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半導體生產設備半導體製造設備

市場調查報告書

商品編碼

1905276

日本半導體製造設備市場報告（按設備類型、產品類型、尺寸、供應鏈參與者和地區分類，2026-2034年）

Japan Semiconductor Manufacturing Equipment Market Report by Equipment Type, Product Type, Dimension, Supply Chain Participant, and Region 2026-2034

出版日期: 2026年01月01日 | 出版商:

IMARC | 英文 116 Pages | 商品交期: 5-7個工作天內

價格

簡介目錄

2025年，日本半導體製造設備市場規模達70億美元。展望未來， IMARC Group預計到2034年，該市場規模將達到152億美元，2026年至2034年期間的複合年成長率（CAGR）為8.93%。裝置小型化趨勢的日益普及以及連網設備的廣泛應用是推動市場成長的主要因素。

本報告解答的關鍵問題：

日本半導體製造設備市場目前的表現如何？未來幾年又將如何發展？
新冠疫情對日本半導體製造設備市場產生了哪些影響？
日本半導體製造設備市場依設備類型分類的組成是怎樣的？
日本半導體製造設備市場依產品類型分類的組成是怎樣的？
日本半導體製造設備市場依規模分類的組成是怎樣的？
日本半導體製造設備市場依供應鏈參與者分類的組成是怎樣的？
日本半導體製造設備市場價值鏈的各個階段有哪些？
日本半導體製造設備的關鍵促進因素和挑戰是什麼？
日本半導體製造設備市場的結構是怎麼樣的？主要參與者有哪些？
日本半導體製造設備市場的競爭程度如何？

Japan semiconductor manufacturing equipment market size reached USD 7.0 Billion in 2025. Looking forward, IMARC Group expects the market to reach USD 15.2 Billion by 2034, exhibiting a growth rate (CAGR) of 8.93% during 2026-2034. The rising popularity of device miniaturization, along with the widespread adoption of connected devices, is primarily driving the market growth.

Semiconductor manufacturing equipment encompass the machinery employed in the production of a wide range of electronic components and integrated circuits (ICs). Among the commonly utilized devices are the front-end and back-end equipment. In addition to this, the front-end category comprises machines used in silicon-wafer fabrication, photolithography, deposition, etching, ion implantation, and mechanical polishing. In contrast, the back-end category involves machinery used in the assembly, packaging, and testing of integrated circuits. These machines offer numerous advantages, including streamlined production processes, enhanced yield and reliability, reduction in design and manufacturing errors, and improved workplace safety. Consequently, they have found widespread applications in the manufacturing of various products across industries such as automotive, electronics, robotics, etc.

Japan Semiconductor Manufacturing Equipment Market Trends:

The Japan market for semiconductor manufacturing equipment is primarily being propelled by the burgeoning electronics sector, given the widespread use of semiconductors in consumer electronics like smartphones, tablets, and laptops. Furthermore, the increasing demand for hybrid and electric vehicles (H/EVs) stands as another significant driver of growth. Besides this, these manufacturing equipment is instrumental in the assembly of multiple semiconductors onto a single chip, reducing electronic interference and enhancing the protection of electronic devices, which is positively influencing the regional market. Additionally, several key market players are introducing advanced product variations in a bid to broaden their customer base. This, combined with various technological advancements, such as the integration of artificial intelligence (AI) solutions and the incorporation of connected devices into the Internet of Things (IoT), is exerting a positive impact on market growth. Apart from this, manufacturers are employing silicon-based sensors in their manufacturing equipment. These sensors provide the ability to remotely monitor intricate circuit boards. Moreover, the emerging trend of device miniaturization and extensive research and development (R&D) activities are among the other factors expected to drive market growth in the forthcoming years in Japan.

Japan Semiconductor Manufacturing Equipment Market Segmentation:

Equipment Type Insights:

Front-End
- Lithography
- Deposition
- Cleaning
- Wafer Surface Conditioning
- Others
Back-End
- Testing
- Assembly and Packaging
- Dicing
- Bonding
- Metrology
- Others
Fab Facility Equipment
- Automation
- Chemical Control
- Gas Control
- Others

Product Type Insights:

Memory
Logic Components
Microprocessor
Analog Components
Optoelectronic Components
Discrete Components
Others

Dimension Insights:

2D
2.5D
3D

Supply Chain Participant Insights:

IDM Firms
OSAT Companies
Foundries

Regional Insights:

Kanto Region
Kansai/Kinki Region
Central/ Chubu Region
Kyushu-Okinawa Region
Tohoku Region
Chugoku Region
Hokkaido Region
Shikoku Region
The report has also provided a comprehensive analysis of all the major regional markets, which include Kanto Region, Kansai/Kinki Region, Central/ Chubu Region, Kyushu-Okinawa Region, Tohoku Region, Chugoku Region, Hokkaido Region, and Shikoku Region.

Competitive Landscape:

The market research report has also provided a comprehensive analysis of the competitive landscape in the market. Competitive analysis such as market structure, key player positioning, top winning strategies, competitive dashboard, and company evaluation quadrant has been covered in the report. Also, detailed profiles of all major companies have been provided.

Key Questions Answered in This Report:

How has the Japan semiconductor manufacturing equipment market performed so far and how will it perform in the coming years?
What has been the impact of COVID-19 on the Japan semiconductor manufacturing equipment market?
What is the breakup of the Japan semiconductor manufacturing equipment market on the basis of equipment type?
What is the breakup of the Japan semiconductor manufacturing equipment market on the basis of product type?
What is the breakup of the Japan semiconductor manufacturing equipment market on the basis of dimension?
What is the breakup of the Japan semiconductor manufacturing equipment market on the basis of supply chain participant?
What are the various stages in the value chain of the Japan semiconductor manufacturing equipment market?
What are the key driving factors and challenges in the Japan semiconductor manufacturing equipment?
What is the structure of the Japan semiconductor manufacturing equipment market and who are the key players?
What is the degree of competition in the Japan semiconductor manufacturing equipment market?

1 Preface

2 Scope and Methodology

2.1 Objectives of the Study
2.2 Stakeholders
2.3 Data Sources
- 2.3.1 Primary Sources
- 2.3.2 Secondary Sources
2.4 Market Estimation
- 2.4.1 Bottom-Up Approach
- 2.4.2 Top-Down Approach
2.5 Forecasting Methodology

3 Executive Summary

4 Japan Semiconductor Manufacturing Equipment Market - Introduction

4.1 Overview
4.2 Market Dynamics
4.3 Industry Trends
4.4 Competitive Intelligence

5 Japan Semiconductor Manufacturing Equipment Market Landscape

5.1 Historical and Current Market Trends (2020-2025)
5.2 Market Forecast (2026-2034)

6 Japan Semiconductor Manufacturing Equipment Market - Breakup by Equipment Type

6.1 Front-End
- 6.1.1 Overview
- 6.1.2 Historical and Current Market Trends (2020-2025)
- 6.1.3 Market Segmentation
  - 6.1.3.1 Lithography
  - 6.1.3.2 Deposition
  - 6.1.3.3 Cleaning
  - 6.1.3.4 Wafer Surface Conditioning
  - 6.1.3.5 Others
- 6.1.4 Market Forecast (2026-2034)
6.2 Back-End
- 6.2.1 Overview
- 6.2.2 Historical and Current Market Trends (2020-2025)
- 6.2.3 Market Segmentation
  - 6.2.3.1 Testing
  - 6.2.3.2 Assembly and Packaging
  - 6.2.3.3 Dicing
  - 6.2.3.4 Bonding
  - 6.2.3.3 Metrology
  - 6.2.3.4 Others
- 6.2.4 Market Forecast (2026-2034)
6.3 Fab Facility Equipment
- 6.3.1 Overview
- 6.3.2 Historical and Current Market Trends (2020-2025)
- 6.3.3 Market Segmentation
  - 6.3.3.1 Automation
  - 6.3.3.2 Chemical Control
  - 6.3.3.3 Gas Control
  - 6.3.3.4 Others
- 6.3.4 Market Forecast (2026-2034)

7 Japan Semiconductor Manufacturing Equipment Market - Breakup by Product Type

7.1 Memory
- 7.1.1 Overview
- 7.1.2 Historical and Current Market Trends (2020-2025)
- 7.1.3 Market Forecast (2026-2034)
7.2 Logic Components
- 7.2.1 Overview
- 7.2.2 Historical and Current Market Trends (2020-2025)
- 7.2.3 Market Forecast (2026-2034)
7.3 Microprocessor
- 7.3.1 Overview
- 7.3.2 Historical and Current Market Trends (2020-2025)
- 7.3.3 Market Forecast (2026-2034)
7.4 Analog Components
- 7.4.1 Overview
- 7.4.2 Historical and Current Market Trends (2020-2025)
- 7.4.3 Market Forecast (2026-2034)
7.5 Optoelectronic Components
- 7.5.1 Overview
- 7.5.2 Historical and Current Market Trends (2020-2025)
- 7.5.3 Market Forecast (2026-2034)
7.6 Discrete Components
- 7.6.1 Overview
- 7.6.2 Historical and Current Market Trends (2020-2025)
- 7.6.3 Market Forecast (2026-2034)
7.7 Others
- 7.7.1 Historical and Current Market Trends (2020-2025)
- 7.7.2 Market Forecast (2026-2034)

8 Japan Semiconductor Manufacturing Equipment Market - Breakup by Dimension

8.1 2D
- 8.1.1 Overview
- 8.1.2 Historical and Current Market Trends (2020-2025)
- 8.1.3 Market Forecast (2026-2034)
8.2 2.5D
- 8.2.1 Overview
- 8.2.2 Historical and Current Market Trends (2020-2025)
- 8.2.3 Market Forecast (2026-2034)
8.3 3D
- 8.3.1 Overview
- 8.3.2 Historical and Current Market Trends (2020-2025)
- 8.3.3 Market Forecast (2026-2034)

9 Japan Semiconductor Manufacturing Equipment Market - Breakup by Supply Chain Participant

9.1 IDM Firms
- 9.1.1 Overview
- 9.1.2 Historical and Current Market Trends (2020-2025)
- 9.1.3 Market Forecast (2026-2034)
9.2 OSAT Companies
- 9.2.1 Overview
- 9.2.2 Historical and Current Market Trends (2020-2025)
- 9.2.3 Market Forecast (2026-2034)
9.3 Foundries
- 9.3.1 Overview
- 9.3.2 Historical and Current Market Trends (2020-2025)
- 9.3.3 Market Forecast (2026-2034)

10 Japan Semiconductor Manufacturing Equipment Market - Breakup by Region

10.1 Kanto Region
- 10.1.1 Overview
- 10.1.2 Historical and Current Market Trends (2020-2025)
- 10.1.3 Market Breakup by Equipment Type
- 10.1.4 Market Breakup by Product Type
- 10.1.5 Market Breakup by Dimension
- 10.1.6 Market Breakup by Supply Chain Participant
- 10.1.7 Key Players
- 10.1.8 Market Forecast (2026-2034)
10.2 Kansai/Kinki Region
- 10.2.1 Overview
- 10.2.2 Historical and Current Market Trends (2020-2025)
- 10.2.3 Market Breakup by Equipment Type
- 10.2.4 Market Breakup by Product Type
- 10.2.5 Market Breakup by Dimension
- 10.2.6 Market Breakup by Supply Chain Participant
- 10.2.7 Key Players
- 10.2.8 Market Forecast (2026-2034)
10.3 Central/ Chubu Region
- 10.3.1 Overview
- 10.3.2 Historical and Current Market Trends (2020-2025)
- 10.3.3 Market Breakup by Equipment Type
- 10.3.4 Market Breakup by Product Type
- 10.3.5 Market Breakup by Dimension
- 10.3.6 Market Breakup by Supply Chain Participant
- 10.3.7 Key Players
- 10.3.8 Market Forecast (2026-2034)
10.4 Kyushu-Okinawa Region
- 10.4.1 Overview
- 10.4.2 Historical and Current Market Trends (2020-2025)
- 10.4.3 Market Breakup by Equipment Type
- 10.4.4 Market Breakup by Product Type
- 10.4.5 Market Breakup by Dimension
- 10.4.6 Market Breakup by Supply Chain Participant
- 10.4.7 Key Players
- 10.4.8 Market Forecast (2026-2034)
10.5 Tohoku Region
- 10.5.1 Overview
- 10.5.2 Historical and Current Market Trends (2020-2025)
- 10.5.3 Market Breakup by Equipment Type
- 10.5.4 Market Breakup by Product Type
- 10.5.5 Market Breakup by Dimension
- 10.5.6 Market Breakup by Supply Chain Participant
- 10.5.7 Key Players
- 10.5.8 Market Forecast (2026-2034)
10.6 Chugoku Region
- 10.6.1 Overview
- 10.6.2 Historical and Current Market Trends (2020-2025)
- 10.6.3 Market Breakup by Equipment Type
- 10.6.4 Market Breakup by Product Type
- 10.6.5 Market Breakup by Dimension
- 10.6.6 Market Breakup by Supply Chain Participant
- 10.6.7 Key Players
- 10.6.8 Market Forecast (2026-2034)
10.7 Hokkaido Region
- 10.7.1 Overview
- 10.7.2 Historical and Current Market Trends (2020-2025)
- 10.7.3 Market Breakup by Equipment Type
- 10.7.4 Market Breakup by Product Type
- 10.7.5 Market Breakup by Dimension
- 10.7.6 Market Breakup by Supply Chain Participant
- 10.7.7 Key Players
- 10.7.8 Market Forecast (2026-2034)
10.8 Shikoku Region
- 10.8.1 Overview
- 10.8.2 Historical and Current Market Trends (2020-2025)
- 10.8.3 Market Breakup by Equipment Type
- 10.8.4 Market Breakup by Product Type
- 10.8.5 Market Breakup by Dimension
- 10.8.6 Market Breakup by Supply Chain Participant
- 10.8.7 Key Players
- 10.8.8 Market Forecast (2026-2034)

11 Japan Semiconductor Manufacturing Equipment Market - Competitive Landscape

11.1 Overview
11.2 Market Structure
11.3 Market Player Positioning
11.4 Top Winning Strategies
11.5 Competitive Dashboard
11.6 Company Evaluation Quadrant

12 Profiles of Key Players

12.1 Company A
- 12.1.1 Business Overview
- 12.1.2 Product Portfolio
- 12.1.3 Business Strategies
- 12.1.4 SWOT Analysis
- 12.1.5 Major News and Events
12.2 Company B
- 12.2.1 Business Overview
- 12.2.2 Product Portfolio
- 12.2.3 Business Strategies
- 12.2.4 SWOT Analysis
- 12.2.5 Major News and Events
12.3 Company C
- 12.3.1 Business Overview
- 12.3.2 Product Portfolio
- 12.3.3 Business Strategies
- 12.3.4 SWOT Analysis
- 12.3.5 Major News and Events
12.4 Company D
- 12.4.1 Business Overview
- 12.4.2 Product Portfolio
- 12.4.3 Business Strategies
- 12.4.4 SWOT Analysis
- 12.4.5 Major News and Events
12.5 Company E
- 12.5.1 Business Overview
- 12.5.2 Product Portfolio
- 12.5.3 Business Strategies
- 12.5.4 SWOT Analysis
- 12.5.5 Major News and Events

13 Japan Semiconductor Manufacturing Equipment Market - Industry Analysis

13.1 Drivers, Restraints, and Opportunities
- 13.1.1 Overview
- 13.1.2 Drivers
- 13.1.3 Restraints
- 13.1.4 Opportunities
13.2 Porters Five Forces Analysis
- 13.2.1 Overview
- 13.2.2 Bargaining Power of Buyers
- 13.2.3 Bargaining Power of Suppliers
- 13.2.4 Degree of Competition
- 13.2.5 Threat of New Entrants
- 13.2.6 Threat of Substitutes
13.3 Value Chain Analysis