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1873080

2025年全球半導體後端設備市場報告

Semiconductor Back-End Equipment Global Market Report 2025
出版日期: | 出版商: The Business Research Company | 英文 250 Pages | 商品交期: 2-10個工作天內

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簡介目錄

近年來，半導體後端設備市場經歷了顯著成長，預計將從2024年的198.8億美元成長到2025年的216.5億美元，複合年成長率為8.9%。過去的成長可歸因於行動裝置的日益普及、汽車電子產品產量的增加、通訊基礎設施的擴展、對高效能運算日益成長的需求以及對工業自動化日益成長的需求。

預計未來幾年半導體後端設備市場將維持強勁成長，2029年市場規模將達到301.9億美元，複合年成長率（CAGR）為8.7%。預測期內的成長預計將受到人工智慧（AI）應用日益普及、5G網路部署不斷擴大、電動車（EV）需求不斷成長、資料中心容量不斷擴大以及物聯網（IoT）設備廣泛應用等因素的推動。預測期內的關鍵趨勢包括晶圓級封裝技術的進步、自動化光學檢測系統的開發、高通量組裝設備的投資、溫度控管解決方案的創新以及真空拾放自動化技術的進步。

預計未來幾年，人們對電動車 (EV) 的興趣日益濃厚，將推動半導體後端設備市場的擴張。電動車由可充電電池儲存的電能驅動，並使用電動馬達而非傳統的燃油引擎進行推進。日益成長的環境問題促使人們更加重視電動車，電動車透過減少溫室氣體排放和降低對石化燃料的依賴，有助於實現全球永續性目標。半導體後端設備在電動車生產中發揮著至關重要的作用，它支援先進功率晶片的製造，這些晶片能夠提高能源效率、最佳化電池性能並增強整車可靠性。例如，根據美國政府機構能源與交通聯合辦公室 (JOET) 於 2024 年 11 月發布的報告，預計美國插電式電動車的銷量佔汽車總銷量的比例將從 2022 年的 6.8% 成長到 2023 年的 9.4%。因此，電動車的日益普及正在推動半導體後端設備市場的成長。

半導體後端設備市場的主要企業正致力於開發混合鍵合系統等先進技術，以提升性能、提高能源效率並實現3D整合。混合鍵結系統無需焊料凸塊，即可利用金屬-介質界面直接鍵合晶粒或晶圓，從而實現超細間距和卓越的電氣及熱性能。例如，2024年5月，總部位於荷蘭的半導體組裝設備製造商BE Semiconductor Industries NV從一家大型半導體邏輯製造商獲得26套混合鍵結系統的訂單。該產品實現了100奈米的高精度貼片，超越了傳統鍵合系統。它支援先進的晶圓間和晶片晶粒鍵合，適用於大批量生產。對混合鍵合技術的日益關注反映了半導體產業正在尋求解決方案，以滿足下一代元件對性能、密度和效率不斷成長的需求。

目錄

第1章執行摘要

第2章 市場特徵

第3章 市場趨勢與策略

第4章 市場：宏觀經濟情景，包括利率、通貨膨脹、地緣政治、貿易戰和關稅，以及新冠疫情及其復甦對市場的影響

第5章 全球成長分析與策略分析框架

  • 全球半導體後端設備：PESTEL 分析（政治、社會、技術、環境、法律因素、促進因素和限制因素）
  • 終端用戶產業分析
  • 全球半導體後端設備市場：成長率分析
  • 全球半導體後端設備市場表現：規模與成長，2019-2024年
  • 全球半導體後端設備市場預測：規模與成長，2024-2029年，2034年預測
  • 全球半導體後端設備：潛在市場規模 (TAM)

第6章 市場細分

  • 全球半導體後端設備市場：依設備、性能及預測分類，2019-2024年、2024-2029年預測、2034年預測
  • 晶粒黏合設備
  • 焊線設備
  • 包裝設備
  • 測試設備
  • 全球半導體後端設備市場依製程階段、性能及預測分類，2019-2024年、2024-2029年預測、2034年預測
  • 晶圓級加工
  • 晶片級處理
  • 最終測試和包裝
  • 組裝
  • 其他工藝步驟
  • 全球半導體後端設備市場：按應用、性能和預測分類，2019-2024年、2024-2029年預測、2034年預測
  • 家用電子電器
  • 汽車電子
  • 電訊
  • 資料處理
  • 工業應用
  • 全球半導體後端設備市場：依終端用戶產業分類，結果及預測，2019-2024年、2024-2029年預測、2034年預測
  • 半導體製造商
  • 原始設備製造商 (OEM)
  • 製造廠（fab）
  • 研究與發展研究所
  • 其他終端用戶產業
  • 全球半導體後端設備市場：晶片鍵合設備晶粒，按類型、性能和預測（2019-2024年、2024-2029年預測、2034年預測）
  • 熱壓晶片晶粒合
  • 共晶晶片晶粒合
  • 瞬態液相鍵結（TLP鍵結）
  • 覆晶合
  • 黏合劑晶粒
  • 全球半導體後端設備市場：細分市場－引線焊線設備，依類型、效能與預測（2019-2024年、2024-2029年預測、2034年預測）
  • 球鍵合
  • 楔形黏合
  • 環形回路系統
  • 帶狀黏合
  • 全球半導體後端設備市場：依封裝設備、類型、效能與預測細分，2019-2024年、2024-2029年預測、2034年預測
  • 成型設備
  • 封裝裝置
  • 導線架加工設備
  • 修整成型裝置
  • 晶圓層次電子構裝（WLP）設備
  • 全球半導體後端設備市場：按測試設備、類型、性能和預測進行細分，2019-2024年、2024-2029年預測、2034年預測
  • 最終測試設備
  • 在線連續測試設備
  • 老化測試設備
  • 自動測試設備（ATE）

第7章 區域和國家分析

  • 全球半導體後端設備市場：依地區分類，結果及預測，2019-2024年、2024-2029年預測、2034年預測
  • 全球半導體後端設備市場：依國家分類，結果及預測，2019-2024 年、2024-2029 年預測、2034 年預測

第8章 亞太市場

第9章：中國市場

第10章 印度市場

第11章 日本市場

第12章：澳洲市場

第13章 印尼市場

第14章 韓國市場

第15章 西歐市場

第16章英國市場

第17章：德國市場

第18章：法國市場

第19章：義大利市場

第20章：西班牙市場

第21章 東歐市場

第22章：俄羅斯市場

第23章 北美市場

第24章美國市場

第25章：加拿大市場

第26章 南美洲市場

第27章：巴西市場

第28章 中東市場

第29章：非洲市場

第30章：競爭格局與公司概況

  • 半導體後端設備市場：競爭格局
  • 半導體後端設備市場：公司概況
    • ASE Group Overview, Products and Services, Strategy and Financial Analysis
    • Toray Engineering Co. Ltd. Overview, Products and Services, Strategy and Financial Analysis
    • Yamaha Robotics Holdings Co. Ltd. Overview, Products and Services, Strategy and Financial Analysis
    • Micron Technology Inc. Overview, Products and Services, Strategy and Financial Analysis
    • Applied Materials Inc. Overview, Products and Services, Strategy and Financial Analysis

第31章：其他領先和創新企業

  • Advantest Corp.
  • ASM International
  • Teradyne Inc.
  • Nordson Corporation
  • KLA Corp.
  • Disco Corporation
  • Advanced Micro-Fabrication Equipment Inc.
  • Onto Innovation Inc.
  • FormFactor
  • Cohu Inc.
  • SUSS MicroTec SE
  • TOWA Corp.
  • EV Group Inc.
  • Kulicke & Soffa Industries Inc.
  • Screen Holdings Company Limited

第32章 全球市場競爭基準化分析與儀錶板

第33章 重大併購

第34章 近期市場趨勢

第35章：高潛力市場國家、細分市場與策略

  • 2029年半導體後端設備市場：蘊藏新機會的國家
  • 2029年半導體後端設備市場：新興細分市場機會
  • 2029年半導體後端設備市場：成長策略
    • 基於市場趨勢的策略
    • 競爭對手策略

第36章附錄

簡介目錄
Product Code: r38997

Semiconductor back-end equipment refers to the machinery and tools used in the later stages of semiconductor manufacturing, where fabricated wafers undergo assembly, packaging, and testing processes. This equipment is essential for transforming processed wafers into finished semiconductor devices by ensuring precision, reliability, and consistent performance.

The primary types of semiconductor back-end equipment include die bonding equipment, wire bonding equipment, packaging equipment, and testing equipment. Die bonding equipment consists of machines that attach semiconductor dies or chips onto substrates, packages, or carriers with high precision. These tools cover various process stages, such as wafer-level processing, chip-level processing, final testing and packaging, assembly, and more. They are applied across sectors including consumer electronics, automotive electronics, telecommunications, data processing, and industrial applications, and are used by end-users such as semiconductor manufacturers, original equipment manufacturers (OEMs), fabrication plants (fabs), research and development institutions, and others.

Note that the outlook for this market is being affected by rapid changes in trade relations and tariffs globally. The report will be updated prior to delivery to reflect the latest status, including revised forecasts and quantified impact analysis. The report's Recommendations and Conclusions sections will be updated to give strategies for entities dealing with the fast-moving international environment.

The rapid rise in U.S. tariffs and the subsequent trade frictions in spring 2025 are having a major impact on the electrical and electronics sector, with semiconductors, display panels, and rare-earth metals (essential for batteries and motors) subject to steep duties. Consumer electronics brands face profit erosion, as competitive markets limit their ability to pass costs to buyers. Industrial electronics manufacturers, meanwhile, grapple with delayed projects due to shortages of tariff-impacted components like printed circuit boards. Companies are responding by relocating assembly to tariff-exempt countries, increasing inventory buffers, and redesigning products to reduce dependency on restricted materials.

The semiconductor back-end equipment market research report is one of a series of new reports from The Business Research Company that provides semiconductor back-end equipment market statistics, including semiconductor back-end equipment industry global market size, regional shares, competitors with a semiconductor back-end equipment market share, detailed semiconductor back-end equipment market segments, market trends and opportunities, and any further data you may need to thrive in the semiconductor back-end equipment industry. This semiconductor back-end equipment market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

The semiconductor back-end equipment market size has grown strongly in recent years. It will grow from $19.88 billion in 2024 to $21.65 billion in 2025 at a compound annual growth rate (CAGR) of 8.9%. The growth during the historic period can be linked to the rising adoption of mobile devices, increasing production of automotive electronics, expansion of telecommunications infrastructure, growing demand for high-performance computing, and rising requirements for industrial automation.

The semiconductor back-end equipment market size is expected to see strong growth in the next few years. It will grow to $30.19 billion in 2029 at a compound annual growth rate (CAGR) of 8.7%. The growth in the forecast period is expected to result from the growing adoption of artificial intelligence applications, increased deployment of 5G networks, rising demand for electric vehicles, expansion of data center capacities, and broader use of Internet of Things (IoT) devices. Key trends in the forecast period include advancements in wafer-level packaging, development of automated optical inspection systems, investment in high-throughput assembly equipment, innovations in thermal management solutions, and progress in vacuum pick-and-place automation.

The growing focus on electric vehicles (EVs) is expected to drive the expansion of the semiconductor back-end equipment market in the coming years. EVs are powered by electricity stored in rechargeable batteries and use electric motors for propulsion instead of traditional fuel-based engines. The increasing emphasis on EVs is driven by rising environmental concerns, as they help reduce greenhouse gas emissions and dependency on fossil fuels, supporting global sustainability goals. Semiconductor back-end equipment plays a critical role in EV production by supporting the manufacturing of advanced power chips that enhance energy efficiency, optimize battery performance, and improve overall vehicle reliability. For example, in November 2024, the Joint Office of Energy and Transportation, a US-based government agency, reported that plug-in electric vehicle sales in the US grew from 6.8% of total vehicle sales in 2022 to 9.4% in 2023. As a result, the rising adoption of electric vehicles is driving the growth of the semiconductor back-end equipment market.

Leading companies in the semiconductor back-end equipment market are focusing on developing advanced technologies, such as hybrid bonding systems, to improve performance, power efficiency, and enable 3D integration. A hybrid bonding system allows for the direct bonding of dies or wafers using metal and dielectric interfaces without the need for solder bumps, providing ultra-fine pitch and superior electrical and thermal performance. For example, in May 2024, BE Semiconductor Industries N.V., a Netherlands-based semiconductor assembly equipment manufacturer, received an order for 26 Hybrid Bonding Systems from a leading semiconductor logic manufacturer. This product delivers high precision with 100 nm placement accuracy, surpassing conventional bonding systems. It supports advanced wafer-to-wafer and die-to-wafer bonding, making it suitable for high-volume manufacturing. This growing interest in hybrid bonding reflects the semiconductor industry's need for solutions to meet the increasing performance, density, and efficiency demands of next-generation devices.

In October 2023, Cohu Inc., a US-based provider of semiconductor test and inspection solutions, acquired Equiptest Engineering for an undisclosed amount. Through this acquisition, Cohu aims to expand its product portfolio of test contactors and consumables while strengthening its position in the global semiconductor back-end equipment market. Equiptest Engineering, a Singapore-based manufacturer, specializes in semiconductor back-end equipment.

Major players in the semiconductor back-end equipment market are ASE Group, Toray Engineering Co. Ltd., Yamaha Robotics Holdings Co. Ltd., Micron Technology Inc., Applied Materials Inc., Advantest Corp., ASM International, Teradyne Inc., Nordson Corporation, KLA Corp., Disco Corporation, Advanced Micro-Fabrication Equipment Inc., Onto Innovation Inc., FormFactor, Cohu Inc., SUSS MicroTec SE, TOWA Corp., EV Group Inc., Kulicke & Soffa Industries Inc., Screen Holdings Company Limited, Hanmi Semiconductor Company Limited, GL Tech Co. Ltd., Camtek Ltd., Synova LLC, Matsusada Precision Inc.

Asia-Pacific was the largest region in the semiconductor back-end equipment market in 2024. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in semiconductor back-end equipment report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East and Africa.

The countries covered in the semiconductor back-end equipment market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The semiconductor back-end equipment market consists of sales of molding equipment, metrology equipment, burn-in equipment, and final test handlers. Values in this market are 'factory gate' values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

Semiconductor Back-End Equipment Global Market Report 2025 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses on semiconductor back-end equipment market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

Reasons to Purchase

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  • Create regional and country strategies on the basis of local data and analysis.
  • Identify growth segments for investment.
  • Outperform competitors using forecast data and the drivers and trends shaping the market.
  • Understand customers based on the latest market shares.
  • Benchmark performance against key competitors.
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  • Report will be updated with the latest data and delivered to you within 2-3 working days of order along with an Excel data sheet for easy data extraction and analysis.
  • All data from the report will also be delivered in an excel dashboard format.

Where is the largest and fastest growing market for semiconductor back-end equipment ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward, including technological disruption, regulatory shifts, and changing consumer preferences? The semiconductor back-end equipment market global report from the Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

  • The market characteristics section of the report defines and explains the market.
  • The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
  • The forecasts are made after considering the major factors currently impacting the market. These include:

The forecasts are made after considering the major factors currently impacting the market. These include the technological advancements such as AI and automation, Russia-Ukraine war, trade tariffs (government-imposed import/export duties), elevated inflation and interest rates.

  • Market segmentations break down the market into sub markets.
  • The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth.
  • The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
  • The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.

Scope

  • Markets Covered:1) By Equipment Type: Die Bonding Equipment; Wire Bonding Equipment; Packaging Equipment; Testing Equipment
  • 2) By Process Stage: Wafer Level Processing; Chip Level Processing; Final Test And Packaging; Assembly; Other Process Stages
  • 3) By Application: Consumer Electronics; Automotive Electronics; Telecommunications; Data Processing; Industrial Applications
  • 4) By End-User Industry: Semiconductor Manufacturers; Original Equipment Manufacturers (OEMs); Fabrication Plants (Fabs); Research And Development Institutions; Other End-User Industries
  • Subsegments:
  • 1) By Die Bonding Equipment: Thermo-Compression Die Bonding; Eutectic Die Bonding; Transient Liquid Phase (TLP) Bonding; Flip Chip Bonding; Adhesive Die Bonding
  • 2) By Wire Bonding Equipment: Ball Bonding; Wedge Bonding; Looping Systems; Ribbon Bonding
  • 3) By Packaging Equipment: Molding Equipment; Encapsulation Equipment; Lead Frame Processing Equipment; Trim And Form Equipment; Wafer-Level Packaging (WLP) Equipment
  • 4) By Testing Equipment: Final Test Equipment; In-Line Test Equipment; Burn-In Test Equipment; Automated Test Equipment (ATE)
  • Companies Mentioned: ASE Group; Toray Engineering Co. Ltd.; Yamaha Robotics Holdings Co. Ltd.; Micron Technology Inc.; Applied Materials Inc.; Advantest Corp.; ASM International; Teradyne Inc.; Nordson Corporation; KLA Corp.; Disco Corporation; Advanced Micro-Fabrication Equipment Inc.; Onto Innovation Inc.; FormFactor; Cohu Inc.; SUSS MicroTec SE; TOWA Corp.; EV Group Inc.; Kulicke & Soffa Industries Inc.; Screen Holdings Company Limited; Hanmi Semiconductor Company Limited; GL Tech Co. Ltd.; Camtek Ltd.; Synova LLC; Matsusada Precision Inc.
  • Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain.
  • Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
  • Time Series: Five years historic and ten years forecast.
  • Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita,
  • Data Segmentations: country and regional historic and forecast data, market share of competitors, market segments.
  • Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
  • Delivery Format: PDF, Word and Excel Data Dashboard.

Table of Contents

1. Executive Summary

2. Semiconductor Back-End Equipment Market Characteristics

3. Semiconductor Back-End Equipment Market Trends And Strategies

4. Semiconductor Back-End Equipment Market - Macro Economic Scenario Including The Impact Of Interest Rates, Inflation, Geopolitics, Trade Wars and Tariffs, And Covid And Recovery On The Market

  • 4.1. Supply Chain Impact from Tariff War & Trade Protectionism

5. Global Semiconductor Back-End Equipment Growth Analysis And Strategic Analysis Framework

  • 5.1. Global Semiconductor Back-End Equipment PESTEL Analysis (Political, Social, Technological, Environmental and Legal Factors, Drivers and Restraints)
  • 5.2. Analysis Of End Use Industries
  • 5.3. Global Semiconductor Back-End Equipment Market Growth Rate Analysis
  • 5.4. Global Semiconductor Back-End Equipment Historic Market Size and Growth, 2019 - 2024, Value ($ Billion)
  • 5.5. Global Semiconductor Back-End Equipment Forecast Market Size and Growth, 2024 - 2029, 2034F, Value ($ Billion)
  • 5.6. Global Semiconductor Back-End Equipment Total Addressable Market (TAM)

6. Semiconductor Back-End Equipment Market Segmentation

  • 6.1. Global Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Die Bonding Equipment
  • Wire Bonding Equipment
  • Packaging Equipment
  • Testing Equipment
  • 6.2. Global Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Wafer Level Processing
  • Chip Level Processing
  • Final Test And Packaging
  • Assembly
  • Other Process Stages
  • 6.3. Global Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Consumer Electronics
  • Automotive Electronics
  • Telecommunications
  • Data Processing
  • Industrial Applications
  • 6.4. Global Semiconductor Back-End Equipment Market, Segmentation By End-User Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Semiconductor Manufacturers
  • Original Equipment Manufacturers (OEMs)
  • Fabrication Plants (Fabs)
  • Research And Development Institutions
  • Other End-User Industries
  • 6.5. Global Semiconductor Back-End Equipment Market, Sub-Segmentation Of Die Bonding Equipment, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Thermo-Compression Die Bonding
  • Eutectic Die Bonding
  • Transient Liquid Phase (TLP) Bonding
  • Flip Chip Bonding
  • Adhesive Die Bonding
  • 6.6. Global Semiconductor Back-End Equipment Market, Sub-Segmentation Of Wire Bonding Equipment, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Ball Bonding
  • Wedge Bonding
  • Looping Systems
  • Ribbon Bonding
  • 6.7. Global Semiconductor Back-End Equipment Market, Sub-Segmentation Of Packaging Equipment, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Molding Equipment
  • Encapsulation Equipment
  • Lead Frame Processing Equipment
  • Trim And Form Equipment
  • Wafer-Level Packaging (WLP) Equipment
  • 6.8. Global Semiconductor Back-End Equipment Market, Sub-Segmentation Of Testing Equipment, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Final Test Equipment
  • In-Line Test Equipment
  • Burn-In Test Equipment
  • Automated Test Equipment (ATE)

7. Semiconductor Back-End Equipment Market Regional And Country Analysis

  • 7.1. Global Semiconductor Back-End Equipment Market, Split By Region, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 7.2. Global Semiconductor Back-End Equipment Market, Split By Country, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

8. Asia-Pacific Semiconductor Back-End Equipment Market

  • 8.1. Asia-Pacific Semiconductor Back-End Equipment Market Overview
  • Region Information, Market Information, Background Information, Government Initiatives, Regulations, Regulatory Bodies, Major Associations, Taxes Levied, Corporate Tax Structure, Investments, Major Companies
  • 8.2. Asia-Pacific Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 8.3. Asia-Pacific Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 8.4. Asia-Pacific Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

9. China Semiconductor Back-End Equipment Market

  • 9.1. China Semiconductor Back-End Equipment Market Overview
  • 9.2. China Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion
  • 9.3. China Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion
  • 9.4. China Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion

10. India Semiconductor Back-End Equipment Market

  • 10.1. India Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 10.2. India Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 10.3. India Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

11. Japan Semiconductor Back-End Equipment Market

  • 11.1. Japan Semiconductor Back-End Equipment Market Overview
  • 11.2. Japan Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 11.3. Japan Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 11.4. Japan Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

12. Australia Semiconductor Back-End Equipment Market

  • 12.1. Australia Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 12.2. Australia Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 12.3. Australia Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

13. Indonesia Semiconductor Back-End Equipment Market

  • 13.1. Indonesia Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 13.2. Indonesia Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 13.3. Indonesia Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

14. South Korea Semiconductor Back-End Equipment Market

  • 14.1. South Korea Semiconductor Back-End Equipment Market Overview
  • 14.2. South Korea Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 14.3. South Korea Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 14.4. South Korea Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

15. Western Europe Semiconductor Back-End Equipment Market

  • 15.1. Western Europe Semiconductor Back-End Equipment Market Overview
  • 15.2. Western Europe Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 15.3. Western Europe Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 15.4. Western Europe Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

16. UK Semiconductor Back-End Equipment Market

  • 16.1. UK Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 16.2. UK Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 16.3. UK Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

17. Germany Semiconductor Back-End Equipment Market

  • 17.1. Germany Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 17.2. Germany Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 17.3. Germany Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

18. France Semiconductor Back-End Equipment Market

  • 18.1. France Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 18.2. France Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 18.3. France Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

19. Italy Semiconductor Back-End Equipment Market

  • 19.1. Italy Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 19.2. Italy Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 19.3. Italy Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

20. Spain Semiconductor Back-End Equipment Market

  • 20.1. Spain Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 20.2. Spain Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 20.3. Spain Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

21. Eastern Europe Semiconductor Back-End Equipment Market

  • 21.1. Eastern Europe Semiconductor Back-End Equipment Market Overview
  • 21.2. Eastern Europe Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 21.3. Eastern Europe Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 21.4. Eastern Europe Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

22. Russia Semiconductor Back-End Equipment Market

  • 22.1. Russia Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 22.2. Russia Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 22.3. Russia Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

23. North America Semiconductor Back-End Equipment Market

  • 23.1. North America Semiconductor Back-End Equipment Market Overview
  • 23.2. North America Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 23.3. North America Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 23.4. North America Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

24. USA Semiconductor Back-End Equipment Market

  • 24.1. USA Semiconductor Back-End Equipment Market Overview
  • 24.2. USA Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 24.3. USA Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 24.4. USA Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

25. Canada Semiconductor Back-End Equipment Market

  • 25.1. Canada Semiconductor Back-End Equipment Market Overview
  • 25.2. Canada Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 25.3. Canada Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 25.4. Canada Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

26. South America Semiconductor Back-End Equipment Market

  • 26.1. South America Semiconductor Back-End Equipment Market Overview
  • 26.2. South America Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 26.3. South America Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 26.4. South America Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

27. Brazil Semiconductor Back-End Equipment Market

  • 27.1. Brazil Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 27.2. Brazil Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 27.3. Brazil Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

28. Middle East Semiconductor Back-End Equipment Market

  • 28.1. Middle East Semiconductor Back-End Equipment Market Overview
  • 28.2. Middle East Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 28.3. Middle East Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 28.4. Middle East Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

29. Africa Semiconductor Back-End Equipment Market

  • 29.1. Africa Semiconductor Back-End Equipment Market Overview
  • 29.2. Africa Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 29.3. Africa Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 29.4. Africa Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

30. Semiconductor Back-End Equipment Market Competitive Landscape And Company Profiles

  • 30.1. Semiconductor Back-End Equipment Market Competitive Landscape
  • 30.2. Semiconductor Back-End Equipment Market Company Profiles
    • 30.2.1. ASE Group Overview, Products and Services, Strategy and Financial Analysis
    • 30.2.2. Toray Engineering Co. Ltd. Overview, Products and Services, Strategy and Financial Analysis
    • 30.2.3. Yamaha Robotics Holdings Co. Ltd. Overview, Products and Services, Strategy and Financial Analysis
    • 30.2.4. Micron Technology Inc. Overview, Products and Services, Strategy and Financial Analysis
    • 30.2.5. Applied Materials Inc. Overview, Products and Services, Strategy and Financial Analysis

31. Semiconductor Back-End Equipment Market Other Major And Innovative Companies

  • 31.1. Advantest Corp.
  • 31.2. ASM International
  • 31.3. Teradyne Inc.
  • 31.4. Nordson Corporation
  • 31.5. KLA Corp.
  • 31.6. Disco Corporation
  • 31.7. Advanced Micro-Fabrication Equipment Inc.
  • 31.8. Onto Innovation Inc.
  • 31.9. FormFactor
  • 31.10. Cohu Inc.
  • 31.11. SUSS MicroTec SE
  • 31.12. TOWA Corp.
  • 31.13. EV Group Inc.
  • 31.14. Kulicke & Soffa Industries Inc.
  • 31.15. Screen Holdings Company Limited

32. Global Semiconductor Back-End Equipment Market Competitive Benchmarking And Dashboard

33. Key Mergers And Acquisitions In The Semiconductor Back-End Equipment Market

34. Recent Developments In The Semiconductor Back-End Equipment Market

35. Semiconductor Back-End Equipment Market High Potential Countries, Segments and Strategies

  • 35.1 Semiconductor Back-End Equipment Market In 2029 - Countries Offering Most New Opportunities
  • 35.2 Semiconductor Back-End Equipment Market In 2029 - Segments Offering Most New Opportunities
  • 35.3 Semiconductor Back-End Equipment Market In 2029 - Growth Strategies
    • 35.3.1 Market Trend Based Strategies
    • 35.3.2 Competitor Strategies

36. Appendix

  • 36.1. Abbreviations
  • 36.2. Currencies
  • 36.3. Historic And Forecast Inflation Rates
  • 36.4. Research Inquiries
  • 36.5. The Business Research Company
  • 36.6. Copyright And Disclaimer