6G時代基礎設施與客戶設備的散熱材料：商業機會、市場與技術（2026-2046）

摘要

隨著每一代無線通訊技術的革新，我們如何應對日益嚴峻的熱管理課題？發熱基礎設施日益增多，客戶端設備日益緊湊，而可用於熱管理的空間卻日益縮小。

需要對6G以外的領域進行詳細分析，前沿研究是當務之急

disruptiveZhar Research執行長Peter Harrop博士指出，為了應對大量小型客戶端設備（例如 "協作設備" ）的熱課題，最佳實踐必須超越當前的通訊領域。事實上，基地台可能會被整合到多功能摩天大樓和平流層太陽能無人機中，而客戶端設備也正在轉變為穿戴式裝置和植入物。這將使6G專用熱管理的概念變得越來越少見。本報告認為，這種情況為新型導熱材料和熱管理原理帶來了龐大的商機。

本報告深入研究了6G通訊時代基礎設施和客戶端設備的導熱材料市場，透過11個章節、11個SWOT分析、32條涵蓋2026-2046年的預測線以及33張新的資訊圖，總結了新的商機、技術和市場前景。

目錄

第1章 摘要整理·總論

• 報告目標和假設
• 方法論
• 6G 通訊中散熱材料機會的 SWOT 評估
• 冷卻需求成長的一些原因
• 冷卻工具包：多功能化趨勢與最佳固態冷卻工具
• 固態冷卻的性質及其在 6G 及整體應用中的優先考慮
• 關鍵結論：6G 的散熱要求
• 關鍵結論：6G 基礎設施和客戶端設備的冷卻材料
• 關鍵結論：透過傳導和對流散熱的材料
• 6G 材料和五金以及分立元件冷卻路線圖
• 32 項市場預測： 2026-2046
  • 6G 基礎設施與客戶端設備熱管理材料及結構的市場規模
  • 6G 電介質和熱材料市場規模（區域佔有率）
  • 5G 與 6G 熱界面材料市場
• 市場背景預測：2025-2046
  • 全球冷卻模組市場（Seven Technologies 數據）
  • 商用產品中的地面輻射冷卻性能
  • 5G 與 6G 基地台市場（年出貨量）
  • 6G 基地台市場規模（若成功）
  • 6G RIS 市場規模（主動和三個半被動類別）
  • 6G 全被動式透明超材料反射器陣列市場
  • 全球智慧型手機銷售（若 6G 成功）
  • 空調市場規模
  • 全球暖通空調市場冰箱、冷凍櫃和其他冷卻設備
  • 冰箱和冷凍櫃市場規模
  • 固定電池市場規模及冷卻需求

第二章 引言

• 概述
• 6G 的關鍵熱管理機遇
• 6G 的冷卻、熱障和先進的熱支援技術
• 範例
  • 嚴苛的新型微晶片冷卻需求的出現
  • 6G 電子元件和智慧型手機的冷卻
  • 6G 基地台的冷卻，包括能量收集和存儲
  • 6G 基礎設施的太陽能板和光伏外殼的冷卻
  • 6G 基礎設施中大型電池的熱管理
  • 2024 年至 2025 年進展範例2025
• 12 種固態冷凍原理與 10 種功能對比
• 三種冷凍熱控制技術趨勢及成熟度曲線：2026、2036 和 2046
• 傳統冷凍技術與新興冷凍技術對比
• 廣泛使用和被提議的不理想材料

第三章：被動式晝夜放射製冷 (PDRC)

• 概述
• PDRC 基礎知識
• 輻射冷凍材料的結構與配方研究與分析
• 潛在優勢與應用
• 2025 年前的其他關鍵進展
• PDRC 商業化的公司
  • 美國 3M 公司
  • 德國 BASF 公司
  • i2Cool美國
  • LifeLabs 美國
  • Plasmonics 美國
  • Radicool 日本、馬來西亞等
  • SkyCool Systems 美國
  • SolCold 以色列
  • 從美國麻州大學阿默斯特分校分拆而來
  • SRI 美國
• PDRC SWOT 報告

第四章 自適應、可切換、可調、Janus 和反斯托克斯固態冷卻

• SWOT 分析概述
• 輻射冷卻技術成熟度曲線
• 自適應和可切換輻射冷卻
• 採用雙面元件的可調式輻射冷卻：Janus 發射器 (JET) 的進展和 SWOT 分析
• 反斯托克斯螢光冷卻及其 SWOT 分析評估

第五章 相變冷卻與熱冷卻

• 結構相變冷卻及鐵電相變冷卻模式及材料
• 固態相變冷卻：特定應用的潛在競爭機會
• 熱冷卻相關物理原理
• 熱冷卻的工作原理
• 與熱電冷卻的比較及有前景的熱冷卻技術的識別
• 推進熱冷卻應用的若干建議
• 電熱冷卻
• 磁熱冷卻的SWOT評估
• 機械熱冷卻（彈性熱、壓力熱和扭轉熱冷卻）
• 多熱冷卻的進展2025

第六章：賦能技術：超材料及其他先進光子冷卻：新材料與裝置

• 超材料
• 先進光子冷卻與防熱

第七章：熱電冷卻和熱電發電的未來：作為其他固態冷卻技術的用戶和提供者

• 基礎知識
• 熱電材料
• 廣域柔性熱電冷卻：尚存的市場空白
• 建築輻射冷卻：熱電收集與多功能化
• 熱電冷卻器 (TEC) 和熱電發電機 (TEG) 散熱課題：不斷發展的解決方案
• 熱電冷卻與收集技術的 20 項進展與回顧冷凍
• 前瞻發展
• 82家珀爾帖熱電模組及產品製造商

第八章：未來的蒸發式、熔融式和流動式冷卻：用於6G智慧型手機、其他6G客戶端設備和6G基礎設施的熱管、熱水凝膠

• 概述：用於6G智慧型手機的蒸汽冷卻和用於6G的水凝膠冷卻
• 相變冷卻的背景
• 熱管和均熱板
• 用於6G通訊的水凝膠

第九章：導熱界面材料 (TIM) 和其他新興材料應對6G傳導冷卻課題

• 概述：從導熱黏合劑到用於6G的導熱混凝土
• 關鍵使用導電材料解決熱課題的考量因素
• 導熱界面材料 (TIM)
• 聚合物選項：矽基或碳基
• 導熱聚合物的進展：2025 年及以後

第 10 章：用於 6G 的先進熱障和絕緣材料及離子凝膠

• 概述
• 用於 6G 的無機、有機和複合絕緣材料
• 熱障膜與多功能絕緣窗
• 散熱器和其他被動冷卻絕緣材料
• 用於 6G 應用的離子凝膠，包括導電絕緣材料

第 11 章 熱超材料：概述

• 章節目標
• 熱超材料
• 主要發現：市場定位
• 主要發現：關鍵配方、功能和製造技術
• 132 個近期熱超材料研究實例中配方的流行度
• 用於靜態到動態熱傳遞的超材料
• 靜態輻射冷卻應用：超材料是一種選擇
• 熱超材料和冷卻路線圖（按市場和技術劃分）
• 熱超元件市場：依應用劃分
• 電磁超元件市場
• 電磁超元件市場：依應用劃分
• 電磁超元件市場：電磁 vs. 熱

Summary

How can we deal with the increasing problems of thermal management with every new generation of wireless communications? We get ever more infrastructure generating more heat and more compact client devices offering less space for thermal management. The new 533-page, commercially-oriented Zhar Research report, "6G Communications Thermal Materials for Infrastructure and Client Devices: Opportunities, Markets, Technology 2026-2046" has the answers and forecasts the large market, mainly for new cooling materials, that will emerge.

Incremental then disruptive

Dr. Peter Harrop, CEO of Zhar Research, puts it this way. "Initially, 6G will be an incremental improvement mainly using, and limited by, 5G frequencies and largely served by improved 5G thermal solutions. Ubiquity is a top priority for 6G. No more patchy coverage in cities from London to Tokyo and dead in the countryside and ocean. Much more self-powering, thermally managed, will avoid the considerable cost of running power to expanding terrestrial infrastructure and the impossibility of running power to burgeoning aerospace infrastructure for 6G. However, 6G Phase Two, around 2035, must be a whole new ball game to achieve real financial success with startlingly better performance and reach. That means disruptive new thermal solutions for everything from active, transparent, 360-degree reconfigurable intelligent surfaces to reinvented, "must have" personal electronics."

Detailed analysis required beyond 6G, with latest research prioritised

He points out that, to meet the thermal challenges, including in more compact client devices in huge numbers, such as things-collaborating-with-things, we must benchmark best practice far beyond telecommunications today. Indeed, as base stations sometimes vanish into multipurpose high-rise buildings and stratospheric solar drones and as client devices vanish into wearables, implants and more, thermal management uniquely for 6G will become less common. The report finds great opportunities for new thermal materials and principles in all this. Necessarily, the report is very detailed, involving 11 chapters, 11 SWOT appraisals, 32 forecast lines 2026-2046 and 33 new infograms. Vitally, it analyses the flood of new research advances through 2025 because out-of-date reports can be very misleading in this rapidly evolving subject. Indeed, the report is continuously updated so you only get the latest.

Quick read

The 48-page Executive Summary and Conclusions is sufficient for those with limited time. See the emerging needs, 19 primary conclusions, detailed 20-year roadmaps in 6 lines and those 32 forecasts with explanation, for example. The radically new cooling technologies such as Passive Daylight Radiative Cooling PDRC, five forms of caloric cooling and wide-area thermoelectrics are introduced together with combinations. See why solid-state cooling comes to the fore. A pie chart prioritises solid-state-cooling materials in number of latest research advances, revealing some issues with toxigens, for this report is unbiassed. Parameter comparisons and forecasts of their improvement are presented.

Tougher and more varied thermal needs arriving

Chapter 2. Introduction (40 pages) explains the changing view of what 6G seeks to achieve and when and the trend to smart thermal materials to assist. From graphics, quickly absorb the severe new microchip cooling requirements arriving, cooling 6G electronic components, smartphones and 6G base stations including cooling solar panels and cladding for 6G infrastructure, and thermal management of large batteries for 6G infrastructure. There are hype curves for the thermal materials by year ahead, and a table where twelve solid-state cooling operating principles are compared by 10 capabilities. See examples of advances in 2024-5. Indeed, every chapter examines latest advances.

New approaches to cooling arriving and eagerly sought

Cooling that does not need power will be as important as self-powered infrastructure in avoiding prohibitive costs for vast 6G infrastructure everywhere. Therefore Chapter 2 covers Passive Daytime Radiative Cooling (PDRC) ejecting heat from Earth through the near-infrared window. Understand 40 important advances in 2024-5 and how ten companies are commercialising PDRC. 103 pages are needed due to the wide relevance to 6G, from enhancing its thermoelectric energy harvesting to cooling base stations and buildings. Three SWOT appraisals respectively address passive radiative cooling in general, Janus effect for thermal management and anti-Stokes thermal management.

Ferroic cooling will become important

Chapter 5. Phase Change and Particularly Caloric Cooling shows how the conventional phase changes between gas, liquid and solid have limited relevance to 6G but ferroic phase change called caloric cooling could be very valuable. Learn which forms are most promising and what research achieved through 2025. The 77 pages present pie charts, SWOT appraisals and tables pulling it all together.

Thermoelectrics reinvented

Chapter 7, in 53 pages, covers future thermoelectric cooling such as wide area versions. Thermoelectric harvesting for 6G "Zero emission devices ZED" also appears. Its cold side is becoming a user of new forms of solid-state cooling and it can power active forms of solid-state cooling, all applicable to 6G Communications. There is even analysis of new research on multifunctional cooling and multi-mode cooling, both including thermoelectrics as a part because 6G thermal management must become much more sophisticated, such are the challenges it must address.

Evaporative, melting and flow cooling

Chapter 8. takes 38 pages to cover future evaporative, melting and flow cooling including heat pipes, new thermal hydrogels for 6G client devices and infrastructure. Infograms, commentary and comparisons make sense of it all. Chapter 9 then takes 57 pages to analyse Thermal Interface Materials TIM and other emerging materials for 6G conductive cooling challenges. Then Chapter 10 (30 pages) covers advanced heat shielding, thermal insulation and new ionogels for 6G and Chapter 11 (26 pages) gives the big picture of thermal metamaterials for benchmarking into 6G. All these chapters include much 2025 research.

Unique, essential reference

This Zhar Research report, "6G Communications Thermal Materials for Infrastructure and Client Devices: Opportunities, Markets, Technology 2026-2046" is your essential up-to-date and in-depth source as you participate in the lucrative new 6G thermal materials market that is emerging. Product and system integrators and operators will also value the report.

CAPTION: Dielectric and thermal materials for 6G value market % by location 2029-2046. Source Zhar Research report, "6G Communications Thermal Materials for Infrastructure and Client Devices: Opportunities, Markets, Technology 2026-2046".

Table of Contents

1. Executive summary and conclusions

• 1.1. Purpose of this report and assumptions
• 1.2. Methodology of this analysis
• 1.3. SWOT appraisal of 6G Communications thermal material opportunities
• 1.4. Some reasons for the escalating need for cooling
• 1.5. Cooling toolkit, trend to multifunctionality with best solid-state cooling tools shown red
• 1.6. The nature of solid-state cooling and why it is now a priority for 6G and generally
• 1.7. Primary conclusions: 6G thermal requirements
• 1.8. Primary conclusions: Materials for making cold in 6G infrastructure and client devices
  • 1.8.1. General situation
  • 1.8.2. Leading candidate materials and structures compared
  • 1.8.3. Leading materials in number of latest research advances on solid state cooling
  • 1.8.4. Research pipeline of solid-state cooling by topic vs technology readiness level
  • 1.8.5. Typical best reported temperature drop achieved by technology 2000-2046 extrapolated
  • 1.8.6. SWOT appraisal of Passive Daytime Radiative Cooling PDRC and pie chart of leading materials
  • 1.8.7. SWOT appraisal of electrocaloric cooling and pie chart of leading materials
  • 1.8.8. SWOT appraisal of elastocaloric cooling and leading materials
  • 1.8.9. SWOT appraisal of thermoelectric cooling and pie chart of leading materials
• 1.9. Primary conclusions: Materials for removing heat by conduction and convection
• 1.10. Roadmaps of 6G materials and hardware and separately cooling 2026-2046
• 1.11. Market forecasts in 32 lines 2026-2046
  • 1.11.1. Thermal management material and structure for 6G infrastructure and client devices $ billion 2026-2046
  • 1.11.2. Dielectric and thermal materials for 6G value market % by location 2029-2046
  • 1.11.3. 5G vs 6G thermal interface material market $ billion 2025-2046
• 1.12. Background forecasts 2025-2046
  • 1.12.1. Cooling module global market by seven technologies $ billion 2025-2046
  • 1.12.2. Terrestrial radiative cooling performance in commercial products W/sq. m 2025-2046
  • 1.12.3. Market for 6G vs 5G base stations units millions yearly 2025-2046
  • 1.12.4. Market for 6G base stations market value $bn if successful 2025-2046
  • 1.12.5. 6G RIS value market $ billion: active and three semi-passive categories 2029-2046
  • 1.12.6. 6G fully passive transparent metamaterial reflect-array market $ billion 2029-2046
  • 1.12.7. Smartphone billion units sold globally 2023-2046 if 6G is successful
  • 1.12.8. Air conditioner value market $ billion 2025-2046
  • 1.12.9. Global market for HVAC, refrigerators, freezers, other cooling $ billion 2025-2046
  • 1.12.10. Refrigerator and freezer value market $ billion 2025-2046
  • 1.12.11. Stationary battery market $ billion and cooling needs 2025-2046

2. Introduction

• 2.1. Overview
  • 2.1.1. Why 6G brings a much bigger opportunity for thermal management and it is mainly cooling
  • 2.1.2. 6G cooling challenge in context of evolution of other cooling increasingly becoming laminar and solid state
  • 2.1.3. Need for cooling in general becomes much larger and often different in nature: the 6G smartphone example
  • 2.1.4. Some of the reasons for much greater need for thermal materials in 6G
  • 2.1.5. How cooling technology will trend to smart materials 2025-2046
• 2.2. Location of the primary 6G thermal management opportunities
  • 2.2.1. Situation with primary 6G infrastructure and client devices
  • 2.2.2. Example RIS for massive MIMO base station: Tsinghua University, Emerson
• 2.3. Cooling, heat barrier and advanced thermally supportive technologies for 6G covered in this report
• 2.4. Examples
  • 2.4.1. Severe new microchip cooling requirements arriving
  • 2.4.2. Cooling 6G electronic components and smartphones
  • 2.4.3. Cooling 6G base stations including their energy harvesting and storage
  • 2.4.4. Cooling solar panels and photovoltaic cladding for 6G infrastructure
  • 2.4.5. Large battery thermal management for 6G infrastructure
  • 2.4.6. Examples of advances in 2024-5
• 2.5. Twelve solid-state cooling operating principles compared by 10 capabilities
• 2.6. Attention vs maturity of cooling and thermal control technologies 3 curves 2026, 2036, 2046
• 2.7. Comparison of traditional and emerging refrigeration technologies
• 2.8. Undesirable materials widely used and proposed: this is an opportunity for you

3. Passive daytime radiative cooling (PDRC)

• 3.1. Overview
• 3.2. PDRC basics
• 3.3. Radiative cooling materials by structure and formulation with research analysis
• 3.4. Potential benefits and applications
  • 3.4.1. Overall opportunity and progress
  • 3.4.2. Transparent PDRC for facades, solar panels and windows including 8 advances in 2024
  • 3.4.3. Wearable PDRC, textile and fabric with 15 advances in 2024-5 and SWOT
  • 3.4.4. PDRC cold side boosting power of thermoelectric generators
  • 3.4.5. Color without compromise
  • 3.4.6. Aerogel and porous material approaches
  • 3.4.7. Environmental and inexpensive PDRC materials development
• 3.5. Other important advances in 2025 and earlier
  • 3.5.1. 40 important advances in 2024-5
  • 3.5.2. Advances in 2023
• 3.6. Companies commercialising PDRC
  • 3.6.1. 3M USA
  • 3.6.2. BASF Germany
  • 3.6.3. i2Cool USA
  • 3.6.4. LifeLabs USA
  • 3.6.5. Plasmonics USA
  • 3.6.6. Radicool Japan, Malaysia etc.
  • 3.6.7. SkyCool Systems USA
  • 3.6.8. SolCold Israel
  • 3.6.9. Spinoff from University of Massachusetts Amherst USA
  • 3.6.10. SRI USA
• 3.7. PDRC SWOT report

4. Self-adaptive, switchable, tuned, Janus and Anti-Stokes solid state cooling

• 4.1. Overview of the bigger picture with SWOT
• 4.2. Maturity curve of radiative cooling technologies
• 4.3. Self-adaptive and switchable radiative cooling
  • 4.3.1. The vanadium phase change approaches
  • 4.3.2. Alternative using liquid crystal
• 4.4. Tuned radiative cooling using both sides: Janus emitter JET advances and SWOT
• 4.5. Anti-Stokes fluorescence cooling with SWOT appraisal

5. Phase change and particularly caloric cooling

• 5.1. Structural and ferroic phase change cooling modes and materials
• 5.2. Solid-state phase-change cooling potentially competing with other forms in named applications
• 5.3. The physical principles adjoining caloric cooling
• 5.4. Operating principles for caloric cooling
• 5.5. Caloric compared to thermoelectric cooling and winning caloric technologies identified
• 5.6. Some proposals for work to advance the use of caloric cooling
• 5.7. Electrocaloric cooling
  • 5.7.1. Overview and SWOT appraisal
  • 5.7.2. Operating principles, device construction, successful materials and form factors
  • 5.7.3. Electrocaloric material popularity in latest research with explanation
  • 5.7.4. Giant electrocaloric effect
  • 5.7.5. Electrocaloric cooling: issues to address
  • 5.7.6. 10 important advances in 2025
  • 5.7.7. 58 earlier advances
• 5.8. Magnetocaloric cooling with SWOT appraisal
• 5.9. Mechanocaloric cooling (elastocaloric, barocaloric, twistocaloric) cooling
  • 5.9.1. Elastocaloric cooling overview: operating principle, system design, applications, SWOT
  • 5.9.2. Elastocaloric advances in 2024-5
  • 5.9.3. Barocaloric cooling
• 5.10. Multicaloric cooling advances in 2025

6. Enabling technology: Metamaterial and other advanced photonic cooling: emerging materials and devices

• 6.1. Metamaterials
  • 6.1.1. Metamaterial and metasurface basics and thermal metamaterial advances in 2025
  • 6.1.2. The meta-atom, patterning and functional options
  • 6.1.3. SWOT assessment for metamaterials and metasurfaces generally
  • 6.1.4. Metamaterial energy harvesting may power 6G active cooling
  • 6.1.5. Thermal metamaterial with 14 advances in 2025 and 2024
• 6.2. Advanced photonic cooling and prevention of heating

7. Future thermoelectric cooling and thermoelectric harvesting as a user of and power provider for other solid-state cooling

• 7.1. Basics
  • 7.1.1. Operation, examples, SWOT appraisal
  • 7.1.2. Thermoelectric cooling and temperature control applications 2026 and 2046
  • 7.1.3. SWOT appraisal of thermoelectric cooling, temperature control, harvesting for 6G
• 7.2. Thermoelectric materials
  • 7.2.1. Requirements
  • 7.2.2. Useful and misleading metrics
  • 7.2.3. Quest for better zT performance which is often the wrong approach
  • 7.2.4. Some alternatives to bismuth telluride being considered
  • 7.2.5. Non-toxic and less toxic thermoelectric materials, some lower cost
  • 7.2.6. Ferron and spin driven thermoelectrics
• 7.3. Wide area and flexible thermoelectric cooling is a gap in the market for you to address
  • 7.3.1. The need and general approaches
  • 7.3.2. Advances in flexible and wide area thermoelectric cooling in 2025 and earlier
  • 7.3.3. Wide area or flexible TEG research 40 examples that may lead to similar TEC
• 7.4. Radiation cooling of buildings: multifunctional with thermoelectric harvesting
• 7.5. The heat removal problem of TEC and TEG - evolving solutions
• 7.6. 20 advances in thermoelectric cooling and harvesting involving cooling and a review
• 7.7. Earlier advances
• 7.8. 82 Manufactures of Peltier thermoelectric modules and products

8. Future evaporative, melting and flow cooling including heat pipes, thermal hydrogels for 6G smartphones, other 6G client devices, 6G infrastructure

• 8.1. Overview: 6G smartphone vapor cooling and hydrogel cooling for 6G
• 8.2. Background to phase change cooling
• 8.3. Heat pipes and vapor chambers
  • 8.3.1. Definitions and relevance to 6G infrastructure and client devices
  • 8.3.2. Focus of vapor chamber research relevant to 6G success
  • 8.3.3. Research on relevant heat pipes, vapor chambers and allied: 39 advances
  • 8.3.4. Thermal storage heat pipes: nano-enhanced phase change material (NEPCM) for device thermal management
• 8.4. Hydrogels for 6G Communications
  • 8.4.1. Thermal hydrogels: context, ambitions and limitations
  • 8.4.2. Hydrogels cooling suitable for 6G microelectronics and solar panels: Five advances
  • 8.4.3. Thermogalvanic hydrogel for synchronous evaporative cooling
  • 8.4.4. Hydrogels in architectural cooling that can involve 6G functions: advances
  • 8.4.5. Aerogel and hydrogel together for cooling
  • 8.4.6. Other emerging cooling hydrogels for 6G microchips, power electronics, data centers, large batteries, cell towers and buildings

9. Thermal Interface Materials TIM, other emerging materials for 6G conductive cooling challenges

• 9.1. Overview: thermal adhesives to thermally conductive concrete for 6G
  • 9.1.1. TIM, heat spreaders from micro to heavy industrial: activity of 17 companies
  • 9.1.2. 17 examples of research advances in 2025 and 2024 relevant to 6G transistors up to buildings
  • 9.1.3. Annealed pyrolytic graphite: progress in 2025 and 2024 as microelectronic TIM
  • 9.1.4. Thermally conductive concrete and allied work
• 9.2. Important considerations when solving thermal challenges with conductive materials
  • 9.2.1. Bonding or non-bonding
  • 9.2.2. Varying heat
  • 9.2.3. Electrically conductive or not
  • 9.2.4. Placement
  • 9.2.5. Environmental attack
  • 9.2.6. Choosing a thermal structure
  • 9.2.7. Research on embedded cooling
• 9.3. Thermal Interface Material TIM
  • 9.3.1. General
  • 9.3.2. Seven current options compared against nine parameters
  • 9.3.3. Nine important research advances in 2025 and 2024 relevant to 6G
  • 9.3.4. Thermal pastes compared
  • 9.3.5. TIM and other examples today: Henkel, Momentive, ShinEtsu, Sekisui, Fujitsu, Suzhou Dasen
  • 9.3.6. 37 examples of TIM manufacturers
  • 9.3.7. Thermal interface material trends as needs change: graphene, liquid metals etc.
• 9.4. Polymer choices: silicones or carbon-based
  • 9.4.1. Comparison
  • 9.4.2. Silicone parameters, ShinEtsu, patents
  • 9.4.3. SWOT appraisal for silicone thermal conduction materials
• 9.5. Thermally conductive polymer advances in 2025 and earlier
  • 9.5.1. Overview
  • 9.5.2. Examples of companies making thermally conductive additives
  • 9.5.3. Thermally conductive polymers: pie charts of host materials and particulates prioritised in research
  • 9.5.4. Important progress in 2025 and earlier

10. Advanced heat shielding, thermal insulation and ionogels for 6G

• 10.1. Overview
• 10.2. Inorganic, organic and composite thermal insulation for 6G
• 10.3. Heat shield film and multipurpose thermally insulating windows
• 10.4. Thermal insulation for heat spreaders and other passive cooling
  • 10.4.1. W.L.Gore enhancing graphite heat spreader performance
  • 10.4.2. Protecting smartphones from heat
  • 10.4.3. 20 companies involved in silica aerogel thermal insulation of devices
• 10.5. Ionogels for 6G applications including electrically conductive thermal insulation
  • 10.5.1. Basics for 6G
  • 10.5.2. Eight ionogel advances in 2025 and 2024

11. Thermal metamaterials - the big picture

• 11.1. Purpose of this chapter
  • 11.1.1. General
  • 11.1.2. Types of metamaterial thermal management materials by function
  • 11.1.3. Applications analysed from sensors to surgical robots and spacecraft
  • 11.1.4. Three families of metamaterials overlap
• 1.2. Thermal metamaterials
  • 11.2.1. Some of the drivers of commercialisation of thermal metamaterials
  • 11.2.2. Cooling toolkit, 7 metamaterial-enabled options in blue text, trend to multifunctionality
  • 11.2.3. Examples of thermal metamaterials in 2025 advances
• 11.3. Primary conclusions; market positioning
• 11.4. Primary conclusions: leading formulations, functionality and manufacturing technologies
• 11.5. Popularity by formulation in 132 examples of latest thermal metamaterial research
• 11.6. Static to dynamic heat transfer using metamaterials
• 11.7. Static radiative cooling materials showing metamaterials as one of many options
• 11.8. Thermal metamaterial and cooling roadmap by market and by technology 2025-2045
• 11.9. Thermal meta-device market $ billion 2025-2045 by application segment
• 11.10. Electromagnetic meta-device market $ billion 2025-2045
• 11.11. Electromagnetic meta-device market $ billion 2025-2045 by application segment
• 11.12. Meta-device market electromagnetic vs thermal 2025-2045