查看購物車
  • English
  • Japanese
  • Korean
6G通訊：可重構智慧表面（RIS）材料與硬體的市場與技術（2027-2047）
市場調查報告書
商品編碼
2128695

6G通訊：可重構智慧表面（RIS）材料與硬體的市場與技術（2027-2047）

6G Communications: Reconfigurable Intelligent Surface RIS Materials and Hardware Markets, Technology 2027-2047
出版日期: | 出版商: Zhar Research | 英文 579 Pages | 商品交期: 最快1-2個工作天內

價格
簡介目錄

概要

隨著無線通訊技術的發展，更高頻率和其他特性的應用有望帶來更廣泛的應用和全新的使用者功能。為了實現預計於2030年推出的6G技術，需要在傳播路徑上廣泛部署可重構智慧表面（RIS）。這份長達579頁的研究報告著重分析商業機會，透過11項SWOT分析、2027年至2047年的24個預測情境以及57項關鍵結論，說明了市場機會。

說明沒有使用冗長的文字，而是採用清晰的資訊圖表。

本報告針對價值鏈上的所有參與者，包括投資者、高價值材料製造商、設備製造商、產品和系統整合商以及設施管理人員。報告也為研究人員、監管機構和其他相關人員提供寶貴的見解。具體而言，報告涵蓋潛在的合作與收購、前景廣闊的方法、最佳實踐以及從失敗中汲取的經驗教訓。報告以SWOT分析、比較圖表、創新資訊圖表、藍圖、預測以及標有「Zhar研究評論」的章節形式呈現了全新的博士級分析。為了便於理解，報告以餅圖的形式對前景廣闊的材料進行優先排序，並在正文中以紅色突出顯示。關鍵點以綠色突出顯示。由於這是個快速發展的領域，報告會持續更新，以提供最新資訊。掌握這些獨特的見解和詳盡的分析，就有可能創造價值數十億美元的商機。

目錄

第一章：執行摘要與結論，以及2027-2047年路線圖與預測

  • 本報告的目的
  • 此分析方法論
  • RIS背景
    • 適用於5G，對6G至關重要
    • 與RIS相關的Google搜尋結果、研究論文、專利趨勢和重要RIS主題
    • 理想的RIS無所不在：Infogram
  • 6G 所需的多種 RIS 類型
  • 關於6G通信的10個主要結論
  • 關於6G RIS的27個主要結論
  • 關於6G RIS材料和組件的商業機會的7個主要結論
  • 關於6G成本問題的7個主要結論RIS
  • 關於 6G RIS 和反射鏡陣列製造技術的 6 個關鍵結論
  • 8 個 SWOT 評估
    • 6G RIS 的 SWOT 評估
    • 新增亞太赫茲、太赫茲、近紅外線和可見光頻率的 6G 的 SWOT 評估
    • BD-RIS 在 6G 的 SWOT 評估
    • STAR-RIS 的 SWOT 評估
    • OWC 的 6G RIS 的 SWOT 評估
    • 6G ISAC 和 RIS 應用的 SWOT 評估
    • 可見光通訊 (VLC) 的 SWOT 評估
    • 超材料和超表面的 SWOT 評估
    • 可變形 FIM（柔性智慧超表面）的 SWOT 評估
  • 6G 系統、材料和標準路線圖（6 項），2026-2047 年
  • 6G 反射器陣列與RIS市場預測及背景預測（24項），2027-2047年
    • 6G 全被動超材料反射陣列市場 OWC 及總額 2029-2047 十億美元
    • 6G RIS價值市場數十億美元：2026-2047年頻率分類的主動與四種半被動類別並附說明
    • 6G RIS面積年銷售量 2027-2047 年十億平方米，附說明
    • 平均 6G RIS 價格：$/平方公尺，含電子產品 2028-2047 年，含說明
    • 6G RIS 區域銷售與平均面板面積、銷售數字及2027-2047年累計部署總數，附說明
    • 2029-2047 全球 RIS 硬體價值市場於四個地區的百分比佔有率
    • 智慧型手機及其後繼機型全球銷售量 2025-2047
    • 6G 與 5G 基站市場 2025-2047 年單位數數百萬
    • 2029-2047 $bn 6G 基站市場價值
    +

第二章 2026年展望，含研究成果

  • 概述
    • RIS的定義、背景及發展需求
    • RIS的運作模式、挑戰及實現預期6G效益的設計方法
    • 從機械部件到智慧材料的轉變的關鍵趨勢
    • RIS及相關智慧超表面的多樣化功能與應用
    • RIS設計和功能方面的現有方法範例
    • RIS與傳統方法相比的獨特之處組合
    • 液晶作為相控陣中的可變電容介質
    • RIS 與傳統方法的競爭
    • 6G 系統如何在傳播路徑中融合多種技術
    • 主動式 RIS 的重要性：預期可能性與進展
  • RIS 的功能和實用性 - 詳細考慮
    • 改進的空間覆蓋和宏觀分集
    • 容量提升、綠色通訊和物聯網
    • 物理層安全性、抗干擾性和可靠性的提升
    • 支援大規模物聯網網路部署
    • 無線感測與定位、HRIS、ISAC
    • 從系統和安全角度看 RIS
  • 與 6G RIS 相關的標準化機構和重要利害關係人的活動
  • 6G 和 6G RIS 目標的擴展和縮減智慧無線環境
  • 術語混淆
  • 產業和研究趨勢的變化
    • 理論研究的擴展是有益的，但相對忽略硬體是不可取的
    • 頻率策略的撤回可能會影響服務啟動時的功能
    • 近期研究普遍集中在5G頻段：6G的GHz頻段與毫米波
    • 6G：0.1THz至3THz RIS
  • 提高高頻段覆蓋範圍：軌道工程
  • 2025年以後其他研究進展分析
    • 特定6G RIS、反射陣列、相控陣
    • 相關主題：研究與出版計劃，2025年、2026年
  • 6G世界的建議架構互補系統

第三章：終極 6G RIS 硬體工具包：隱形、廣域、自供電、自學習、自適應、自修復、自清潔、普適、自主、持久、AI 賦能、動態頻譜共享等（包括截至 2026 年的研究）

  • 概述
    • 透過以下領域的許多進步，提升 6G RIS 的可接受性、可部署性和實用性：
    • 透過先進的物理特性和 RIS 特性的協同組合
  • 隱形 RIS - 透明或超越視線範圍
    • RIS 的消失之路：透明或超越視線範圍
    • 透明 6G RIS 2025-2026 年：企業、大學及其雄心
    • 透明反射陣列：積水等。
  • 大型智慧表面 (LIS) 和超大型天線陣列 (ELAA) 的研究，包括廣域 RIS
    • 定義和優勢
    • 利用大型智慧表面 (LIS) 和 RIS 提高安全性、通訊範圍和減少錯誤
    • RIS 廣域能量收集和保護塗層的進展
  • RIS 實現自供電，從而支援零能耗客戶端設備
    • 概述
    • 關鍵零能耗 (ZED) 基礎技術的成熟度
    • 最值得關注的 6G 研究：ZED 化合物和同素異形體的排名
    • ZED 背景：重疊和相鄰技術以及長壽命能源自給案例
    • SWIPT、STIIPT、AmBC 和 CD-ZED 的目標和最新進展
    • 13 2027 年至 2047 年 6G ZED 基礎設施與客戶設備的能量採集技術
    • 6G 主動式 RIS 和 UM MIMO 基地台的功率需求與能量擷取方案相符
    • ZED RIS 及其他設備的無電池儲能技術的 SWOT 分析
    • 無需儲能的電路和基礎設施的 SWOT 分析
  • 用於優化、自學習、自適應和自主 RIS 的人工智慧和機器學習
  • 多模、多頻、動態頻譜共享 (DSS) 6G 及其 RIS

第四章 超越對角線 RIS 架構：6G 突破 RIS 的極限

  • 定義、關鍵挑戰與適用性
    • 重要性
    • 簡要說明
    • BD-RIS 在 6G 的 SWOT 分析
    • 本章範圍與你的機會
  • BD-RIS 的潛在優勢
  • BD-RIS 的硬體挑戰
  • 實際應用及改善需求
    • 挑戰
    • BD-RIS 的首次示範實驗
    • 地面 BD-RIS 的發展至 2025 年：諸多進展與評估
    • 非地面網路 (NTN) 中 RIS 的改進

第五章 多功能多模 RIS，包括 STAR RIS、ISAC 和 SWIPT，以及至 2026 年的發展趨勢

  • 研究與產業總結趨勢與可能性
  • STAR：透明與反射結合的RIS
    • 概述
    • STAR-RIS的優化
    • STAR-RIS-ISAC整合感測與通訊系統
    • TAIS（透明放大智慧表面）
    • 訊息與能量的同步無線傳輸（SWIPT），包括主動STAR-RIS和太赫茲版本
    • 具備能量收集和自適應功率控制功能的STAR-RIS
    • STAR-RIS的SWOT分析
  • 其他多功能和多模RIS
    • 概述
    • 多功能RIS：固態冷卻功能
  • 2025年後整合感測與通訊系統（ISAC）的進一步發展，包括RIS和SWOT分析
    • 原生6G功能
    • SWOT分析與RIS 在 6G ISAC 的應用
    • 基礎
  • 用於系統安全的多模 RIS：半被動式和主動式 RIS 的組合應用

第六章 基地台、UM-MIMO、高區域通訊平台 (HAPS) 和無人機 RIS 及研究進展，2026 年

  • 相關主題：RIS增強6G基站與非地面網路
  • UM-MIMO 的進展
  • 支援 RIS 的自供電超大規模 6G UM-MIMO 基地台的設計
    • 基本與結構性RIS
    • 變形超材料 MIMO 技術
  • 大型 MIMO 基站的 RIS：清華大學，艾默生
  • RIS 作為小型基地台
  • 2025 年支援 RIS 的 MIMO 與基地台的其他重要進展
  • 衛星與無人機如何協助甚至受益於6G RIS技術
  • 2025 年及 2026 年宣布的重要進展及預定
  • 大型平流層HAPS RIS

第 7 章 RIS 調諧硬體目標與 2026 年前的研究進展

  • 概述
    • 從基礎到高階調諧
    • 調諧機制概述
    • 用於研究和測試的 RIS 外部控制激勵範例
    • RIS 調諧硬體選項比較
    • 資訊圖表：太赫茲頻段需要不同的調諧材料和裝置
  • 經驗教訓RIS調校研究：2026年以前
    • 研究重點轉移
    • 首選的電調諧和光調諧，以及高頻段
  • 使用分立調諧元件的詳細進展分析
    • 概述
    • 使用肖特基二極體的RIS調諧及其與其他二極體的比較
    • 使用高電子遷移率電晶體（HEMT）的RIS調諧
    • 其他表現不佳的方案及其原因
  • 優先選擇調諧材料取代 6G RIS（0.1–1 THz 和近紅外線）中的分立元件
    • 目前領先的候選材料
    • 適用於更高頻率 6G 的整合式調諧材料方案
    • 二氧化釩：原理及 2025 年前的關鍵發展
    • 硫系相變材料（特別是 GST 和 GeTe）
    • 石墨烯：原理及 2025 年前的關鍵發展
    • 液晶：原理及 2025 年前的發展
  • 大型 RIS 和其他市場面臨的挑戰

第 8 章 6G 光無線通訊 ORIS：2026 年前的關鍵發展

  • 為什麼 OWC（包括 RIS）在其頻率範圍內對 6G 具有吸引力頻段
    • 光無線通訊 (OWC) 及其子領域可見光通訊 (VLC)：2026 年前的發展
    • 多頻 6G 第二階段（包括光通訊）在可靠通訊中的重要性
    • 3-300GHz 頻段自由空間光通訊 (FSO) 的參數比較
  • 基於 SWOT 分析的光 RIS (ORIS) 的可能性和挑戰
    • 概述
    • ORIS 和分散式 RIS (DRIS) 方案的優勢
    • ORIS 的挑戰
    • 6G 用於 OWC 的 RIS SWOT 分析
    • 可見光通訊的 SWOT 分析
  • ORIS 實施流程
  • OWC 在遠端、地下、水下和太空中的應用：RIS：2026 年的研究進展前文
    • 概述
    • 利用RIS增強OWC車載網路與行動環境
    • 混合射頻-自由空間光RIS
    • 水下UOWC系統（包括截至2026年的最新進展）
    • 需要RIS的地下OWC
    • 利用RIS技術的雷射平流層與空間通信
  • 短距離與室內OWC及其RIS：截至2026年及之前的研究進展
    • 室內和大氣中的短距離通信
    • 將其他室內和短距離室外系統（例如LiFi）與RIS集成
  • 光學材料在6G的應用潛力
  • 用於6G的超透鏡（包括截至2026年的最新進展）
  • 鏡陣列的設計與應用進展ORIS

第九章 6G 變形 FIM（柔性智慧超表面）、6G 超表面與超材料基礎

  • 概述
  • 6G 相關超材料的評估：關鍵進展
    • 超材料設計的新進展
    • 超表面、堆疊式智慧超表面、群聚、雙功能超表面
    • 最優超材料基板和低損耗 6G 玻璃 TIRS
    • 最優超材料基板，包括透明 6G 玻璃
  • 超材料基礎
    • 超原子和圖案化選項
    • 材料與功能分類
    • 用於 5G 和 6G 通訊的超材料反射陣列
    • 超材料圖案與材質：
    • 通訊用超材料：六種形式及實例
  • 超表面基礎
    • 超表面的設計、運作及RIS
    • 超材料RIS硬體的工作原理
    • RIS和反射陣列的配置及潛在功能
    • 全介質和非線性介質超表面
  • 超材料的長期展望
  • GHz、THz、紅外線和光學超材料的新興應用
  • 熱超材料
  • 超材料與超表面的SWOT分析
  • 可變形FIM（柔性智慧超表面）的基礎與研究趨勢
    • 基礎
    • FIM的網路拓樸結構及潛在應用
    • FIM研究進展評估2026
    • 6G FIM 的 SWOT 分析

第十章 RIS 和反射陣列的製造、偵測、測試和成本細分

  • 薄膜和透明電子技術的最新趨勢
  • 從單一基板和層壓薄膜到完全整合智慧材料的趨勢
  • 柔性、層壓、二維能量收集和感測的重要性
  • 低太赫茲和高太赫茲 6G RIS 製造技術的差異
    • 候選技術：奈米壓印、奈米光刻、光刻、凹版印刷、噴墨印刷、網版印刷、柔版印刷、噴塗、其他
    • 例外：電子束沉積 3D 列印
    • 超快雷射系統
  • 6G RIS 檢測與測試：最新進展
    • 測試挑戰
    • RIS 檢測技術的進步
  • RIS 成本分析
    • 總體評估
    • NEC 及其他成本估算範例
    • 大規模部署區域室外半被動式和主動式 RIS 的成本分析
    • 大規模室內部署半被動式 RIS 的成本分析

第十一章 6G RIS 相關公司：產品、計畫、專利及 Zhar Research 評估

  • 概述及專利獲取
  • AGC (日本)
  • Alcan Systems (德國)
  • Alibaba (中國)
  • Alphacore (美國)
  • 中國電信、中國移動、中國聯通、華為、中興、聯想、等CICT（中國）公司的合作
  • Ericsson (瑞典)
  • Fractal Antenna Systems (美國)
  • Greenerwave (法國)
  • Huawei (中國)
  • ITOCHU (日本)
  • Kymeta Corp. (美國)
  • Kyocera (日本)
  • Metacept Systems (美國)
  • Metawave (美國)
  • NEC (日本)
  • Nokia Finland with LG Uplus (韓國)
  • NTT DoCoMo and NTT(日本)
  • Orange (法國)
  • Panasonic (日本)
  • Pivotal Commware (美國)
  • Qualcomm (美國)
  • Samsung Electronic (韓國)
  • Sekisui (日本)
  • SensorMetrix (美國)
  • SK Telecom (韓國)
  • Sony (日本)
  • Teraview (美國)
  • Vivo Mobile Communications (中國)
  • VTT (芬蘭)
  • ZTE (中國)
簡介目錄

Summary

Successive generations of wireless communications promise wider availability and new, must-have user features, partly by adopting higher frequencies. To enable these, 6G, launching in 2030, must widely deploy Reconfigurable Intelligent Surfaces RIS in the propagation path. The new commercially-oriented, 579-page report, "6G Communications: Reconfigurable Intelligent Surface RIS Materials and Hardware Markets, Technology 2027-2047" details your opportunities, clarified with 11 SWOT appraisals, 24 forecast lines 2027-2047, 57 key conclusions.

Clear infograms not rambling text

The report is intended for all in the value chain from investors to added value materials companies, device manufacturers, product and system integrators, and facilities managers. Indeed, there is much to interest academics, regulators and other interested parties. For example, here you will find potential partners and acquisitions, winning approaches, best practice and lessons from failure. The new PhD level analysis is presented as SWOT appraisals, comparison charts, new infograms, roadmaps, forecasts and sections marked “Zhar Research Comment”. For easy understanding, successful materials are prioritised in pie charts and highlighted in red in the text. Key points are highlighted in green. The report is constantly updated so you only get the latest - essential because the progress is now rapid. Billion-dollar businesses can be created by those keeping ahead with this level of original insight and detail.

Deep coverage of the flood of new research

Vitally, there is deep coverage of the flood of new research and company activity through 2025 and 2026. It will assist those seeking opportunities for their existing materials and manufacturing expertise such as flexible and structural electronics, fine metals, conductive inks, graphene, activated carbon, silicon, silicas and liquid crystal, often wide-area. See future progress from GHz to THz and visible-light RIS and to sophisticated forms such as Transparent Amplifying Intelligent Surfaces TAIS and morphing RIS.

Two stages

6G will mostly launch in 2030 with minimal infrastructure expenditure, performance being improved by radical advances above the physical layer. However, later, many advanced forms of RIS will be essential to meet the original promises and reverse the decline in sales of client devices. Those promises include Tbps data rates, sub ms latency, native AI, native sensing and native precise positioning, ten times the client density of 5G, all sufficient to serve the ambitions of real-time brain-computer interfaces, superlative robotics, holographic communication, immersive extended reality XR and so much more. For these, we may widely deploy 0.1-0.3 THz, visible light communication and affordable RIS. This report therefore covers RIS at all likely frequencies from GHz to visible light and ways of limiting the RIS expenditure and improving paybacks by such things as 360-degree RIS, including as windows, multipurpose RIS and fully active RIS that doubles range and provides much better added value services. We also cover RIS technology in aerospace, underwater and underground, all essential if the poor geographical coverage of 5G is not to be repeated.

Report contents

The Executive Summary and Conclusions (74 pages) is self-sufficient for those with limited time. See the basics, conclusions, main SWOT appraisals, roadmaps and all forecasts. The Introduction (117 pages) presents the various RIS variants, objectives and trends emerging and how they support necessary 6G evolution. Learn how a 6G Phase Two will be essential to meet the original promises. Backing up the analysis, 60 research papers from 2026 are listed. Chapter 3. “Ultimate 6G RIS hardware toolkit: invisible, wide area, self-powered, self-learning, self-adaptive, self-healing, self-cleaning, ubiquitous, autonomous, everlasting, AI enabled, dynamic spectrum sharing, other” (38 pages), with other research advances through 2026, details these aspects. Chapter 4. “Beyond diagonal RIS architecture tackles 6G RIS limitations” (22 pages) explains this relatively-new aspect.

Affordable and acceptable RIS everywhere

To be affordable and acceptable. RIS must become more capable and disappear into the fabric of society. Chapter 5. “Multifunctional and multi-mode RIS including STAR RIS, ISAC, SWIPT with research through 2026” (54 pages) explains how this will be achieved, eventually including SWIPT providing enough power in the signal beam to interrogate unpowered 6G client devices such as Internet of Things nodes in billions.

RIS technology will enhance 6G base stations

RIS technology will enhance 6G base stations as their nature changes, and example being “Tower in the Sky”. Chapter 6. “Base station, UM-MIMO, Tower in the Sky HAPS and UAV RIS with research advances 2026” explains. Indeed, Unmanned Aerial Vehicles will both enhance and benefit from RIS-enabled 6G. Chapter 7. “RIS tuning hardware objectives and progress with research through 2026” (52 pages) concerns the formulation and patterning options for materials and components enabling the reconfigurable feature of RIS metasurfaces. The trend is from flip chip to structural electronics, with vanadium dioxide among the likely winners.

Optical and other advanced RIS

Given the inevitability of 6G progressing later to frequencies high enough to provide the ultimate benefits, visible light communication must become part of the mix. Indeed, only this has demonstrated Tbps data rates. Chapter 8. “Optical Wireless Communications ORIS for 6G: major progress through 2026” (61 pages) explains your opportunities arising. They cover indoor up to satellite optical systems. Chapter 9. “6G Morphing Flexible Intelligent Metasurfaces FIM, 6G hypersurfaces, metamaterial basics” (49 pages) covers other options that will appear later in the 2027-2047 timeframe. It also gives metamaterial basics for those that need them. The report closes with Chapter 10. “RIS and reflect-array manufacture, inspection, testing, cost breakdown”.

“6G Communications: Reconfigurable Intelligent Surface RIS Materials and Hardware Markets, Technology 2027-2047” is your essential handbook.

CAPTION: Recent research papers relevant to RIS at GHz and THz showing need for more experimental work as we approach commercialisation. Source: Zhar Research report, “6G Communications: Reconfigurable Intelligent Surface RIS Materials and Hardware Markets, Technology 2027-2047”.

Table of Contents

1. Executive summary and conclusions with roadmap and forecast lines 2027-2047

  • 1.1 Purpose of this report
  • 1.2 Methodology of this analysis
  • 1.3 Background to RIS
    • 1.3.1 Useful for 5G but essential for 6G
    • 1.3.2 RIS Google, research paper, patent trends, trending RIS topics
    • 1.3.3 Dreams of RIS everywhere: infograms
  • 1.4 Many types of RIS needed for 6G
  • 1.5 Ten key conclusions concerning 6G Communications generally
  • 1.6 27 general conclusions concerning 6G RIS
  • 1.7 Seven key conclusions concerning 6G RIS materials and component opportunities
  • 1.8 Seven key conclusions concerning 6G RIS cost issues
  • 1.9 Six key conclusions concerning 6G RIS and reflect-array manufacturing technology
  • 1.10 Eight SWOT appraisals
    • 1.10.1 6G RIS SWOT appraisal
    • 1.10.2 SWOT appraisal of 6G adding sub-THz, THz, near infrared and visible frequencies
    • 1.10.3 SWOT appraisal of BD-RIS for 6G
    • 1.10.4 STAR-RIS SWOT appraisal
    • 1.10.5 SWOT appraisal of 6G RIS for OWC
    • 1.10.6 SWOT appraisal of 6G ISAC and its use of RIS
    • 1.10.7 SWOT appraisal of visible light communication VLC
    • 1.10.8 SWOT appraisal for metamaterials and metasurfaces generally
    • 1.10.9 SWOT appraisal of morphing Flexible Intelligent Metasurfaces FIM
  • 1.11 6G systems, materials and standards roadmaps in six lines 2026-2047
  • 1.12 6G reflectarray and RIS market forecasts and background forecasts in 24 lines 2027-2047
    • 1.12.1 6G fully passive metamaterial reflect-array market OWC and total $ billion 2029-2047
    • 1.12.2 6G RIS value market $ billion: active vs four semi-passive categories by frequency 2026-2047 with explanation
    • 1.12.3 6G RIS area sales yearly billion square meters 2027-2047 with explanation
    • 1.12.4 Average 6G RIS price $/ square m. ex-factory including electronics 2028-2047 with explanation
    • 1.12.5 6G RIS area sales vs average panel area, sales number and total deployed cumulatively 2027-2047 with explanation
    • 1.12.6 Percentage share of global RIS hardware value market by four regions 2029-2047
    • 1.12.7 Smartphone and successor billion units sold globally 2025-2047
    • 1.12.8 Market for 6G vs 5G base stations units millions yearly 2025-2047
    • 1.12.9 Market for 6G base stations market value $bn 2029-2047

2. Introduction with research through 2026

  • 2.1 Overview
    • 2.1.1 RIS definitions, context, needs driving increased RIS sophistication
    • 2.1.2 RIS operation modes, issues and design approaches in providing planned 6G benefits
    • 2.1.3 Important trend from moving parts to smart materials
    • 2.1.4 Diverse functionalities and applications of RIS and allied intelligent metasurfaces
    • 2.1.5 Examples of current approaches to RIS design and capability
    • 2.1.6 Unique features of RIS vs traditional approaches and combinations
    • 2.1.7 Liquid crystal as a variable capacitive medium in phased arrays
    • 2.1.8 RIS competing with traditional approaches
    • 2.1.9 How 6G systems will mix and match many technologies in the propagation path
    • 2.1.10 Active RIS becomes important: different envisaged potential and advances
  • 2.2 RIS functionality and usefulness – a closer look
    • 2.2.1 Improved spatial coverage and macro-diversity
    • 2.2.2 Capacity enhancement, green communications and Internet of Things
    • 2.2.3 Physical layer security, anti-jamming, and reliability enhancement
    • 2.2.4 Enabling Large-Scale IoT Network Deployment
    • 2.2.5 Wireless Sensing and Localization, HRIS, ISAC
    • 2.2.6 RIS from the systems and security viewpoint
  • 2.3 Activities of standards bodies and influencers related to 6G RIS
  • 2.4 Broadening vs retrenching 6G and 6G RIS objectives, smart radio environments
  • 2.5 Terminology thicket
  • 2.6 Changing industrial and research trends
    • 2.6.1 Broadening theoretical studies useful but relative neglect of hardware is not
    • 2.6.2 Backtracking on frequencies compromises capability at launch
    • 2.6.3 Latest research focussed on broadly 5G frequencies: GHz and mmWave for 6G
    • 2.6.4 0.1THz to 3THz 6G RIS research
  • 2.7 Improving reach at the higher frequencies: trajectory engineering
  • 2.8 Analysis of other research advances 2025 through
    • 2.8.1 Specifically 6G RIS, reflect arrays, phased arrays
    • 2.8.2 Adjacent topics research in 2025, 2026 and for scheduled publication in
  • 2.9 6G global architecture proposals, complementary systems

3. Ultimate 6G RIS hardware toolkit: invisible, wide area, self-powered, self-learning, self-adaptive, self-healing, self-cleaning, ubiquitous, autonomous, everlasting, AI enabled, dynamic spectrum sharing, other with research through 2026

  • 3.1 Overview
    • 3.1.1 Making 6G RIS more acceptable, deployable and useful: many advances through
    • 3.1.2 Synergistic combination of advanced physical and RIS properties
  • 3.2 Invisible RIS – transparent or out of sight
    • 3.2.1 The journey to vanishing RIS: transparent or out-of-sight
    • 3.2.2 Transparent 6G RIS in 2025-6: companies, universities, ambitions
    • 3.2.3 Transparent reflect arrays: Sekisui and others
  • 3.3 Large Intelligent Surfaces LIS and Extremely Large-scale Antenna Array ELAA research including wide area RIS
    • 3.3.1 Definitions and benefits
    • 3.3.2 Large Intelligent Surfaces LIS RIS enhancing security, range, error reduction
    • 3.3.3 Advances in protective coatings for wide area energy harvesting and RIS
  • 3.4 RIS will become self-powered and enable zero energy client devices
    • 3.4.1 Overview
    • 3.4.2 Maturity of primary ZED enabling technologies
    • 3.4.3 Ranking of most popular 6G ZED compounds and carbon allotropes in research
    • 3.4.4 Context of ZED: overlapping and adjacent technologies and examples of long-life energy independence
    • 3.4.5 SWIPT, STIIPT, AmBC and CD-ZED objectives and latest progress
    • 3.4.6 13 harvesting technologies for 6G ZED infrastructure and client devices 2027-2047
    • 3.4.7 6G active RIS and UM MIMO base station power demands matched to energy harvesting options
    • 3.4.8 SWOT appraisal of batteryless storage technologies for ZED RIS and more
    • 3.4.9 SWOT appraisal of circuits and infrastructure that eliminate storage
  • 3.5 Artificial intelligence and machine learning for optimising, self-learning, self-adaptive , autonomous RIS
  • 3.6 Multimode and multifrequency, dynamic spectrum sharing DSS 6G and its RIS

4. Beyond diagonal RIS architecture tackles 6G RIS limitations

  • 4.1 Definitions, material challenges, applicability
    • 4.1.1 Significance
    • 4.1.2 The simple description
    • 4.1.3 SWOT appraisal of BD-RIS for 6G
    • 4.1.4 Coverage in this chapter and your opportunities
  • 4.2 Potential benefits of BD-RIS
  • 4.3 BD-RIS hardware challenges
  • 4.4 Practical implementations and requirement for improvement
    • 4.4.1 The challenge
    • 4.4.2 First practical demonstrations of BD-RIS
    • 4.4.3 Terrestrial BD-RIS progress through 2025: many other advances and appraisals
    • 4.4.4 Improving RIS in non terrestrial networks NTN

5. Multifunctional and multi-mode RIS including STAR RIS, ISAC, SWIPT with research through 2026

  • 5.1 Overview with review of research, industrial trends and possibilities
  • 5.2 Simultaneous transmissive and reflective STAR RIS
    • 5.2.1 Overview
    • 5.2.2 STAR-RIS optimisation
    • 5.2.3 STAR-RIS-ISAC integrated sensing and communication system
    • 5.2.4 TAIS Transparent Amplifying Intelligent Surface
    • 5.2.5 Simultaneous Wireless Information and Power Transfer SWIPT including active STAR-RIS and THz versions
    • 5.2.6 STAR-RIS with energy harvesting and adaptive power
    • 5.2.7 STAR RIS SWOT appraisal
  • 5.3 Other multifunctional and multi-mode RIS
    • 5.3.1 Overview
    • 5.3.2 Multifunctional RIS: solid-state cooling functionality
  • 5.4 Integrated sensing and communication ISAC including RIS, SWOT, advances 2025 snd
    • 5.4.1 Native 6G capability
    • 5.4.2 SWOT appraisal of 6G ISAC and its use of RIS
    • 5.4.3 Basics
  • 5.5 Multimode RIS ensuring system security: combined semi-passive and active RIS

6. Base station, UM-MIMO, Tower in the Sky HAPS and UAV RIS with research advances 2026

  • 6.1 Overlapping subjects: RIS enhancing 6G base stations and non-terrestrial networks
  • 6.2 Progress to UM-MIMO
  • 6.3 RIS-enabled, self-powered ultra-massive 6G UM-MIMO base station design
    • 6.3.1 Basic and structural RIS
    • 6.3.2 Morphing metamaterial MIMO technology
  • 6.4 RIS for massive MIMO base station: Tsinghua University, Emerson
  • 6.5 RIS as small cell base station
  • 6.6 Other important advances in RIS-enabled MIMO and base stations in 2025 through
  • 6.7 How satellites and UAVs will aid and sometimes benefit from 6G RIS
  • 6.8 Important advances announced in 2025 and 2026 and scheduled for
  • 6.9 Large stratospheric HAPS RIS

7. RIS tuning hardware objectives and progress with research through 2026

  • 7.1 Overview
    • 7.1.1 Primitive to advanced tuning
    • 7.1.2 Tuning mechanisms in context
    • 7.1.3 Examples of RIS external control stimuli used in research and trials
    • 7.1.4 RIS tuning hardware options compared
    • 7.1.5 Infogram: The Terahertz Gap demands different tuning materials and devices
  • 7.2 Lessons from research carried out on RIS tuning: 2026 and earlier
    • 7.2.1 Changing focus
    • 7.2.2 Electrical and optical tuning and higher frequencies favoured
  • 7.3 Detailed analysis of progress with discrete tuning components
    • 7.3.1 General
    • 7.3.2 Schottky diode RIS tuning vs other diodes
    • 7.3.3 High-Electron Mobility Transistor HEMT RIS tuning
    • 7.3.4 Less successful other options with reasons
  • 7.4 Prioritisation of tuning materials replacing discretes for 6G RIS 0.1-1THz and NearIR
    • 7.4.1 Winners on current evidence
    • 7.4.2 Options for integrated tuning materials for higher frequency 6G
    • 7.4.3 Vanadium dioxide: rationale and major progress through 2025,
    • 7.4.4 Chalcogenide phase change materials notably GST and GeTe
    • 7.4.5 Graphene: rationale and major progress through 2025,
    • 7.4.6 Liquid crystal rationale and progress through 2025,
  • 7.5 Large RIS and other gaps in the market

8. Optical Wireless Communications ORIS for 6G: major progress through 2026

  • 8.1 Why OWC including RIS at its frequencies is an attractive addition for 6G
    • 8.1.1 Optical Wireless Communications OWC, subset Visible Light Communications VLC, 2026 advances
    • 8.1.2 The case for multi-frequency 6G Phase Two including optical “so one gets through”
    • 8.1.3 Parameter comparison of Free Space Optical FSO with 3-300GHz communication
  • 8.2 The potential and the challenges of Optical RIS ORIS with SWOT appraisals
    • 8.2.1 Overview
    • 8.2.2 ORIS benefits and the Distributed RIS DRIS option
    • 8.2.3 ORIS challenges
    • 8.2.4 SWOT appraisal of 6G RIS for OWC
    • 8.2.5 SWOT appraisal of visible light communication
  • 8.3 ORIS implementation procedures
  • 8.4 Long range, underground, underwater and space OWC: RIS: research advances 2026 and earlier
    • 8.4.1 General
    • 8.4.2 RIS enhanced OWC vehicular networks and mobile environments
    • 8.4.3 Hybrid RF-FSO RIS
    • 8.4.4 Underwater UOWC systems with 2026 advances
    • 8.4.5 Underground OWC needing RIS
    • 8.4.6 Laser stratospheric and space communications with RIS technology
  • 8.5 Short range and indoor OWC and its RIS: research advances through 2026 and earlier
    • 8.5.1 Indoors and short range in air
    • 8.5.2 Leveraging other indoor and short-range outdoor systems such as LiFi with RIS
  • 8.6 Potentially 6G optical materials
  • 8.7 Metalenses for 6G including advances through
  • 8.8 Mirror array ORIS design and application advances through

9. 6G Morphing Flexible Intelligent Metasurfaces FIM, 6G hypersurfaces, metamaterial basics

  • 9.1 Overview
  • 9.2 Appraisal of 6G-related metamaterial research major advances through
    • 9.2.1 New advances in metamaterial design
    • 9.2.2 Hypersurfaces, stacked intelligent metasurfaces, swarms, bifunctional metasurfaces
    • 9.2.3 Optimal metamaterial substrates and low loss, 6G glass TIRS
    • 9.2.4 Optimal metamaterial substrates including transparent 6G glass
  • 9.3 Metamaterial basics
    • 9.3.1 The meta-atom and patterning options
    • 9.3.2 Material and functional families
    • 9.3.3 Metamaterial reflect-arrays for 5G and 6G Communications
    • 9.3.4 Metamaterial patterns and materials through
    • 9.3.5 Six formats of communications metamaterial with examples
  • 9.4 Metasurface basics
    • 9.4.1 Metasurface design, operation and RIS
    • 9.4.2 How metamaterial RIS hardware operates
    • 9.4.3 RIS and reflect-array construction and potential capability
    • 9.4.4 All dielectric and non-linear dielectric metasurfaces
  • 9.5 The long-term picture of metamaterials overall
  • 9.6 Emerging applications of GHz, THz, infrared and optical metamaterials
  • 9.7 Thermal metamaterials
  • 9.8 SWOT appraisal for metamaterials and metasurfaces generally
  • 9.9 Morphing Flexible Intelligent Metasurfaces FIM basics and their research through
    • 9.9.1 Basics
    • 9.9.2 FIM network topology and potential applications targetted
    • 9.9.3 Many FIM research advances through 2026 assessed
    • 9.9.4 SWOT appraisal of 6G FIM

10. RIS and reflect-array manufacture, inspection, testing, cost breakdown

  • 10.1 Thin film and transparent electronics state-of-the-art
  • 10.2 Trend from discrete boards, stacked films to full smart material integration
  • 10.3 Importance of flexible, laminar and 2D energy harvesting and sensing
  • 10.4 How manufacturing technologies differ for 6G RIS optical, low or high THz
    • 10.4.1 Candidates: nano-imprinting, nano-lithography, lithography, gravure, inkjet, screen, flexo, spray, other
    • 10.4.2 Special case: 3D printing with electron beam evaporation
    • 10.4.3 Ultra-fast laser system
  • 10.5 6G RIS inspection and testing: new advances
    • 10.5.1 Testing challenges
    • 10.5.2 Progress in RIS inspection
  • 10.6 RIS cost analysis
    • 10.6.1General assessment
    • 10.6.2 NEC and other costed case studies
    • 10.6.3 Outdoor semi-passive and active RIS cost analysis at high areas of deployment
    • 10.6.4 Indoor semi-passive RIS cost analysis at volume

11. 6G RIS companies : products, plans, patents, Zhar appraisals

  • 11.1 Overview and patenting
    • 11.1.1 Rapidly changing situation 2025-6
    • 11.1.2 RIS patenting and literature trends
  • 11.2 AGC Japan
  • 11.3 Alcan Systems Germany
  • 11.4 Alibaba China
  • 11.5 Alphacore USA
  • 11.6 China Telecom China Mobile, China Unicom, Huawei, ZTE, Lenovo, CICT China collaboration
  • 11.7 Ericsson Sweden
  • 11.8 Fractal Antenna Systems USA
  • 11.9 Greenerwave France
  • 11.10 Huawei China
  • 11.11 ITOCHU Japan
  • 11.12 Kymeta Corp. USA
  • 11.13 Kyocera Japan
  • 11.14 Metacept Systems USA
  • 11.15 Metawave USA
  • 11.16 NEC Japan
  • 11.17 Nokia Finland with LG Uplus South Korea
  • 11.18 NTT DoCoMo and NTTJapan
  • 11.19 Orange France
  • 11.20 Panasonic Japan
  • 11.21 Pivotal Commware USA
  • 11.22 Qualcomm USA
  • 11.23 Samsung Electronic South Korea
  • 11.24 Sekisui Japan
  • 11.25 SensorMetrix USA
  • 11.26 SK Telecom South Korea
  • 11.27 Sony Japan
  • 11.28 Teraview USA
  • 11.29 Vivo Mobile Communications China
  • 11.30 VTT Finland
  • 11.31 ZTE China