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市場調查報告書
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1787889

2032 年系統晶片市場預測:按類型、核心數量、架構、應用、最終用戶和地區進行的全球分析

System-on-Chip Market Forecasts to 2032 - Global Analysis By Type, Core Count, Architecture, Application, End User and By Geography

出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

根據 Stratistics MRC 的預測,全球系統晶片市場規模預計在 2025 年達到 2,230.6 億美元,到 2032 年將達到 4,374.5 億美元,複合年成長率為 10.1%。

將電腦或電子系統所需的所有組件整合到單一晶片上的積體電路稱為系統系統晶片晶片 (SoC)。它通常包含中央處理器 (CPU)、記憶體、輸入/輸出埠、圖形處理單元 (GPU)、數位訊號處理器 (DSP)、無線通訊模組以及其他支援元件。 SoC 結構緊湊、節能且專為特定目的而設計,是嵌入式系統、行動裝置和物聯網 (IoT) 裝置的理想選擇。與傳統的多晶片解決方案相比,SoC 透過將多種功能整合到單一晶片上,最大限度地減少了空間需求、提高了效能並降低了成本。

根據代表美國公司的領先產業組織半導體產業協會 (SIA) 的數據,該協會負責美國約 80% 的半導體生產,預計 2024 年全球半導體收益將達到 6276 億美元(2025 年第一季為 1,677 億美元,2025 年 4 月為 570 億美元),成長 2.5%,成長 2.5%,成長 2.5%。

包括智慧型手機在內的行動裝置增加

推動 SoC 市場發展的關鍵因素之一是智慧型手機和行動運算設備的快速成長。客戶需要更強大、功能更豐富、支援多工、更節能、體積更小的設備。 SoC 透過將 CPU、GPU、數據機、記憶體控制器以及有時還整合到單一晶片上,不僅滿足了這些需求,還降低了尺寸和功耗。這種整合技術使行動電話變得更薄、性能更快、電池續航時間更長。此外,隨著 5G 在全球範圍內的加速普及,整合 5G 數據機的 SoC 也正在開發中,這進一步提升了 SoC 在行動技術中的重要性。

製造成本高且初期投資大

開發SoC需要大量的前期投資,包括研發、設計工具、IP授權以及代工廠的進入。在先進節點(例如5奈米或3奈米)生產SoC需要成本高昂的半導體製造程序,而晶圓廠(fab)的建造和營運成本高達數十億美元。全球只有台積電、三星和英特爾等少數幾家公司能夠量產先進的SoC。高昂的資本支出對新參與企業和中小型公司構成了巨大的進入障礙。此外,即使是一個設計缺陷也可能導致對整個晶片進行昂貴且耗時的返工,從而導致巨大的故障和返工成本。

生物醫學醫療設備和醫療保健的成長

新冠疫情 (COVID-19) 疫情推動了全球對穿戴式監控、遠距醫療和診斷設備的需求,為 SoC 在醫療技術領域的整合開闢了新的途徑。行動診斷套件、智慧胰島素幫浦、穿戴式醫療設備以及連網心電圖 (ECG)/心電圖監測儀都需要安全有效的片上通訊和運算。透過將感測器、數據處理、無線通訊和安全功能整合到單一單元中,SoC 提供了可靠、緊湊的解決方案。人工智慧在醫療保健領域的應用,例如影像分析和預測診斷等任務,進一步推動了對具有醫療級安全性和處理能力的 SoC 的需求。

依賴少數代工廠

以台積電和三星為首的少數幾家代工廠控制著先進SoC(尤其是採用5奈米和3奈米製程節點的SoC)的絕大部分製造。由於這種高度依賴,這些代工廠的停工,無論是由於產能限制、自然災害、政治動盪或設備短缺,都可能影響全球SoC的生產。 2020-2022年的晶片短缺表明,依賴少數晶圓廠可能會嚴重影響家用電子電器、汽車和智慧型手機等下游產業。此外,這種壟斷結構限制了晶片設計商的議價能力和價格競爭力,增加了供應側出現瓶頸的可能性。

COVID-19的影響

新冠疫情最初擾亂了全球供應鏈、半導體製造和物流,原因是工廠關閉和勞動力短缺,尤其是在中國大陸、台灣和東南亞等主要製造地。這對系統晶片(SoC) 市場產生了多方面的影響。這些中斷導致了嚴重的晶片短缺,使得包括家用電子電器、智慧型手機、汽車和工業設備在內的多個行業的 SoC 供應減少。這場疫情也加速了全球數位轉型,推動了對基於 SoC 的設備(例如筆記型電腦、智慧型手機、物聯網感測器、醫療穿戴設備和雲端基礎設施組件)的需求。此外,需求激增和供不應求導致價格波動,凸顯了國內半導體能力的戰略重要性。

預計數位 SoC 市場在預測期內將佔據最大佔有率

預計數位SoC領域將在預測期內佔據最大的市場佔有率。這種主導地位源自於數位SoC在穿戴式裝置、筆記型電腦、平板電腦、智慧型手機和高效能運算系統等家用電子電器的廣泛應用。數位SoC透過將CPU、GPU、記憶體控制器以及最新的AI加速器等基本元件整合到單一晶片上,實現了強大的處理能力、節能性和緊湊的設備設計。此外,儘管對更快處理速度、5G設備、邊緣AI和智慧應用的需求日益成長,數位SoC仍透過支援各行各業的各種即時和運算密集型應用繼續佔據市場主導地位。

預計預測期內汽車和運輸領域將以最高的複合年成長率成長。

由於尖端電子設備在汽車中的應用日益廣泛,尤其是聯網汽車、自動駕駛系統和電動車,預計汽車和交通運輸領域將在預測期內實現最高成長率。資訊娛樂、電池管理、車聯網 (V2X)通訊和高級駕駛輔助系統 (ADAS) 等應用都依賴 SoC 來實現即時處理。隨著汽車製造商轉向集中式運算和軟體定義的車輛架構,高性能、節能的 SoC 的需求日益成長。此外,汽車安全和排放標準的監管要求也迫使汽車製造商採用依賴基於 SoC 解決方案的智慧技術。

比最大的地區

預計亞太地區將在預測期內佔據最大的市場佔有率。該地區在消費性電子和半導體生產領域佔據主導地位,各行各業也擴大採用最尖端科技。中國大陸、韓國、台灣和日本等國家和地區擁有主要的晶片代工廠、電子巨頭以及強大的供應鏈生態系統,這些都促進了SoC的大規模開發和部署。智慧型手機、5G基礎設施、電動車和物聯網設備的強勁需求進一步推動了該位置SoC的消費。此外,印度「印度製造」計畫等政府措施以及中國推動半導體自力更生的努力也在加速國內SoC的設計和製造。

複合年成長率最高的地區

預計北美地區在預測期內的複合年成長率最高。該地區在先進半導體設計領域的領先地位、對整合人工智慧和機器學習、邊緣運算、無人駕駛汽車設備的高需求以及5G基礎設施的日益普及,是推動這一成長的關鍵因素。 AMD、NVIDIA、高通和英特爾等主要科技公司和晶片設計公司的入駐,以及美國《晶片與科學法案》等政府專案的投資增加,正在刺激技術創新和國內製造業的發展。此外,雲端資料中心、國防電子以及電動和自動駕駛汽車專案的成長,正在推動各行各業對系統單晶片(SoC)的快速應用。

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目錄

第1章執行摘要

第2章 前言

  • 概述
  • 相關利益者
  • 調查範圍
  • 調查方法
    • 資料探勘
    • 數據分析
    • 數據檢驗
    • 研究途徑
  • 研究材料
    • 主要研究資料
    • 二手研究資料
    • 先決條件

第3章市場走勢分析

  • 介紹
  • 驅動程式
  • 抑制因素
  • 機會
  • 威脅
  • 應用分析
  • 最終用戶分析
  • 新興市場
  • COVID-19的影響

第4章 波特五力分析

  • 供應商的議價能力
  • 買方的議價能力
  • 替代品的威脅
  • 新進入者的威脅
  • 競爭對手之間的競爭

5. 全球系統晶片市場類型

  • 介紹
  • 數位SoC
  • 混合訊號SoC
  • 模擬SoC
  • 射頻/連接 SoC

6. 全球系統晶片市場(以核心數為單位)

  • 介紹
  • 單核
  • 雙核心
  • 四核心
  • 八核心
  • 多核心

7. 全球系統晶片市場(依架構)

  • 介紹
  • 手臂
  • x86
  • RISC-V
  • 百萬指令
  • 其他架構

第 8 章:全球系統晶片市場(按應用)

  • 介紹
  • 家用電子電器產品
  • 智慧型手機和攜帶式電子設備
  • ADAS 系統
  • 醫療設備
  • 射頻設備
  • 電力電子
  • 有線和無線通訊設備
  • 其他

9. 全球系統晶片市場(按最終用戶)

  • 介紹
  • 家用電子電器
  • 汽車和運輸
  • 資訊科技/通訊
  • 航太和國防
  • 衛生保健
  • 電力/公共產業
  • 其他

第 10 章:全球系統晶片市場(按地區)

  • 介紹
  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 義大利
    • 法國
    • 西班牙
    • 其他歐洲國家
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳洲
    • 紐西蘭
    • 韓國
    • 其他亞太地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地區
  • 中東和非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 卡達
    • 南非
    • 其他中東和非洲地區

第11章 重大進展

  • 協議、夥伴關係、合作和合資企業
  • 收購與合併
  • 新產品發布
  • 業務擴展
  • 其他關鍵策略

第12章 公司概況

  • Broadcom Inc.
  • Intel Corporation
  • Huawei Technologies Co. Ltd.
  • Microchip Technology Inc
  • Advanced Micro Devices Inc.
  • NXP Semiconductors NV
  • MediaTek Inc.
  • Infineon Technologies AG
  • Toshiba Corporation
  • STMicroelectronics NV
  • Apple, Inc.
  • NVIDIA Corporation
  • Texas Instruments Incorporated
  • Samsung Electronics Co. Ltd.
  • Qualcomm Incorporated
  • Renesas Electronics Corporation
  • Taiwan Semiconductor Manufacturing Co., Ltd.
Product Code: SMRC30154

According to Stratistics MRC, the Global System-on-Chip Market is accounted for $223.06 billion in 2025 and is expected to reach $437.45 billion by 2032 growing at a CAGR of 10.1% during the forecast period. The integrated circuit that houses all of the necessary parts of a computer or electronic system on a single chip is called a System-on-Chip (SoC). A central processing unit (CPU), memory, input/output ports, and auxiliary parts like graphics processing units (GPUs), digital signal processors (DSPs), and wireless communication modules are usually included. Compact, power-efficient, and application-specific, SoCs are perfect for embedded systems, mobile devices, and Internet of Things (IoT) gadgets. In comparison to conventional multi-chip solutions, SoCs minimize space requirements, improve performance, and lower costs by combining multiple functions into a single chip.

According to the Semiconductor Industry Association (SIA)-a key trade association that represents U.S. companies responsible for roughly 80% of America's semiconductor production-global semiconductor revenue reached $627.6 billion in 2024, including $167.7 billion in the first quarter of 2025, and $57.0 billion in April 2025, reflecting an increase of 2.5%.

Market Dynamics:

Driver:

Increase in smartphones and other mobile devices

One of the main factors propelling the SoC market is the exponential rise in smartphones and mobile computing devices. Customers are calling for more potent, feature-rich, multitasking, energy-efficient, and small devices. By combining the CPU, GPU, modem, memory controller, and occasionally AI engines onto a single chip, SoCs satisfy these requirements while lowering size and power consumption. Thinner phones with faster performance and longer battery life are made possible by this integration. Moreover, SoCs with integrated 5G modems are also being developed as 5G adoption picks up speed worldwide, further solidifying their importance in mobile technologies.

Restraint:

High fabrication costs and initial investment

Large upfront expenditures in R&D, design tools, IP licensing, and foundry access are required for SoC development. The fabrication of SoCs at advanced nodes (such as 5 nm and 3 nm) requires very costly semiconductor fabrication processes; the construction and operation of fabrication plants (fabs) can cost billions of dollars. Only a small number of businesses worldwide, including TSMC, Samsung, and Intel, are able to mass-produce sophisticated SoCs. The high capital expenditure serves as a major barrier to entry for new or smaller players. Furthermore, a single design flaw may require an expensive and time-consuming re-spin of the entire chip, resulting in a huge cost of failure or rework.

Opportunity:

Growth in biomedical devices and healthcare

Enhanced by the COVID-19 pandemic, the global demand for wearable monitoring, remote healthcare, and diagnostic devices has opened up new avenues for SoC integration in medical technology. Mobile diagnostic kits, smart insulin pumps, wearable medical devices, and connected ECG/EKG monitors all need secure and effective on-chip communication and computation. Through the integration of sensors, data processing, wireless communication, and security features into a single unit, SoCs offer a dependable and small solution. Additionally, a further factor driving demand for SoCs with medical-grade safety and processing capabilities is the use of AI in healthcare for tasks like imaging analysis and predictive diagnostics.

Threat:

Reliance on a small group of foundries

A small number of companies, most notably TSMC and Samsung Foundry, control a large portion of the manufacturing of advanced SoCs, especially those that use 5 nm and 3 nm process nodes. Because of this concentrated reliance, any interruption in these foundries-whether brought on by capacity limitations, natural disasters, political unrest, or equipment shortages-may have an impact on the production of SoC worldwide. The shortage of chips in 2020-2022 demonstrated how downstream industries like consumer electronics, automobiles, and smartphones can be seriously crippled by reliance on a small number of fabs. Moreover, chip designers' bargaining power and price competitiveness are restricted by this monopoly-like structure, raising the possibility of supply-side bottlenecks.

Covid-19 Impact:

Due to factory closures and labor shortages, particularly in major manufacturing hubs like China, Taiwan, and Southeast Asia, the COVID-19 pandemic initially disrupted global supply chains, semiconductor fabrication, and logistics. This had a multifaceted effect on the System-on-Chip (SoC) market. Due to these disruptions, there was a severe shortage of chips, which impacted the availability of SoCs in a variety of industries, including consumer electronics, smartphones, automobiles, and industrial devices. Global digital transformation was also sped up by the pandemic, which raised demand for SoC-powered gadgets like laptops, smartphones, IoT sensors, medical wearables, and cloud infrastructure parts. Additionally, price volatility resulted from this spike in demand and supply shortages, underscoring the strategic significance of domestic semiconductor capabilities.

The digital SoCs segment is expected to be the largest during the forecast period

The digital SoCs segment is expected to account for the largest market share during the forecast period. The extensive use of digital SoCs in consumer electronics like wearables, laptops, tablets, smartphones, and high-performance computing systems is what is causing this dominance. Digital SoCs allow for powerful processing, energy efficiency, and small device designs by combining necessary parts like CPUs, GPUs, memory controllers, and increasingly AI accelerators onto a single chip. Furthermore, digital SoCs continue to dominate the market by supporting a wide range of real-time and compute-intensive applications across industries, despite the growing demand for faster processing, 5G-enabled devices, AI at the edge, and smart applications.

The automotive and transportation segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the automotive and transportation segment is predicted to witness the highest growth rate because of the growing use of cutting-edge electronics in automobiles, particularly in connected cars, autonomous driving systems, and electric vehicles. Applications like infotainment, battery management, vehicle-to-everything (V2X) communication, and advanced driver assistance systems (ADAS) depend on SoCs to enable real-time processing. High-performance, energy-efficient SoCs are becoming more and more in demand as automakers move toward centralized computing and software-defined vehicle architectures. Additionally, manufacturers are being forced to embrace smart technologies that rely on SoC-based solutions due to regulatory requirements for vehicle safety and emission standards.

Region with largest share:

During the forecast period, the Asia-Pacific region is expected to hold the largest market share, driven by the area's leadership in the production of consumer electronics and semiconductors, as well as the expanding use of cutting-edge technologies in a variety of industries. Major chip foundries, electronics behemoths, and a strong supply chain ecosystem that facilitates large-scale SoC development and deployment are located in nations like China, South Korea, Taiwan, and Japan. SoC consumption is further increased in the region by the robust demand for smartphones, 5G infrastructure, electric vehicles, and Internet of Things devices. Furthermore, domestic SoC design and manufacturing are also being accelerated by government initiatives like India's "Make in India" program and China's push for semiconductor self-reliance.

Region with highest CAGR:

Over the forecast period, the North American region is anticipated to exhibit the highest CAGR. The region's leadership in advanced semiconductor design, the high demand for devices with AI and ML integrated, and the growing uptake of edge computing, driverless cars and 5G infrastructures are all contributing factors to this growth. Growing investments under government programs like the U.S. CHIPS and Science Act, along with the presence of significant tech firms and chip designers like AMD, NVIDIA, Qualcomm, and Intel, are speeding up innovation and domestic manufacturing. Moreover, rapid SoC adoption across a variety of industries is also being fueled by the growth of cloud data centers, defense-grade electronics, and electric and autonomous vehicle programs.

Key players in the market

Some of the key players in System-on-Chip Market include Broadcom Inc., Intel Corporation, Huawei Technologies Co. Ltd., Microchip Technology Inc, Advanced Micro Devices Inc., NXP Semiconductors NV, MediaTek Inc., Infineon Technologies AG, Toshiba Corporation, STMicroelectronics NV, Apple, Inc., NVIDIA Corporation, Texas Instruments Incorporated, Samsung Electronics Co. Ltd., Qualcomm Incorporated, Renesas Electronics Corporation and Taiwan Semiconductor Manufacturing Co., Ltd.

Key Developments:

In July 2025, Microchip Technology announces that under a new partnership agreement with Delta Electronics, Inc. the companies will collaborate to use Microchip's mSiC(TM) products and technology in Delta's designs. The synergies between the companies aim to accelerate the development of innovative SiC solutions, energy-saving products and systems that enable a more sustainable future.

In April 2025, Intel Corporation announced that it has entered into a definitive agreement to sell 51% of its Altera business to Silver Lake, a global leader in technology investing. The transaction, which values Altera at $8.75 billion, establishes Altera's operational independence and makes it the largest pure-play FPGA semiconductor solutions company.

In November 2024, Broadcom Inc. and Telia Company announced the expansion of their longtime partnership with a new multi-year agreement, which will see Telia further modernize and transform its telco and cloud infrastructure with the VMware product portfolio. Telia, a Nordic and Baltic telecommunications leader and Nordic media house, will continue its network and IT cloud journey with both VMware Telco Cloud Platform and VMware Cloud Foundation as the basis of its modern cloud platform.

Types Covered:

  • Digital SoCs
  • Mixed-Signal SoCs
  • Analog SoCs
  • RF/Connectivity SoCs

Core Counts Covered:

  • Single-core
  • Dual-core
  • Quad-core
  • Octa-core
  • Multi-core

Architectures Covered:

  • ARM
  • x86
  • RISC-V
  • MIPS
  • Other Architectures

Applications Covered:

  • Home Appliances
  • Smartphones & Portable Electronic Devices
  • ADAS System
  • Medical Devices
  • RF Devices
  • Power Electronics
  • Wired & Wireless Communication Devices
  • Other Applications

End Users Covered:

  • Consumer Electronics
  • Automotive and Transportation
  • IT & Telecommunication
  • Aerospace & Defense
  • Healthcare
  • Power & Utility
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global System-on-Chip Market, By Type

  • 5.1 Introduction
  • 5.2 Digital SoCs
  • 5.3 Mixed-Signal SoCs
  • 5.4 Analog SoCs
  • 5.5 RF/Connectivity SoCs

6 Global System-on-Chip Market, By Core Count

  • 6.1 Introduction
  • 6.2 Single-core
  • 6.3 Dual-core
  • 6.4 Quad-core
  • 6.5 Octa-core
  • 6.6 Multi-core

7 Global System-on-Chip Market, By Architecture

  • 7.1 Introduction
  • 7.2 ARM
  • 7.3 x86
  • 7.4 RISC-V
  • 7.5 MIPS
  • 7.6 Other Architectures

8 Global System-on-Chip Market, By Application

  • 8.1 Introduction
  • 8.2 Home Appliances
  • 8.3 Smartphones & Portable Electronic Devices
  • 8.4 ADAS System
  • 8.5 Medical Devices
  • 8.6 RF Devices
  • 8.7 Power Electronics
  • 8.8 Wired & Wireless Communication Devices
  • 8.9 Other Applications

9 Global System-on-Chip Market, By End User

  • 9.1 Introduction
  • 9.2 Consumer Electronics
  • 9.3 Automotive and Transportation
  • 9.4 IT & Telecommunication
  • 9.5 Aerospace & Defense
  • 9.6 Healthcare
  • 9.7 Power & Utility
  • 9.8 Other End Users

10 Global System-on-Chip Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 Broadcom Inc.
  • 12.2 Intel Corporation
  • 12.3 Huawei Technologies Co. Ltd.
  • 12.4 Microchip Technology Inc
  • 12.5 Advanced Micro Devices Inc.
  • 12.6 NXP Semiconductors NV
  • 12.7 MediaTek Inc.
  • 12.8 Infineon Technologies AG
  • 12.9 Toshiba Corporation
  • 12.10 STMicroelectronics NV
  • 12.11 Apple, Inc.
  • 12.12 NVIDIA Corporation
  • 12.13 Texas Instruments Incorporated
  • 12.14 Samsung Electronics Co. Ltd.
  • 12.15 Qualcomm Incorporated
  • 12.16 Renesas Electronics Corporation
  • 12.17 Taiwan Semiconductor Manufacturing Co., Ltd.

List of Tables

  • Table 1 Global System-on-Chip Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global System-on-Chip Market Outlook, By Type (2024-2032) ($MN)
  • Table 3 Global System-on-Chip Market Outlook, By Digital SoCs (2024-2032) ($MN)
  • Table 4 Global System-on-Chip Market Outlook, By Mixed-Signal SoCs (2024-2032) ($MN)
  • Table 5 Global System-on-Chip Market Outlook, By Analog SoCs (2024-2032) ($MN)
  • Table 6 Global System-on-Chip Market Outlook, By RF/Connectivity SoCs (2024-2032) ($MN)
  • Table 7 Global System-on-Chip Market Outlook, By Core Count (2024-2032) ($MN)
  • Table 8 Global System-on-Chip Market Outlook, By Single-core (2024-2032) ($MN)
  • Table 9 Global System-on-Chip Market Outlook, By Dual-core (2024-2032) ($MN)
  • Table 10 Global System-on-Chip Market Outlook, By Quad-core (2024-2032) ($MN)
  • Table 11 Global System-on-Chip Market Outlook, By Octa-core (2024-2032) ($MN)
  • Table 12 Global System-on-Chip Market Outlook, By Multi-core (2024-2032) ($MN)
  • Table 13 Global System-on-Chip Market Outlook, By Architecture (2024-2032) ($MN)
  • Table 14 Global System-on-Chip Market Outlook, By ARM (2024-2032) ($MN)
  • Table 15 Global System-on-Chip Market Outlook, By x86 (2024-2032) ($MN)
  • Table 16 Global System-on-Chip Market Outlook, By RISC-V (2024-2032) ($MN)
  • Table 17 Global System-on-Chip Market Outlook, By MIPS (2024-2032) ($MN)
  • Table 18 Global System-on-Chip Market Outlook, By Other Architectures (2024-2032) ($MN)
  • Table 19 Global System-on-Chip Market Outlook, By Application (2024-2032) ($MN)
  • Table 20 Global System-on-Chip Market Outlook, By Home Appliances (2024-2032) ($MN)
  • Table 21 Global System-on-Chip Market Outlook, By Smartphones & Portable Electronic Devices (2024-2032) ($MN)
  • Table 22 Global System-on-Chip Market Outlook, By ADAS System (2024-2032) ($MN)
  • Table 23 Global System-on-Chip Market Outlook, By Medical Devices (2024-2032) ($MN)
  • Table 24 Global System-on-Chip Market Outlook, By RF Devices (2024-2032) ($MN)
  • Table 25 Global System-on-Chip Market Outlook, By Power Electronics (2024-2032) ($MN)
  • Table 26 Global System-on-Chip Market Outlook, By Wired & Wireless Communication Devices (2024-2032) ($MN)
  • Table 27 Global System-on-Chip Market Outlook, By Other Applications (2024-2032) ($MN)
  • Table 28 Global System-on-Chip Market Outlook, By End User (2024-2032) ($MN)
  • Table 29 Global System-on-Chip Market Outlook, By Consumer Electronics (2024-2032) ($MN)
  • Table 30 Global System-on-Chip Market Outlook, By Automotive and Transportation (2024-2032) ($MN)
  • Table 31 Global System-on-Chip Market Outlook, By IT & Telecommunication (2024-2032) ($MN)
  • Table 32 Global System-on-Chip Market Outlook, By Aerospace & Defense (2024-2032) ($MN)
  • Table 33 Global System-on-Chip Market Outlook, By Healthcare (2024-2032) ($MN)
  • Table 34 Global System-on-Chip Market Outlook, By Power & Utility (2024-2032) ($MN)
  • Table 35 Global System-on-Chip Market Outlook, By Other End Users (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.