AI accelerators, data center processors, and 5G modems. The increasing need for signal integrity, power delivery, and miniaturization has made advanced substrates indispensable in modern chip architectures, sustaining the segment's leadership.

Advanced IC Substrates Market- Geographical Insights

Asia Pacific dominates the global advanced IC substrates market during the forecast period in 2024.

Asia Pacific is the dominating region because of its strong semiconductor packaging infrastructure in Taiwan, South Korea, Japan, and China. Companies like Unimicron Technology, Kinsus Interconnect, Ibiden, and Shinko Electric provide high-quality substrates such as FCBGA and FCCSP to major players like TSMC, Samsung, and SK Hynix. Taiwan contributes significantly to global substrate manufacturing capacity. The region has made large investments in substrate like PCBs (SLPs) and chiplet-based packaging. China's national policies under "Made in China 2025" focus on boosting domestic chip and substrate production, which further strengthens regional leadership. Affordable manufacturing, skilled workers, and integrated electronics ecosystems keep Asia Pacific at the forefront.

North America is estimated to register the highest CAGR in the advanced IC substrates market during the forecast period in 2024.

North America is becoming the fastest-growing region because of policy changes and the use of new technology. The CHIPS and Science Act has made over USD 50 billion available in federal incentives. This funding is driving infrastructure development and substrate research and development. For example, Intel is expanding its fab in Ohio and its R&D center in Oregon. They are incorporating new substrate technologies such as EMIB (Embedded Multi-die Interconnect Bridge) and Foveros Direct for 3D stacking. Also, U.S. based AI chip makers like NVIDIA and AMD are creating a higher demand for ultra high density substrates to support multi-chiplet designs. Local initiatives to bring packaging capabilities back to the U.S., along with the growing demand in defence, aerospace, and AI cloud infrastructure, are driving rapid market growth in the region.

Advanced IC Substrates Market- Competitive Landscape:

The Advanced IC Substrates Market is highly consolidated, with a few key players controlling global supply, especially in Asia Pacific. Leading companies like Ibiden, Shinko Electric, Unimicron, and Samsung Electro-Mechanics are focusing on next-generation substrate technologies such as Flip Chip Ball Grid Array (FCBGA) and embedded trace substrates. These firms are investing in high layer count substrates, miniaturization, and improvements in thermal performance to support advanced processors used in AI, 5G, and high-performance computing (HPC) applications. Strategic partnerships with chipmakers like Intel, AMD, and NVIDIA are driving innovation in chiplet integration and heterogeneous packaging.

Companies such as AT&S (Austria) and Zhen Ding Technology (China) are actively expanding their manufacturing capabilities through new investments and regional growth. AT&S is making progress in the HPC space by establishing new IC substrate fabs in Southeast Asia, while Zhen Ding is quickly expanding as part of China's initiative for semiconductor self reliance. Competitive differentiation is increasingly based on capabilities such as fine line routing, low warpage, and advancements in dielectric materials. Manufacturers are racing to meet the packaging needs of ultra compact, high speed semiconductor devices.

Recent Developments:

In May 2024, Samsung Electro-Mechanics announced a USD 1.1 billion investment to expand its FC-BGA substrate manufacturing lines in Korea and Vietnam. The expansion aims to support increased demand for server, AI, and HPC processors requiring complex, multilayer substrates

In July 2024, Samsung Electro-Mechanics partnered with AMD to supply ultra-high-layer FCBGA substrates built in plants across Busan and Vietnam. These substrates support larger chip surface areas and denser interconnects for hyperscale data center GPUs and CPUs. SEMCO has invested approximately KRW 1.9 trillion to scale production for next-gen AI and server processors

In December 2024, Ibiden is accelerating capacity expansion in response to surging demand for AI chip substrates from clients such as Nvidia, Intel, and AMD. A new substrate factory in Gifu Prefecture is expected to run at 25% capacity by late 2025 and reach 50% by March 2026. Management is exploring ways to bring remaining capacity online sooner to meet demand

In October 2024, KLA launched a broad range of IC substrates to develop semiconductor packaging technology. This portfolio includes inspection, measurement, and data analysis solutions aimed at meeting the needs of complex IC substrate production processes. The improvements tackle challenges in advanced packaging applications, such as system in package designs and heterogeneous integration, by focusing on improving yield, performance, and reliability

In September 2023, the AP860, a new DRAM-free PCIe 4.0 SSD from BIWIN, is made for desktops, laptops, and all in one system. The price of high-performance SSDs is declining, following the drop in PCIe SSD prices in 2022. This trend has boosted the market share of customer PCIe 4.0 SSDs and increased their use in the PC OEM market

SCOPE OF THE REPORT

The scope of this report covers the market by its major segments, which include as follows:

GLOBAL ADVANCED IC SUBSTRATES MARKET KEY PLAYERS- DETAILED COMPETITIVE INSIGHTS

  • Amkor Technology
  • ASE Technology Holding Co.
  • Broadcom Inc.
  • Fujitsu
  • Ibiden Co. Ltd
  • Intel Corporation
  • Kinsus Interconnect Technology Corp.
  • LG Innotek
  • Murata Manufacturing Co.
  • Nanya Technology Corporation
  • Osram Licht AG
  • Powertech Technology Inc.
  • Samsung ElectroMechanics
  • Sankoh Co., Ltd.
  • Shinko Electric Industries
  • Taiwan Semiconductor Manufacturing Company
  • Unimicron Technology Corp.
  • Yizumi Technology
  • Eastern
  • Semco
  • Others

GLOBAL ADVANCED IC SUBSTRATES MARKET, BY TYPE- MARKET ANALYSIS, 2019 - 2032

  • Flip Chip Ball Grid Array (FCBGA) Substrates
  • Flip Chip Chip Scale Package (FCCSP) Substrates
  • Embedded Substrates
  • Wire Bond Substrates
  • Others

GLOBAL ADVANCED IC SUBSTRATES MARKET, BY PACKAGING TECHNOLOGY- MARKET ANALYSIS, 2019 - 2032

  • 2D Flip-Chip
  • 2.5D Interposer
  • SiP / Module
  • Fan-Out WLP
  • 3D-IC / SoIC

GLOBAL ADVANCED IC SUBSTRATES MARKET, BY MATERIAL- MARKET ANALYSIS, 2019 - 2032

  • Polyimide
  • FR-4
  • Silicon
  • Low-Temperature Co-fired Ceramics
  • High-Frequency Laminates

GLOBAL ADVANCED IC SUBSTRATES MARKET, BY END USE- MARKET ANALYSIS, 2019 - 2032

  • Semiconductors
  • Computer Hardware
  • Healthcare Equipment
  • Home Appliances
  • Mobile Devices

GLOBAL ADVANCED IC SUBSTRATES MARKET, BY REGION- MARKET ANALYSIS, 2019 - 2032

  • North America
  • U.S.
  • Canada
  • Europe
  • Germany
  • UK
  • France
  • Italy
  • Spain
  • The Netherlands
  • Sweden
  • Russia
  • Poland
  • Rest of Europe
  • Asia Pacific
  • China
  • India
  • Japan
  • South Korea
  • Australia
  • Indonesia
  • Thailand
  • Philippines
  • Rest of APAC
  • Latin America
  • Brazil
  • Mexico
  • Argentina
  • Colombia
  • Rest of LATAM
  • The Middle East and Africa
  • Saudi Arabia
  • UAE
  • Israel
  • Turkey
  • Algeria
  • Egypt
  • Rest of MEA

Table of Contents

1. Advanced IC Substrates Market Overview

  • 1.1. Study Scope
  • 1.2. Market Estimation Years

2. Executive Summary

  • 2.1. Market Snippet
    • 2.1.1. Advanced IC Substrates Market Snippet by Type
    • 2.1.2. Advanced IC Substrates Market Snippet by Packaging Technology
    • 2.1.3. Advanced IC Substrates Market Snippet by Material
    • 2.1.4. Advanced IC Substrates Market Snippet by End Use
    • 2.1.5. Advanced IC Substrates Market Snippet by Country
    • 2.1.6. Advanced IC Substrates Market Snippet by Region
  • 2.2. Competitive Insights

3. Advanced IC Substrates Key Market Trends

  • 3.1. Advanced IC Substrates Market Drivers
    • 3.1.1. Impact Analysis of Market Drivers
  • 3.2. Advanced IC Substrates Market Restraints
    • 3.2.1. Impact Analysis of Market Restraints
  • 3.3. Advanced IC Substrates Market Opportunities
  • 3.4. Advanced IC Substrates Market Future Trends

4. Advanced IC Substrates Industry Study

  • 4.1. PESTEL Analysis
  • 4.2. Porter's Five Forces Analysis
  • 4.3. Growth Prospect Mapping
  • 4.4. Regulatory Framework Analysis

5. Advanced IC Substrates Market: Impact of Escalating Geopolitical Tensions

  • 5.1. Impact of COVID-19 Pandemic
  • 5.2. Impact of Russia-Ukraine War
  • 5.3. Impact of Middle East Conflicts

6. Advanced IC Substrates Market Landscape

  • 6.1. Advanced IC Substrates Market Share Analysis, 2024
  • 6.2. Breakdown Data, by Key Manufacturer
    • 6.2.1. Established Players' Analysis
    • 6.2.2. Emerging Players' Analysis

7. Advanced IC Substrates Market - By Type

  • 7.1. Overview
    • 7.1.1. Segment Share Analysis, By Type, 2024 & 2032 (%)
    • 7.1.2. Flip Chip Ball Grid Array (FCBGA) Substrates
    • 7.1.3. Flip Chip Chip Scale Package (FCCSP) Substrates
    • 7.1.4. Embedded Substrates
    • 7.1.5. Wire Bond Substrates
    • 7.1.6. Others

8. Advanced IC Substrates Market - By Packaging Technology

  • 8.1. Overview
    • 8.1.1. Segment Share Analysis, By Packaging Technology, 2024 & 2032 (%)
    • 8.1.2. 2D Flip-Chip
    • 8.1.3. 2.5D Interposer
    • 8.1.4. SiP / Module
    • 8.1.5. Fan-Out WLP
    • 8.1.6. 3D-IC / SoIC

9. Advanced IC Substrates Market - By Material

  • 9.1. Overview
    • 9.1.1. Segment Share Analysis, By Material, 2024 & 2032 (%)
    • 9.1.2. Polyimide
    • 9.1.3. FR-4
    • 9.1.4. Silicon
    • 9.1.5. Low-Temperature Co-fired Ceramics
    • 9.1.6. High-Frequency Laminates

10. Advanced IC Substrates Market - By End Use

  • 10.1. Overview
    • 10.1.1. Segment Share Analysis, By End Use, 2024 & 2032 (%)
    • 10.1.2. Semiconductors
    • 10.1.3. Computer Hardware
    • 10.1.4. Healthcare Equipment
    • 10.1.5. Home Appliances
    • 10.1.6. Mobile Devices

11. Advanced IC Substrates Market- By Geography

  • 11.1. Introduction
    • 11.1.1. Segment Share Analysis, By Geography, 2024 & 2032 (%)
  • 11.2. North America
    • 11.2.1. Overview
    • 11.2.2. Advanced IC Substrates Key Manufacturers in North America
    • 11.2.3. North America Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 11.2.4. North America Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
    • 11.2.5. North America Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
    • 11.2.6. North America Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
    • 11.2.7. North America Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.2.8. U.S.
      • 11.2.8.1. Overview
      • 11.2.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.2.8.3. U.S. Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.2.8.4. U.S. Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.2.8.5. U.S. Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.2.8.6. U.S. Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.2.9. Canada
      • 11.2.9.1. Overview
      • 11.2.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.2.9.3. Canada Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.2.9.4. Canada Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.2.9.5. Canada Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.2.9.6. Canada Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
  • 11.3. Europe
    • 11.3.1. Overview
    • 11.3.2. Advanced IC Substrates Key Manufacturers in Europe
    • 11.3.3. Europe Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 11.3.4. Europe Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
    • 11.3.5. Europe Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
    • 11.3.6. Europe Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
    • 11.3.7. Europe Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.3.8. Germany
      • 11.3.8.1. Overview
      • 11.3.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.8.3. Germany Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.8.4. Germany Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.3.8.5. Germany Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.3.8.6. Germany Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.3.9. UK
      • 11.3.9.1. Overview
      • 11.3.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.9.3. UK Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.9.4. UK Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.3.9.5. UK Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.3.9.6. UK Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.3.10. France
      • 11.3.10.1. Overview
      • 11.3.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.10.3. France Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.10.4. France Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.3.10.5. France Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.3.10.6. France Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.3.11. Italy
      • 11.3.11.1. Overview
      • 11.3.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.11.3. Italy Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.11.4. Italy Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.3.11.5. Italy Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.3.11.6. Italy Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.3.12. Spain
      • 11.3.12.1. Overview
      • 11.3.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.12.3. Spain Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.12.4. Spain Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.3.12.5. Spain Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.3.12.6. Spain Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.3.13. The Netherlands
      • 11.3.13.1. Overview
      • 11.3.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.13.3. The Netherlands Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.13.4. The Netherlands Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.3.13.5. The Netherlands Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.3.13.6. The Netherlands Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.3.14. Sweden
      • 11.3.14.1. Overview
      • 11.3.14.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.14.3. Sweden Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.14.4. Sweden Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.3.14.5. Sweden Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.3.14.6. Sweden Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.3.15. Russia
      • 11.3.15.1. Overview
      • 11.3.15.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.15.3. Russia Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.15.4. Russia Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.3.15.5. Russia Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.3.15.6. Russia Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.3.16. Poland
      • 11.3.16.1. Overview
      • 11.3.16.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.16.3. Poland Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.16.4. Poland Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.3.16.5. Poland Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.3.16.6. Poland Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.3.17. Rest of Europe
      • 11.3.17.1. Overview
      • 11.3.17.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.3.17.3. Rest of the Europe Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.3.17.4. Rest of the Europe Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.3.17.5. Rest of the Europe Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.3.17.6. Rest of the Europe Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
  • 11.4. Asia Pacific (APAC)
    • 11.4.1. Overview
    • 11.4.2. Advanced IC Substrates Key Manufacturers in Asia Pacific
    • 11.4.3. APAC Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 11.4.4. APAC Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
    • 11.4.5. APAC Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
    • 11.4.6. APAC Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
    • 11.4.7. APAC Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.4.8. China
      • 11.4.8.1. Overview
      • 11.4.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.8.3. China Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.8.4. China Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.4.8.5. China Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.4.8.6. China Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.4.9. India
      • 11.4.9.1. Overview
      • 11.4.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.9.3. India Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.9.4. India Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.4.9.5. India Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.4.9.6. India Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.4.10. Japan
      • 11.4.10.1. Overview
      • 11.4.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.10.3. Japan Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.10.4. Japan Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.4.10.5. Japan Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.4.10.6. Japan Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.4.11. South Korea
      • 11.4.11.1. Overview
      • 11.4.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.11.3. South Korea Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.11.4. South Korea Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.4.11.5. South Korea Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.4.11.6. South Korea Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.4.12. Australia
      • 11.4.12.1. Overview
      • 11.4.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.12.3. Australia Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.12.4. Australia Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.4.12.5. Australia Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.4.12.6. Australia Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.4.13. Indonesia
      • 11.4.13.1. Overview
      • 11.4.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.13.3. Indonesia Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.13.4. Indonesia Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.4.13.5. Indonesia Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.4.13.6. Indonesia Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.4.14. Thailand
      • 11.4.14.1. Overview
      • 11.4.14.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.14.3. Thailand Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.14.4. Thailand Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.4.14.5. Thailand Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.4.14.6. Thailand Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.4.15. Philippines
      • 11.4.15.1. Overview
      • 11.4.15.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.15.3. Philippines Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.15.4. Philippines Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.4.15.5. Philippines Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.4.15.6. Philippines Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.4.16. Rest of APAC
      • 11.4.16.1. Overview
      • 11.4.16.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.4.16.3. Rest of APAC Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.4.16.4. Rest of APAC Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.4.16.5. Rest of APAC Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.4.16.6. Rest of APAC Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
  • 11.5. Latin America (LATAM)
    • 11.5.1. Overview
    • 11.5.2. Advanced IC Substrates Key Manufacturers in Latin America
    • 11.5.3. LATAM Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 11.5.4. LATAM Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
    • 11.5.5. LATAM Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
    • 11.5.6. LATAM Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
    • 11.5.7. LATAM Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.5.8. Brazil
      • 11.5.8.1. Overview
      • 11.5.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.5.8.3. Brazil Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.5.8.4. Brazil Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.5.8.5. Brazil Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.5.8.6. Brazil Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.5.9. Mexico
      • 11.5.9.1. Overview
      • 11.5.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.5.9.3. Mexico Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.5.9.4. Mexico Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.5.9.5. Mexico Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.5.9.6. Mexico Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.5.10. Argentina
      • 11.5.10.1. Overview
      • 11.5.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.5.10.3. Argentina Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.5.10.4. Argentina Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.5.10.5. Argentina Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.5.10.6. Argentina Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.5.11. Colombia
      • 11.5.11.1. Overview
      • 11.5.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.5.11.3. Colombia Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.5.11.4. Colombia Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.5.11.5. Colombia Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.5.11.6. Colombia Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.5.12. Rest of LATAM
      • 11.5.12.1. Overview
      • 11.5.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.5.12.3. Rest of LATAM Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.5.12.4. Rest of LATAM Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.5.12.5. Rest of LATAM Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.5.12.6. Rest of LATAM Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
  • 11.6. Middle East and Africa (MEA)
    • 11.6.1. Overview
    • 11.6.2. Advanced IC Substrates Key Manufacturers in Middle East and Africa
    • 11.6.3. MEA Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 11.6.4. MEA Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
    • 11.6.5. MEA Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
    • 11.6.6. MEA Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
    • 11.6.7. MEA Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.6.8. Saudi Arabia
      • 11.6.8.1. Overview
      • 11.6.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.8.3. Saudi Arabia Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.6.8.4. Saudi Arabia Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.6.8.5. Saudi Arabia Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.6.8.6. Saudi Arabia Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.6.9. United Arab Emirates
      • 11.6.9.1. Overview
      • 11.6.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.9.3. United Arab Emirates Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.6.9.4. United Arab Emirates Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.6.9.5. United Arab Emirates Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.6.9.6. United Arab Emirates Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.6.10. Israel
      • 11.6.10.1. Overview
      • 11.6.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.10.3. Israel Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.6.10.4. Israel Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.6.10.5. Israel Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.6.10.6. Israel Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.6.11. Turkey
      • 11.6.11.1. Overview
      • 11.6.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.11.3. Turkey Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.6.11.4. Turkey Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.6.11.5. Turkey Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.6.11.6. Turkey Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.6.12. Algeria
      • 11.6.12.1. Overview
      • 11.6.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.12.3. Algeria Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.6.12.4. Algeria Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.6.12.5. Algeria Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.6.12.6. Algeria Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.6.13. Egypt
      • 11.6.13.1. Overview
      • 11.6.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.13.3. Egypt Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.6.13.4. Egypt Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.6.13.5. Egypt Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.6.13.6. Egypt Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 11.6.14. Rest of MEA
      • 11.6.14.1. Overview
      • 11.6.14.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 11.6.14.3. Rest of MEA Market Size and Forecast, By Type, 2019 - 2032 (US$ Million)
      • 11.6.14.4. Rest of MEA Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 11.6.14.5. Rest of MEA Market Size and Forecast, By Material, 2019 - 2032 (US$ Million)
      • 11.6.14.6. Rest of MEA Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)

12. Key Vendor Analysis- Advanced IC Substrates Industry

  • 12.1. Competitive Benchmarking
    • 12.1.1. Competitive Dashboard
    • 12.1.2. Competitive Positioning
  • 12.2. Company Profiles
    • 12.2.1. Amkor Technology
    • 12.2.2. ASE Technology Holding Co.
    • 12.2.3. Broadcom Inc.
    • 12.2.4. Fujitsu
    • 12.2.5. Ibiden Co. Ltd
    • 12.2.6. Intel Corporation
    • 12.2.7. Kinsus Interconnect Technology Corp.
    • 12.2.8. LG Innotek
    • 12.2.9. Murata Manufacturing Co.
    • 12.2.10. Nanya Technology Corporation
    • 12.2.11. Osram Licht AG
    • 12.2.12. Powertech Technology Inc.
    • 12.2.13. Samsung ElectroMechanics
    • 12.2.14. Sankoh Co., Ltd.
    • 12.2.15. Shinko Electric Industries
    • 12.2.16. Taiwan Semiconductor Manufacturing Company
    • 12.2.17. Unimicron Technology Corp.
    • 12.2.18. Yizumi Technology
    • 12.2.19. Eastern
    • 12.2.20. Semco
    • 12.2.21. Others

13. 360 Degree Analyst View

14. Appendix

  • 14.1. Research Methodology
  • 14.2. References
  • 14.3. Abbreviations
  • 14.4. Disclaimer
  • 14.5. Contact Us