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市場調查報告書
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1945933

晶片系統市場 - 全球產業規模、佔有率、趨勢、機會及預測（按類型、應用、地區和競爭格局分類，2021-2031年）

System on Chip Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Type, By Application, By Region & Competition, 2021-2031F
出版日期: | 出版商: TechSci Research | 英文 180 Pages | 商品交期: 2-3個工作天內

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簡介目錄

全球系統晶片市場預計將從 2025 年的 1,261.1 億美元成長到 2031 年的 2,059.7 億美元，複合年成長率為 8.52%。

系統晶片(SoC) 是一種積體電路，它將中央處理器 (CPU)、記憶體和輸入/輸出介面等關鍵電子元件整合到單一基板上。行動通訊領域對低功耗處理能力的需求不斷成長，以及物聯網 (IoT) 設備的廣泛應用，都推動了 SoC 市場的成長。這兩者都需要緊湊而高效能的運算能力。因此，SoC 技術並非曇花一現的市場趨勢，而是由於這些基本運作需求，在消費性電子、汽車系統和工業自動化等領域中得到了持續應用。

市場概覽
預測期 2027-2031
市場規模：2025年 1261.1億美元
市場規模：2031年 2059.7億美元
複合年成長率：2026-2031年 8.52%
成長最快的細分市場 數位訊號
最大的市場 亞太地區

儘管市場需求強勁，但電晶體節點尺寸不斷縮小帶來的設計複雜性增加和製造成本上升阻礙了市場擴張，這不僅增加了供應鏈的複雜性，也需要大量的資本投資。根據半導體產業協會 (SIA) 預測，構成大多數系統單晶片 (SoC) 核心架構的邏輯產品收入將在 2024 年達到 2,126 億美元，成為收入最高的半導體產品類型。這一數字凸顯了半導體產業對這些整合解決方案的嚴重經濟依賴，儘管製造商面臨著巨大的技術和財務障礙。

市場促進因素

人工智慧 (AI) 與邊緣運算的融合正在從根本上改變系統晶片(SoC) 解決方案的架構和效用。現代設備需要板載神經處理單元 (NPU) 來本地運行複雜的演算法，與完全依賴雲端的解決方案相比，這可以降低延遲並提高資料隱私性。這種需求正促使半導體製造商採用異質運算架構，將 CPU、GPU 和 NPU 整合在單一晶粒上，這對於支援智慧型手機和資料中心中的生成式 AI 至關重要。台積電 (TSMC) 在其 2024 會計年度第三季財報電話會議（2024 年 10 月）中清晰地闡述了這一轉變帶來的財務影響。其高效能運算平台（構成公司 AI 處理器和 SoC 的核心）的收入佔其總淨銷售額的 51%。

同時，汽車產業的電氣化和自動化是SoC市場擴張的關鍵驅動力。隨著車輛向軟體定義平台演進，製造商正以集中式、高性能的SoC取代傳統的分散式控制單元，這些SoC能夠同時管理先進駕駛輔助系統（ADAS）、資訊娛樂系統和自動駕駛功能。這種整合降低了車輛重量和佈線複雜性，並方便了空中下載（OTA）更新。高通在2024年11月發布的「2024會計年度第四季及全年業績」報告中指出，其汽車業務收入為8.99億美元，反映出該技術在工業領域的快速應用。此外，半導體產業協會（SIA）指出，2024年8月全球半導體銷售額達531億美元，顯示市場對這些組件的需求持續強勁。

市場挑戰

全球系統晶片市場面臨許多挑戰：日益複雜的設計以及不斷上漲的製造成本。隨著產業向更小的電晶體節點遷移以滿足效能需求，技術准入門檻也急劇上升。開發這些先進的積體電路需要複雜的架構設計和專門的製造程序，導致開發週期延長和生產風險增加。這種複雜性給供應鏈帶來了壓力，只有少數代工廠能夠製造最先進的晶片節點，從而造成瓶頸，限制了市場擴張，並導致下一代組件的供不應求。

這項挑戰的經濟規模體現在維持產能所需的巨額資本支出。製造商被迫在尖端微影術技術和加工設備方面投入大量資金，造成高成本環境，限制了市場流動性。根據SEMI預測，2024年全球半導體製造設備銷售額將達到創紀錄的1,090億美元。如此巨大的財務負擔限制了中小企業的競爭力，甚至迫使市場領導也必須投入大量資源來維持其技術優勢，直接阻礙了整個產業的成長動能。

市場趨勢

晶片級和3D先進封裝技術的應用，透過將模組化晶粒整合到單一封裝中，正在革新半導體設計。該策略克服了單片封裝的局限性，將來自不同製程節點的組件（例如高性能邏輯和I/O介面）整合在一起，從而有效最佳化了製造成本和產量比率。這種結構模組化對於建構現代運算任務所需的強大異質系統至關重要。業界對這項技術的關注在台積電於2024年7月舉行的2024年第二季財報電話會議上得到了強調。該公司宣布計劃在2024年將其CoWoS先進封裝產能提高一倍以上，以滿足快速成長的高效能運算整合需求。

同時，開放原始碼RISC-V 核心設計的日益普及，透過提供免版稅的替代方案，使處理器開發更加民主化，從而取代了專有架構。這一趨勢促進了客製化晶片的開發，使企業能夠針對特定工作負載設計專用內核，而無需承擔昂貴的許可費用。 RISC-V 的柔軟性支援了從物聯網到資料中心應用等各個領域專用加速器的部署，並推動了從邊緣設備到人工智慧叢集的創新。根據 RISC-V International 於 2024 年 4 月發布的新聞稿《RISC-V International 獲得 40 項規範核准，里程碑式進展》，目前市場上已有超過 130 億個 RISC-V 內核，這表明該開放標準已被廣泛商業性接受。

目錄

第1章概述

第2章調查方法

第3章執行摘要

第4章：客戶評價

第5章 全球晶片系統市場展望

  • 市場規模及預測
    • 按金額
  • 市佔率及預測
    • 按類型（數位訊號、類比訊號、混合訊號）
    • 按應用領域（家用電子電器、醫療、通訊、汽車、其他）
    • 按地區
    • 按公司（2025 年）
  • 市場地圖

第6章 北美晶片系統市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 北美洲：國家分析
    • 美國
    • 加拿大
    • 墨西哥

7. 歐洲晶片系統市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 歐洲：國家分析
    • 德國
    • 法國
    • 英國
    • 義大利
    • 西班牙

第8章：亞太地區晶片系統市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 亞太地區：國家分析
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳洲

9. 中東和非洲晶片系統市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 中東和非洲：國家分析
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 南非

10. 南美洲晶片系統市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 南美洲：國家分析
    • 巴西
    • 哥倫比亞
    • 阿根廷

第11章 市場動態

  • 促進要素
  • 任務

第12章 市場趨勢與發展

  • 併購
  • 產品發布
  • 最新進展

第13章：全球晶片系統市場：SWOT分析

第14章：波特五力分析

  • 產業競爭
  • 新進入者的可能性
  • 供應商電力
  • 顧客權力
  • 替代品的威脅

第15章 競爭格局

  • Qualcomm Incorporated
  • Intel Corporation
  • Samsung Electronics Co., Ltd.
  • Taiwan Semiconductor Manufacturing Company Limited（TSMC）
  • NVIDIA Corporation
  • Broadcom Inc.
  • MediaTek Inc.
  • Advanced Micro Devices, Inc.（AMD）
  • Apple Inc.
  • Texas Instruments Incorporated
  • NXP Semiconductors NV
  • STMicroelectronics NV
  • Renesas Electronics Corporation

第16章 策略建議

第17章：關於研究公司及免責聲明

簡介目錄
Product Code: 17702

The Global System on Chip Market is projected to expand from USD 126.11 Billion in 2025 to USD 205.97 Billion by 2031, reflecting a CAGR of 8.52%. A System on Chip (SoC) is defined as an integrated circuit that consolidates essential electronic components, including the central processing unit, memory, and input/output interfaces, onto a single substrate. This market growth is underpinned by the rising demand for power-efficient processing in mobile telecommunications and the extensive proliferation of Internet of Things (IoT) devices, both of which require compact and high-performance computing capabilities. Consequently, SoC technology is consistently adopted across consumer electronics, automotive systems, and industrial automation sectors, driven by these fundamental operational necessities rather than fleeting market trends.

Market Overview
Forecast Period2027-2031
Market Size 2025USD 126.11 Billion
Market Size 2031USD 205.97 Billion
CAGR 2026-20318.52%
Fastest Growing SegmentDigital Signal
Largest MarketAsia Pacific

Despite this strong demand, market expansion is hindered by the escalating design complexity and manufacturing costs associated with reducing transistor node sizes, which complicate supply chains and require significant capital investment. According to the Semiconductor Industry Association, sales of logic products, which form the core architecture for most SoC devices, reached $212.6 billion in 2024, making it the largest semiconductor product category by sales. This figure highlights the industry's critical economic reliance on these integrated solutions, even as manufacturers face substantial technical and financial hurdles.

Market Driver

The integration of Artificial Intelligence and edge computing is fundamentally transforming the architecture and utility of System on Chip (SoC) solutions. Modern devices now require onboard neural processing units to execute complex algorithms locally, thereby reducing latency and improving data privacy compared to cloud-only solutions. This necessity drives semiconductor manufacturers to adopt heterogeneous computing architectures that combine CPUs, GPUs, and NPUs on a single die, which is essential for supporting generative AI in smartphones and data centers. The financial impact of this shift was highlighted in TSMC's 'Third Quarter 2024 Earnings Conference' report (October 2024), where revenue from their High Performance Computing platform-central to AI-enabled processors and SoCs-comprised 51% of total net revenue.

Concurrently, the electrification and automation of the automotive sector serve as a major catalyst for SoC market expansion. As vehicles evolve into software-defined platforms, manufacturers are replacing legacy distributed control units with centralized, high-compute SoCs that manage advanced driver-assistance systems (ADAS), infotainment, and autonomous driving features simultaneously. This consolidation reduces vehicle weight and wiring complexity while facilitating over-the-air updates. Qualcomm reported in its November 2024 'Fourth Quarter and Fiscal Year 2024 Earnings' release that automotive segment revenues hit $899 million, reflecting rapid industrial adoption. Furthermore, the Semiconductor Industry Association noted that global semiconductor sales reached $53.1 billion in August 2024, signaling sustained industrial demand for these components.

Market Challenge

The Global System on Chip Market confronts a significant obstacle in the form of rising design complexity and soaring manufacturing costs. As the industry moves toward smaller transistor nodes to meet performance requirements, the technical barriers to entry have increased sharply. Developing these advanced integrated circuits necessitates intricate architectural designs and specialized fabrication processes, which prolong development cycles and heighten production risks. This complexity places a strain on supply chains, as only a limited number of foundries are capable of manufacturing chips at the most advanced nodes, creating bottlenecks that restrict broader market expansion and the availability of next-generation components.

The economic scale of this challenge is reflected in the massive capital expenditures required to maintain production capabilities. Manufacturers must invest heavily in cutting-edge lithography and processing tools, creating a high-cost environment that limits market fluidity. According to SEMI, global sales of semiconductor manufacturing equipment were forecast to reach a record $109 billion in 2024. This substantial financial burden restricts the ability of smaller players to compete and forces even established market leaders to allocate vast resources simply to maintain technological relevance, thereby directly impeding the sector's overall growth momentum.

Market Trends

The adoption of chiplet-based and 3D advanced packaging architectures is revolutionizing semiconductor design by integrating modular dies into a single package. This strategy overcomes the limitations of monolithic scaling by combining components from different process nodes, such as high-performance logic and I/O interfaces, effectively optimizing manufacturing costs and yield rates. This structural modularity is crucial for building the powerful heterogeneous systems required for modern computing tasks. The industry's focus on this technology was underscored by TSMC in its 'Second Quarter 2024 Earnings Conference' (July 2024), where the company announced plans to more than double its CoWoS advanced packaging capacity in 2024 to meet the surging demand for high-performance compute integration.

Simultaneously, the rising implementation of open-source RISC-V core designs is democratizing processor development by offering a royalty-free alternative to proprietary architectures. This trend encourages custom silicon development, enabling companies to design specialized cores for specific workloads without facing prohibitive licensing fees. The flexibility of RISC-V supports the deployment of domain-specific accelerators across IoT and data center applications, fostering innovation from edge devices to AI clusters. According to a RISC-V International press release from April 2024 titled 'RISC-V International Achieves Milestone with Ratification of 40 Specifications,' there are now more than 13 billion RISC-V cores in the market, demonstrating the widespread commercial acceptance of this open standard.

Key Market Players

  • Qualcomm Incorporated
  • Intel Corporation
  • Samsung Electronics Co., Ltd.
  • Taiwan Semiconductor Manufacturing Company Limited (TSMC)
  • NVIDIA Corporation
  • Broadcom Inc.
  • MediaTek Inc.
  • Advanced Micro Devices, Inc. (AMD)
  • Apple Inc.
  • Texas Instruments Incorporated
  • NXP Semiconductors N.V.
  • STMicroelectronics N.V.
  • Renesas Electronics Corporation

Report Scope

In this report, the Global System on Chip Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

System on Chip Market, By Type

  • Digital Signal
  • Analog Signal
  • Mixed Signal

System on Chip Market, By Application

  • Consumer Electronics
  • Healthcare
  • Telecommunication
  • Automotive
  • Others

System on Chip Market, By Region

  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • France
    • United Kingdom
    • Italy
    • Germany
    • Spain
  • Asia Pacific
    • China
    • India
    • Japan
    • Australia
    • South Korea
  • South America
    • Brazil
    • Argentina
    • Colombia
  • Middle East & Africa
    • South Africa
    • Saudi Arabia
    • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global System on Chip Market.

Available Customizations:

Global System on Chip Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

  • 1.1. Market Definition
  • 1.2. Scope of the Market
    • 1.2.1. Markets Covered
    • 1.2.2. Years Considered for Study
    • 1.2.3. Key Market Segmentations

2. Research Methodology

  • 2.1. Objective of the Study
  • 2.2. Baseline Methodology
  • 2.3. Key Industry Partners
  • 2.4. Major Association and Secondary Sources
  • 2.5. Forecasting Methodology
  • 2.6. Data Triangulation & Validation
  • 2.7. Assumptions and Limitations

3. Executive Summary

  • 3.1. Overview of the Market
  • 3.2. Overview of Key Market Segmentations
  • 3.3. Overview of Key Market Players
  • 3.4. Overview of Key Regions/Countries
  • 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global System on Chip Market Outlook

  • 5.1. Market Size & Forecast
    • 5.1.1. By Value
  • 5.2. Market Share & Forecast
    • 5.2.1. By Type (Digital Signal, Analog Signal, Mixed Signal)
    • 5.2.2. By Application (Consumer Electronics, Healthcare, Telecommunication, Automotive, Others)
    • 5.2.3. By Region
    • 5.2.4. By Company (2025)
  • 5.3. Market Map

6. North America System on Chip Market Outlook

  • 6.1. Market Size & Forecast
    • 6.1.1. By Value
  • 6.2. Market Share & Forecast
    • 6.2.1. By Type
    • 6.2.2. By Application
    • 6.2.3. By Country
  • 6.3. North America: Country Analysis
    • 6.3.1. United States System on Chip Market Outlook
      • 6.3.1.1. Market Size & Forecast
        • 6.3.1.1.1. By Value
      • 6.3.1.2. Market Share & Forecast
        • 6.3.1.2.1. By Type
        • 6.3.1.2.2. By Application
    • 6.3.2. Canada System on Chip Market Outlook
      • 6.3.2.1. Market Size & Forecast
        • 6.3.2.1.1. By Value
      • 6.3.2.2. Market Share & Forecast
        • 6.3.2.2.1. By Type
        • 6.3.2.2.2. By Application
    • 6.3.3. Mexico System on Chip Market Outlook
      • 6.3.3.1. Market Size & Forecast
        • 6.3.3.1.1. By Value
      • 6.3.3.2. Market Share & Forecast
        • 6.3.3.2.1. By Type
        • 6.3.3.2.2. By Application

7. Europe System on Chip Market Outlook

  • 7.1. Market Size & Forecast
    • 7.1.1. By Value
  • 7.2. Market Share & Forecast
    • 7.2.1. By Type
    • 7.2.2. By Application
    • 7.2.3. By Country
  • 7.3. Europe: Country Analysis
    • 7.3.1. Germany System on Chip Market Outlook
      • 7.3.1.1. Market Size & Forecast
        • 7.3.1.1.1. By Value
      • 7.3.1.2. Market Share & Forecast
        • 7.3.1.2.1. By Type
        • 7.3.1.2.2. By Application
    • 7.3.2. France System on Chip Market Outlook
      • 7.3.2.1. Market Size & Forecast
        • 7.3.2.1.1. By Value
      • 7.3.2.2. Market Share & Forecast
        • 7.3.2.2.1. By Type
        • 7.3.2.2.2. By Application
    • 7.3.3. United Kingdom System on Chip Market Outlook
      • 7.3.3.1. Market Size & Forecast
        • 7.3.3.1.1. By Value
      • 7.3.3.2. Market Share & Forecast
        • 7.3.3.2.1. By Type
        • 7.3.3.2.2. By Application
    • 7.3.4. Italy System on Chip Market Outlook
      • 7.3.4.1. Market Size & Forecast
        • 7.3.4.1.1. By Value
      • 7.3.4.2. Market Share & Forecast
        • 7.3.4.2.1. By Type
        • 7.3.4.2.2. By Application
    • 7.3.5. Spain System on Chip Market Outlook
      • 7.3.5.1. Market Size & Forecast
        • 7.3.5.1.1. By Value
      • 7.3.5.2. Market Share & Forecast
        • 7.3.5.2.1. By Type
        • 7.3.5.2.2. By Application

8. Asia Pacific System on Chip Market Outlook

  • 8.1. Market Size & Forecast
    • 8.1.1. By Value
  • 8.2. Market Share & Forecast
    • 8.2.1. By Type
    • 8.2.2. By Application
    • 8.2.3. By Country
  • 8.3. Asia Pacific: Country Analysis
    • 8.3.1. China System on Chip Market Outlook
      • 8.3.1.1. Market Size & Forecast
        • 8.3.1.1.1. By Value
      • 8.3.1.2. Market Share & Forecast
        • 8.3.1.2.1. By Type
        • 8.3.1.2.2. By Application
    • 8.3.2. India System on Chip Market Outlook
      • 8.3.2.1. Market Size & Forecast
        • 8.3.2.1.1. By Value
      • 8.3.2.2. Market Share & Forecast
        • 8.3.2.2.1. By Type
        • 8.3.2.2.2. By Application
    • 8.3.3. Japan System on Chip Market Outlook
      • 8.3.3.1. Market Size & Forecast
        • 8.3.3.1.1. By Value
      • 8.3.3.2. Market Share & Forecast
        • 8.3.3.2.1. By Type
        • 8.3.3.2.2. By Application
    • 8.3.4. South Korea System on Chip Market Outlook
      • 8.3.4.1. Market Size & Forecast
        • 8.3.4.1.1. By Value
      • 8.3.4.2. Market Share & Forecast
        • 8.3.4.2.1. By Type
        • 8.3.4.2.2. By Application
    • 8.3.5. Australia System on Chip Market Outlook
      • 8.3.5.1. Market Size & Forecast
        • 8.3.5.1.1. By Value
      • 8.3.5.2. Market Share & Forecast
        • 8.3.5.2.1. By Type
        • 8.3.5.2.2. By Application

9. Middle East & Africa System on Chip Market Outlook

  • 9.1. Market Size & Forecast
    • 9.1.1. By Value
  • 9.2. Market Share & Forecast
    • 9.2.1. By Type
    • 9.2.2. By Application
    • 9.2.3. By Country
  • 9.3. Middle East & Africa: Country Analysis
    • 9.3.1. Saudi Arabia System on Chip Market Outlook
      • 9.3.1.1. Market Size & Forecast
        • 9.3.1.1.1. By Value
      • 9.3.1.2. Market Share & Forecast
        • 9.3.1.2.1. By Type
        • 9.3.1.2.2. By Application
    • 9.3.2. UAE System on Chip Market Outlook
      • 9.3.2.1. Market Size & Forecast
        • 9.3.2.1.1. By Value
      • 9.3.2.2. Market Share & Forecast
        • 9.3.2.2.1. By Type
        • 9.3.2.2.2. By Application
    • 9.3.3. South Africa System on Chip Market Outlook
      • 9.3.3.1. Market Size & Forecast
        • 9.3.3.1.1. By Value
      • 9.3.3.2. Market Share & Forecast
        • 9.3.3.2.1. By Type
        • 9.3.3.2.2. By Application

10. South America System on Chip Market Outlook

  • 10.1. Market Size & Forecast
    • 10.1.1. By Value
  • 10.2. Market Share & Forecast
    • 10.2.1. By Type
    • 10.2.2. By Application
    • 10.2.3. By Country
  • 10.3. South America: Country Analysis
    • 10.3.1. Brazil System on Chip Market Outlook
      • 10.3.1.1. Market Size & Forecast
        • 10.3.1.1.1. By Value
      • 10.3.1.2. Market Share & Forecast
        • 10.3.1.2.1. By Type
        • 10.3.1.2.2. By Application
    • 10.3.2. Colombia System on Chip Market Outlook
      • 10.3.2.1. Market Size & Forecast
        • 10.3.2.1.1. By Value
      • 10.3.2.2. Market Share & Forecast
        • 10.3.2.2.1. By Type
        • 10.3.2.2.2. By Application
    • 10.3.3. Argentina System on Chip Market Outlook
      • 10.3.3.1. Market Size & Forecast
        • 10.3.3.1.1. By Value
      • 10.3.3.2. Market Share & Forecast
        • 10.3.3.2.1. By Type
        • 10.3.3.2.2. By Application

11. Market Dynamics

  • 11.1. Drivers
  • 11.2. Challenges

12. Market Trends & Developments

  • 12.1. Merger & Acquisition (If Any)
  • 12.2. Product Launches (If Any)
  • 12.3. Recent Developments

13. Global System on Chip Market: SWOT Analysis

14. Porter's Five Forces Analysis

  • 14.1. Competition in the Industry
  • 14.2. Potential of New Entrants
  • 14.3. Power of Suppliers
  • 14.4. Power of Customers
  • 14.5. Threat of Substitute Products

15. Competitive Landscape

  • 15.1. Qualcomm Incorporated
    • 15.1.1. Business Overview
    • 15.1.2. Products & Services
    • 15.1.3. Recent Developments
    • 15.1.4. Key Personnel
    • 15.1.5. SWOT Analysis
  • 15.2. Intel Corporation
  • 15.3. Samsung Electronics Co., Ltd.
  • 15.4. Taiwan Semiconductor Manufacturing Company Limited (TSMC)
  • 15.5. NVIDIA Corporation
  • 15.6. Broadcom Inc.
  • 15.7. MediaTek Inc.
  • 15.8. Advanced Micro Devices, Inc. (AMD)
  • 15.9. Apple Inc.
  • 15.10. Texas Instruments Incorporated
  • 15.11. NXP Semiconductors N.V.
  • 15.12. STMicroelectronics N.V.
  • 15.13. Renesas Electronics Corporation

16. Strategic Recommendations

17. About Us & Disclaimer