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市場調查報告書
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1871212

汽車網路安全半導體市場機會、成長促進因素、產業趨勢分析及預測（2025-2034年）

Automotive Cybersecurity Semiconductors Market Opportunity, Growth Drivers, Industry Trend Analysis, and Forecast 2025 - 2034
出版日期: | 出版商: Global Market Insights Inc. | 英文 220 Pages | 商品交期: 2-3個工作天內

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簡介目錄

2024年全球汽車網路安全半導體市場規模為9.894億美元，預計將以9.4%的複合年成長率成長，到2025年達到23億美元。

汽車網路安全半導體市場 - IMG1

2034年。

市場範圍
起始年份 2024
預測年份 2025-2034
起始值 9.894億美元
預測值 23億美元
複合年成長率 9.4%

隨著汽車日益軟體化和互聯化，對內建安全功能的半導體的需求也隨之成長。這些晶片對於保護汽車系統免受網路威脅至關重要，尤其是在汽車製造商轉型為電氣化和軟體定義架構之際。先進駕駛輔助系統的日益普及以及自動駕駛技術的興起，正在加速安全硬體組件的整合。汽車製造商正在嵌入安全網路元件、支援加密的處理器和可信任平台，以確保安全通訊、空中升級和即時入侵偵測。這些改進措施符合不斷發展的監管框架，有助於遵守國際網路安全標準，同時加強車輛資料保護和系統完整性。

隨著混合動力和電動車的興起，對支援安全電池監控、充電和動力控制系統的安全型半導體的需求日益成長。下一代汽車需要高度可擴展且智慧的積體電路，以在資訊娛樂、診斷和遠端軟體管理功能方面提供無縫的安全保障。晶片製造商正在投資人工智慧賦能的網路威脅偵測技術，並提升半導體產品的耐熱性和耐用性，以滿足汽車級可靠性要求。供應商正在擴展產品組合，以滿足乘用車和商用車應用的需求，同時專注於模組化、能源最佳化和合規性，從而為整個行業創造價值。

2024年，安全微控制器（MCU）市佔率達到33%，預計2025年至2034年間將以9.5%的複合年成長率成長。這些MCU透過整合安全啟動、身份驗證和加密功能，為通訊介面、控制單元和車輛電子設備提供必要的硬體級保護。隨著互聯、電動化和自動駕駛汽車平台的興起，安全MCU的需求正在迅速成長。圍繞汽車網路安全的監管要求正促使原始設備製造商（OEM）和供應商採用防篡改和加密功能的組件，使安全MCU成為現代汽車架構的基礎。

2024年乘用車市佔率達42%，預計到2034年將以9.8%的複合年成長率成長。互聯汽車和軟體定義汽車的日益普及促使汽車製造商在資訊娛樂系統、高級駕駛輔助系統（ADAS）和車聯網（V2O）通訊中部署先進的基於半導體的安全保護系統。安全啟動功能、硬體加密和嵌入式入侵偵測系統正整合到電子控制單元（ECU）中，以保護車輛網路。隨著個人車輛採用更複雜的數位平台，對車載網路安全的需求也不斷成長。

預計到2024年，亞太地區汽車網路安全半導體市場將佔42%的佔有率，其中中國市場規模將達到1.761億美元。強勁的數位化趨勢、ADAS功能的快速部署以及電動車產量的不斷成長正在推動該地區市場的成長。由於高額的研發投入、在地化的半導體製造以及OEM廠商與網路安全技術供應商之間更緊密的合作，亞太地區正經歷著顯著的進步。中國市場的成長尤其強勁，這得益於其有利的政策框架以及互聯和自動駕駛出行生態系統中安全通訊模組的日益普及。

汽車網路安全半導體市場的主要公司包括三星電子、微芯科技、恩智浦半導體、英飛凌科技、德州儀器、義法半導體、瑞薩電子、大陸集團、高通科技和安森美半導體。這些公司優先發展基於硬體的安全功能，例如安全啟動機制、即時入侵偵測和加密模組。對人工智慧驅動的威脅偵測引擎的戰略投資正在增強晶片架構的韌性。領先企業正在調整其產品組合，使其符合全球網路安全合規標準，並為乘用車和商用車開發可擴展的平台。

目錄

第1章：方法論

  • 市場範圍和定義
  • 研究設計
    • 研究方法
    • 資料收集方法
  • 資料探勘來源
    • 全球的
    • 地區/國家
  • 基準估算和計算
    • 基準年計算
    • 市場估算的關鍵趨勢
  • 初步研究和驗證
    • 原始資料
  • 預測模型
  • 研究假設和局限性

第2章：執行概要

第3章：行業洞察

  • 產業生態系分析
    • 供應商格局
    • 利潤率分析
    • 成本結構
    • 每個階段的價值增加
    • 影響價值鏈的因素
    • 中斷
  • 產業影響因素
      • 成長促進因素
      • 車輛互聯性和數位化程度不斷提高
      • 自動駕駛和ADAS技術的擴展
      • 採用軟體定義及集中式車輛架構
      • 電動車和混合動力車（EV 和 HEV）的成長
      • 網路威脅的頻率和複雜性日益增加
    • 產業陷阱與挑戰
      • 跨多個ECU和域的網路安全整合具有高度複雜性
      • 全球網路安全法規不斷演變且日益分散。
    • 市場機遇
      • 與連網和自動駕駛汽車平台整合
      • 電動車和混合動力車（EV 和 HEV）的普及率不斷提高
      • 人工智慧驅動和抗量子安全技術的進步
      • 對安全無線 (OTA) 更新和雲端連線的需求不斷成長
  • 成長潛力分析
  • 監管環境
  • 波特的分析
  • PESTEL 分析
  • 技術與創新格局
    • 當前技術趨勢
    • 新興技術
  • 定價分析與成本結構動態
    • 歷史價格趨勢分析（2021-2024）
    • 按組件分類的成本明細
    • 製造成本結構分析
    • 研發投資對定價的影響
    • 基於銷售量的定價策略
  • 區域價格差異及影響因素
  • 專利分析
  • 永續性和環境方面
    • 永續實踐
    • 減少廢棄物策略
    • 生產中的能源效率
    • 環保舉措
    • 碳足跡考量
  • 宏觀經濟動態影響分析
    • 全球半導體短缺的影響（2021-2024 年）
    • 通貨膨脹和原料成本壓力
    • 地緣政治貿易緊張局勢與供應鏈中斷
    • 匯率波動對全球定價的影響
    • 經濟衰退對汽車需求的影響
    • 利率變動與資本投資決策
  • 微觀經濟動態及產業特定因素
    • 汽車產量波動
    • 不同OEM的技術採用率差異
    • 競爭性定價壓力分析
    • 客戶議價能力與採購策略
    • 供應商集中度與市場力量動態
    • 產品生命週期與技術更新周期
  • 威脅情勢及產業應對分析
    • 新興網路安全威脅載體
    • 國家級和高階持續性威脅
    • 供應鏈攻擊漏洞
    • 零日漏洞利用風險及緩解策略
    • 量子運算威脅時間線
    • 產業合作防務計劃
  • 公司策略因應與適應策略
    • 垂直整合與合作策略
    • 地理多元化和近岸外包趨勢
    • 技術組合擴展策略
    • 監理合規投資策略
    • 人才招募與留任挑戰
    • 客戶關係與鎖定策略

第4章：競爭格局

  • 介紹
  • 公司市佔率分析
    • 北美洲
    • 歐洲
    • 亞太地區
    • 拉丁美洲
    • MEA
  • 主要市場參與者的競爭分析
  • 競爭定位矩陣
  • 戰略展望矩陣
  • 關鍵進展
    • 併購
    • 合作夥伴關係與合作
    • 新產品發布
    • 擴張計劃和資金

第5章：市場估算與預測：依組件分類，2021-2034年

  • 主要趨勢
  • 硬體安全模組（HSM）
  • 安全微控制器（MCU）
  • 可信任平台模組（TPM）
  • 加密處理器/協處理器
  • 網路安全晶片
  • 可信執行環境（TEE）

第6章：市場估價與預測：依車輛類型分類，2021-2034年

  • 主要趨勢
  • 搭乘用車
    • 掀背車
    • 轎車
    • SUV
  • 商用車輛
    • 輕型商用車
    • 中型商用車
    • 重型商用車輛
  • 電動車
  • 自動駕駛汽車

第7章：市場估計與預測：依證券類型分類，2021-2034年

  • 主要趨勢
  • 網路安全
  • 應用程式安全
  • 雲端安全
  • 端點安全

第8章：市場估算與預測：依應用領域分類，2021-2034年

  • 主要趨勢
  • 車載資訊系統和資訊娛樂系統
  • ADAS與自動駕駛系統
  • 動力總成和電動車系統
  • 車聯網（V2X）
  • 閘道器和區域控制器
  • 空中下載 (OTA) 更新

第9章：市場估計與預測：依地區分類，2021-2034年

  • 主要趨勢
  • 北美洲
    • 美國
    • 加拿大
  • 歐洲
    • 德國
    • 英國
    • 法國
    • 義大利
    • 西班牙
    • 俄羅斯
    • 北歐
    • 葡萄牙
    • 克羅埃西亞
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 澳洲
    • 韓國
    • 新加坡
    • 泰國
    • 印尼
    • 越南
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 阿根廷
  • MEA
    • 南非
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 土耳其

第10章：公司簡介

  • Contract Manufacturers
    • GlobalFoundries
    • Samsung Electronics
    • Taiwan Semiconductor Manufacturing Company (TSMC)
    • United Microelectronics
  • Integrated Device Manufacturers
    • Analog Devices
    • Continental
    • Infineon Technologies
    • Microchip Technology
    • NXP Semiconductors
    • ON Semiconductor
    • Renesas Electronics
    • STMicroelectronics
    • Texas Instruments
  • Fabless Semiconductor Companies
    • Broadcom
    • Marvell Technology
    • Qualcomm Technologies
  • IP Providers
    • ARM Holdings
    • Cadence Design Systems
    • Imagination Technologies
    • Synopsys
簡介目錄
Product Code: 14928

The Global Automotive Cybersecurity Semiconductors Market was valued at USD 989.4 million in 2024 and is estimated to grow at a CAGR of 9.4% to reach USD 2.3 Billion by

Automotive Cybersecurity Semiconductors Market - IMG1

2034.

Market Scope
Start Year2024
Forecast Year2025-2034
Start Value$989.4 Million
Forecast Value$2.3 Billion
CAGR9.4%

As vehicles become increasingly software-driven and connected, the demand for semiconductors with built-in security features is rising. These chips are essential for protecting automotive systems against cyber threats as automakers transition to electrified and software-defined architectures. The growing presence of advanced driver assistance systems and the shift toward autonomous mobility are accelerating the integration of secure hardware components. Automakers are embedding secure network elements, encryption-enabled processors, and trusted platforms to ensure secure communications, over-the-air updates, and real-time intrusion detection. These enhancements align with evolving regulatory frameworks, supporting compliance with international cybersecurity standards while strengthening vehicle data protection and system integrity.

With the rise in hybrid and electric mobility, there is a growing demand for safety-focused semiconductors that support secure battery monitoring, charging, and propulsion control systems. Next-generation vehicles require highly scalable and intelligent integrated circuits that offer seamless security across infotainment, diagnostics, and remote software management functions. Chipmakers are investing in AI-enabled cyber threat detection and improving the thermal endurance and ruggedness of semiconductor products to meet automotive-grade reliability. Vendors are expanding portfolios to address both passenger and commercial vehicle applications while also focusing on modularity, energy optimization, and compliance to drive value across the industry.

The secure microcontrollers (MCUs) segment held a 33% share in 2024 and is expected to grow at a 9.5% CAGR between 2025 and 2034. These MCUs provide essential hardware-based protections for communication interfaces, control units, and vehicle electronics by integrating secure boot, authentication, and encryption capabilities. With the rise in connected, electrified, and automated vehicle platforms, demand for secure MCUs is scaling rapidly. Regulatory mandates around automotive cybersecurity are compelling OEMs and suppliers to adopt tamper-resistant and cryptography-enabled components, making secure MCUs foundational to modern vehicle architectures.

The passenger cars segment held a 42% share in 2024 and is forecasted to grow at a CAGR of 9.8% through 2034. The growing shift toward connected and software-defined vehicles is prompting automakers to deploy advanced semiconductor-based protection systems across infotainment, ADAS, and vehicle-to-everything communications. Secure boot functions, hardware-based encryption, and embedded intrusion detection systems are being integrated into electronic control units to safeguard vehicle networks. As personal vehicles adopt more sophisticated digital platforms, the need for onboard cybersecurity continues to increase.

Asia Pacific Automotive Cybersecurity Semiconductors Market held a 42% share in 2024, with China generating USD 176.1 million. Strong digitalization trends, rapid deployment of ADAS features, and increasing EV production are propelling regional growth. Asia Pacific is witnessing significant advancements due to high R&D spending, localized semiconductor manufacturing, and stronger alliances between OEMs and cybersecurity technology providers. China's growth is particularly robust, backed by supportive policy frameworks and increasing adoption of secure communication modules across connected and autonomous mobility ecosystems.

Major companies in the Automotive Cybersecurity Semiconductors Market include Samsung Electronics, Microchip Technology, NXP Semiconductors, Infineon Technologies, Texas Instruments, STMicroelectronics, Renesas Electronics, Continental, Qualcomm Technologies, and ON Semiconductor. Companies operating in the automotive cybersecurity semiconductors sector are prioritizing innovation in hardware-based security features such as secure boot mechanisms, real-time intrusion detection, and cryptographic modules. Strategic investments in AI-driven threat detection engines are enhancing the resilience of chip architectures. Leading firms are aligning their portfolios with global cybersecurity compliance standards and developing scalable platforms for both passenger and commercial vehicles.

Table of Contents

Chapter 1 Methodology

  • 1.1 Market scope and definition
  • 1.2 Research design
    • 1.2.1 Research approach
    • 1.2.2 Data collection methods
  • 1.3 Data mining sources
    • 1.3.1 Global
    • 1.3.2 Regional/Country
  • 1.4 Base estimates and calculations
    • 1.4.1 Base year calculation
    • 1.4.2 Key trends for market estimation
  • 1.5 Primary research and validation
    • 1.5.1 Primary sources
  • 1.6 Forecast model
  • 1.7 Research assumptions and limitations

Chapter 2 Executive Summary

  • 2.1 Industry 3600 synopsis, 2021 - 2034
  • 2.2 Key market trends
    • 2.2.1 Regional
    • 2.2.2 Component
    • 2.2.3 Vehicles
    • 2.2.4 Security
    • 2.2.5 Application
  • 2.3 TAM Analysis, 2025-2034
  • 2.4 CXO perspectives: Strategic imperatives
    • 2.4.1 Executive decision points
    • 2.4.2 Critical success factors
  • 2.5 Future outlook and strategic recommendations

Chapter 3 Industry Insights

  • 3.1 Industry ecosystem analysis
    • 3.1.1 Supplier landscape
    • 3.1.2 Profit margin analysis
    • 3.1.3 Cost structure
    • 3.1.4 Value addition at each stage
    • 3.1.5 Factor affecting the value chain
    • 3.1.6 Disruptions
  • 3.2 Industry impact forces
      • 3.2.1.1 Growth drivers
      • 3.2.1.2 Rising connectivity and digitalization of vehicles
      • 3.2.1.3 Expansion of autonomous and ADAS technologies
      • 3.2.1.4 Adoption of software-defined and centralized vehicle architecture
      • 3.2.1.5 Growth in electric and connected vehicles (EVs and HEVs)
      • 3.2.1.6 Increasing frequency and sophistication of cyber threats
    • 3.2.2 Industry pitfalls and challenges
      • 3.2.2.1 High complexity of cybersecurity integration across multiple ECUs and domains
      • 3.2.2.2 Evolving and fragmented global cybersecurity regulations
    • 3.2.3 Market opportunities
      • 3.2.3.1 Integration with connected and autonomous vehicle platforms
      • 3.2.3.2 Growing adoption of electric and hybrid vehicles (EVs & HEVs)
      • 3.2.3.3 Advancements in AI-driven and quantum-resistant security technologies
      • 3.2.3.4 Rising demand for secure over-the-air (OTA) updates and cloud connectivity
  • 3.3 Growth potential analysis
  • 3.4 Regulatory landscape
  • 3.5 Porter's analysis
  • 3.6 PESTEL analysis
  • 3.7 Technology and innovation landscape
    • 3.7.1 Current technological trends
    • 3.7.2 Emerging technologies
  • 3.8 Pricing analysis & cost structure dynamics
    • 3.8.1 Historical price trend analysis (2021-2024)
    • 3.8.2 Cost breakdown by component
    • 3.8.3 Manufacturing cost structure analysis
    • 3.8.4 R&D investment impact on pricing
    • 3.8.5 Volume-based pricing strategies
  • 3.9 Regional Price Variations & Influencing Factors
  • 3.10 Patent analysis
  • 3.11 Sustainability and environmental aspects
    • 3.11.1 Sustainable practices
    • 3.11.2 Waste reduction strategies
    • 3.11.3 Energy efficiency in production
    • 3.11.4 Eco-friendly Initiatives
    • 3.11.5 Carbon footprint considerations
  • 3.12 Macro-economic dynamics impact analysis
    • 3.12.1 Global semiconductor shortage impact (2021-2024)
    • 3.12.2 Inflation & raw material cost pressures
    • 3.12.3 Geopolitical trade tensions & supply chain disruptions
    • 3.12.4 Currency fluctuation impact on global pricing
    • 3.12.5 Economic recession impact on automotive demand
    • 3.12.6 Interest rate changes & capital investment decisions
  • 3.13 Micro-economic dynamics & industry-specific factors
    • 3.13.1 Automotive production volume fluctuations
    • 3.13.2 Technology adoption rate variations by OEM
    • 3.13.3 Competitive pricing pressure analysis
    • 3.13.4 Customer bargaining power & procurement strategies
    • 3.13.5 Supplier concentration & market power dynamics
    • 3.13.6 Product lifecycle & technology refresh cycles
  • 3.14 Threat landscape & industry response analysis
    • 3.14.1 Emerging cybersecurity threat vectors
    • 3.14.2 Nation-state & advanced persistent threats
    • 3.14.3 Supply chain attack vulnerabilities
    • 3.14.4 Zero-day exploit risks & mitigation strategies
    • 3.14.5 Quantum computing threat timeline
    • 3.14.6 Industry collaborative defense initiatives
  • 3.15 Company strategic response & adaptation strategies
    • 3.15.1 Vertical integration vs partnership strategies
    • 3.15.2 Geographic diversification & nearshoring trends
    • 3.15.3 Technology portfolio expansion strategies
    • 3.15.4 Regulatory compliance investment strategies
    • 3.15.5 Talent acquisition & retention challenges
    • 3.15.6 Customer relationship & lock-in strategies

Chapter 4 Competitive Landscape, 2024

  • 4.1 Introduction
  • 4.2 Company market share analysis
    • 4.2.1 North America
    • 4.2.2 Europe
    • 4.2.3 Asia Pacific
    • 4.2.4 LATAM
    • 4.2.5 MEA
  • 4.3 Competitive analysis of major market players
  • 4.4 Competitive positioning matrix
  • 4.5 Strategic outlook matrix
  • 4.6 Key developments
    • 4.6.1 Mergers & acquisitions
    • 4.6.2 Partnerships & collaborations
    • 4.6.3 New Product Launches
    • 4.6.4 Expansion Plans and funding

Chapter 5 Market Estimates & Forecast, By Component, 2021 - 2034 (USD Mn, Units)

  • 5.1 Key trends
  • 5.2 Hardware security modules (HSMs)
  • 5.3 Secure microcontrollers (MCUs)
  • 5.4 Trusted platform modules (TPMs)
  • 5.5 Crypto processors / co-processors
  • 5.6 Network security chips
  • 5.7 Trusted execution environments (TEE)

Chapter 6 Market Estimates & Forecast, By Vehicles, 2021 - 2034 (USD Mn, Units)

  • 6.1 Key trends
  • 6.2 Passenger cars
    • 6.2.1 Hatchbacks
    • 6.2.2 Sedans
    • 6.2.3 SUVs
  • 6.3 Commercial vehicles
    • 6.3.1 Light commercial vehicles
    • 6.3.2 Medium commercial vehicles
    • 6.3.3 Heavy commercial vehicles
  • 6.4 Electric vehicles
  • 6.5 Autonomous vehicles

Chapter 7 Market Estimates & Forecast, By Security, 2021 - 2034 (USD Mn, Units)

  • 7.1 Key trends
  • 7.2 Network security
  • 7.3 Application security
  • 7.4 Cloud security
  • 7.5 Endpoint security

Chapter 8 Market Estimates & Forecast, By Application, 2021 - 2034 (USD Mn, Units)

  • 8.1 Key trends
  • 8.2 Telematics & infotainment
  • 8.3 ADAS & autonomous systems
  • 8.4 Powertrain & EV systems
  • 8.5 Vehicle-to-everything (V2X)
  • 8.6 Gateway & zonal controllers
  • 8.7 Over-the-Air (OTA) updates

Chapter 9 Market Estimates & Forecast, By Region, 2021 - 2034 (USD Mn, Units)

  • 9.1 Key trends
  • 9.2 North America
    • 9.2.1 US
    • 9.2.2 Canada
  • 9.3 Europe
    • 9.3.1 Germany
    • 9.3.2 UK
    • 9.3.3 France
    • 9.3.4 Italy
    • 9.3.5 Spain
    • 9.3.6 Russia
    • 9.3.7 Nordics
    • 9.3.8 Portugal
    • 9.3.9 Croatia
  • 9.4 Asia Pacific
    • 9.4.1 China
    • 9.4.2 India
    • 9.4.3 Japan
    • 9.4.4 Australia
    • 9.4.5 South Korea
    • 9.4.6 Singapore
    • 9.4.7 Thailand
    • 9.4.8 Indonesia
    • 9.4.9 Vietnam
  • 9.5 Latin America
    • 9.5.1 Brazil
    • 9.5.2 Mexico
    • 9.5.3 Argentina
  • 9.6 MEA
    • 9.6.1 South Africa
    • 9.6.2 Saudi Arabia
    • 9.6.3 UAE
    • 9.6.4 Turkey

Chapter 10 Company Profiles

  • 10.1 Contract Manufacturers
    • 10.1.1 GlobalFoundries
    • 10.1.2 Samsung Electronics
    • 10.1.3 Taiwan Semiconductor Manufacturing Company (TSMC)
    • 10.1.4 United Microelectronics
  • 10.2 Integrated Device Manufacturers
    • 10.2.1 Analog Devices
    • 10.2.2 Continental
    • 10.2.3 Infineon Technologies
    • 10.2.4 Microchip Technology
    • 10.2.5 NXP Semiconductors
    • 10.2.6 ON Semiconductor
    • 10.2.7 Renesas Electronics
    • 10.2.8 STMicroelectronics
    • 10.2.9 Texas Instruments
  • 10.3 Fabless Semiconductor Companies
    • 10.3.1 Broadcom
    • 10.3.2 Marvell Technology
    • 10.3.3 Qualcomm Technologies
  • 10.4 IP Providers
    • 10.4.1 ARM Holdings
    • 10.4.2 Cadence Design Systems
    • 10.4.3 Imagination Technologies
    • 10.4.4 Synopsys