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市場調查報告書
商品編碼
1940817

系統晶片（SoC）：市場佔有率分析、行業趨勢和統計數據、成長預測（2026-2031 年）

System On Chip (SoC) - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2026 - 2031)
出版日期: | 出版商: Mordor Intelligence | 英文 156 Pages | 商品交期: 2-3個工作天內

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簡介目錄

預計系統晶片(SoC) 市場將從 2025 年的 1,618.8 億美元成長到 2026 年的 1,739.4 億美元，到 2031 年將達到 2,491.9 億美元，2026 年至 2031 年的複合年成長率為 7.45%。

系統單晶片 (SoC) - 市場 - 圖片 1

智慧型手機更新換代速度放緩，但邊緣原生AI推理和5G客戶端設備的快速普及抵消了這一影響，從而實現了穩定的出貨量和平均晶粒尺寸的增加。一級汽車製造商將數十個控制單元整合到集中式運算域中，推動了對多核心、具備ASIL-D等級的SoC的需求。超大規模資料中心業者持續以自主設計取代現成晶片，擴大了先進封裝供應商的潛在市場。美國、日本和歐盟的區域晶圓廠激勵政策支持了產能擴張，降低了供應鏈風險，並促進了在地化設計策略的實施。

全球系統晶片(SoC) 市場趨勢與洞察

對5G相容設備的需求激增

首批獨立組網的5G網路導致上行鏈路預算更加緊張，基頻也更加複雜，迫使智慧型手機OEM廠商在調變解調器子系統中整合AI調優引擎。高通驍龍8 Elite將Release 17級調變解調器與45 TOPS神經網路引擎結合，相比上一代產品，每瓦效能提升了45%。聯發科天瑩9400採用了類似的層級架構，加速了2025年初發布的高階智慧型手機的在線連續影片增強功能。工業路由器的配套模組也採用了類似的整合方式，無需透過雲端即可在智慧工廠單元內實現亞毫秒操作。因此，智慧型手機和工業閘道器的更新換代推動了系統晶片（SoC）市場近期營收的激增。

物聯網和人工智慧邊緣運算的快速普及

分散式推理工作負載的興起迫使設計人員將通用核心、DSP 和神經網路加速器整合到單一晶粒上。 EdgeCortix 的 SAKURA-II 晶片功耗低於 10 瓦，卻能提供 40 TOPS 的運算能力，已被用於裝配線上零件檢測的工業相機所採用。智慧城市整合商透過改造交通號誌控制櫃，加裝微型伺服器，在傳輸元元資料之前對視訊串流進行本地壓縮，從而將回程傳輸減少了 80%。這種架構轉變提高了每個節點的矽含量，同時縮短了設計週期，使得異構/融合 SoC系統晶片(SoC) 市場中成長最快的細分領域。

5奈米以下製程設計與掩模成本飆升

2024年底，台積電2nm製程的掩模組成本將超過每片晶圓3萬美元，比3nm製程高出50%。這導致複雜SoC計劃的總預算飆升至1億美元。只有少數無廠半導體公司能夠承擔如此高昂的費用，迫使許多設計人員繼續沿用成熟的製程節點。這限制了晶片的功能整合，並減緩了領先EDA供應商的潛在市場成長。

細分市場分析

到2025年，數位SoC裝置將佔總收入的52.45%，這反映了它們在智慧型手機和通用運算領域的普及。設計人員在不同層級重複使用可擴展的IP庫，從而降低了成本曲線，並加快了衍生產品的上市速度。然而，基於晶片堆疊技術的出現對單晶片數位SoC的主導地位構成了首個結構性挑戰。將CPU、GPU、NPU和專用加速器整合在單一中介層上的異質/融合SoC預計將以9.7%的複合年成長率成長，從而蠶食傳統數位SoC的市場佔有率。混合訊號SoC在感測器融合和電源管理（例如電池BMS控制器）的交叉領域仍將發揮重要作用。射頻/連接SoC將受益於Wi-Fi 7和5G RedCap的日益普及，而類比晶片將為動力傳動系統和工業驅動提供支援。因此，SoC 市場正處於轉型期，研發投入正從增量研發轉向模組化、特定領域的混合型晶片，同時保持其在數位領域的量化優勢。

這種架構重組也導致了代工廠配置的變化。純數位晶片的流片集中在運轉率極高的7/6nm製程線上，而早期的異構原型則將5nm邏輯晶片與16nm模擬晶片組合晶粒，並整合到台積電的SoIC封裝流程中。這種分離保護了模擬IP免受超細鰭片寬度縮小帶來的性能損失，並降低了風險。供應商透過通用晶片互連高速（UCIe）規範推動標準化，旨在促進2026年後多源晶片市場的形成。隨著互通性的成熟，系統晶片（SoC）市場預計將加速產品類型的更新換代，縮短設計週期，並擴大從晶粒到封裝的價值創造。

到2025年，家用電子電器佔總收入的45.58%，這主要得益於行動電話、穿戴式裝置和AR眼鏡的12-18個月週期性更新換代。內容成長主要來自支援生成式AI相機功能的大規模ISP叢集。然而，汽車產業超越通訊基礎設施，成為成長最快的產業，到2031年複合年成長率將達到13.85%。這項轉變主要由軟體定義車輛藍圖驅動，該路線圖將感知處理、區域控制和資訊娛樂工作負載集中在有限的車輛運算節點上。一級供應商開始簽署多年半導體供應協議，從而降低了分配風險，並為SoC製造商提供了前所未有的需求可視性。工業和物聯網領域保持了穩定的個位數成長，這得益於現有設施的維修，這些改造在PLC上實施了預測性維護模型。

在醫療領域，體內連續血糖監測儀獲得監管部門批准，推動了對整合無線功能的超低功耗生物醫學SoC的需求。資料中心的需求隨著AWS等超大規模資料中心業者採用其自主研發的Graviton4 CPU而轉變，通用伺服器CPU的潛在市場規模（TAM）有所縮小，但同時也推動了對機架式共封裝光控制器的需求。電信基礎設施收入受惠於5G Advanced基頻升級，但由於開放式無線接取網路（RAN）定價，利潤率有所下降。整體而言，系統晶片（SoC）市場依靠汽車和邊緣人工智慧物聯網訂單來緩解消費性行動電話的週期性波動，凸顯了各垂直產業需求結構的多樣性。

系統晶片(SoC) 市場按產品類型（數位 SoC、類比 SoC、混合訊號 SoC、射頻/連接 SoC 等）、終端用戶產業（家用電子電器、通訊基礎設施、汽車等）、製程節點（28nm 及以上、16/14nm、10/8nm、7/6

區域分析

亞太地區預計到2025年將佔全球營收的54.20%，並將持續保持領先成長，到2031年複合年成長率將達到9.75%。中國的「小巨人」扶持計畫已扶持了200多家國內SoCStart-Ups，這些企業專注於從低軌道衛星數據機到汽車LiDAR訊號處理器等垂直細分市場。韓國整合裝置製造商（IDM）透過使用自主生產的DRAM和HBM將記憶體和運算模組捆綁在一起，增強了生態系統的凝聚力。台灣晶圓代工廠保持了其製程技術的領先地位，並於2025年第二季交付了首批採用2nm環柵製程的風險晶圓。同時，日本晶圓廠正專注於為電動車驅動逆變器生產寬能能隙功率SoC。

在北美，英特爾在俄亥俄州投資200億美元，以及位於新墨西哥州的新封裝廠（於2025年4月開始試營運），都為該地區帶來了強勁的成長動力。 AWS從2024年7月開始在美國五個可用區部署基於Graviton 4架構的實例，並報告指出Web層效能提升了30%。這形成了一個晶片飛輪效應，加速了國內晶片的設計週期。儘管政府出口管制政策的調整限制了與中國的雙邊貿易，但強勁的雲端運算和國防費用幫助該地區維持了較高的個位數複合年成長率。

歐洲已將重心轉向汽車矽技術領域的卓越發展。德國汽車製造商與英飛凌和意法半導體簽署了多代供應協議，以確保ADAS（高級駕駛輔助系統）運算能力；歐盟晶片法案承諾投入430億歐元（約479億美元），力爭到2030年將區域產能翻倍。法國和義大利聯合投資建造了晶圓層次電子構裝線，確保了工業4.0部署所需的供應自主性。這些發展表明，儘管亞太地區仍保持著規模優勢，系統晶片（SoC）市場正朝著兼顧規模和韌性的三方供應結構演變。

其他福利：

  • Excel格式的市場預測（ME）表
  • 3個月的分析師支持

目錄

第1章 引言

  • 研究假設和市場定義
  • 調查範圍

第2章調查方法

第3章執行摘要

第4章 市場情勢

  • 市場概覽
  • 市場促進因素
    • 對5G相容設備的需求激增
    • 物聯網和人工智慧邊緣運算的快速普及
    • 汽車產業向集中式電子電氣架構的過渡
    • 補貼以擴大本地晶圓廠規模
    • 基於晶片組的異質整合技術發展勢頭強勁
    • 邊緣原生AI模型推理的需求
  • 市場限制
    • 5奈米以下製程設計與掩模成本飆升
    • 出口管制使供應鏈變得脆弱
    • 晶片組互通性標準尚不成熟
    • 高階SoC的熱密度限制
  • 宏觀經濟因素的影響
  • 價值鏈分析
  • 監管環境
  • 技術展望
  • 波特五力分析
    • 供應商的議價能力
    • 買方的議價能力
    • 新進入者的威脅
    • 替代品的威脅
    • 競爭對手之間的競爭
  • Chiplet採用與去中心化趨勢分析

第5章 市場規模與成長預測

  • 依產品類型
    • 數位SoC
    • 模擬SoC
    • 混合訊號SoC
    • 射頻/連接SoC
    • 異構/融合SoC
  • 按最終用戶行業分類
    • 家用電子電器
    • 通訊基礎設施
    • 車
    • 計算和資料中心
    • 工業和物聯網
    • 醫療保健和醫療設備
  • 按行程節點
    • 28奈米或更大
    • 16/14 nm
    • 10/8 nm
    • 7/6 nm
    • 5/4/3 nm
    • 2 nm 或更小/3-DIC
  • 透過使用
    • 智慧型手機和平板電腦
    • 邊緣人工智慧和物聯網設備
    • 伺服器和資料中心
    • 汽車ADAS/資訊娛樂系統
    • 工業自動化
    • 穿戴式裝置和智慧家居
  • 按地區
    • 北美洲
      • 美國
      • 加拿大
    • 南美洲
      • 巴西
      • 南美洲其他地區
    • 歐洲
      • 德國
      • 法國
      • 英國
      • 義大利
      • 西班牙
      • 俄羅斯
      • 其他歐洲地區
    • 亞太地區
      • 中國
      • 日本
      • 韓國
      • 台灣
      • 印度
      • 亞太其他地區
    • 中東和非洲
      • 中東
        • 沙烏地阿拉伯
        • 阿拉伯聯合大公國
        • 土耳其
        • 其他中東地區
      • 非洲
        • 南非
        • 奈及利亞
        • 其他非洲地區

第6章 競爭情勢

  • 市場集中度
  • 策略趨勢
  • 市佔率分析
  • 公司簡介
    • Advanced Micro Devices Inc.
    • Apple Inc.
    • Arm Holdings plc
    • Broadcom Inc.
    • Rockchip Electronics Co., Ltd.
    • Google LLC（Tensor SoC）
    • HiSilicon Technologies Co., Ltd.
    • Infineon Technologies AG
    • Intel Corporation
    • Marvell Technology Inc.
    • MediaTek Inc.
    • Microchip Technology Inc.
    • Nvidia Corporation
    • NXP Semiconductors NV
    • Qualcomm Technologies Inc.
    • Realtek Semiconductor Corp.
    • Renesas Electronics Corporation
    • Samsung Electronics Co., Ltd.（System LSI）
    • SiFive Inc.
    • Silicon Labs Inc.
    • STMicroelectronics NV
    • Taiwan Semiconductor Manufacturing Company Limited
    • Texas Instruments Incorporated
    • Allwinner Technology Co., Ltd.
    • UNISOC Technologies Co., Ltd.

第7章 市場機會與未來展望

簡介目錄
Product Code: 92353

The system-on-chip market is expected to grow from USD 161.88 billion in 2025 to USD 173.94 billion in 2026 and is forecast to reach USD 249.19 billion by 2031 at 7.45% CAGR over 2026-2031.

System On Chip (SoC) - Market - IMG1

Softer smartphone refresh cycles were offset by rapid adoption of edge-native AI inference and 5G client devices, keeping unit volumes stable and average die sizes larger. Tier-one automotive OEMs consolidated dozens of control units into centralized compute domains, lifting demand for multicore, ASIL-D capable SoCs. Hyperscalers continued to displace merchant silicon with in-house designs, widening the addressable opportunity for advanced packaging providers. Regional fab incentives in the United States, Japan, and the European Union funded capacity that tempered supply-chain risk and encouraged localized design-for-manufacture strategies.

Global System On Chip (SoC) Market Trends and Insights

Soaring Demand for 5G-Enabled Devices

The first wave of standalone 5G networks brought tighter uplink budgets and higher baseband complexity, prompting smartphone OEMs to embed AI tuning engines inside the modem subsystem. Qualcomm's Snapdragon 8 Elite coupled a Release 17-class modem with a 45 TOPS neural engine that lifted performance per watt by 45% versus its predecessor. MediaTek's Dimensity 9400 adopted a similar hierarchy, accelerating in-line video enhancement for premium handsets launched in early 2025. Companion modules targeting industrial routers replicated this integration, allowing sub-millisecond actuation in smart-factory cells without cloud round-trips. Consequently, handset and industrial gateway refreshes amplified the near-term revenue pulse across the system-on-chip market.

Rapid IoT and AI-Edge Proliferation

Distributed inference workloads pushed designers to blend general-purpose cores, DSPs, and neural accelerators on a single die. EdgeCortix's SAKURA-II delivered 40 TOPS at sub-10-watt draw for industrial cameras that inspect parts in line. Smart-city integrators retrofitted traffic-signal cabinets with microservers that compress video streams locally before dispatching metadata, slashing backhaul by 80%. The architectural pivot increased silicon content per node while shortening design cycles, which in turn elevated heterogeneous/fusion SoCs as the fastest growing slice of the system on chip market.

Escalating Sub-5 nm Design and Mask Costs

Mask-set expenses for TSMC's 2 nm node surpassed USD 30,000 per wafer in late 2024, 50% higher than 3 nm, and drove total project budgets for complex SoCs toward USD 100 million. Only a handful of fabless houses could underwrite such outlays, forcing the long-tail of designers onto mature nodes, limiting feature integration and flattening TAM growth for bleeding-edge EDA vendors.

Other drivers and restraints analyzed in the detailed report include:

  1. Automotive Shift to Centralized E/E Architectures
  2. Subsidy-Fuelled Regional Fab Build-Out
  3. Export-Control Driven Supply-Chain Fragility

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Digital SoC devices held 52.45% of 2025 revenue, reflecting their ubiquity in smartphones and general computing. Designers reused scalable IP libraries across tiers, smoothing cost curves and enabling rapid derivative launches. However, the arrival of chiplet-based stacking tolls the first structural challenge to monolithic digital supremacy. Heterogeneous/fusion SoCs-splicing CPU, GPU, NPU, and specialty accelerators on a single interposer-logged a 9.7% CAGR outlook, siphoning share from legacy digital formats. Mixed-signal variants remained pivotal where sensor fusion and power management intersected, such as in battery BMS controllers. RF/connectivity SoCs capitalized on expanded Wi-Fi 7 and 5G RedCap rollouts, while analog-centric devices anchored powertrain and industrial drive channels. The result is a transitional phase where the system-on-chip market preserves digital volume leadership yet directs incremental R&D to modular, domain-specific hybrids.

The architectural reshuffle also changed the foundry mix. Pure digital tape-outs gravitated to high utilization 7/6 nm lines, whereas early heterogeneous prototypes paired 5 nm logic dies with 16 nm analogue chiplets, nesting under TSMC's SoIC packaging flow. This partitioning lowered risk by sheltering analog IP from ultra-thin fin-width shrink penalties. Vendors emphasized standardization through the Universal Chiplet Interconnect Express (UCIe) specification, aiming to unleash a multi-sourced chiplet marketplace after 2026. As interoperability matures, the system-on-chip market is slated to witness an accelerated product-type turnover, compressing design cycles and amplifying die-to-package value capture.

Consumer electronics commanded 45.58% revenue in 2025 as handsets, wearables, and AR glasses refreshed on predictable 12-to-18-month cadences. Content gains came from larger ISP clusters that supported generative AI camera features. Yet, automotive overtook communications infrastructure as the fastest-growing sector, charting a 13.85% CAGR through 2031. The shift stemmed from software-defined vehicle roadmaps that centralize perception, domain control, and infotainment workloads on a limited number of vehicle compute nodes. Tier-ones began locking multi-year silicon supply agreements, curbing allocation risk and granting SoC houses unmatched demand visibility. The industrial and IoT segment maintained steady single-digit expansion, aided by brownfield retrofits that layered predictive-maintenance models atop PLCs.

In healthcare, regulatory clearances for in-body continuous-glucose monitors boosted volumes of ultra-low-power biomedical SoCs with integrated radios. Data-center demand evolved as hyperscalers such as AWS adopted internally developed Graviton4 CPUs, eroding merchant server-CPU TAM yet spurring co-packaged optics controllers inside racks. Communications infrastructure revenue benefited from 5G Advanced baseband upgrades, but margins compressed due to open-RAN pricing. Altogether, the system-on-chip market leaned on automotive and edge-AI IoT orders to cushion cyclicality in consumer handsets, showcasing its diversified demand mosaic across industries.

System On Chip Market is Segmented by Product Type (Digital SoC, Analog SoC, Mixed-Signal SoC, RF/Connectivity SoC, and More), End-User Industry (Consumer Electronics, Communications Infrastructure, Automotive, and More), Process Node (>=28 Nm, 16/14 Nm, 10/8 Nm, 7/6 Nm, and More), Application (Smartphones and Tablets, Edge-AI and IoT Devices, Servers and Data Centers, Automotive ADAS/Infotainment, and More), and Geography.

Geography Analysis

Asia-Pacific held 54.20% revenue in 2025 and continued to outpace all regions with a 9.75% CAGR to 2031. China's "Little Giant" subsidy track funded over 200 domestic SoC startups, each targeting vertical niches from low-orbit satellite modems to automotive lidar-signal processors. South Korean IDMs leveraged captive DRAM plus HBM production to bundle memory with compute tiles, tightening ecosystem stickiness. Taiwan's foundry corridor maintained process leadership, shipping the first risk wafers on 2 nm gate-all-around in Q2 2025, while Japanese fabs specialized in wide-bandgap power SoCs for EV traction inverters.

North America benefited from USD 20 billion of Intel investment in Ohio and a new packaging plant in New Mexico that entered pilot runs in April 2025. AWS rolled Graviton4-based instances across five U.S. availability zones after July 2024 and reported a 30% web-tier performance uplift, establishing a silicon flywheel that accelerates domestic design cycles. Government export-control updates did constrain bilateral trade with China, yet robust cloud and defense spending preserved a high single-digit CAGR for the region.

Europe pivoted around automotive silicon excellence. German OEMs locked multi-generational supply accords with Infineon and STMicroelectronics to secure ADAS compute, while the EU Chips Act committed EUR 43 billion (USD 47.9 billion) to double regional output capacity by 2030. France and Italy co-financed wafer-level packing lines for 3-DIC modules tailored to industrial automation systems, ensuring supply autonomy for Industry 4.0 rollouts. Collectively, these dynamics indicate that while Asia-Pacific retains numeric leadership, the system-on-chip market is evolving into a tri-polar supply landscape that balances resilience with scale.

  1. Advanced Micro Devices Inc.
  2. Apple Inc.
  3. Arm Holdings plc
  4. Broadcom Inc.
  5. Rockchip Electronics Co., Ltd.
  6. Google LLC (Tensor SoC)
  7. HiSilicon Technologies Co., Ltd.
  8. Infineon Technologies AG
  9. Intel Corporation
  10. Marvell Technology Inc.
  11. MediaTek Inc.
  12. Microchip Technology Inc.
  13. Nvidia Corporation
  14. NXP Semiconductors N.V.
  15. Qualcomm Technologies Inc.
  16. Realtek Semiconductor Corp.
  17. Renesas Electronics Corporation
  18. Samsung Electronics Co., Ltd. (System LSI)
  19. SiFive Inc.
  20. Silicon Labs Inc.
  21. STMicroelectronics N.V.
  22. Taiwan Semiconductor Manufacturing Company Limited
  23. Texas Instruments Incorporated
  24. Allwinner Technology Co., Ltd.
  25. UNISOC Technologies Co., Ltd.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 Soaring demand for 5G-enabled devices
    • 4.2.2 Rapid IoT and AI-edge proliferation
    • 4.2.3 Automotive shift to centralized E/E architectures
    • 4.2.4 Subsidy-fuelled regional fab build-out
    • 4.2.5 Chiplet-based heterogeneous integration momentum
    • 4.2.6 Edge-native AI model inference needs
  • 4.3 Market Restraints
    • 4.3.1 Escalating <5 nm design and mask costs
    • 4.3.2 Export-control driven supply-chain fragility
    • 4.3.3 Immature chiplet interoperability standards
    • 4.3.4 Thermal-density limits in high-end SoCs
  • 4.4 Impact of Macroeconomic Factors
  • 4.5 Value Chain Analysis
  • 4.6 Regulatory Landscape
  • 4.7 Technological Outlook
  • 4.8 Porter's Five Forces Analysis
    • 4.8.1 Bargaining Power of Suppliers
    • 4.8.2 Bargaining Power of Buyers
    • 4.8.3 Threat of New Entrants
    • 4.8.4 Threat of Substitutes
    • 4.8.5 Intensity of Competitive Rivalry
  • 4.9 Chiplet Adoption and Disaggregation Trend Analysis

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

  • 5.1 By Product Type
    • 5.1.1 Digital SoC
    • 5.1.2 Analog SoC
    • 5.1.3 Mixed-signal SoC
    • 5.1.4 RF / Connectivity SoC
    • 5.1.5 Heterogeneous / Fusion SoC
  • 5.2 By End-user Industry
    • 5.2.1 Consumer Electronics
    • 5.2.2 Communications Infrastructure
    • 5.2.3 Automotive
    • 5.2.4 Computing and Data Center
    • 5.2.5 Industrial and IoT
    • 5.2.6 Healthcare and Medical Devices
  • 5.3 By Process Node
    • 5.3.1 >=28 nm
    • 5.3.2 16/14 nm
    • 5.3.3 10/8 nm
    • 5.3.4 7/6 nm
    • 5.3.5 5/4/3 nm
    • 5.3.6 2 nm and below / 3-DIC
  • 5.4 By Application
    • 5.4.1 Smartphones and Tablets
    • 5.4.2 Edge-AI and IoT Devices
    • 5.4.3 Servers and Data Centers
    • 5.4.4 Automotive ADAS/Infotainment
    • 5.4.5 Industrial Automation
    • 5.4.6 Wearables and Smart Home
  • 5.5 By Geography
    • 5.5.1 North America
      • 5.5.1.1 United States
      • 5.5.1.2 Canada
    • 5.5.2 South America
      • 5.5.2.1 Brazil
      • 5.5.2.2 Rest of South America
    • 5.5.3 Europe
      • 5.5.3.1 Germany
      • 5.5.3.2 France
      • 5.5.3.3 United Kingdom
      • 5.5.3.4 Italy
      • 5.5.3.5 Spain
      • 5.5.3.6 Russia
      • 5.5.3.7 Rest of Europe
    • 5.5.4 Asia-Pacific
      • 5.5.4.1 China
      • 5.5.4.2 Japan
      • 5.5.4.3 South Korea
      • 5.5.4.4 Taiwan
      • 5.5.4.5 India
      • 5.5.4.6 Rest of Asia-Pacific
    • 5.5.5 Middle East and Africa
      • 5.5.5.1 Middle East
        • 5.5.5.1.1 Saudi Arabia
        • 5.5.5.1.2 United Arab Emirates
        • 5.5.5.1.3 Turkey
        • 5.5.5.1.4 Rest of Middle East
      • 5.5.5.2 Africa
        • 5.5.5.2.1 South Africa
        • 5.5.5.2.2 Nigeria
        • 5.5.5.2.3 Rest of Africa

6 COMPETITIVE LANDSCAPE

  • 6.1 Market Concentration
  • 6.2 Strategic Moves
  • 6.3 Market Share Analysis
  • 6.4 Company Profiles (includes Global-level Overview, Market-level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
    • 6.4.1 Advanced Micro Devices Inc.
    • 6.4.2 Apple Inc.
    • 6.4.3 Arm Holdings plc
    • 6.4.4 Broadcom Inc.
    • 6.4.5 Rockchip Electronics Co., Ltd.
    • 6.4.6 Google LLC (Tensor SoC)
    • 6.4.7 HiSilicon Technologies Co., Ltd.
    • 6.4.8 Infineon Technologies AG
    • 6.4.9 Intel Corporation
    • 6.4.10 Marvell Technology Inc.
    • 6.4.11 MediaTek Inc.
    • 6.4.12 Microchip Technology Inc.
    • 6.4.13 Nvidia Corporation
    • 6.4.14 NXP Semiconductors N.V.
    • 6.4.15 Qualcomm Technologies Inc.
    • 6.4.16 Realtek Semiconductor Corp.
    • 6.4.17 Renesas Electronics Corporation
    • 6.4.18 Samsung Electronics Co., Ltd. (System LSI)
    • 6.4.19 SiFive Inc.
    • 6.4.20 Silicon Labs Inc.
    • 6.4.21 STMicroelectronics N.V.
    • 6.4.22 Taiwan Semiconductor Manufacturing Company Limited
    • 6.4.23 Texas Instruments Incorporated
    • 6.4.24 Allwinner Technology Co., Ltd.
    • 6.4.25 UNISOC Technologies Co., Ltd.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

  • 7.1 White-space and Unmet-need Assessment