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市場調查報告書
商品編碼
1965365

被動式和互連式電子元件市場－全球產業規模、佔有率、趨勢、機會、預測：按類型、應用、地區和競爭格局分類，2021-2031年

Passive & Interconnecting Electronic Components Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Type, By Application, By Region & Competition, 2021-2031F
出版日期: | 出版商: TechSci Research | 英文 182 Pages | 商品交期: 2-3個工作天內

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簡介目錄

全球被動和連接電子元件市場預計將從 2025 年的 1967.2 億美元成長到 2031 年的 2,745.1 億美元，複合年成長率為 5.71%。

這些元件是電路的基本硬體；電阻器和電容器等被動元件無需外部電源即可控制訊號，而印刷基板和連接器等互連元件則連接各種系統元素。推動成長的關鍵因素包括電動車產量增加、工業自動化普及以及先進通訊基礎設施的發展。正如電子元件工業協會 (ECIA) 指出，全球排名前 50 名的授權分銷商在 2024 年實現了總合% 的銷售額成長，這主要得益於亞洲市場的強勁成長勢頭。

市場概覽
預測期 2027-2031
市場規模：2025年 1967.2億美元
市場規模：2031年 2745.1億美元
複合年成長率：2026-2031年 5.71%
成長最快的細分市場 醫療保健
最大的市場 亞太地區

儘管市場呈現上升趨勢，但由於地緣政治貿易分歧導致全球供應鏈持續波動，市場仍面臨許多重大障礙。這些波動造成了關鍵原料供應和物流路線的不確定性，進而導致生產成本不穩定。這種不穩定性會擾亂生產計劃，限制各行業充分利用不斷成長的需求的能力。因此，供應鏈的複雜性成為市場進一步擴張的持續障礙，阻礙了相關人員充分發揮當前產業和技術趨勢所帶來的潛力。

市場促進因素

電動車和自動駕駛汽車的激增正成為被動式和連接式電子元件市場的主要驅動力，催生了對能夠承受高電壓和熱應力的高可靠性硬體的需求。現代電動驅動系統顯著增加了對多層陶瓷電容器和功率電阻器的需求，以高效管理車載充電器和電池系統。根據國際能源總署（IEA）於2024年4月發布的《2024年全球電動車展望》，2023年電動車銷量將達到約1,400萬輛，引發了對汽車級零件需求的激增。汽車產業的這項轉型正在直接強化零件生態系統，IPC數據顯示，2024年8月北美印刷基板總出貨量年增35%，也印證了這一點。

同時，5G通訊基礎設施的部署顯著增加了對高頻互連和高頻被動元件的需求。小型基地台和高密度天線陣列的部署需要小型化的濾波器和電感器，以便在不增加基地台尺寸的情況下，在更寬的頻寬內保持訊號完整性。為了滿足消費者對網路連接的需求，這項基礎設施正在迅速擴展。根據愛立信2024年6月發布的《行動報告》，光是2024年第一季，全球服務供應商就新增了1.6億5G用戶，這推動了對網路密度所需的專用連接器和被動元件的持續採購。

市場挑戰

地緣政治貿易分散化導致全球供應鏈持續波動，這是全球被動和互連電子元件市場成長的主要障礙。這種碎片化正在擾亂現有的物流網路，並破壞成品互連件和關鍵原料的供應。隨著關稅和貿易壁壘的增加，製造商面臨採購成本大幅上升和前置作業時間延長的雙重壓力，導致定價模式不穩定，關鍵生產計劃延遲。因此，供應商難以維持滿足工業自動化和電動車產業日益成長的需求所需的產量，被迫縮減潛在市場佔有率。

此次衝擊的嚴重性已在近期整個產業的商業風險評估中得到體現。根據IPC 2024年8月的數據，44%的電子產品製造商表示「非常擔憂」或「極度擔憂」關稅和貿易政策對其營運的影響。這項數據凸顯了地緣政治不穩定如何迫使企業將重點放在風險規避而非擴大產能上。這些貿易趨勢為製造業生態系統帶來了巨大的不確定性，直接限制了該行業掌握需求成長機會的能力，並有效地減緩了整體市場成長動能。

市場趨勢

在高效能運算叢集和人工智慧加速器對更高密度需求的推動下，元件尺寸縮小至極小體積的趨勢正在加速發展。隨著資料中心架構不斷演進以應對海量處理負載，製造商正在擴大超小型多層陶瓷電容器（MLCC）的生產，電容器能夠在不佔用過多基板空間的情況下實現高容量。這種向高密度被動元件的結構性轉變也反映在主要供應商的收入結構中。根據《朝鮮日報》2025年11月發表的題為《AI伺服器和電動汽車需求驅動MLCC超級週期》的報導報道，三星電子機械公司報告稱，其用於AI伺服器的MLCC銷售佔比將從2023年的3%成長到2024年的9%，這凸顯了行業向更小、更高附加值元件的轉型。

同時，隨著我們適應循環經濟原則和全球脫碳需求，環保永續材料成分的轉型正在重新定義製造業的優先事項。供應商正逐步重新設計產品線，利用回收材料和生物基聚合物，同時提高組件效率，以減少終端用戶營運中的碳足跡。這種對環境管理的承諾正在顯著減少溫室氣體排放。例如，根據TDK公司於2025年8月發布的《2025年永續發展報告》，該公司產品在截至2025年3月的會計年度中減少了703.8萬噸二氧化碳排放，比上年度增加了35.2%。這顯示環保電子解決方案的影響力日益增強。

目錄

第1章概述

第2章：調查方法

第3章執行摘要

第4章：客戶心聲

第5章：全球被動和互連電子元件市場展望

  • 市場規模及預測
    • 按金額
  • 市佔率及預測
    • 依類型（被動元件、連接元件）
    • 依應用領域（家用電子電器、汽車、醫療、IT/電信、工業、航太/國防）
    • 按地區
    • 按公司（2025 年）
  • 市場地圖

第6章：北美被動和互連電子元件市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 北美洲：國別分析
    • 美國
    • 加拿大
    • 墨西哥

第7章：歐洲被動和互連電子元件市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 歐洲：國別分析
    • 德國
    • 法國
    • 英國
    • 義大利
    • 西班牙

第8章：亞太地區被動及互連電子元件市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 亞太地區：國別分析
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳洲

第9章：中東和非洲被動及互連電子元件市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 中東與非洲：國別分析
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 南非

第10章：南美被動及互連電子元件市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 南美洲：國別分析
    • 巴西
    • 哥倫比亞
    • 阿根廷

第11章 市場動態

  • 促進因素
  • 任務

第12章 市場趨勢與發展

  • 併購
  • 產品發布
  • 近期趨勢

第13章 全球被動及互連電子元件市場：SWOT分析

第14章：波特五力分析

  • 產業競爭
  • 新進入者的潛力
  • 供應商的議價能力
  • 顧客權力
  • 替代品的威脅

第15章 競爭格局

  • Murata Manufacturing Co., Ltd.
  • TDK Corporation
  • Yageo Corporation
  • Vishay Intertechnology, Inc.
  • KYOCERA AVX Components Corporation
  • TE Connectivity Ltd.
  • Panasonic Corporation
  • Samsung Electronics Co., Ltd.
  • Littelfuse, Inc.
  • Rohm Co. Ltd

第16章 策略建議

第17章：關於研究公司及免責聲明

簡介目錄
Product Code: 24518

The Global Passive & Interconnecting Electronic Components Market is projected to expand from USD 196.72 Billion in 2025 to USD 274.51 Billion by 2031, reflecting a compound annual growth rate of 5.71%. These components serve as the fundamental hardware for electrical circuits, with passive devices like resistors and capacitors regulating signals independent of external power, while interconnects such as printed circuit boards and connectors bridge various system elements. Growth is largely underpinned by the rising production of electric vehicles, the widespread adoption of industrial automation, and the development of advanced telecommunications infrastructure. As noted by the Electronic Components Industry Association (ECIA), the top 50 global authorized distributors realized a collective sales increase of 4.8 percent in 2024, a performance significantly bolstered by strong market activity in Asia.

Market Overview
Forecast Period2027-2031
Market Size 2025USD 196.72 Billion
Market Size 2031USD 274.51 Billion
CAGR 2026-20315.71%
Fastest Growing SegmentHealthcare
Largest MarketAsia Pacific

Despite this upward trajectory, the market faces substantial obstacles stemming from ongoing global supply chain volatility triggered by geopolitical trade fragmentation. These disruptions introduce uncertainty regarding the availability of essential raw materials and logistical routes, resulting in unstable production costs. Such instability can disrupt manufacturing timelines and limit the industry's capacity to fully leverage growing demand. Consequently, these supply chain complications present a persistent barrier to broader market expansion, preventing stakeholders from maximizing the potential offered by current industrial and technological trends.

Market Driver

The surge in electric and autonomous vehicles serves as a primary driver for the passive and interconnecting electronic components market, creating a need for highly reliable hardware that can withstand elevated voltages and thermal stress. Modern electric drivetrains demand a significantly higher volume of multilayer ceramic capacitors and power resistors to efficiently manage on-board chargers and battery systems. According to the International Energy Agency's 'Global EV Outlook 2024' released in April 2024, electric car sales reached approximately 14 million units in 2023, triggering a spike in demand for automotive-grade components. This shift in the automotive sector directly bolsters the component ecosystem, a trend highlighted by IPC data showing that total North American printed circuit board shipments rose by 35 percent in August 2024 compared to the same month the prior year.

Simultaneously, the rollout of 5G telecommunications infrastructure is generating substantial demand for radio frequency interconnects and high-frequency passive devices. The installation of small cells and dense antenna arrays requires miniaturized filters and inductors that maintain signal integrity across broader bandwidths without expanding the physical size of base stations. This infrastructure development is expanding rapidly to satisfy consumer connectivity requirements. As reported in the June 2024 'Ericsson Mobility Report', service providers added 160 million 5G subscriptions globally in the first quarter of 2024 alone, driving the ongoing acquisition of specialized connectors and passive elements necessary for network densification.

Market Challenge

Persistent volatility within the global supply chain, fueled by geopolitical trade fragmentation, stands as a primary impediment to the growth of the Global Passive & Interconnecting Electronic Components Market. This fragmentation disrupts established logistical networks, leading to irregular availability of finished interconnects and essential raw materials. As tariffs and trade barriers increase, manufacturers face sudden escalations in procurement costs and prolonged lead times, which destabilize pricing models and delay crucial production schedules. Consequently, suppliers often struggle to sustain the output levels required to meet the escalating demands of the industrial automation and electric vehicle sectors, forcing a reduction in potential market throughput.

The severity of these disruptions is reflected in recent industry assessments of operational risk. According to IPC data from August 2024, 44 percent of electronics manufacturers expressed being very or extremely concerned regarding the effects of tariffs and trade policies on their business operations. This statistic highlights how geopolitical instability compels companies to focus on risk mitigation rather than capacity expansion. By injecting substantial unpredictability into the manufacturing ecosystem, these trade dynamics directly constrain the industry's ability to take advantage of rising demand, effectively slowing overall market momentum.

Market Trends

The trend toward miniaturizing component footprints to ultra-small case sizes is accelerating, propelled by the increasing density demands of high-performance computing clusters and artificial intelligence accelerators. As data center architectures advance to manage immense processing workloads, manufacturers are ramping up production of ultra-compact multilayer ceramic capacitors that provide high capacitance without occupying excessive board space. This structural pivot toward high-density passive components is reflected in the revenue composition of key suppliers; according to a November 2025 Chosun article titled 'AI server and EV demand drives MLCC supercycle', Samsung Electro-Mechanics noted that the portion of its MLCC sales attributed to AI servers grew from 3 percent in 2023 to 9 percent in 2024, emphasizing the industry's shift toward miniaturized, high-value components.

Simultaneously, the transition toward eco-friendly and sustainable material compositions is redefining manufacturing priorities as the industry adapts to circular economy principles and global decarbonization mandates. Suppliers are progressively re-engineering their product lines to utilize recycled materials and bio-based polymers, while also enhancing component efficiency to reduce operational carbon footprints for end-users. This dedication to environmental stewardship is producing tangible reductions in greenhouse gas emissions. For instance, TDK Corporation's 'Sustainability Report 2025', released in August 2025, revealed that the CO2 reduction contribution from its products totaled 7.038 million tons for the fiscal year ending March 2025, a 35.2 percent increase over the prior year, highlighting the expanding impact of eco-efficient electronic solutions.

Key Market Players

  • Murata Manufacturing Co., Ltd.
  • TDK Corporation
  • Yageo Corporation
  • Vishay Intertechnology, Inc.
  • KYOCERA AVX Components Corporation
  • TE Connectivity Ltd.
  • Panasonic Corporation
  • Samsung Electronics Co., Ltd.
  • Littelfuse, Inc.
  • Rohm Co. Ltd

Report Scope

In this report, the Global Passive & Interconnecting Electronic Components Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Passive & Interconnecting Electronic Components Market, By Type

  • Passive
  • Interconnecting

Passive & Interconnecting Electronic Components Market, By Application

  • Consumer Electronics
  • Automotive
  • Healthcare
  • IT & Telecom
  • Industrial
  • Aerospace & defense

Passive & Interconnecting Electronic Components Market, By Region

  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • France
    • United Kingdom
    • Italy
    • Germany
    • Spain
  • Asia Pacific
    • China
    • India
    • Japan
    • Australia
    • South Korea
  • South America
    • Brazil
    • Argentina
    • Colombia
  • Middle East & Africa
    • South Africa
    • Saudi Arabia
    • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Passive & Interconnecting Electronic Components Market.

Available Customizations:

Global Passive & Interconnecting Electronic Components Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

  • 1.1. Market Definition
  • 1.2. Scope of the Market
    • 1.2.1. Markets Covered
    • 1.2.2. Years Considered for Study
    • 1.2.3. Key Market Segmentations

2. Research Methodology

  • 2.1. Objective of the Study
  • 2.2. Baseline Methodology
  • 2.3. Key Industry Partners
  • 2.4. Major Association and Secondary Sources
  • 2.5. Forecasting Methodology
  • 2.6. Data Triangulation & Validation
  • 2.7. Assumptions and Limitations

3. Executive Summary

  • 3.1. Overview of the Market
  • 3.2. Overview of Key Market Segmentations
  • 3.3. Overview of Key Market Players
  • 3.4. Overview of Key Regions/Countries
  • 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Passive & Interconnecting Electronic Components Market Outlook

  • 5.1. Market Size & Forecast
    • 5.1.1. By Value
  • 5.2. Market Share & Forecast
    • 5.2.1. By Type (Passive, Interconnecting)
    • 5.2.2. By Application (Consumer Electronics, Automotive, Healthcare, IT & Telecom, Industrial, Aerospace & defense)
    • 5.2.3. By Region
    • 5.2.4. By Company (2025)
  • 5.3. Market Map

6. North America Passive & Interconnecting Electronic Components Market Outlook

  • 6.1. Market Size & Forecast
    • 6.1.1. By Value
  • 6.2. Market Share & Forecast
    • 6.2.1. By Type
    • 6.2.2. By Application
    • 6.2.3. By Country
  • 6.3. North America: Country Analysis
    • 6.3.1. United States Passive & Interconnecting Electronic Components Market Outlook
      • 6.3.1.1. Market Size & Forecast
        • 6.3.1.1.1. By Value
      • 6.3.1.2. Market Share & Forecast
        • 6.3.1.2.1. By Type
        • 6.3.1.2.2. By Application
    • 6.3.2. Canada Passive & Interconnecting Electronic Components Market Outlook
      • 6.3.2.1. Market Size & Forecast
        • 6.3.2.1.1. By Value
      • 6.3.2.2. Market Share & Forecast
        • 6.3.2.2.1. By Type
        • 6.3.2.2.2. By Application
    • 6.3.3. Mexico Passive & Interconnecting Electronic Components Market Outlook
      • 6.3.3.1. Market Size & Forecast
        • 6.3.3.1.1. By Value
      • 6.3.3.2. Market Share & Forecast
        • 6.3.3.2.1. By Type
        • 6.3.3.2.2. By Application

7. Europe Passive & Interconnecting Electronic Components Market Outlook

  • 7.1. Market Size & Forecast
    • 7.1.1. By Value
  • 7.2. Market Share & Forecast
    • 7.2.1. By Type
    • 7.2.2. By Application
    • 7.2.3. By Country
  • 7.3. Europe: Country Analysis
    • 7.3.1. Germany Passive & Interconnecting Electronic Components Market Outlook
      • 7.3.1.1. Market Size & Forecast
        • 7.3.1.1.1. By Value
      • 7.3.1.2. Market Share & Forecast
        • 7.3.1.2.1. By Type
        • 7.3.1.2.2. By Application
    • 7.3.2. France Passive & Interconnecting Electronic Components Market Outlook
      • 7.3.2.1. Market Size & Forecast
        • 7.3.2.1.1. By Value
      • 7.3.2.2. Market Share & Forecast
        • 7.3.2.2.1. By Type
        • 7.3.2.2.2. By Application
    • 7.3.3. United Kingdom Passive & Interconnecting Electronic Components Market Outlook
      • 7.3.3.1. Market Size & Forecast
        • 7.3.3.1.1. By Value
      • 7.3.3.2. Market Share & Forecast
        • 7.3.3.2.1. By Type
        • 7.3.3.2.2. By Application
    • 7.3.4. Italy Passive & Interconnecting Electronic Components Market Outlook
      • 7.3.4.1. Market Size & Forecast
        • 7.3.4.1.1. By Value
      • 7.3.4.2. Market Share & Forecast
        • 7.3.4.2.1. By Type
        • 7.3.4.2.2. By Application
    • 7.3.5. Spain Passive & Interconnecting Electronic Components Market Outlook
      • 7.3.5.1. Market Size & Forecast
        • 7.3.5.1.1. By Value
      • 7.3.5.2. Market Share & Forecast
        • 7.3.5.2.1. By Type
        • 7.3.5.2.2. By Application

8. Asia Pacific Passive & Interconnecting Electronic Components Market Outlook

  • 8.1. Market Size & Forecast
    • 8.1.1. By Value
  • 8.2. Market Share & Forecast
    • 8.2.1. By Type
    • 8.2.2. By Application
    • 8.2.3. By Country
  • 8.3. Asia Pacific: Country Analysis
    • 8.3.1. China Passive & Interconnecting Electronic Components Market Outlook
      • 8.3.1.1. Market Size & Forecast
        • 8.3.1.1.1. By Value
      • 8.3.1.2. Market Share & Forecast
        • 8.3.1.2.1. By Type
        • 8.3.1.2.2. By Application
    • 8.3.2. India Passive & Interconnecting Electronic Components Market Outlook
      • 8.3.2.1. Market Size & Forecast
        • 8.3.2.1.1. By Value
      • 8.3.2.2. Market Share & Forecast
        • 8.3.2.2.1. By Type
        • 8.3.2.2.2. By Application
    • 8.3.3. Japan Passive & Interconnecting Electronic Components Market Outlook
      • 8.3.3.1. Market Size & Forecast
        • 8.3.3.1.1. By Value
      • 8.3.3.2. Market Share & Forecast
        • 8.3.3.2.1. By Type
        • 8.3.3.2.2. By Application
    • 8.3.4. South Korea Passive & Interconnecting Electronic Components Market Outlook
      • 8.3.4.1. Market Size & Forecast
        • 8.3.4.1.1. By Value
      • 8.3.4.2. Market Share & Forecast
        • 8.3.4.2.1. By Type
        • 8.3.4.2.2. By Application
    • 8.3.5. Australia Passive & Interconnecting Electronic Components Market Outlook
      • 8.3.5.1. Market Size & Forecast
        • 8.3.5.1.1. By Value
      • 8.3.5.2. Market Share & Forecast
        • 8.3.5.2.1. By Type
        • 8.3.5.2.2. By Application

9. Middle East & Africa Passive & Interconnecting Electronic Components Market Outlook

  • 9.1. Market Size & Forecast
    • 9.1.1. By Value
  • 9.2. Market Share & Forecast
    • 9.2.1. By Type
    • 9.2.2. By Application
    • 9.2.3. By Country
  • 9.3. Middle East & Africa: Country Analysis
    • 9.3.1. Saudi Arabia Passive & Interconnecting Electronic Components Market Outlook
      • 9.3.1.1. Market Size & Forecast
        • 9.3.1.1.1. By Value
      • 9.3.1.2. Market Share & Forecast
        • 9.3.1.2.1. By Type
        • 9.3.1.2.2. By Application
    • 9.3.2. UAE Passive & Interconnecting Electronic Components Market Outlook
      • 9.3.2.1. Market Size & Forecast
        • 9.3.2.1.1. By Value
      • 9.3.2.2. Market Share & Forecast
        • 9.3.2.2.1. By Type
        • 9.3.2.2.2. By Application
    • 9.3.3. South Africa Passive & Interconnecting Electronic Components Market Outlook
      • 9.3.3.1. Market Size & Forecast
        • 9.3.3.1.1. By Value
      • 9.3.3.2. Market Share & Forecast
        • 9.3.3.2.1. By Type
        • 9.3.3.2.2. By Application

10. South America Passive & Interconnecting Electronic Components Market Outlook

  • 10.1. Market Size & Forecast
    • 10.1.1. By Value
  • 10.2. Market Share & Forecast
    • 10.2.1. By Type
    • 10.2.2. By Application
    • 10.2.3. By Country
  • 10.3. South America: Country Analysis
    • 10.3.1. Brazil Passive & Interconnecting Electronic Components Market Outlook
      • 10.3.1.1. Market Size & Forecast
        • 10.3.1.1.1. By Value
      • 10.3.1.2. Market Share & Forecast
        • 10.3.1.2.1. By Type
        • 10.3.1.2.2. By Application
    • 10.3.2. Colombia Passive & Interconnecting Electronic Components Market Outlook
      • 10.3.2.1. Market Size & Forecast
        • 10.3.2.1.1. By Value
      • 10.3.2.2. Market Share & Forecast
        • 10.3.2.2.1. By Type
        • 10.3.2.2.2. By Application
    • 10.3.3. Argentina Passive & Interconnecting Electronic Components Market Outlook
      • 10.3.3.1. Market Size & Forecast
        • 10.3.3.1.1. By Value
      • 10.3.3.2. Market Share & Forecast
        • 10.3.3.2.1. By Type
        • 10.3.3.2.2. By Application

11. Market Dynamics

  • 11.1. Drivers
  • 11.2. Challenges

12. Market Trends & Developments

  • 12.1. Merger & Acquisition (If Any)
  • 12.2. Product Launches (If Any)
  • 12.3. Recent Developments

13. Global Passive & Interconnecting Electronic Components Market: SWOT Analysis

14. Porter's Five Forces Analysis

  • 14.1. Competition in the Industry
  • 14.2. Potential of New Entrants
  • 14.3. Power of Suppliers
  • 14.4. Power of Customers
  • 14.5. Threat of Substitute Products

15. Competitive Landscape

  • 15.1. Murata Manufacturing Co., Ltd.
    • 15.1.1. Business Overview
    • 15.1.2. Products & Services
    • 15.1.3. Recent Developments
    • 15.1.4. Key Personnel
    • 15.1.5. SWOT Analysis
  • 15.2. TDK Corporation
  • 15.3. Yageo Corporation
  • 15.4. Vishay Intertechnology, Inc.
  • 15.5. KYOCERA AVX Components Corporation
  • 15.6. TE Connectivity Ltd.
  • 15.7. Panasonic Corporation
  • 15.8. Samsung Electronics Co., Ltd.
  • 15.9. Littelfuse, Inc.
  • 15.10. Rohm Co. Ltd

16. Strategic Recommendations

17. About Us & Disclaimer