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市場調查報告書
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1878253

半導體設備市場-2025-2030年預測

Semiconductor Equipment Market - Forecasts from 2025 to 2030

出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 151 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

預計半導體設備市場將從 2025 年的 1,135.32 億美元成長到 2030 年的 1,382.62 億美元,複合年成長率為 4.02%。

半導體設備市場分析

半導體設備涵蓋了生產電子元件所必需的工具和系統,這些電子元件利用了矽、鍺、砷化鎵和有機半導體等材料的特性。市場動力源自於5G的加速部署和人工智慧的融合,這在近期、中期和長期內都需要高效能、具成本效益的晶片。 5G的廣泛應用正在推動擴增實境、關鍵任務通訊、固定無線存取和物聯網(IoT)生態系統等創新,這些創新共同促進了對先進半導體設備的需求。

市場亮點

  • 消費性電子產品需求激增,推動了設備投資。
  • 5G 和人工智慧的日益普及推動了對下一代製造解決方案的需求。
  • 亞太地區憑藉其高度集中的製造群主導地位。
  • 擴展的 OSAT(外包半導體組裝和測試)能力將使晶片的組裝、封裝和測試更加高效。
  • 汽車產業的成長正在推動感測器和處理器專用設備的發展。
  • 政府資金將加速國內生產生態系的發展。
  • 加強研發正在推動 5nm 以下製程節點的創新。

市場促進因素

消費性電子產品是關鍵成長引擎

智慧型手機、平板電腦、筆記型電腦、穿戴式裝置和智慧家電的日益普及推動了消費性電子產品的發展,也構成了半導體設備需求的基礎。積體電路晶片、二極體和電晶體等半導體技術為從微波爐、冷藏庫到遊戲機和行動電話等各種設備的功能提供動力。該產業的規模之大可見一斑:預計到2027年,智慧型手機用戶數將達到78億部,佔全球行動用戶總數的87%。為了滿足市場對小型化和高性能的需求,設備製造商正投入大量研發資金,用於開發5奈米以下製程節點的精密設備以及平板顯示器和太陽能板等相關市場。隨著製造商擴大產能以滿足設備普及的需求,這些投資與市場成長直接相關。

擴展 OSAT 生態系統

OSAT供應商將積體電路設計與可直接投放市場的零件連接起來,在封裝、測試和供應鏈最佳化方面發揮關鍵作用。微控制器、感測器和雷達晶片在汽車、工業和物聯網應用的整合度不斷提高,正在拓展OSAT供應商的工作範圍。隨著半導體代工廠和OSAT工廠擴大生產規模,對設備的需求也隨之成長。設計複雜性、產量比率要求和不斷擴大的量產規模之間的相互作用,使得OSAT成為推動成長的關鍵因素,這就要求設備供應商提供專為異構整合和先進封裝技術而設計的高吞吐量、高精度系統。

區域展望

在亞太地區主導地位

亞太地區憑藉其成熟的製造地和戰略政策,正逐步確立市場主導地位。在優先考慮技術自主和經濟實力的國家舉措的支持下,中國正鞏固其作為先進半導體設備生產中心的地位。以韓國為首的晶圓代工經濟體,正透過有針對性的激勵措施和產能擴張,進一步增強該地區的成長動能。晶圓製造、組裝和測試業務的集中,以及強大的供應鏈生態系統,使亞太地區成為製造設備應用中心。持續投資於國內基地和跨境夥伴關係將強化該地區的成長軌跡,確保在整個預測期內持續的資本流入和技術領先地位。

主要企業

  • 應用材料公司:涵蓋沉積、蝕刻和檢測的全面產品系列。
  • ASML控股公司:在極紫外線(EUV)微影術系統領域佔據主導地位。
  • 東京電子有限公司:擁有塗佈/開發人員和熱處理的專業技術。
  • KLA公司:測量和過程控制領域的領導者。
  • Lam Research Corporation:為先進節點提供蝕刻和沈積解決方案。

半導體設備市場處於地緣政治策略、技術融合和終端市場演變的交會點。相關人員必須兼顧供應鏈韌性、節點過渡藍圖和永續性等迫切需求,同時充分利用5G/人工智慧和汽車電氣化帶來的機會。亞太地區的結構性優勢——集中的製造地、政策的一致性以及接近性需求中心——鞏固了其優勢,迫使全球企業相應地調整其研發、產能和夥伴關係策略。隨著產業向基於埃的製造模式轉型,精度、產能和產量比率仍然是關鍵指標。

本報告的主要優勢:

  • 深入分析:提供對主要和新興地區的深入市場洞察,重點關注客戶群、政府政策和社會經濟因素、消費者偏好、垂直行業和其他細分市場。
  • 競爭格局:了解主要全球參與者正在採取的策略舉措,並了解透過正確的策略進入市場的可能性。
  • 市場促進因素與未來趨勢:探索推動市場的動態因素和關鍵趨勢,以及它們將如何塑造未來的市場發展。
  • 可操作的建議:利用洞察力,做出策略決策,在動態環境中發展新的業務流和收入來源。
  • 受眾廣泛:適用於Start-Ups、研究機構、顧問公司、中小企業和大型企業,且經濟實惠。

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產業與市場分析、機會評估、產品需求預測、打入市場策略、地理擴張、資本投資決策、法規結構及影響、新產品開發、競爭情報

研究範圍:

  • 2022年至2024年的歷史數據和2025年至2030年的預測數據
  • 成長機會、挑戰、供應鏈前景、法規結構與趨勢分析
  • 競爭定位、策略和市場佔有率分析
  • 按業務板塊和地區分類的收入成長和預測評估,包括國家/地區
  • 公司概況(策略、產品、財務資訊、關鍵發展等)

目錄

第1章執行摘要

第2章 市場概覽

  • 市場概覽
  • 市場定義
  • 調查範圍

第3章 商業情境

  • 市場促進因素
  • 市場限制
  • 市場機遇
  • 波特五力分析
  • 產業價值鏈分析
  • 政策與法規
  • 策略建議

第4章 技術展望

第5章 半導體設備市場(依設備分類)

  • 介紹
  • 前端設備
  • 後端設備

第6章 半導體設備市場(依最終用戶分類)

  • 介紹
  • 鑄造廠
  • IDM公司
  • OSAT公司

第7章 半導體設備市場(依尺寸分類)

  • 介紹
  • QR 圖
  • 2.5D
  • 3D

第8章 半導體設備市場(按地區分類)

  • 介紹
  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 南美洲
    • 巴西
    • 阿根廷
    • 其他
  • 歐洲
    • 德國
    • 法國
    • 英國
    • 西班牙
    • 其他
  • 中東和非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 其他
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 韓國
    • 印尼
    • 泰國
    • 其他

第9章 競爭格局與分析

  • 主要企業和策略分析
  • 市佔率分析
  • 合併、收購、協議和合作
  • 競爭對手儀錶板

第10章:公司簡介

  • Applied Materials Inc.
  • ASML Holding Semiconductor Company
  • Tokyo Electron Limited
  • KLA Corporation
  • Lam Research Corporation
  • Hitachi Corporation
  • Teradyne Inc.
  • SCREEN Semiconductor Solutions Co. Ltd.

第11章附錄

  • 貨幣
  • 先決條件
  • 基準年和預測年時間表
  • 相關人員的主要收益
  • 調查方法
  • 簡稱列表

第1章執行摘要

第2章 市場概覽

  • 市場概覽
  • 市場定義
  • 調查範圍

第2章 4. 市場區隔

第3章 商業情境

  • 市場促進因素
  • 市場限制
  • 市場機遇
  • 波特五力分析
  • 產業價值鏈分析
  • 政策與法規
  • 策略建議

第4章 技術展望

第5章 半導體設備市場(依設備分類)

  • 介紹
  • 前端設備
  • 後端設備

第6章 半導體設備市場(依最終用戶分類)

  • 介紹
  • 鑄造廠
  • IDM公司
  • OSAT公司

第7章 半導體設備市場(依尺寸分類)

  • 介紹
  • 2D
  • 2.5D
  • 3D

第8章 半導體設備市場(按地區分類)

  • 介紹
  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 南美洲
    • 巴西
    • 阿根廷
    • 其他
  • 歐洲
    • 德國
    • 法國
    • 英國
    • 西班牙
    • 其他
  • 中東和非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 其他
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 韓國
    • 印尼
    • 泰國
    • 其他

第9章 競爭格局與分析

  • 主要企業和策略分析
  • 市佔率分析
  • 合併、收購、協議和合作
  • 競爭對手儀錶板

第10章:公司簡介

  • Applied Materials Inc.
  • ASML Holding Semiconductor Company
  • Tokyo Electron Limited
  • KLA Corporation
  • Lam Research Corporation
  • Hitachi Corporation
  • Teradyne Inc.
  • SCREEN Semiconductor Solutions Co. Ltd.

第11章附錄

  • 貨幣
  • 先決條件
  • 基準年和預測年時間表
  • 相關人員的主要收益
  • 調查方法
  • 簡稱列表
簡介目錄
Product Code: KSI061614632

The semiconductor equipment market is anticipated to increase at a 4.02% CAGR, from USD 113.532 billion in 2025 to USD 138.262 billion in 2030.

Semiconductor Equipment Market Analysis

Semiconductor equipment encompasses tools and systems essential for fabricating electronic components that leverage the properties of materials such as silicon, germanium, gallium arsenide, and organic semiconductors. Market momentum stems from accelerating 5G deployments and artificial intelligence integration, which demand high-performance, cost-effective chips across short-, medium-, and long-term horizons. The proliferation of 5G enables innovations including augmented reality, mission-critical communications, fixed wireless access, and Internet of Things ecosystems, collectively amplifying requirements for advanced semiconductor manufacturing equipment.

Market Highlights

  • Surging consumer electronics demand propels equipment investments.
  • 5G and AI adoption escalates need for next-generation fabrication solutions.
  • Asia-Pacific dominates with concentrated manufacturing clusters.
  • Expanding OSAT capabilities streamline chip assembly, packaging, and testing.
  • Automotive sector growth drives specialized equipment for sensors and processors.
  • Government funding accelerates domestic production ecosystems.
  • Intensified R&D fosters breakthroughs in sub-5 nm process nodes.

Market Drivers

Consumer Electronics as Primary Growth Engine

Consumer electronics represent a cornerstone of semiconductor equipment demand, fueled by escalating adoption of smartphones, tablets, laptops, wearables, and connected appliances. Semiconductors-manifested as integrated chips, diodes, and transistors-underpin functionality in devices ranging from microwaves and refrigerators to gaming consoles and mobile handsets. The sector's scale is evidenced by projected smartphone subscriptions reaching 7.8 billion by 2027, equating to 87% of global mobile users. Equipment providers channel substantial R&D into precision tools for sub-5 nm nodes and adjacent markets like flat-panel displays and solar panels, ensuring alignment with miniaturization and performance mandates. These investments directly correlate with market expansion as manufacturers scale capacity to meet device proliferation.

OSAT Ecosystem Expansion

Outsourced Semiconductor Assembly and Test (OSAT) providers bridge integrated circuit design and market-ready components, assuming critical roles in packaging, testing, and supply chain optimization. Rising integration of microcontrollers, sensors, and radar chips in automotive, industrial, and IoT applications broadens OSAT scope. As semiconductor foundries and OSAT facilities ramp production, equipment demand surges proportionally. The interplay between design complexity, yield requirements, and volume scaling positions OSAT as a pivotal growth lever, compelling equipment vendors to deliver high-throughput, high-precision systems tailored to heterogeneous integration and advanced packaging techniques.

Geographical Outlook

Asia-Pacific Leadership

Asia-Pacific asserts market dominance through entrenched manufacturing hubs and strategic policy alignment. China has solidified its position as a producer of advanced semiconductor equipment, bolstered by national initiatives prioritizing technological sovereignty and economic leverage. South Korea and other foundry-centric economies amplify regional momentum via targeted incentives and capacity expansions. The concentration of wafer fabrication, assembly, and test operations-coupled with robust supply chain ecosystems-establishes Asia-Pacific as the epicenter of equipment deployment. Continued investments in domestic nodes and cross-border partnerships reinforce the region's trajectory, ensuring sustained capital inflows and technological leadership throughout the forecast period.

Leading Industry Players

  • Applied Materials Inc.: Comprehensive portfolio spanning deposition, etch, and inspection.
  • ASML Holding: Monopoly in extreme ultraviolet (EUV) lithography systems.
  • Tokyo Electron Limited: Expertise in coater/developer and thermal processing.
  • KLA Corporation: Metrology and process control leadership.
  • Lam Research Corporation: Etch and deposition solutions for advanced nodes.

The semiconductor equipment market operates at the nexus of geopolitical strategy, technological convergence, and end-market evolution. Stakeholders must navigate supply chain resilience, node migration roadmaps, and sustainability imperatives while capitalizing on 5G/AI tailwinds and automotive electrification. Asia-Pacific's structural advantages-manufacturing density, policy coherence, and demand proximity-entrench its preeminence, compelling global players to align R&D, capacity, and partnership strategies accordingly. Precision, throughput, and yield remain non-negotiable metrics as the industry transitions toward angstrom-scale manufacturing paradigms.

Key Benefits of this Report:

  • Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
  • Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
  • Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
  • Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
  • Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

  • Historical data from 2022 to 2024 & forecast data from 2025 to 2030
  • Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
  • Competitive Positioning, Strategies, and Market Share Analysis
  • Revenue Growth and Forecast Assessment of segments and regions including countries
  • Company Profiling (Strategies, Products, Financial Information, and Key Developments among others.

Semiconductor Equipment Market Segmentation:

  • SEMICONDUCTOR EQUIPMENT MARKET BY EQUIPMENT TYPE
  • Front-end Equipment
  • Back-end Equipment
  • SEMICONDUCTOR EQUIPMENT MARKET BY END-USER
  • Foundries
  • IDM Firms
  • OSAT Companies
  • SEMICONDUCTOR EQUIPMENT MARKET BY DIMENSION
  • 2D
  • 2.5D
  • 3D
  • SEMICONDUCTOR EQUIPMENT MARKET BY GEOGRAPHY
  • North America
  • USA
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • Germany
  • France
  • United Kingdom
  • Spain
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Others
  • Asia Pacific
  • China
  • India
  • Japan
  • South Korea
  • Indonesia
  • Thailand
  • Others

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

  • 2.1. Market Overview
  • 2.2. Market Definition
  • 2.3. Scope of the Study

2.4. Market Segmentation

3. BUSINESS LANDSCAPE

  • 3.1. Market Drivers
  • 3.2. Market Restraints
  • 3.3. Market Opportunities
  • 3.4. Porter's Five Forces Analysis
  • 3.5. Industry Value Chain Analysis
  • 3.6. Policies and Regulations
  • 3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. SEMICONDUCTOR EQUIPMENT MARKET BY EQUIPMENT TYPE

  • 5.1. Introduction
  • 5.2. Front-end Equipment
  • 5.3. Back-end Equipment

6. SEMICONDUCTOR EQUIPMENT MARKET BY END-USER

  • 6.1. Introduction
  • 6.2. Foundries
  • 6.3. IDM Firms
  • 6.4. OSAT Companies

7. SEMICONDUCTOR EQUIPMENT MARKET BY DIMENSION

  • 7.1. Introduction
  • 7.2. 2D
  • 7.3. 2.5D
  • 7.4. 3D

8. SEMICONDUCTOR EQUIPMENT MARKET BY GEOGRAPHY

  • 8.1. Introduction
  • 8.2. North America
    • 8.2.1. USA
    • 8.2.2. Canada
    • 8.2.3. Mexico
  • 8.3. South America
    • 8.3.1. Brazil
    • 8.3.2. Argentina
    • 8.3.3. Others
  • 8.4. Europe
    • 8.4.1. Germany
    • 8.4.2. France
    • 8.4.3. United Kingdom
    • 8.4.4. Spain
    • 8.4.5. Others
  • 8.5. Middle East and Africa
    • 8.5.1. Saudi Arabia
    • 8.5.2. UAE
    • 8.5.3. Others
  • 8.6. Asia Pacific
    • 8.6.1. China
    • 8.6.2. India
    • 8.6.3. Japan
    • 8.6.4. South Korea
    • 8.6.5. Indonesia
    • 8.6.6. Thailand
    • 8.6.7. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 9.1. Major Players and Strategy Analysis
  • 9.2. Market Share Analysis
  • 9.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 9.4. Competitive Dashboard

10. COMPANY PROFILES

  • 10.1. Applied Materials Inc.
  • 10.2. ASML Holding Semiconductor Company
  • 10.3. Tokyo Electron Limited
  • 10.4. KLA Corporation
  • 10.5. Lam Research Corporation
  • 10.6. Hitachi Corporation
  • 10.7. Teradyne Inc.
  • 10.8. SCREEN Semiconductor Solutions Co. Ltd.

11. APPENDIX

  • 11.1. Currency
  • 11.2. Assumptions
  • 11.3. Base and Forecast Years Timeline
  • 11.4. Key Benefits for the Stakeholders
  • 11.5. Research Methodology
  • 11.6. Abbreviations

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

  • 2.1. Market Overview
  • 2.2. Market Definition
  • 2.3. Scope of the Study

2.4. Market Segmentation

3. BUSINESS LANDSCAPE

  • 3.1. Market Drivers
  • 3.2. Market Restraints
  • 3.3. Market Opportunities
  • 3.4. Porter's Five Forces Analysis
  • 3.5. Industry Value Chain Analysis
  • 3.6. Policies and Regulations
  • 3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. SEMICONDUCTOR EQUIPMENT MARKET BY EQUIPMENT TYPE

  • 5.1. Introduction
  • 5.2. Front-end Equipment
  • 5.3. Back-end Equipment

6. SEMICONDUCTOR EQUIPMENT MARKET BY END-USER

  • 6.1. Introduction
  • 6.2. Foundries
  • 6.3. IDM Firms
  • 6.4. OSAT Companies

7. SEMICONDUCTOR EQUIPMENT MARKET BY DIMENSION

  • 7.1. Introduction
  • 7.2. 2D
  • 7.3. 2.5D
  • 7.4. 3D

8. SEMICONDUCTOR EQUIPMENT MARKET BY GEOGRAPHY

  • 8.1. Introduction
  • 8.2. North America
    • 8.2.1. USA
    • 8.2.2. Canada
    • 8.2.3. Mexico
  • 8.3. South America
    • 8.3.1. Brazil
    • 8.3.2. Argentina
    • 8.3.3. Others
  • 8.4. Europe
    • 8.4.1. Germany
    • 8.4.2. France
    • 8.4.3. United Kingdom
    • 8.4.4. Spain
    • 8.4.5. Others
  • 8.5. Middle East and Africa
    • 8.5.1. Saudi Arabia
    • 8.5.2. UAE
    • 8.5.3. Others
  • 8.6. Asia Pacific
    • 8.6.1. China
    • 8.6.2. India
    • 8.6.3. Japan
    • 8.6.4. South Korea
    • 8.6.5. Indonesia
    • 8.6.6. Thailand
    • 8.6.7. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 9.1. Major Players and Strategy Analysis
  • 9.2. Market Share Analysis
  • 9.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 9.4. Competitive Dashboard

10. COMPANY PROFILES

  • 10.1. Applied Materials Inc.
  • 10.2. ASML Holding Semiconductor Company
  • 10.3. Tokyo Electron Limited
  • 10.4. KLA Corporation
  • 10.5. Lam Research Corporation
  • 10.6. Hitachi Corporation
  • 10.7. Teradyne Inc.
  • 10.8. SCREEN Semiconductor Solutions Co. Ltd.

11. APPENDIX

  • 11.1. Currency
  • 11.2. Assumptions
  • 11.3. Base and Forecast Years Timeline
  • 11.4. Key Benefits for the Stakeholders
  • 11.5. Research Methodology
  • 11.6. Abbreviations