CPO試驗中的創新：共封裝光學模組檢驗的市場機會

隨著共封裝光學模組（CPO）從研發階段邁向實用化，偵測對於實現大規模生產和長期系統穩定性非常重要。然而，CPO 檢測仍面臨許多挑戰，例如日益嚴格的對準精度要求、自動化程度不足以及缺乏成熟的PIC 測試標準。為了應對這些挑戰，傳統的電子元件偵測（EIC）設備供應商，例如 Advantest 和 Teradyne，近期開始與 PIC 探針測試專家，例如 FormFactor 和 ficonTEC 合作。儀器供應商，例如 Keysight 和 Enlitech，也推出可整合到 CPO 檢測系統中的解決方案。

因此，本報告詳細分析了以下四個面向：（1）CPO的技術瓶頸和測試挑戰；（2）CPO 的測試水準；（3）現有的CPO 測試設備和供應商；（4）CPO 測試設備供應鏈中的商機。其目的是幫助供應商了解 CPO 測試技術的發展趨勢和供應鏈的競爭格局。

主要亮點

• 商業化的挑戰：隨著 CPO 從實驗室走向市場，測試對於實現大規模生產和系統穩定性非常重要。
• 技術瓶頸：更嚴格的對準精度要求、自動化程度不足以及缺乏已建立的PIC測試標準。
• 產業合作：傳統 EIC 測試供應商正與 PIC 探測專家合作，以應對挑戰。
• 解決方案整合：測量儀器供應商開發整合式 CPO 測試系統。
• 研究範圍：詳細分析技術瓶頸、測試水準、設備趨勢和供應商生態系統。
• 目標：使相關人員能夠了解技術發展趨勢和供應鏈競爭動態。

目錄

第1章 CPO面臨的技術瓶頸與測試挑戰

第2章 CPO測試等級

第3章 現有CPO測試設備及供應商

第4章 CPO測試設備供應鏈中的機會

第5章 TRI的視角

As Co-Packaged Optics (CPO) moves from the lab toward commercialization, inspection has become the key to achieving mass producibility and long-term system stability. However, CPO inspection still faces challenges such as tighter alignment‑accuracy requirements, insufficient automation, and the lack of established PIC test standards. To address these issues, traditional EIC test‑equipment vendors such as Advantest and Teradyne have in recent years begun partnering with PIC probing specialists like FormFactor and ficonTEC, while measurement‑instrument vendors such as Keysight and Enlitech have also introduced solutions that can be integrated into CPO inspection systems.

This report therefore provides an in‑depth analysis of: (1) CPO technical bottlenecks and test challenges, (2) CPO test levels, (3) existing CPO inspection equipment and suppliers, as well as (4) supply‑chain opportunities for CPO test equipment. The aim is to help vendors understand CPO test technology developments and the competitive landscape of the supply chain.

Key Highlights

• Commercialization Challenge: Inspection critical for achieving mass production and system stability as CPO transitions from lab to market.
• Technical Bottlenecks: Tighter alignment accuracy, insufficient automation, and absence of established PIC testing standards.
• Industry Collaboration: Traditional EIC test vendors partnering with PIC probing specialists to address challenges.
• Solution Integration: Measurement instrument providers developing integrated CPO inspection systems.
• Report Scope: In-depth examination of technical bottlenecks, test levels, equipment landscape, and supplier ecosystem.
• Objective: Enable stakeholders to understand technology developments and supply-chain competitive dynamics.

Table of Contents

1. CPO Technical Bottlenecks and Test Challenges

• Figure 1: Schematics of TSMC’s COUPE
• Figure 2: Differences in Cross-Sectional Area Between Optical Fiber and Optical Waveguide
• Figure 3: Schematics of Optical Probes
• Table 1: Requirements on EIC and PIC Testing

2. CPO Test Levels

• Figure 4: Schematics of CPO Process and Testing of Each Layer

3. Existing CPO Inspection Equipment and Suppliers

• Figure 5: Changes to Market Scale and Market Share among Vendors of SoC Testers (2018-2025)
• Figure 6: Changes to Market Scale and Market Share among Vendors of Memory Testers (2018-2025)
• Figure 7: UFO Probe Card from Advantest, Jenoptik, and Ayar Labs
• Figure 8: V93000-Triton Photonic Test Solution from Advantest and FormFactor
• Figure 9: FormFactor’s OptoVue Pro
• Figure 10: WLT-D2 from Teradyne and ficonTEC
• Figure 11: Chroma’s Model 58606
• Figure 12: Measurement Results with Lamda Scan
• Figure 13: EnliTech’s Night Jar: Wafer-Level Optical Loss Mapping

4. Opportunities in the CPO Testing Equipment Supply Chain

• Figure 14: Breakdown of SPE Capital Expenditures by Process Equipment (2023-2025)
• Table 2: Comparison of Specifications of Existing Wafer-Level PIC Testing Solutions
• Table 3: CPO Testing Equipment Supply Chain

5. TRI’s View