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1892147

NVIDIA Rubin GPU 液冷革命:MCL 技術的崛起與挑戰

NVIDIA Rubin GPU Liquid Cooling Revolution: Rise and Challenges of MCL Tech

出版日期: | 出版商: TrendForce | 英文 15 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

人工智慧 (AI) 和高效能運算 (HPC) 工作負載的激增,使得 GPU 功耗大幅提升,從幾百瓦飆升至 Rubin 世代的 2300 瓦以上。這一演變使得散熱從輔助組件躍升為提升計算性能的關鍵要素。隨著傳統液冷技術接近其物理極限,業界正轉向下一代解決方案:微通道蓋 (MCL)。一場新的 "散熱革命" 正在悄悄發生。

主要亮點

  • 隨著人工智慧 (AI) 和高效能運算 (HPC) 工作負載的激增,GPU 功耗正從適中水準迅速攀升。
  • 散熱正從輔助元件演變為提升運算效能的關鍵要素。
  • 傳統液冷技術正接近其物理極限。
  • 隨著微通道蓋(MCL)等新一代解決方案的採用,業界正悄悄開啟一場 "散熱革命" 。

本報告探討了伺服器散熱技術的演變,總結了主要公司的策略以及關鍵技術的未來發展前景。

目錄

第一章:伺服器散熱的演進

第二章:散熱革命3.0:MCL運作原理

第三章:NVIDIA針對下一代Rubin架構的雙通道散熱策略

第四章:台灣主要散熱供應商及其對產業的影響

第五章:下一代散熱技術展望

第六章:TRI的觀點

簡介目錄
Product Code: TRi-162

The rise of AI and HPC workloads has significantly increased GPU power consumption, from a few hundred watts to over 2,300W in the Rubin generation. This evolution has elevated cooling from a mere support component to a critical factor for maximizing computational performance. As traditional liquid-cooling methods near their physical limits, the industry is turning to a next-generation solution: Microchannel Lids (MCL). Quietly, a new "cooling revolution" is underway.

Key Highlights

  • AI and HPC workloads have driven substantial rises in GPU power consumption, shifting from modest to elevated levels.
  • Cooling has transformed from a secondary component to a vital element for enhancing computational performance.
  • Traditional liquid-cooling techniques are approaching their fundamental physical boundaries.
  • The industry is adopting next-generation solutions like Microchannel Lids (MCL), sparking a subtle "cooling revolution".

Table of Contents

1. The Evolution of Server Cooling

  • Figure 1: TDP Trends Across NVIDIA's GPU Generations
  • Table 1: Key Characteristics of Current Cooling Technologies

2. Cooling Revolution 3.0: The Operating Principle Behind MCL

  • Figure 2: Comparison Between Traditional "Vapor Chamber + Cold Plate" Cooling and MCL Architecture
  • Table 2: Comparison of Conventional "Heat Spread + Cold Plate" Cooling vs. MCL Solutions

3. NVIDIA's Dual-Track Cooling Strategy for the Next-Generation Rubin Architecture

  • Table 3: NVIDIA Rubin Cooling Dual-Track Strategy for Different Configurations

4. Taiwan's Key Thermal Suppliers and the Industry Impact

5. Outlook for Next-Generation Cooling Technologies

6. TRI's View