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市場調查報告書
商品編碼
2109219

2026 年至 2035 年 AI 晶片光 I/O 市場的機會、成長促進因素、產業趨勢分析與預測。

Optical I/O for AI Chips Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2026 - 2035
出版日期: | 出版商: Global Market Insights Inc. | 英文 180 Pages | 商品交期: 2-3個工作天內

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簡介目錄

全球人工智慧晶片光 I/O 市場預計到 2025 年將達到 11 億美元，並以 27.8% 的複合年成長率成長，到 2035 年將達到 140 億美元。

AI晶片市場光I/O-IMG1

人工智慧 (AI) 運算基礎設施的快速擴張，催生了對能夠提供更高頻寬、更低延遲和更高能效的先進光連接解決方案的強勁需求。共封裝光元件 (CPO) 的日益普及、政府旨在加強國內半導體製造業的支持以及對矽光電技術的持續投入，都在加速市場成長。高速光纖網路標準的日益普及，進一步推動了向下一代 AI 硬體架構的轉型。基於矽光電的光子積體電路和光收發器的持續創新，正在提升先進運算環境的可擴展性並降低功耗。隨著 AI 工作負載日益複雜且資料密集，光 I/O 技術正成為提升互連性能和系統效率的關鍵元件。對高效能運算基礎設施日益成長的需求，以及對半導體和光電系統的持續投入，預示著全球 AI 晶片光 I/O 市場將在長期內顯著擴張。

市場範圍
開始年份 2025
預測期 2026-2035
初始市場規模 11億美元
預計金額 140億美元
複合年成長率 27.8%

受人工智慧資料中心快速擴張以及對頻寬更高、功耗更低的互連技術（相較於傳統電連接）日益成長的需求驅動，人工智慧晶片的光I/O市場呈現強勁成長動能。大規模人工智慧運算基礎設施投資的增加，正加速滿足先進處理需求的光互連解決方案的普及。同時，公共和私人對半導體製造和矽光電生產的投資不斷增加，正在強化國內供應鏈，並推動下一代光技術的商業化，從而進一步促進市場的持續成長。

預計到2025年，線性可插拔光元件（LPO）將成為主要產品類型，佔63.2%的市佔率。該領域持續受到廣泛認可，原因在於其易於與現有資料中心基礎設施整合，相比傳統插入式解決方案部署複雜度更低，並且能夠經濟高效地過渡到共封裝光元件。 LPO技術在保持低功耗的同時，也能提供極高的頻寬，因此非常適合要求嚴苛的人工智慧工作負載和高階運算應用。

預計到2025年，矽光電（SiPh）市場規模將達到6.113億美元。該領域因其與CMOS製造流程的兼容性、卓越的整合能力以及為大規模生產提供高頻寬、高能效光連接模組的能力而得到廣泛應用。人工智慧運算平台、超大規模資料中心和高效能運算環境等領域的日益普及推動了市場需求的持續成長，進一步促進了對矽光電技術的投資。

到2025年，北美人工智慧晶片的光I/O市佔率將達到57.8%。這一成長得益於成熟的半導體生態系統、對人工智慧運算基礎設施的大量投資，以及領先的人工智慧硬體、光纖網路技術和矽光電解決方案開發商的存在。對高速、低延遲光連接模組的需求不斷成長，以滿足日益複雜的人工智慧訓練和推理工作負載，這進一步鞏固了該地區的主導地位。

目錄

第1章：調查方法和範圍

第2章執行摘要

第3章 行業洞察

  • 產業生態系分析
    • 供應商情況
    • 利潤率
    • 成本結構
    • 每個階段增加的價值
    • 影響價值鏈的因素
    • 中斷
  • 影響產業的因素
    • 促進因素
      • 人工智慧資料中心的快速擴張正在推動光連接模組的需求。
      • 用於人工智慧基礎設施的共封裝光學元件（CPO）的商業化正在穩步推進。
      • 政府投資支持矽光電和半導體製造
      • 擴大高頻寬光纖網路標準在人工智慧叢集的應用
      • 矽光電和光收發器技術的進步提高了功率效率。
    • 產業潛在風險與挑戰
      • 矽光電的整合和封裝高成本
      • 光電整合和行業標準化的複雜性
    • 市場機遇
      • 面向下一代人工智慧基礎設施的共封裝光學元件 (CPO) 商業化
      • 矽光電在超大規模資料中心和人工智慧網路的應用
  • 成長潛力分析
  • 監理情勢
  • 波特的分析
  • PESTLE分析
  • 技術與創新展望
    • 最新科技趨勢
    • 新興技術
  • 價格趨勢
    • 按地區
    • 依產品
  • 定價策略
  • 新興經營模式
  • 合規要求
  • 專利和智慧財產權分析

第4章 競爭情勢

  • 介紹
  • 企業市佔率分析
    • 按地區
    • 市場集中度分析
  • 主要公司的競爭標竿分析
    • 財務績效比較
      • 收入
      • 利潤率
      • R&D
    • 產品系列比較
      • 產品線寬度
      • 科技
      • 創新
    • 區域擴張比較
      • 全球擴張分析
      • 服務網路覆蓋
      • 按地區分類的市場滲透率
    • 競爭定位矩陣
      • 領導者
      • 挑戰者
      • 追蹤者
      • 小眾玩家
    • 戰略展望矩陣
  • 主要進展
    • 併購
    • 夥伴關係和聯盟
    • 技術進步
    • 擴張和投資策略
    • 數位轉型計劃
  • 新興企業競爭公司和新創企業的發展趨勢

第5章 市場估算與預測：依產品類型分類，2022-2035年

  • 封裝內光 I/O (OIO)
  • 共封裝光學元件 (CPO)
  • 近封裝光學元件（NPO）
  • 機載光學元件（OBO）
  • 線性插入式光學元件（LPO）

第6章 市場估計與預測：依技術分類，2022-2035年

  • 矽光電（SiPh）
  • 磷化銦（InP）
  • 鈮酸鋰薄膜（TFLN）
  • 異構/混合整合
  • 其他

第7章 市場估計與預測：依應用領域分類，2022-2035年

  • 人工智慧訓練
  • 人工智慧推理
  • 高效能運算和科學運算
  • 資料中心網路與交換

第8章 市場估算與預測：依最終用戶分類，2022-2035年

  • 超大規模資料中心業者和雲端服務供應商
  • 企業資料中心
  • 高效能運算與研究機構
  • 政府/國防

第9章 市場估計與預測：依地區分類，2022-2035年

  • 北美洲
    • 美國
    • 加拿大
  • 歐洲
    • 德國
    • 英國
    • 法國
    • 西班牙
    • 義大利
    • 俄羅斯
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 澳洲
    • 韓國
    • 台灣
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 阿根廷
  • 中東和非洲
    • 南非
    • 沙烏地阿拉伯
    • UAE

第10章：公司簡介

  • 全球主要公司
    • Marvell Technology
    • Coherent Corp
    • Lumentum Holdings
    • Broadcom Inc
    • Ayar Labs
  • 該地區的主要公司
    • 北美洲
      • Intel Corporation
      • Ranovus Inc.
      • MACOM Technology Solutions
      • Lightmatter
      • Celestial AI
      • Ciena Corporation
      • POET Technologies Inc.
    • 亞太地區
      • Sumitomo Electric Industries
      • Hamamatsu Photonics
      • Furukawa Electric Co.
      • NewPhotonics
      • PhotonicX AI Pte. Ltd.
    • 歐洲
      • Scintil Photonics
      • Salience Labs
  • 小眾玩家/顛覆者
    • Nexus Photonics
簡介目錄
Product Code: 16393

The Global Optical I/O for AI Chips Market was valued at USD 1.1 billion in 2025 and is estimated to grow at a CAGR of 27.8% to reach USD 14 billion by 2035.

Optical I/O for AI Chips Market - IMG1

Rapid expansion of artificial intelligence computing infrastructure is creating strong demand for advanced optical connectivity solutions capable of delivering greater bandwidth, lower latency, and improved energy efficiency. The increasing deployment of co-packaged optics (CPO), supportive government initiatives aimed at strengthening domestic semiconductor manufacturing, and growing investments in silicon photonics technologies are accelerating market growth. Rising adoption of high-speed optical networking standards is further supporting the transition toward next-generation AI hardware architectures. Continuous innovation in silicon photonics-based photonic integrated circuits and optical transceivers is enabling higher scalability while reducing power consumption across advanced computing environments. As AI workloads become increasingly complex and data-intensive, optical I/O technologies are emerging as a critical component for improving interconnect performance and system efficiency. The growing need for high-performance computing infrastructure, combined with sustained investment in semiconductor and photonics ecosystems, is expected to drive long-term expansion of the global optical I/O for AI chips market.

Market Scope
Start Year2025
Forecast Year2026-2035
Start Value$1.1 Billion
Forecast Value$14 Billion
CAGR27.8%

The optical I/O for AI chips market is experiencing strong momentum as the rapid expansion of AI data centers increases demand for interconnect technologies that provide significantly higher bandwidth and lower power consumption than conventional electrical connections. Growing investments in large-scale AI computing infrastructure are accelerating the adoption of optical interconnect solutions capable of supporting advanced processing requirements. At the same time, increasing public and private investment in semiconductor manufacturing and silicon photonics production is strengthening domestic supply chains and supporting the commercialization of next-generation optical technologies, further contributing to sustained market growth.

The linear pluggable optics (LPO) segment accounted for a 63.2% share in 2025, making it the leading product category. The segment continues to gain widespread acceptance because of its straightforward integration with existing data center infrastructure and its cost-efficient migration path toward co-packaged optics with fewer deployment complexities than conventional pluggable solutions. LPO technology delivers exceptionally high bandwidth while maintaining low power consumption, making it well suited for demanding AI workloads and advanced computing applications.

The silicon photonics (SiPh) segment reached USD 611.3 million in 2025. The segment has achieved strong market adoption due to its compatibility with CMOS manufacturing processes, superior integration capabilities, and ability to deliver high-bandwidth, energy-efficient optical interconnects at large production volumes. Expanding deployment across AI computing platforms, hyperscale data centers, and high-performance computing environments continues to strengthen demand and encourage greater investment in silicon photonics technologies.

North America Optical I/O for AI Chips Market accounted for 57.8% share in 2025. Regional growth is supported by a well-established semiconductor ecosystem, significant investments in AI computing infrastructure, and the presence of leading developers of AI hardware, optical networking technologies, and silicon photonics solutions. Rising demand for high-speed, low-latency optical interconnects designed to support increasingly complex AI training and inference workloads continues to reinforce the region's leadership position.

Key players operating in the global optical I/O for AI chips market include Ayar Labs, Broadcom Inc., Celestial AI, Ciena Corporation, Coherent Corp., Furukawa Electric Co., Hamamatsu Photonics, Intel Corporation, Lightmatter, Lumentum Holdings Inc., MACOM Technology Solutions, Marvell Technology Group, NewPhotonics, Nexus Photonics, PhotonicX AI Pte. Ltd., POET Technologies Inc., Ranovus Inc., Salience Labs, Scintil Photonics, and Sumitomo Electric Industries. Companies operating in the optical I/O for AI chips market are strengthening their market position by investing heavily in silicon photonics innovation, advanced optical interconnect technologies, and next-generation packaging solutions. Many organizations are expanding research and development activities to improve bandwidth, reduce power consumption, and enhance scalability for AI-driven computing environments. Strategic collaborations with semiconductor manufacturers, cloud infrastructure providers, and technology developers are helping companies accelerate commercialization and broaden product adoption. Businesses are also increasing manufacturing capabilities, strengthening supply chain resilience, and introducing integrated optical solutions tailored to evolving AI infrastructure requirements.

Table of Contents

Chapter 1 Methodology and Scope

  • 1.1 Market scope and definition
  • 1.2 Research design
    • 1.2.1 Research approach
    • 1.2.2 Data collection methods
  • 1.3 Data mining sources
    • 1.3.1 Global
    • 1.3.2 Regional/Country
  • 1.4 Base estimates and calculations
    • 1.4.1 Base year calculation
    • 1.4.2 Key trends for market estimation
  • 1.5 Primary research and validation
    • 1.5.1 Primary sources
  • 1.6 Forecast model
  • 1.7 Research assumptions and limitations

Chapter 2 Executive Summary

  • 2.1 Industry 360° synopsis, 2022 – 2035
  • 2.2 Key market trends
    • 2.2.1 Product type trends
    • 2.2.2 Technology trends
    • 2.2.3 Application trends
    • 2.2.4 End-user trends
    • 2.2.5 Regional trends
  • 2.3 TAM Analysis, 2026-2035
  • 2.4 CXO perspectives: Strategic imperatives

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
    • 3.1.1 Supplier Landscape
    • 3.1.2 Profit Margin
    • 3.1.3 Cost structure
    • 3.1.4 Value addition at each stage
    • 3.1.5 Factors affecting the value chain
    • 3.1.6 Disruptions
  • 3.2 Industry impact forces
    • 3.2.1 Growth drivers
      • 3.2.1.1 Rapid expansion of AI data centers driving demand for optical interconnects
      • 3.2.1.2 Growing commercialization of co-packaged optics (CPO) for AI infrastructure
      • 3.2.1.3 Government investments supporting silicon photonics and semiconductor manufacturing
      • 3.2.1.4 Increasing adoption of high-bandwidth optical networking standards for AI clusters
      • 3.2.1.5 Advancements in silicon photonics and optical transceiver technologies improving power efficiency
    • 3.2.2 Industry pitfalls and challenges
      • 3.2.2.1 High cost of silicon photonics integration and packaging
      • 3.2.2.2 Complexity in optical-electrical integration and industry standardization
    • 3.2.3 Market opportunities
      • 3.2.3.1 Commercialization of co-packaged optics (CPO) for next-generation AI infrastructure
      • 3.2.3.2 Expansion of silicon photonics in hyperscale data centers and AI networking
  • 3.3 Growth potential analysis
  • 3.4 Regulatory landscape
    • 3.4.1 North America
    • 3.4.2 Europe
    • 3.4.3 Asia Pacific
    • 3.4.4 Latin America
    • 3.4.5 Middle East & Africa
  • 3.5 Porter’s analysis
  • 3.6 PESTEL analysis
  • 3.7 Technology and Innovation landscape
    • 3.7.1 Current technological trends
    • 3.7.2 Emerging technologies
  • 3.8 Price trends
    • 3.8.1 By region
    • 3.8.2 By product
  • 3.9 Pricing Strategies
  • 3.10 Emerging Business Models
  • 3.11 Compliance Requirements
  • 3.12 Patent and IP analysis

Chapter 4 Competitive Landscape, 2025

  • 4.1 Introduction
  • 4.2 Company market share analysis
    • 4.2.1 By region
      • 4.2.1.1 North America
      • 4.2.1.2 Europe
      • 4.2.1.3 Asia Pacific
      • 4.2.1.4 Latin America
      • 4.2.1.5 Middle East & Africa
    • 4.2.2 Market concentration analysis
  • 4.3 Competitive benchmarking of key players
    • 4.3.1 Financial performance comparison
      • 4.3.1.1 Revenue
      • 4.3.1.2 Profit margin
      • 4.3.1.3 R&D
    • 4.3.2 Product portfolio comparison
      • 4.3.2.1 Product range breadth
      • 4.3.2.2 Technology
      • 4.3.2.3 Innovation
    • 4.3.3 Geographic presence comparison
      • 4.3.3.1 Global footprint analysis
      • 4.3.3.2 Service network coverage
      • 4.3.3.3 Market penetration by region
    • 4.3.4 Competitive positioning matrix
      • 4.3.4.1 Leaders
      • 4.3.4.2 Challengers
      • 4.3.4.3 Followers
      • 4.3.4.4 Niche players
    • 4.3.5 Strategic outlook matrix
  • 4.4 Key developments
    • 4.4.1 Mergers and acquisitions
    • 4.4.2 Partnerships and collaborations
    • 4.4.3 Technological advancements
    • 4.4.4 Expansion and investment strategies
    • 4.4.5 Digital transformation initiatives
  • 4.5 Emerging/ startup competitors landscape

Chapter 5 Market Estimates and Forecast, By Product Type, 2022 – 2035 (USD Million)

  • 5.1 Key trends
  • 5.2 In-package optical I/O (OIO)
  • 5.3 Co-packaged optics (CPO)
  • 5.4 Near-package optics (NPO)
  • 5.5 On-board optics (OBO)
  • 5.6 Linear pluggable optics (LPO)

Chapter 6 Market Estimates and Forecast, By Technology, 2022 – 2035 (USD Million)

  • 6.1 Key trends
  • 6.2 Silicon photonics (SiPh)
  • 6.3 Indium phosphide (InP)
  • 6.4 Thin-film lithium niobate (TFLN)
  • 6.5 Heterogeneous / hybrid integration
  • 6.6 Others

Chapter 7 Market Estimates and Forecast, By Application, 2022 – 2035 (USD Million)

  • 7.1 Key trends
  • 7.2 AI training
  • 7.3 AI inference
  • 7.4 HPC & scientific computing
  • 7.5 Data center networking & switching

Chapter 8 Market Estimates and Forecast, By End-User, 2022 – 2035 (USD Million)

  • 8.1 Key trends
  • 8.2 Hyperscalers & cloud providers
  • 8.3 Enterprise data centers
  • 8.4 HPC & research institutions
  • 8.5 Government & defense

Chapter 9 Market Estimates and Forecast, By Region, 2022 – 2035 (USD Million)

  • 9.1 Key trends
  • 9.2 North America
    • 9.2.1 U.S.
    • 9.2.2 Canada
  • 9.3 Europe
    • 9.3.1 Germany
    • 9.3.2 UK
    • 9.3.3 France
    • 9.3.4 Spain
    • 9.3.5 Italy
    • 9.3.6 Russia
  • 9.4 Asia Pacific
    • 9.4.1 China
    • 9.4.2 India
    • 9.4.3 Japan
    • 9.4.4 Australia
    • 9.4.5 South Korea
    • 9.4.6 Taiwan
  • 9.5 Latin America
    • 9.5.1 Brazil
    • 9.5.2 Mexico
    • 9.5.3 Argentina
  • 9.6 Middle East and Africa
    • 9.6.1 South Africa
    • 9.6.2 Saudi Arabia
    • 9.6.3 UAE

Chapter 10 Company Profiles

  • 10.1 Global Key Players
    • 10.1.1 Marvell Technology
    • 10.1.2 Coherent Corp
    • 10.1.3 Lumentum Holdings
    • 10.1.4 Broadcom Inc
    • 10.1.5 Ayar Labs
  • 10.2 Regional key players
    • 10.2.1 North America
      • 10.2.1.1 Intel Corporation
      • 10.2.1.2 Ranovus Inc.
      • 10.2.1.3 MACOM Technology Solutions
      • 10.2.1.4 Lightmatter
      • 10.2.1.5 Celestial AI
      • 10.2.1.6 Ciena Corporation
      • 10.2.1.7 POET Technologies Inc.
    • 10.2.2 Asia Pacific
      • 10.2.2.1 Sumitomo Electric Industries
      • 10.2.2.2 Hamamatsu Photonics
      • 10.2.2.3 Furukawa Electric Co.
      • 10.2.2.4 NewPhotonics
      • 10.2.2.5 PhotonicX AI Pte. Ltd.
    • 10.2.3 Europe
      • 10.2.3.1 Scintil Photonics
      • 10.2.3.2 Salience Labs
  • 10.3 Niche Players/Disruptors
    • 10.3.1 Nexus Photonics