![]() |
市場調查報告書
商品編碼
1873426
共封裝光模組(CPO)-全球市場佔有率和排名、總收入和需求預測(2025-2031年)Co-Packaged Optics Module (CPO) - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031 |
||||||
※ 本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。
2024 年全球共封裝光學模組(CPO) 市場規模預計為 4,460 萬美元,預計到 2031 年將達到 12.36 億美元,在預測期(2025-2031 年)內複合年成長率為 49.0%。
共封裝光學元件 (CPO) 是一種將光元件和矽晶片高度異質整合到單一構裝基板上的技術,旨在應對下一代頻寬和功耗方面的挑戰。 CPO 融合了光纖、數位訊號處理 (DSP)、交換器專用積體電路 (ASIC) 以及尖端封裝和測試方面的豐富專業知識,為資料中心和雲端基礎設施帶來創新的系統價值。通常,CPO 透過以下幾種方式實現節能:
消除損耗較大的銅纜:與可插拔光學模組不同,CPO 設計無需訊號透過基板耗能的銅纜鏈路從 ASIC 晶片傳輸到前面板。相反,CPO 設計將光纖直接連接到交換機,從而實現晶片和光引擎之間的短距離、低損耗通訊。
數位訊號處理器 (DSP) 的減少:在目前支援 25G/通道以上速度的架構中,基於 DSP 的重定時器是插入式光模組的必要組件,用於主動分析和校正訊號劣化、失真和時序問題。 DSP 會使系統總功耗增加 25-30%。然而,透過消除 ASIC 和光組件之間片外損耗的銅互連,CPO 允許設計人員安全地減少一級 DSP,從而節省功耗和成本。
整合雷射:關於雷射光源的定位,目前有兩種主要思路。主流方法是使用外部雷射器,這需要將光通過光纖傳輸並耦合到晶片上,通常會導致 30-50% 的光功率損耗。另一種方法是將雷射直接整合到晶片上,如果能夠確保溫度控管和雷射可靠性,這種方法可以實現比外部雷射更高的光耦合效率。
更高的頻寬和更低的延遲:CPO 透過減少 DSP 和消除長銅線,實現了更高的頻寬和更低的延遲。 DSP 等額外模組以及銅線中的寄生效應都會造成延遲,但在 CPO 解決方案中,訊號不會受到這些延遲的影響。
人工智慧革命是一個跨產業的趨勢,預計到 2030 年,人工智慧產業規模將達到 2,800 億美元。將光學引擎與運算晶片(例如 AI/ML 加速器)整合的 CPO 技術,有望受益於人工智慧驅動的資料中心和高效能運算叢集中對高速、低延遲資料傳輸的需求。
Google、亞馬遜、微軟和 Meta 等科技巨頭正在探索使用 CPO 來提高電源效率和資料傳輸速度,預計 CPO 將在 2026 年至 2028 年間取代資料中心交換器中的傳統可插拔光學模組。
傳統可插拔光學模組的功耗比CPO高出50-60%。 CPO能夠實現節能資料傳輸,並有助於降低資料中心的冷卻成本。人們對綠色資料中心和減少碳足跡的日益關注正在加速CPO的普及應用。
光互聯論壇 (OIF) 和開放運算專案 (OCP) 等行業組織正在製定 CPO 規範,思科、英特爾和博通等公司正在合作開發用於商業部署的標準化 CPO 模組。
本報告旨在按地區/國家、類型和應用對全球共封裝光學模組(CPO) 市場進行全面分析,重點關注總收入、市場佔有率和主要企業的排名。
本報告基於 2020 年至 2031 年的歷史數據和預測數據(以 2024 年為基準年),對共封裝光模組 (CPO) 市場規模的銷售收入進行了估算和預測。報告採用定量和定性分析相結合的方法,幫助讀者制定業務和成長策略,評估市場競爭,分析自身在當前市場中的地位,並就共封裝光模組 (CPO) 做出明智的商業決策。
市場區隔
公司
按類型分類的細分市場
應用領域
按地區
The global market for Co-Packaged Optics Module (CPO) was estimated to be worth US$ 44.6 million in 2024 and is forecast to a readjusted size of US$ 1236 million by 2031 with a CAGR of 49.0% during the forecast period 2025-2031.
Co-Packaged Optics (CPO) is an advanced heterogeneous integration of optics and silicon on a single packaged substrate aimed at addressing next generation bandwidth and power challenges. CPO brings together a wide range of expertise in fiber optics, digital signal processing (DSP), switch ASICs, and state-of-the-art packaging & test to provide disruptive system value for the data center and cloud infrastructure. Generally, CPOs offer power saving in several different ways.
No lossy copper traces: Unlike pluggable optics, CPO design eliminates the need for signals to traverse from the application-specific integrated circuit (ASIC) chip over energy-sapping copper links across the board up to the front panel. Instead, CPO design brings the fiber directly to the switch enabling short, low-loss communication between the chip and the optical engine.
Fewer digital signal processors (DSPs): In current architectures for speeds higher than 25G/lane, DSP-based retimers have become necessary components in pluggable optics to actively analyze and compensate for signal degradation, distortions, and timing issues. The DSP contributes to driving up the overall system power by as much as 25-30%. However, given that CPOs eliminate the off-chip lossy copper traces between the ASIC and the optics, designers can safely eliminate one DSP level to save power and reduce costs.
Integrated lasers: There are two schools of thought regarding laser source placement. The prevalent approach involves an external laser, necessitating the transmission of light through a fiber and coupling it into the CPO and typically incurring an optical power loss of 30-50%. The alternative approach integrates the laser directly onto the chip, offering a notably higher optical coupling compared to the latter approach, provided that thermal management and laser reliability are viable.
High bandwidth and low latency: CPOs can enable higher bandwidth and lower latency, mainly because of fewer DSPs and the removal of long copper traces. Additional blocks like DSPs as well as the parasitics in copper traces all introduce delays that signals won't see in a CPO solution.
The AI revolution is a recurring theme across industries, with projections of the AI sector reaching $280 billion by 2030. CPO technology, which integrates optical engines with compute chips (e.g., AI/ML accelerators), could benefit from AI-driven demand for high-speed, low-latency data transmission in data centers and HPC clusters.
Tech giants like Google, Amazon, Microsoft, and Meta are exploring CPO to enhance power efficiency and data transmission speeds. CPO is expected to replace traditional pluggable optics in data center switches by 2026-2028.
Traditional pluggable optics consume 50-60% more power than CPO. CPO enables energy-efficient data transmission, reducing cooling costs in data centers. Growing focus on green data centers and carbon footprint reduction is accelerating CPO deployment.
Industry alliances like OIF (Optical Internetworking Forum) and Open Compute Project (OCP) are working on CPO specifications. Companies like Cisco, Intel, Broadcom, etc. are collaborating to develop standardized CPO modules for commercial deployment.
This report aims to provide a comprehensive presentation of the global market for Co-Packaged Optics Module (CPO), focusing on the total sales revenue, key companies market share and ranking, together with an analysis of Co-Packaged Optics Module (CPO) by region & country, by Type, and by Application.
The Co-Packaged Optics Module (CPO) market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Co-Packaged Optics Module (CPO).
Market Segmentation
By Company
Segment by Type
Segment by Application
By Region
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Co-Packaged Optics Module (CPO) company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Revenue of Co-Packaged Optics Module (CPO) in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Revenue of Co-Packaged Optics Module (CPO) in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.