2025年3D（3D）積體電路（IC）全球市場報告

預計未來幾年3D（3D）積體電路（IC）市場規模將快速成長。到 2029 年，這一數字將成長至 258.3 億美元，年複合成長率（CAGR）為 15.7%。預測期內的成長可歸因於對智慧設備和高整合度的需求突然增加、對研發活動的投資增加、伺服器、資料中心、軍事和航太等領域對 3D IC 的需求不斷成長、對半導體產業的需求不斷增加以及物聯網和人工智慧技術的擴展。預測期內的關鍵趨勢包括對設備小型化的持續需求、先進封裝技術的使用、設備的異質整合整合、對永續性和能源效率的關注、針對特定應用的 3D IC 解決方案的客製化、為提高性能和效率而開發的新材料，以及為降低成本而改善製造流程。

不斷擴張的半導體產業預計將推動3D（3D）積體電路（IC）市場的成長。半導體產業包括設計、製造和銷售半導體元件的公司，這些元件是電腦、智慧型手機和工業機械等各種電子產品的重要組成部分。由於智慧型手機、平板電腦和穿戴式裝置等消費性電子產品的日益普及，該產業正在經歷顯著成長，這推動了對先進半導體元件的需求。此外，5G 網路的推出將需要新的半導體技術來增強通訊、加快資料傳輸並改善連接性。 3D IC 為半導體應用提供了許多優勢，包括提高性能、改善功率效率、最佳化空間和有效的溫度控管。例如，2024年7月，代表美國半導體產業的貿易協會美國半導體產業協會（SIA）報告稱，2024年5月全球半導體產業銷售額達到491億美元，較2023年5月的412億美元成長19.3%，較2024年4月的472億美元成長4.1億美元。由此可見，半導體需求的不斷成長正推動3D IC市場擴張。

3D（3D）積體電路（IC）市場的主要企業正專注於開發針對特定應用和客戶要求（例如 5G 射頻性能）的客自訂3D IC，以提高其競爭力，滿足精確的市場需求，並透過專門的解決方案創造更高的收益。 3D IC 技術將把多個高速組件整合到單一封裝中，為 5G 提供動力，提高效能，減少延遲，並實現更緊湊、更有效率的網路基礎設施和設備。例如，2024年5月，台灣跨國半導體公司聯華電子推出業界首個射頻絕緣體上矽（RFSOI）技術的3D IC解決方案，標誌著5G時代取得重要突破。這項開創性技術基於聯華電子的 55nm RFSOI 平台，可將電路面積減少 45% 以上，從而能夠在 5G 設備中整合更多射頻組件。這種創新的 3D IC 解決方案解決了射頻 (RF) 干擾挑戰，為 5G 毫米波 (mmWave) 技術的未來發展鋪平了道路。

目錄

第1章執行摘要

第2章 市場特徵

第3章 市場趨勢與策略

第4章 市場 - 宏觀經濟情景，包括利率、感染疾病、地緣政治、新冠疫情、經濟復甦對市場的影響

第5章 全球成長分析與策略分析框架

• 全球3D（3D）積體電路（IC）PESTEL分析（政治、社會、技術、環境、法律因素、促進因素與限制因素）
• 最終用途產業分析
• 全球3D（3D）積體電路（IC）市場：成長率分析
• 全球3D（3D）積體電路（IC）市場表現：規模與成長，2019-2024年
• 全球3D（3D）積體電路（IC）市場預測：規模與成長，2024-2029年，2034年
• 全球3D（3D）積體電路（IC）總可尋址市場（TAM）

第6章市場區隔

• 全球3D (3D) 積體電路 (IC) 市場（按組件、性能和預測），2019-2024 年、2024-2029 年、2034 年
• 玻璃通孔 (TGV)
• 穿透矽通孔(TSV)
• 其他組件
• 全球3D (3D) 積體電路 (IC) 市場技術、效能及預測（2019-2024 年、2024-2029 年及 2034 年）
• 3D堆疊積體電路（IC）
• 單晶片3D積體電路（IC）
• 整合和封裝類型
• 全球3D (3D) 積體電路 (IC) 市場應用、效能及預測（2019-2024 年、2024-2029 年及 2034 年）
• 航太和工業
• 通訊與資訊科技（IT）
• 車
• 家電
• 藥品
• 產業
• 其他用途
• 全球3D (3D) 積體電路 (IC) 市場按玻璃通孔 (TGV) 類型細分，實際狀況及預測，2019-2024 年、2024-2029 年、2034 年
• 3D IC玻璃基板
• TGV製造過程
• TGV互聯互通
• IC封裝用高性能玻璃
• 全球3D (3D) 積體電路 (IC) 市場按穿透矽通孔(TSV) 類型細分，實際狀況及預測，2019-2024 年、2024-2029 年、2034 年
• 用於 TSV 製造的矽晶圓
• TSV 互連與通孔形成
• 銅 TSV
• TSV 封裝解決方案
• 用於 3D IC 的高密度 TSV
• 全球3D（3D）積體電路（IC）市場、其他組件細分（按類型）、業績及預測，2019-2024 年、2024-2029 年、2034 年
• 微凸塊
• 內插器
• 電子機械系統（MEMS）
• 被動元件（電阻器、電容器）
• 溫度控管元件
• 供電網路 (PDN) 組件
• 晶圓鍵合材料
• 測試和檢驗零件

第7章 區域和國家分析

• 全球3D（3D）積體電路（IC）市場：按地區、績效及預測，2019-2024年、2024-2029年、2034年
• 全球3D（3D）積體電路（IC）市場：按國家/地區、業績及預測，2019-2024 年、2024-2029 年、2034 年

第8章 亞太市場

第9章：中國市場

第10章 印度市場

第11章 日本市場

第12章 澳洲市場

第13章 印尼市場

第14章 韓國市場

第15章 西歐市場

第16章英國市場

第17章 德國市場

第18章 法國市場

第19章：義大利市場

第20章：西班牙市場

第21章 東歐市場

第22章 俄羅斯市場

第23章 北美市場

第24章美國市場

第25章：加拿大市場

第26章 南美洲市場

第27章：巴西市場

第28章 中東市場

第29章：非洲市場

第30章競爭格局與公司概況

• 3D（3D）積體電路（IC）市場：競爭格局
• 3D（3D）積體電路（IC）市場：公司簡介
  • Samsung Electronics Co. Ltd. Overview, Products and Services, Strategy and Financial Analysis
  • Taiwan Semiconductor Manufacturing Company（TSMC）Overview, Products and Services, Strategy and Financial Analysis
  • Intel Corporation Overview, Products and Services, Strategy and Financial Analysis
  • International Business Machines Corporation Overview, Products and Services, Strategy and Financial Analysis
  • Qualcomm Incorporated Overview, Products and Services, Strategy and Financial Analysis

第31章 其他大型創新企業

• SK Hynix Inc.
• Broadcom Inc.
• Micron Technology Inc.
• NVIDIA Corporation
• Toshiba Corporation
• Advanced Micro Devices Inc.（AMD）
• ASML Holding NV
• Texas Instruments Incorporated
• MediaTek Inc.
• STMicroelectronics NV
• Infineon Technologies AG
• NXP Semiconductors NV
• Analog Devices Inc.
• Renesas Electronics Corporation
• United Microelectronics Corporation

第 32 章全球市場競爭基準化分析與儀表板

第33章 重大併購

第34章近期市場趨勢

第 35 章 高市場潛力國家、細分市場與策略

• 2029 年3D (3D) 積體電路 (IC) 市場：提供新機會的國家
• 2029 年3D (3D) 積體電路 (IC) 市場：細分市場將帶來新機會
• 2029年3D（3D）積體電路（IC）市場：成長策略
  • 基於市場趨勢的策略
  • 競爭對手的策略

第36章 附錄

Three-dimensional (3D) integrated circuits (ICs) are semiconductor devices where multiple layers of circuits are vertically stacked to form a single, compact unit. This vertical stacking allows for higher integration density, enhanced performance, and a smaller footprint compared to traditional two-dimensional (2D) ICs.

The primary components of three-dimensional (3D) integrated circuits (ICs) include through-glass vias (TGVs), silicon vias (TSVs), and others. Through-glass vias are tiny holes or channels created through a glass substrate to enable electrical signals to pass between different layers of a 3D IC, using glass as an insulating material due to its dielectric properties. The technology types include 3D stacked integrated circuits (ICs), monolithic 3D integrable circuits (ICs), and various integration and packaging types for applications such as aerospace and industrial, telecommunication and information technology (IT), automotive, consumer electronics, medical, industrial, and others.

The three dimensional (3D) integrated circuit (IC) market research report is one of a series of new reports from the business research company that provides three dimensional (3D) integrated circuit (IC) market statistics, including three dimensional (3D) integrated circuit (IC) industry global market size, regional shares, competitors with an three dimensional (3D) integrated circuit (IC) market share, detailed three dimensional (3D) integrated circuit (IC) market segments, market trends and opportunities, and any further data you may need to thrive in the three dimensional (3D) integrated circuit (IC) industry. This three dimensional (3D) integrated circuit (IC) market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

The three dimensional (3D) integrated circuits (IC) market size has grown rapidly in recent years. It will grow from $12.41 billion in 2024 to $14.41 billion in 2025 at a compound annual growth rate (CAGR) of 16.1%. The growth in the historic period can be attributed to increased demand for advanced electronic products, the rising need for improved energy efficiency, rising demand for higher-performance electronics.

The three dimensional (3D) integrated circuits (IC) market size is expected to see rapid growth in the next few years. It will grow to $25.83 billion in 2029 at a compound annual growth rate (CAGR) of 15.7%. The growth in the forecast period can be attributed to a spike in demand for smart devices and sophisticated integrations, an increase in investment in research and development activities, an increasing need for 3D ICs in sectors like servers and data hubs, and the military and aerospace sectors, growing need for semiconductor industries, expansion of IoT and AI technologies. Major trends in the forecast period include the constant need for miniaturization of devices, the use of advanced packaging technologies, heterogeneous integration of devices, a focus on sustainability and energy efficiency, the customization of 3D IC solutions for specific applications, the development of new materials for better performance and efficiency, and enhanced manufacturing processes to reduce costs.

The expanding semiconductor industry is expected to drive the growth of the three-dimensional (3D) integrated circuit (IC) market. The semiconductor industry includes companies involved in designing, manufacturing, and selling semiconductor devices, which are crucial components in various electronic products such as computers, smartphones, and industrial machinery. This industry is experiencing substantial growth due to the increasing prevalence of consumer electronics, including smartphones, tablets, and wearable devices, which boosts the demand for advanced semiconductor components. Additionally, the rollout of 5G networks necessitates new semiconductor technologies for enhanced communication, faster data transfer, and improved connectivity. 3D ICs offer numerous benefits for semiconductor applications, such as enhanced performance, improved power efficiency, space optimization, and effective thermal management. For example, in July 2024, the Semiconductor Industry Association (SIA), a US-based trade association representing the United States semiconductor industry, reported that global semiconductor industry sales reached $49.1 billion in May 2024, a 19.3% increase compared to $41.2 billion in May 2023, and a 4.1% increase compared to $47.2 billion in April 2024. Thus, the growing need for semiconductors drives the expansion of the 3D IC market.

Leading companies in the Three Dimensional (3D) Integrated Circuits (IC) market are focusing on developing custom 3D ICs tailored to specific applications or customer requirements, such as 5G radio frequency performance, to gain a competitive edge, meet precise market demands, and drive higher revenue through specialized solutions. 3D IC technology enhances 5G by integrating multiple high-speed components into a single package, improving performance, reducing latency, and enabling more compact and efficient network infrastructure and devices. For instance, in May 2024, United Microelectronics Corporation, a Taiwan-based multinational corporation and semiconductor company, introduced the industry's first 3D IC solution for radio frequency silicon on insulator (RFSOI) technology, marking a significant advancement in the 5G era. This pioneering technology, available on UMC's 55nm RFSOI platform, reduces circuit footprint by over 45%, allowing for the integration of more RF components into 5G devices. This innovative 3D IC solution addresses the challenge of radio frequency (RF) interference and paves the way for future developments in 5G millimeter-wave (mmWave) technology.

In February 2022, Advanced Micro Devices Inc. (AMD), a US-based semiconductor company, acquired Xilinx Inc. for an undisclosed amount. The acquisition of Xilinx aims to enhance AMD's portfolio by incorporating Xilinx's leading FPGA and adaptive computing technologies, thereby strengthening AMD's position in high-performance computing, data centers, and embedded markets. Xilinx Inc. is a US-based technology and semiconductor company that manufactures 3D ICs.

Major companies operating in the three dimensional (3D) integrated circuits (IC) market are Samsung Electronics Co. Ltd., Taiwan Semiconductor Manufacturing Company (TSMC), Intel Corporation, International Business Machines Corporation, Qualcomm Incorporated, SK Hynix Inc., Broadcom Inc., Micron Technology Inc., NVIDIA Corporation, Toshiba Corporation, Advanced Micro Devices Inc. (AMD), ASML Holding N.V., Texas Instruments Incorporated, MediaTek Inc., STMicroelectronics N.V., Infineon Technologies AG, NXP Semiconductors N.V., Analog Devices Inc., Renesas Electronics Corporation, United Microelectronics Corporation, ON Semiconductor Corporation, GlobalFoundries Inc., Microchip Technology Incorporated, Marvell Technology Group Ltd., JCET Group, Xilinx Inc., Silicon Labs Inc., Rambus Inc.

North America was the largest region in the three dimensional (3D) integrated circuit (IC) market in 2024. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the three dimensional (3D) integrated circuits (IC) market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the three dimensional (3D) integrated circuits (IC) market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The three-dimensional (3D) integrated circuit (IC) market consists of sales of chip-on-chip (CoC), wafer-on-wafer (WoW), and chip-on-wafer (CoW). Values in this market are 'factory gate' values, that is, the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

Three Dimensional (3D) Integrated Circuits (IC) Global Market Report 2025 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses on three dimensional (3d) integrated circuits (ic) market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

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Where is the largest and fastest growing market for three dimensional (3d) integrated circuits (ic) ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward? The three dimensional (3d) integrated circuits (ic) market global report from the Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

• The market characteristics section of the report defines and explains the market.
• The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
• The forecasts are made after considering the major factors currently impacting the market. These include:

The forecasts are made after considering the major factors currently impacting the market. These include the Russia-Ukraine war, rising inflation, higher interest rates, and the legacy of the COVID-19 pandemic.

• Market segmentations break down the market into sub markets.
• The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth. It covers the growth trajectory of COVID-19 for all regions, key developed countries and major emerging markets.
• The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
• The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.

Scope

• Markets Covered:1) By Components: Through Glass Vias (TGVs); Through Silicon Vias (TSVs); Other Components
• 2) By Technology: 3D Stacked Integrated Circuit (ICs); Monolithic 3D Integrated Circuit (ICs); Integration And Packaging Type
• 3) By Application: Aerospace And Industrial; Telecommunication And Information Technology (IT); Automotive; Consumer Electronics; Medical; Industrial; Other Applications
• Subsegments:
• 1) By Through Glass Vias (TGVs): Glass Substrate For 3D ICs; TGV Fabrication Process; TGV Interconnects; High-Performance Glass For IC Packaging
• 2) By Through Silicon Vias (TSVs): Silicon Wafer For TSV Fabrication; TSV Interconnects and Via Formation; Copper TSVs; TSV Packaging Solutions; High-Density Tsvs For 3D ICs
• 3) By Other Components: Microbumps; Interposers; Microelectromechanical Systems (MEMS); Passive Components (Resistors, Capacitors); Thermal Management Components; Power Delivery Network (PDN) Components; Wafer Bonding Materials; Test And Inspection Components
• Companies Mentioned: Samsung Electronics Co. Ltd.; Taiwan Semiconductor Manufacturing Company (TSMC); Intel Corporation; International Business Machines Corporation; Qualcomm Incorporated
• Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain
• Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
• Time series: Five years historic and ten years forecast.
• Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita,
• Data segmentations: country and regional historic and forecast data, market share of competitors, market segments.
• Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
• Delivery format: PDF, Word and Excel Data Dashboard.

Table of Contents

1. Executive Summary

2. Three Dimensional (3D) Integrated Circuits (IC) Market Characteristics

3. Three Dimensional (3D) Integrated Circuits (IC) Market Trends And Strategies

4. Three Dimensional (3D) Integrated Circuits (IC) Market - Macro Economic Scenario Including The Impact Of Interest Rates, Inflation, Geopolitics, Covid And Recovery On The Market

5. Global Three Dimensional (3D) Integrated Circuits (IC) Growth Analysis And Strategic Analysis Framework

• 5.1. Global Three Dimensional (3D) Integrated Circuits (IC) PESTEL Analysis (Political, Social, Technological, Environmental and Legal Factors, Drivers and Restraints)
• 5.2. Analysis Of End Use Industries
• 5.3. Global Three Dimensional (3D) Integrated Circuits (IC) Market Growth Rate Analysis
• 5.4. Global Three Dimensional (3D) Integrated Circuits (IC) Historic Market Size and Growth, 2019 - 2024, Value ($ Billion)
• 5.5. Global Three Dimensional (3D) Integrated Circuits (IC) Forecast Market Size and Growth, 2024 - 2029, 2034F, Value ($ Billion)
• 5.6. Global Three Dimensional (3D) Integrated Circuits (IC) Total Addressable Market (TAM)

6. Three Dimensional (3D) Integrated Circuits (IC) Market Segmentation

• 6.1. Global Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Through Glass Vias (TGVs)
• Through Silicon Vias (TSVs)
• Other Components
• 6.2. Global Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 3D Stacked Integrated Circuit (ICs)
• Monolithic 3D Integrated Circuit (ICs)
• Integration And Packaging Type
• 6.3. Global Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Aerospace And Industrial
• Telecommunication And Information Technology (IT)
• Automotive
• Consumer Electronics
• Medical
• Industrial
• Other Applications
• 6.4. Global Three Dimensional (3D) Integrated Circuits (IC) Market, Sub-Segmentation Of Through Glass Vias (TGVs), By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Glass Substrate For 3D ICs
• TGV Fabrication Process
• TGV Interconnects
• High-Performance Glass For IC Packaging
• 6.5. Global Three Dimensional (3D) Integrated Circuits (IC) Market, Sub-Segmentation Of Through Silicon Vias (TSVs), By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Silicon Wafer For TSV Fabrication
• TSV Interconnects and Via Formation
• Copper TSVs
• TSV Packaging Solutions
• High-Density Tsvs For 3D ICs
• 6.6. Global Three Dimensional (3D) Integrated Circuits (IC) Market, Sub-Segmentation Of Other Components, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Microbumps
• Interposers
• Microelectromechanical Systems (MEMS)
• Passive Components (Resistors, Capacitors)
• Thermal Management Components
• Power Delivery Network (PDN) Components
• Wafer Bonding Materials
• Test And Inspection Components

7. Three Dimensional (3D) Integrated Circuits (IC) Market Regional And Country Analysis

• 7.1. Global Three Dimensional (3D) Integrated Circuits (IC) Market, Split By Region, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 7.2. Global Three Dimensional (3D) Integrated Circuits (IC) Market, Split By Country, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

8. Asia-Pacific Three Dimensional (3D) Integrated Circuits (IC) Market

• 8.1. Asia-Pacific Three Dimensional (3D) Integrated Circuits (IC) Market Overview
• Region Information, Market Information, Background Information, Government Initiatives, Regulations, Regulatory Bodies, Major Associations, Taxes Levied, Corporate Tax Structure, Investments, Major Companies
• 8.2. Asia-Pacific Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 8.3. Asia-Pacific Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 8.4. Asia-Pacific Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

9. China Three Dimensional (3D) Integrated Circuits (IC) Market

• 9.1. China Three Dimensional (3D) Integrated Circuits (IC) Market Overview
• 9.2. China Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion
• 9.3. China Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion
• 9.4. China Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion

10. India Three Dimensional (3D) Integrated Circuits (IC) Market

• 10.1. India Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 10.2. India Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 10.3. India Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

11. Japan Three Dimensional (3D) Integrated Circuits (IC) Market

• 11.1. Japan Three Dimensional (3D) Integrated Circuits (IC) Market Overview
• 11.2. Japan Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 11.3. Japan Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 11.4. Japan Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

12. Australia Three Dimensional (3D) Integrated Circuits (IC) Market

• 12.1. Australia Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 12.2. Australia Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 12.3. Australia Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

13. Indonesia Three Dimensional (3D) Integrated Circuits (IC) Market

• 13.1. Indonesia Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 13.2. Indonesia Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 13.3. Indonesia Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

14. South Korea Three Dimensional (3D) Integrated Circuits (IC) Market

• 14.1. South Korea Three Dimensional (3D) Integrated Circuits (IC) Market Overview
• 14.2. South Korea Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 14.3. South Korea Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 14.4. South Korea Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

15. Western Europe Three Dimensional (3D) Integrated Circuits (IC) Market

• 15.1. Western Europe Three Dimensional (3D) Integrated Circuits (IC) Market Overview
• 15.2. Western Europe Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 15.3. Western Europe Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 15.4. Western Europe Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

16. UK Three Dimensional (3D) Integrated Circuits (IC) Market

• 16.1. UK Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 16.2. UK Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 16.3. UK Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

17. Germany Three Dimensional (3D) Integrated Circuits (IC) Market

• 17.1. Germany Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 17.2. Germany Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 17.3. Germany Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

18. France Three Dimensional (3D) Integrated Circuits (IC) Market

• 18.1. France Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 18.2. France Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 18.3. France Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

19. Italy Three Dimensional (3D) Integrated Circuits (IC) Market

• 19.1. Italy Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 19.2. Italy Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 19.3. Italy Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

20. Spain Three Dimensional (3D) Integrated Circuits (IC) Market

• 20.1. Spain Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 20.2. Spain Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 20.3. Spain Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

21. Eastern Europe Three Dimensional (3D) Integrated Circuits (IC) Market

• 21.1. Eastern Europe Three Dimensional (3D) Integrated Circuits (IC) Market Overview
• 21.2. Eastern Europe Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 21.3. Eastern Europe Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 21.4. Eastern Europe Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

22. Russia Three Dimensional (3D) Integrated Circuits (IC) Market

• 22.1. Russia Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 22.2. Russia Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 22.3. Russia Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

23. North America Three Dimensional (3D) Integrated Circuits (IC) Market

• 23.1. North America Three Dimensional (3D) Integrated Circuits (IC) Market Overview
• 23.2. North America Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 23.3. North America Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 23.4. North America Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

24. USA Three Dimensional (3D) Integrated Circuits (IC) Market

• 24.1. USA Three Dimensional (3D) Integrated Circuits (IC) Market Overview
• 24.2. USA Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 24.3. USA Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 24.4. USA Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

25. Canada Three Dimensional (3D) Integrated Circuits (IC) Market

• 25.1. Canada Three Dimensional (3D) Integrated Circuits (IC) Market Overview
• 25.2. Canada Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 25.3. Canada Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 25.4. Canada Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

26. South America Three Dimensional (3D) Integrated Circuits (IC) Market

• 26.1. South America Three Dimensional (3D) Integrated Circuits (IC) Market Overview
• 26.2. South America Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 26.3. South America Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 26.4. South America Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

27. Brazil Three Dimensional (3D) Integrated Circuits (IC) Market

• 27.1. Brazil Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 27.2. Brazil Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 27.3. Brazil Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

28. Middle East Three Dimensional (3D) Integrated Circuits (IC) Market

• 28.1. Middle East Three Dimensional (3D) Integrated Circuits (IC) Market Overview
• 28.2. Middle East Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 28.3. Middle East Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 28.4. Middle East Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

29. Africa Three Dimensional (3D) Integrated Circuits (IC) Market

• 29.1. Africa Three Dimensional (3D) Integrated Circuits (IC) Market Overview
• 29.2. Africa Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 29.3. Africa Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 29.4. Africa Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

30. Three Dimensional (3D) Integrated Circuits (IC) Market Competitive Landscape And Company Profiles

• 30.1. Three Dimensional (3D) Integrated Circuits (IC) Market Competitive Landscape
• 30.2. Three Dimensional (3D) Integrated Circuits (IC) Market Company Profiles
  • 30.2.1. Samsung Electronics Co. Ltd. Overview, Products and Services, Strategy and Financial Analysis
  • 30.2.2. Taiwan Semiconductor Manufacturing Company (TSMC) Overview, Products and Services, Strategy and Financial Analysis
  • 30.2.3. Intel Corporation Overview, Products and Services, Strategy and Financial Analysis
  • 30.2.4. International Business Machines Corporation Overview, Products and Services, Strategy and Financial Analysis
  • 30.2.5. Qualcomm Incorporated Overview, Products and Services, Strategy and Financial Analysis

31. Three Dimensional (3D) Integrated Circuits (IC) Market Other Major And Innovative Companies

• 31.1. SK Hynix Inc.
• 31.2. Broadcom Inc.
• 31.3. Micron Technology Inc.
• 31.4. NVIDIA Corporation
• 31.5. Toshiba Corporation
• 31.6. Advanced Micro Devices Inc. (AMD)
• 31.7. ASML Holding N.V.
• 31.8. Texas Instruments Incorporated
• 31.9. MediaTek Inc.
• 31.10. STMicroelectronics N.V.
• 31.11. Infineon Technologies AG
• 31.12. NXP Semiconductors N.V.
• 31.13. Analog Devices Inc.
• 31.14. Renesas Electronics Corporation
• 31.15. United Microelectronics Corporation

32. Global Three Dimensional (3D) Integrated Circuits (IC) Market Competitive Benchmarking And Dashboard

33. Key Mergers And Acquisitions In The Three Dimensional (3D) Integrated Circuits (IC) Market

34. Recent Developments In The Three Dimensional (3D) Integrated Circuits (IC) Market

35. Three Dimensional (3D) Integrated Circuits (IC) Market High Potential Countries, Segments and Strategies

• 35.1 Three Dimensional (3D) Integrated Circuits (IC) Market In 2029 - Countries Offering Most New Opportunities
• 35.2 Three Dimensional (3D) Integrated Circuits (IC) Market In 2029 - Segments Offering Most New Opportunities
• 35.3 Three Dimensional (3D) Integrated Circuits (IC) Market In 2029 - Growth Strategies
  • 35.3.1 Market Trend Based Strategies
  • 35.3.2 Competitor Strategies

36. Appendix

• 36.1. Abbreviations
• 36.2. Currencies
• 36.3. Historic And Forecast Inflation Rates
• 36.4. Research Inquiries
• 36.5. The Business Research Company
• 36.6. Copyright And Disclaimer